SGM2008-2.8

SGM2008 GENERAL DESCRIPTION The SGM2008/A series low-power, low-noise, low-dropout, CMOS linear voltage regulators operate from a 2.5V to 5.5V input and deliver up to 300mA. They are the perfect choice for low voltage, low power applications. An ultra low ground current（200µA at 300mA output ) makes these part attractive for battery operated power systems. The SGM2008/A series also offer ultra low dropout voltage (300mV at 300mA output) to prolong battery life in portable electronics. Systems requiring a quiet voltage source, such as RF applications, will benefit from the SGM2008/A series’ ultra low output noise (30µVRMS) and high PSRR. An external noise bypass capacitor connected to the device’s BP pin can further reduce the noise level. The output voltage is preset to voltages in the range of 1.5V to 3.6V. Other features include a 10nA high logic-controlled shutdown mode, foldback current limit and thermal shut- down protection. Devices come in 5-pin SOT23 package. Low Power, Low Dropout, 300mA, RF - Linear Regulators FEATURES - Low Output Noise: 30µVRMS typ(10Hz to 100KHz) - Ultra-Low Dropout Voltage: 300mV at 300mA output - Low 77µA No-Load Supply Current - Low 200µA Operating Supply Current - at 300mA Output High PSRR (73dB at 1KHz) Thermal-Overload Protection Output Current Limit 10nA high Logic-Controlled Shutdown Available in Multiple Output Voltage Versions Fixed Outputs of 1.8V, 2.5V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V, 3.3V and 3.6V PIN CONFIGURATIONS（TOP VIEW） SGM2008 IN 1 2 5 OUT APPLICATIONS Cellular Telephones Cordless Telephones PHS Telephones PCMCIA Cards Modems MP3 Player Hand-Held Instruments Palmtop Computers Electronic Planners Portable/Battery-Powered Equipment GND EN 3 SOT23-5 4 BP Shengbang Microelectronics Co, Ltd Tel: 86/451/84348461 www.sg-micro.com REV. A ORDERING INFORMATION MODEL SGM2008-1.8 SGM2008-2.5 SGM2008-2.7 SGM2008-2.8 SGM2008-2.85 SGM2008-2.9 SGM2008-3.0 SGM2008-3.3 SGM2008-3.6 VOUT(V) 1.8V 2.5V 2. 7V 2.8V 2.85V 2.9V 3.0V 3.3V 3.6V PINPACKAGE SPECIFIED TEMPERATURE RANGE ORDERING NUMBER SGM2008-1.8XN5/TR SGM2008-2.5XN5/TR SGM2008-2. 7XN5/TR SGM2008-2.8XN5/TR SGM2008-2.85XN5/TR SGM2008-2.9XN5/TR SGM2008-3.0XN5/TR SGM2008-3.3XN5/TR SGM2008-3.6XN5/TR PACKAGE MARKING X818 X825 X827 X828 X82J X829 X830 X833 X836 PACKAGE OPTION SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5 - 40°C to +125°C - 40°C to +125°C - 40°C to +125°C - 40°C to +125°C - 40°C to +125°C - 40°C to +125°C - 40°C to +125°C - 40°C to +125°C - 40°C to +125°C Tape and Reel, 3000 Tape and Reel, 3000 Tape and Reel, 3000 Tape and Reel, 3000 Tape and Reel, 3000 Tape and Reel, 3000 Tape and Reel, 3000 Tape and Reel, 3000 Tape and Reel, 3000 ABSOLUTE MAXIMUM RATINGS IN to GND.....................................................................- 0.3V to +6V Output Short-Circuit Duration ...........................................Infinite EN to GND.................................................................- 0.3V to +6V OUT, BP to GND......................................- 0.3V to (VIN + 0.3V) Power Dissipation, PD @ TA = 25℃ SOT23-5 .....................................................................................0.4W Package Thermal Resistance SOT23-5, θJA....................................................................... 250℃/W Operating Temperature Range...........................- 40°C to +125°C Junction Temperature...........................................................+150°C Storage Temperature.............................................- 65°C to +150°C Lead Temperature (soldering, 10s).......................................260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2 SGM2008 ELECTRICAL CHARACTERISTICS PARAMETER Input Voltage Output Voltage Accuracy(1) Maximum Output Current Current Limit Ground Pin Current Dropout Voltage (2) Line Regulation(1) Load Regulation Output Voltage Noise Power Supply Rejection Rate SHUTDOWN ΔVLNR ΔVLDR ILIM IQ No load, EN = 0.4V SYMBOL VIN (VIN = VOUT (NOMINAL) + 0.5V (1), TA = - 40°C to +125°C, unless otherwise noted. Typical values are at TA = + 25°C.) CONDITIONS IOUT =1mA to 300mA, TA = +25°C VOUT + 0.5V≤VIN≤ 5.5V MIN 2.5 -3 300 310 IOUT = 300mA, EN = 0.4V IOUT = 1mA IOUT = 300mA VIN = 2.5V or (VOUT + 0.5V) to 5.5V, IOUT = 1mA IOUT = 0.1mA to 300mA, COUT = 1µF f = 10Hz to 100KHz, CBP = 0.01µF, COUT = 10µF CBP = 0.1µF, ILOAD = 50mA, COUT = 1µF f = 100Hz, f = 1KHz, 2.0 0.4 TA = +25°C TA = +125°C TA = +25°C TA = +125°C TA = +25°C 0.01 0.01 0.01 0.01 30 1 1 750 77 200 0.8 300 0.03 0.0008 30 78 73 380 0.15 0.002 145 TYP MAX 5.5 +3 UNITS V % mA mA µA mV %/V %/mA µVRMS dB dB en PSRR EN Input Threshold EN Input Bias Current Shutdown Supply Current Shutdown Exit Delay(3) THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis VIH VIL IB(SHDN) IQ(SHDN) VIN = 2.5V to 5.5V V µA µA µs EN = 0V and EN = 5.5V EN = 2.0V CBP = 0.01µF COUT = 1µF, No load TSHDN ΔTSHDN 160 15 ℃ ℃ Specifications subject to change without notice. Note 1: VIN = VOUT(NOMINAL) + 0.5V or 2.5V, whichever is greater. Note 2: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 0.5V. (Only applicable for VOUT = +2.5V to +5.0V.) Note 3: Time needed for VOUT to reach 95% of final value. ３ SGM2008 TYPICAL OPERATION CIRCUIT INPUT 2.5V TO 5.5V IN CIN 1μF OFF ON OUT OUTPUT SGM2008 EN GND BP COUT 1μF CBP 0.01μF PIN DESCRIPTION PIN 1 2 3 4 5 NAME IN GND FUNCTION Regulator Input. Supply voltage can range from 2.5V to 5.5V. Bypass with a 1µF capacitor to GND. Ground. Shutdown Input. A high reduces the supply current to 10nA. Connect to GND for normal operation. Reference-Noise Bypass. Bypass with a low-leakage 0.01µF ceramic capacitor for reduced noise at the output. Regulator Output. EN BP OUT ４ SGM2008 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Load Current 2.9 3.4 Output Voltage vs.Load Current Output Voltage(V) Output Voltage(V) VOUT = 2.8V 2.85 3.35 2.8 3.3 2.75 3.25 VOUT = 3.3V 3.2 2.7 0 100 200 Load Current(mA) 300 0 100 200 Load Current(mA) 300 Ground Pin Current vs.Load Current 200 190 180 170 160 150 140 130 120 110 100 90 80 70 0 Ground Pin Current vs.Input Voltage 200 VOUT = 2.8V Ground Pin Current(µA) 160 120 80 No Load 40 0 Ground Pin Current(µA) VOUT = 3.3V Iload = 50mA VOUT = 2.8V 100 200 Load Current(mA) 300 0 1 2 3 4 Input Voltage(V) 5 6 Ground Pin Current vs.Input Voltage 200 VOUT = 3.3V Ground Pin Current(µA) 160 120 80 40 0 0 1 2 3 4 Input Voltage(V) 5 6 Iload = 50mA Output Voltage(V) 5 4 3 2 1 0 0 6 Output Voltage vs.Input Voltage No Load VOUT = 3.3V No Load VOUT = 2.8V 1 2 3 4 Input Voltage(V) 5 6 ５ SGM2008 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Temperature 2.9 ILOAD = 150mA Output Voltage(V) Output Voltage(V) 3.4 ILOAD = 150mA 3.35 Output Voltage vs.Temperature 2.85 2.8 3.3 2.75 VOUT = 2.8V 2.7 -40 -20 0 20 40 60 80 Temperature(℃) 100 120 140 3.25 VOUT = 3.3V 3.2 -40 -20 0 20 40 60 80 Temperature(℃) 100 120 140 Ground Pin Current vs.Temperature 260 240 Ground Pin Current( μA) 220 Dropout Voltage vs.Load Current 440 400 360 Dropout Voltage(mV) 320 280 240 200 160 120 80 40 0 0 30 60 VOUT = 2.8V 90 120 150 180 210 240 270 300 Load Current(mA) TA = -40℃ TA = +125℃ 200 180 160 140 120 100 80 60 -40 -20 0 20 40 60 80 Temperature(℃) 100 120 140 ILOAD = 150mA VOUT = 2.8V VOUT = 3.3V TA = +85℃ TA = +25℃ Dropout Voltage vs.Load Current 360 330 300 270 240 210 180 150 120 90 60 30 0 0 1000 900 Current limit(mA) TA = +125℃ Current limit vs.Temperature Dropout Voltage(mV) 800 700 600 500 400 300 200 100 -40 -20 0 20 40 60 80 Temperature(℃) 100 120 140 VOUT = 2.8V VOUT = 3.3V TA = +85℃ TA = +25℃ TA = -40℃ VOUT = 3.3V 30 60 90 120 150 180 210 240 270 300 Load Current(mA) ６ SGM2008 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. ７ SGM2008 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. Power-Supply Rejection Ratio vs.Frequency 100 90 80 PSRR(dB) 70 60 50 40 30 20 0.01 COUT = 1μF 0.1 1 10 Frequency(kHz) 100 1000 COUT = 10μF Output Noise Spectral Density vs.Frequency 10 Output Noise Spectral Density (μV/√Hz) CBP = 0.1μF ILOAD = 50mA VIN = VOUT+1V CBP = 0.01μF ILOAD = 50mA 1 COUT = 1μF 0.1 COUT = 10μF 0.01 0.01 0.1 1 10 100 1000 Frequency(kHz) Output Noise vs.Load Current 50 45 Output Noise(µVRMS) 40 35 30 25 20 15 10 5 0 1 10 100 Load Current(mA) 1000 f = 10Hz to 100kHz CBP = 0.01μF COUT = 10μF VOUT = 3.3V ８ SGM2008 Application Notes When LDO is used in handheld products, Attention must be paid to voltage spike which would damage SGM2008. In such applications, voltage spike will be generated at changer interface and VBUS pin of USB interface when changer adapters and USB equipments are hot-inserted. Besides this, handheld products will be tested on the production line on the condition of no battery. Test Engineer will apply power from the connector pin which connects with positive pole of the battery. When external power supply is turned on suddenly, the voltage spike will be generated at the battery connector. The voltage spike will be very high, it always exceeds the absolute maximum input voltage (6.0V) of LDO. In order to get robust design. Design Engineer needs to clear up this voltage spike. Zener diode is a cheap and effective solution to eliminate such voltage spike. For example, BZM55B5V6 is a 5.6V small package Zener diode which can be used to remove voltage spike in cell phone design. The schematic is shown in below: Vcc Input BZM55B5V6 1uF C1 1 IN SGM2008 EN 3 GND 2 BP/FP 4 VOUT 5 C2 4.7uF VOUT 0.01uF Control ９ SGM2008 PACKAGE OUTLINE DIMENSIONS SOT23-5 D b L 0 θ 0.20 Symbol A A1 Dimensions In Millimeters Min 1.050 0.000 1.050 0.300 0.100 2.820 1.500 2.650 1.800 0.300 0° Dimensions In Inches Min 0.041 0.000 0.041 0.012 0.004 0.111 0.059 0.104 0.071 0.012 0° Max 1.250 0.100 1.150 0.400 0.200 3.020 1.700 2.950 2.000 0.600 8° Max 0.049 0.004 0.045 0.016 0.008 0.119 0.067 0.116 0.079 0.024 8° E1 A2 b c E L e e1 A1 D C E E1 e e1 0.950TYP 0.700REF 0.037TYP 0.028REF A2 L L1 θ A １０ SGM2008