SGM2013-3.0XK3L

SGM2013 GENERAL DESCRIPTION 300mA, Low Power, Low Dropout, 3 -Terminal, Linear Regulators FEATURES - Ultra-Low Dropout Voltage: The SGM2013 low-power, low-dropout, CMOS linear voltage regulators operate from a 2.5V to 5.5V input and deliver up to 300mA. They are perfect choice for low voltage, low power applications. An ultra low ground current (200µA at 300mA output) makes them attractive for battery operated power systems. The SGM2013 series also offer ultra low dropout voltage (300mV at 300mA output) to prolong battery life in portable electronics The output voltage is preset to voltages in the range of 1.8V to 3.3V. Other features include foldback current limit and thermal shut-down protection. SGM2013 come in 3-pin SOT23 and 3-pin SOT89 package. 300mV at 300mA output - Low 77µA No-Load Supply Current - Low 200µA Operating Supply Current - at 300mA Output High PSRR Thermal-Overload Protection Output Current Limit Output Voltage: Available in Fixed Outputs 1.8V, 2.5V, 2.7V, 2.8V, 2.9V, 3.0V and 3.3V APPLICATIONS Cellular Telephones Digital Cameras MP3、MP4 USB 2.0 Modems PC Cameras Hand-Held Instruments Electronic Dictionarys Portable/Battery-Powered Equipment PIN CONFIGURATIONS（TOP VIEW） GND 1 3 IN OUT 2 SOT23-3 GND IN TYPICAL OPERATION CIRCUIT INPUT IN CIN 1μ F OUT COUT 1μ F OUTPUT 1 OUT 2 GND 3 IN 1 GND 2 IN 3 OUT SOT89-3 SOT89-3(L-Type) GND SG Microelectronics Co, Ltd Tel: 86/451/84348461 www.sg-micro.com REV. C ORDERING INFORMATION MODEL VOUT (V) PINPACKAGE SOT23-3 SGM2013-1.8 1.8V SOT89-3 SOT89-3(L-Type) SOT23-3 SGM2013-2.5 2.5V SOT89-3 SOT89-3(L-Type) SOT23-3 SGM2013-2.7 2. 7V SOT89-3 SOT89-3(L-Type) SOT23-3 SGM2013-2.8 2.8V SOT89-3 SOT89-3(L-Type) SOT23-3 SGM2013-2.9 2.9V SOT89-3 SOT89-3(L-Type) SOT23-3 SGM2013-3.0 3.0V SOT89-3 SOT89-3(L-Type) SOT23-3 SGM2013-3.3 3.3V SOT89-3 SOT89-3(L-Type) - 40°C to +125°C - 40°C to +125°C - 40°C to +125°C - 40°C to +125°C - 40°C to +125°C - 40°C to +125°C - 40°C to +125°C SPECIFIED TEMPERATURE RANGE ORDERING NUMBER SGM2013-1.8XN3/TR SGM2013-1.8XK3/TR SGM2013-1.8XK3L/TR SGM2013-2.5XN3/TR SGM2013-2.5XK3/TR SGM2013-2.5XK3L/TR SGM2013-2. 7XN3/TR SGM2013-2. 7XK3/TR SGM2013-2.8XN3/TR SGM2013-2.8XK3/TR SGM2013-2.8XK3L/TR SGM2013-2.9XN3/TR SGM2013-2.9XK3/TR SGM2013-2.9XK3L/TR SGM2013-3.0XN3/TR SGM2013-3.0XK3/TR SGM2013-3.0XK3L/TR SGM2013-3.3XN3/TR SGM2013-3.3XK3/TR SGM2013-3.3XK3L/TR PACKAGE MARKING XD18 SGM2013-1.8XK3 XD25 SGM2013-2.5XK3 XD27 SGM2013-2. 7XK3 XD28 SGM2013-2.8XK3 XD29 SGM2013-2.9XK3 XD30 SGM2013-3.0XK3 XD33 SGM2013-3.3XK3 PACKAGE OPTION Tape and Reel, 3000 Tape and Reel, 1000 SGM2013-1.8XK3L Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 SGM2013-2.5XK3L Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 SGM2013-2. 7XK3L/TR SGM2013-2. 7XK3L Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 SGM2013-2.8XK3L Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 SGM2013-2.9XK3L Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 SGM2013-3.0XK3L Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 SGM2013-3.3XK3L Tape and Reel, 1000 ABSOLUTE MAXIMUM RATINGS IN to GND.....................................................................- 0.3V to +6V Output Short-Circuit Duration............................................Infinite OUT to GND...................................................- 0.3V to (VIN + 0.3V) Power Dissipation, PD @ TA = 25℃ SOT23-3 .....................................................................................0.4W SOT89-3 ................................................................................0.571W Package Thermal Resistance SOT23-3, θJA....................................................................... 250℃/W SOT89-3, θJA.........................................................................175°C/W Operating Temperature Range................. ..........- 40°C to +125°C Junction Temperature...........................................................+150°C Storage Temperature.............................................- 65°C to +150°C Lead Temperature (soldering, 10s).......................................260°C ESD Susceptibility HBM..........................................................................................4000V MM..............................................................................................400V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PIN DESCRIPTION NAME IN GND OUT FUNCTION Regulator Input. Supply voltage can range from 2.5V to 5.5V. Ground. Regulator Output. ２ SGM2013 ELECTRICAL CHARACTERISTICS PARAMETER Input Voltage Output Voltage Accuracy(1) Maximum Output Current Current Limit Ground Pin Current Dropout Voltage (2) Line Regulation(1) Load Regulation Power Supply Rejection Rate THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis TSHDN ΔTSHDN ΔVLNR ΔVLDR PSRR ILIM IQ No load, IOUT = 300mA, IOUT = 1mA IOUT = 300mA SYMBOL VIN (VIN = VOUT (NOMINAL) + 0.5V (1), TA = - 40°C to +125°C, unless otherwise noted. Typical values are at TA = + 25°C.) CONDITIONS IOUT =1mA to 300mA, TA = +25°C VOUT + 0.5V≤VIN≤ 5.5V MIN 2.5 -3 300 310 750 77 200 0.8 300 0.03 0.0008 75 53 160 15 380 0.15 0.002 145 TYP MAX 5.5 +3 UNITS V % mA mA µA mV %/V %/mA dB dB ℃ ℃ VIN = 2.5V or (VOUT + 0.5V) to 5.5V, IOUT = 1mA IOUT = 0.1mA to 300mA, COUT = 1µF ILOAD = 50mA, COUT = 1µF f = 100Hz, f = 1KHz, Specifications subject to change without notice. Note 1: VIN = VOUT(NOMINAL) + 0.5V or 2.5V, whichever is greater. Note 2: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 0.5V. (Only applicable for VOUT = +2.5V to +5.0V.) ３ SGM2013 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Load Current 2.9 3.4 Output Voltage vs.Load Current Output Voltage(V) Output Voltage(V) VOUT = 2.8V 2.85 3.35 2.8 3.3 2.75 3.25 VOUT = 3.3V 3.2 2.7 0 100 200 Load Current(mA) 300 0 100 200 Load Current(mA) 300 Ground Pin Current vs.Load Current 200 190 180 170 160 150 140 130 120 110 100 90 80 70 0 Ground Pin Current vs.Input Voltage 200 VOUT = 2.8V Ground Pin Current(µA) 160 120 80 No Load 40 0 Iload = 50mA Ground Pin Current(µA) VOUT = 3.3V VOUT = 2.8V 100 200 Load Current(mA) 300 0 1 2 3 4 Input Voltage(V) 5 6 Ground Pin Current vs.Input Voltage 200 VOUT = 3.3V Ground Pin Current(µA) 160 120 80 40 0 0 1 2 3 4 Input Voltage(V) 5 6 Iload = 50mA Output Voltage vs.Input Voltage 6 No Load 5 Output Voltage(V) 4 3 2 1 0 0 1 2 3 4 Input Voltage(V) 5 6 VOUT = 2.8V VOUT = 3.3V No Load ４ SGM2013 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted. Power-Supply Rejection Ratio vs.Frequency 90 80 70 60 PSRR(dB) 50 40 30 20 10 0 0.01 0.1 COUT = 1μF 1 10 Frequency(kHz) 100 1000 COUT = 10μF ILOAD = 50mA VIN = VOUT+1V C urrent limit v s.Temperature 1000 900 Current limit(mA) 800 700 600 500 400 300 200 100 -40 -20 0 20 40 60 80 Temperature(℃) 100 120 140 V OUT = 2 .8V V OUT = 3 .3V ５ SGM2013 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Temperature 2.9 ILOAD = 150mA Output Voltage(V) Output Voltage(V) 3.4 Output Voltage vs.Temperature ILOAD = 150mA 3.35 2.85 2.8 3.3 2.75 VOUT = 2.8V 2.7 -40 -20 0 20 40 60 80 Temperature(℃) 100 120 140 3.25 VOUT = 3.3V 3.2 -40 -20 0 20 40 60 80 Temperature(℃) 100 120 140 Ground Pin Current vs.Temperature 260 240 Ground Pin Current( μA) 220 Dropout Voltage vs.Load Current 440 400 360 Dropout Voltage(mV) 320 280 240 200 160 120 80 40 0 0 30 60 VOUT = 2.8V 90 120 150 180 210 240 270 300 Load Current(mA) TA = -40℃ TA = +125℃ 200 180 160 140 120 100 80 60 -40 -20 0 20 40 60 80 Temperature(℃) 100 120 140 ILOAD = 150mA VOUT = 2.8V VOUT = 3.3V TA = +85℃ TA = +25℃ Dropout Voltage vs.Load Current 360 330 300 270 240 210 180 150 120 90 60 30 0 0 Dropout Voltage(mV) TA = +125℃ TA = +85℃ TA = +25℃ TA = -40℃ VOUT = 3.3V 30 60 90 120 150 180 210 240 270 300 Load Current(mA) ６ SGM2013 Application Notes When LDO is used in handheld products, Attention must be paid to voltage spike which would damage SGM2013. In such applications, voltage spike will be generated at changer interface and VBUS pin of USB interface when changer adapters and USB equipments are hot-inserted. Besides this, handheld products will be tested on the production line on the condition of no battery. Test Engineer will apply power from the connector pin which connects with positive pole of the battery. When external power supply is turned on suddenly, the voltage spike will be generated at the battery connector. The voltage spike will be very high, it always exceeds the absolute maximum input voltage (6.0V) of LDO. In order to get robust design. Design Engineer needs to clear up this voltage spike. Zener diode is a cheap and effective solution to eliminate such voltage spike. For example, BZM55B5V6 is a 5.6V small package Zener diode which can be used to remove voltage spike in cell phone design. The schematic is shown in below: Vcc Input BZM55B5V6 1uF C1 IN SGM2013 GND VOUT C2 4.7uF VOUT ７ SGM2013 PACKAGE OUTLINE DIMENSIONS SOT23-3 D b L 0 θ 0.20 Symbol A A1 Dimensions In Millimeters Min 1.050 0.000 1.050 0.300 0.100 2.820 1.500 2.650 1.800 0.300 0° Dimensions In Inches Min 0.041 0.000 0.041 0.012 0.004 0.111 0.059 0.104 0.071 0.012 0° Max 1.250 0.100 1.150 0.400 0.200 3.020 1.700 2.950 2.000 0.600 8° Max 0.049 0.004 0.045 0.016 0.008 0.119 0.067 0.116 0.079 0.024 8° E1 A2 b c D E E e e1 A1 C L E1 e e1 L 0.950TYP 0.700REF 0.037TYP 0.028REF A2 A L1 θ ８ SGM2013 PACKAGE OUTLINE DIMENSIONS SOT89-3 D D1 A Symbol A b b1 c D D1 E E1 e e1 L Dimensions In Millimeters Min Max 1.400 1.600 0.320 0.520 0.360 0.560 0.350 0.440 4.400 4.600 1.400 1.800 2.300 2.600 3.940 4.250 1.500TYP 2.900 3.100 0.900 1.100 Dimensions In Inches Min Max 0.055 0.063 0.013 0.020 0.014 0.022 0.014 0.017 0.173 0.181 0.055 0.071 0.091 0.102 0.155 0.167 0.060TYP 0.114 0.122 0.035 0.043 E1 L b e1 e c E ９ SGM2013 REVISION HISTORY Location 12/06— Data Sheet changed from REV. A to REV. B Changed to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Added Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Page 03/07— Data Sheet changed from REV. B to REV. C Changed to TYPICAL OPERATING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Shengbang Microelectronics Co, Ltd Unit 3, ChuangYe Plaza No.5, TaiHu Northern Street, YingBin Road Centralized Industrial Park Harbin Development Zone Harbin, HeiLongJiang 150078 P.R. China Tel.: 86-451-84348461 Fax: 86-451-84308461 www.sg-micro.com １０ SGM2013