SGM2054
Sink and Source
DDR Termination Regulator
GENERAL DESCRIPTION
FEATURES
The SGM2054 device is a sink and source DDR (double
VLDOIN Voltage Range: 1.1V to 3.5V
data rate) termination regulator. It is specifically designed
Low Input Voltages: 2.5V Rail and 3.3V Rail
for low-cost and low-external component count systems.
Minimum VO Effective Capacitance: 20μF
Other features include logic-controlled shutdown mode,
output current limit and thermal shutdown protection.
The SGM2054 has an EN signal that can be used to
discharge VO when EN is less than 0.3V.
With fast transient response, remote sensing, and
soft-start capabilities to reduce inrush current, the
SGM2054 ensures the optimal system performance for
powering the DDR2, DDR3, Low-Power DDR3, DDR3L,
DDR4 and DDR5 VTT bus termination.
Open-Drain Power-Good (PG) Output
EN Logic Control
Buffered Reference: ±10mA
Soft-Start Inrush Control
Remote Sensing
Fast Load Transient Response
Under-Voltage Lockout
Output Current Limit
Thermal Shutdown Protection
-40℃ to +125℃ Operating Temperature Range
The SGM2054 is available in a Green TDFN-3×3-10L
package. It operates over an operating temperature
range of -40℃ to +125℃.
Available in a Green TDFN-3×3-10L Package
APPLICATIONS
LCD TV
STB
Wireless Base Station
Server, Notebook and Desktop PC
Printer
TYPICAL APPLICATION
1
VREFIN
VVLDOIN
CREFIN
1nF
2
VLDOIN
PGOOD
SGM2054
3
5
CVO
10μF × 3
10
VVIN
R1
100kΩ
CVLDOIN
10μF × 2
VVO
VIN
REFIN
EN
9
7
PGND
4
REFOUT
ON
CIN
4.7μF
OFF
VO
VOSNS
PGOOD
6
GND
8
VREFOUT
CREFOUT
1μF
Figure 1. Typical Application Circuit
SG Micro Corp
www.sg-micro.com
JANUARY 2022 – REV.A
Sink and Source
DDR Termination Regulator
SGM2054
PACKAGE/ORDERING INFORMATION
MODEL
PACKAGE
DESCRIPTION
SPECIFIED
TEMPERATURE
RANGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
SGM2054
TDFN-3×3-10L
-40℃ to +125℃
SGM2054XTD10G/TR
SGM
2054D
XXXXX
Tape and Reel, 4000
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.
XXXXX
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
REFIN, VIN, VLDOIN, VOSNS to GND ............ -0.3V to 3.6V
EN, PGOOD to GND ........................................ -0.3V to 3.6V
PGND to GND .................................................. -0.3V to 0.3V
REFOUT to GND ............................ -0.3V to (VREFOUT + 0.3V)
VO to GND........................................ -0.3V to (VLDOIN + 0.3V)
Package Thermal Resistance
TDFN-3×3-10L, θJA .................................................... 56℃/W
TDFN-3×3-10L, θJB .................................................... 26℃/W
TDFN-3×3-10L, θJC(TOP) ............................................. 59℃/W
TDFN-3×3-10L, θJC(BOT) ............................................. 10℃/W
Junction Temperature .................................................+150℃
Storage Temperature Range ....................... -65℃ to +150℃
Lead Temperature (Soldering, 10s) ............................+260℃
ESD Susceptibility
HBM ............................................................................. 7000V
CDM ............................................................................ 1000V
RECOMMENDED OPERATING CONDITIONS
VIN to GND .....................................................2.375V to 3.5V
VLDOIN to GND .................................................1.1V to 3.5V
EN, PGOOD, VO, VOSNS to GND ........................0V to 3.5V
REFIN to GND ....................................................0.5V to 1.8V
REFOUT to GND ...................................................0V to 1.8V
PGND to GND ................................................................... 0V
VLDOIN Effective Capacitance, CLDOIN ................ 15μF (MIN)
VIN Effective Capacitance, CIN .............................. 1μF (MIN)
VO Effective Capacitance, CVO ....................... 20μF to 100μF
REFOUT Effective Capacitance, CREFOUT .......... 0.1μF to 1μF
Operating Junction Temperature Range ...... -40℃ to +125℃
SG Micro Corp
www.sg-micro.com
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
JANUARY 2022
2
Sink and Source
DDR Termination Regulator
SGM2054
PIN CONFIGURATION
(TOP VIEW)
REFIN
1
10
VIN
VLDOIN
2
9
PGOOD
VO
3
8
GND
PGND
4
7
EN
VOSNS
5
6
REFOUT
GND
TDFN-3×3-10L
PIN DESCRIPTION
PIN
NAME
I/O
FUNCTION
1
REFIN
I
2
VLDOIN
I
3
VO
O
4
PGND
G
5
VOSNS
I
6
REFOUT
O
7
EN
I
Enable Pin. Drive EN high to turn on the regulator. Drive EN low to turn off the regulator.
8
GND
G
Signal Ground.
9
PGOOD
O
10
VIN
I
Exposed
Pad
GND
G
Reference Input Pin.
Regulator Supply Voltage Pin. It is recommended to use a ceramic capacitor with a
minimum effective capacitance of 15μF from VLDOIN pin to ground.
Regulator Output Pin. It is recommended to use output capacitor with effective capacitance
in the range of 20μF to 100μF.
Regulator Power Ground.
Voltage Sense Input Pin. Connect to the remote voltage sensing point of load powered by
VO.
Reference Output Pin. It is recommended to use output capacitor with effective capacitance
in the range of 0.1μF to 1μF.
Power-Good Indicator Output Pin. An open-drain output and active high when the output
voltage reaches VTH(PG) of the target.
Input Voltage Supply Pin. It is recommended to use a ceramic capacitor with a minimum
effective capacitance of 1μF from VIN pin to ground.
Exposed Pad. Connect it to GND internally. Connect it to a large ground plane to maximize
thermal performance; this pad is not an electrical connection point.
NOTE: I = Input, O = Output, G = Ground.
SG Micro Corp
www.sg-micro.com
JANUARY 2022
3
Sink and Source
DDR Termination Regulator
SGM2054
ELECTRICAL CHARACTERISTICS
(VVIN = 3.3V, VVLDOIN = 1.8V, VREFIN = 0.9V, VEN = VVIN, CVO = 3 × 10μF, TJ = -40℃ to +125℃, typical values are at TJ = +25℃,
unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VEN = 3.3V, no load
0.7
1
mA
VEN = 0V, VREFIN = 0V, no load
50
65
VEN = 0V, VREFIN > 0.4V, no load
165
240
1
50
μA
0.1
10
μA
0.5
μA
12
mV
Supply Current
Supply Current
IVIN
Shutdown Current
ISHDN
Supply Current of VLDOIN
IVLDOIN
Shutdown Current of VLDOIN
IVLDOIN(SHDN)
VEN = 3.3V, no load
VEN = 0V, no load
μA
Input Current
Input Current of REFIN
IREFIN
VEN = 3.3V
VO Output
Output DC Voltage of VO
VVO
Output Voltage Tolerance to REFOUT
VOTOL
VO Source Current Limit
IVOSRCL
VO Sink Current Limit
IVOSNCL
Discharge Resistance of VO
RDIS
VREFOUT = 0.9V (DDR2),
IVO = 0A
TJ = +25℃
VREFOUT = 0.75V (DDR3),
IVO = 0A
TJ = +25℃
TJ = -40℃ to +125℃
TJ = -40℃ to +125℃
VREFOUT = 0.675V (DDR3L), TJ = +25℃
IVO = 0A
TJ = -40℃ to +125℃
VREFOUT = 0.6V (DDR4),
IVO = 0A
TJ = +25℃
VREFOUT = 0.55V (DDR5),
IVO = 0A
TJ = +25℃
TJ = -40℃ to +125℃
TJ = -40℃ to +125℃
-2A < IVO < 2A
With reference to REFOUT, VOSNS = 90% × VREFOUT,
TJ = -40℃ to +85℃
With reference to REFOUT, VOSNS = 110% × VREFOUT,
TJ = -40℃ to +85℃
0.9
-12
V
0.75
-12
V
12
0.675
-12
V
12
mV
12
mV
0.6
-12
mV
V
0.55
V
-12
12
mV
-12
12
mV
3
5.5
A
-5.7
-3.5
A
16
30
Ω
-24
-20
-16
16
20
26
VREFIN = 0V, VVO = 0.3V, VEN = 0V
Power-Good Comparator
VO PGOOD Threshold
VTH(PG)
PGOOD Start-Up Delay
tPGSTUPDLY
Output Low Voltage
VPGOODLOW
PGOOD Bad Delay
tPBADDLY
Leakage Current
SG Micro Corp
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IPGOODLKG
PGOOD window lower threshold with respect to
REFOUT
PGOOD window upper threshold with respect to
REFOUT
PGOOD hysteresis
5
Start-up rising edge, VOSNS within 15% of
REFOUT
2
ISINK = 4mA
VOSNS is outside of the ±20% PGOOD window
VOSNS = VREFIN (PGOOD high impedance),
VPGOOD = VIN + 0.2V
%
ms
0.4
0.2
V
μs
1
μA
JANUARY 2022
4
Sink and Source
DDR Termination Regulator
SGM2054
ELECTRICAL CHARACTERISTICS (continued)
(VVIN = 3.3V, VVLDOIN = 1.8V, VREFIN = 0.9V, VEN = VVIN, CVO = 3 × 10μF, TJ = -40℃ to +125℃, typical values are at TJ = +25℃,
unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
1.8
V
410
mV
REFIN and REFOUT
REFIN Voltage Range
VREFIN
0.5
REFIN Under Voltage Lockout
VREFINUVLO
REFIN Under Voltage Lockout Hysteresis
VREFINUVHYS
20
mV
VREFOUT
REFIN
V
REFOUT Voltage
REFOUT Voltage Tolerance to VREFIN
VREFOUTTOL
REFIN rising
-1mA < IREFOUT < 1mA
350
380
VREFIN = 1.25V
-12
12
VREFIN = 0.9V
-12
12
VREFIN = 0.75V
-12
12
VREFIN = 0.675V
-12
12
VREFIN = 0.6V
-12
12
VREFIN = 0.55V
-12
12
mV
REFOUT Source Current Limit
IREFOUTSRCL
VREFOUT = 0V
20
40
mA
REFOUT Sink Current Limit
IREFOUTSNCL
VREFOUT = VIN
20
40
mA
2.15
2.25
UVLO and EN Logic Threshold
Wake up
UVLO Threshold
VUVLO
High-Level Input Voltage
VENIH
Enable
Low-Level Input Voltage
VENIL
Enable
Hysteresis
Hysteresis Voltage
VENYST
Enable
Logic Input Leakage Current
IEN-LKG
EN
COUT = 100μF, VVO(NOM) = 0.6V,
EN turns on to VVO = 90% × VVO(NOM)
Start-Up Time
tSTR
2.35
V
mV
80
1
0.5
V
1
μA
0.03
-1
27
μs
Thermal Shutdown
Thermal Shutdown Temperature
TSHDN
150
Thermal Shutdown Hysteresis
ΔTSHDN
20
SG Micro Corp
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℃
JANUARY 2022
5
Sink and Source
DDR Termination Regulator
SGM2054
TYPICAL PERFORMANCE CHARACTERISTICS
TJ = +25℃, VVLDOIN = 1.8V, VVOSNS = 0.9V, VEN = VVIN, CVO = 3 × 10μF, unless otherwise noted.
VO Load Regulation
753
902
752
Output Voltage (mV)
Output Voltage (mV)
VO Load Regulation
903
901
900
899
898
897
— TJ = -40℃
— TJ = 0℃
— TJ = +25℃
— TJ = +85℃
-3
-2
VREFIN = 0.9V,
VVIN = 3.3V
DDR2
-1
0
1
2
751
750
749
748
747
3
— TJ = -40℃
— TJ = 0℃
— TJ = +25℃
— TJ = +85℃
-3
-2
Output Current (A)
677
602
676
675
673
672
-3
-2
VREFIN = 0.675V,
VVIN = 3.3V
DDR3L
-1
0
1
2
599
598
597
3
— TJ = -40℃
— TJ = 0℃
— TJ = +25℃
— TJ = +85℃
-3
-2
752
Output Voltage (mV)
Output Voltage (mV)
902
901
900
-3
-2
VREFIN = 0.9V,
VVIN = 2.5V
DDR2
-1
0
1
Output Current (A)
SG Micro Corp
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VREFIN = 0.6V,
VVIN = 3.3V
DDR4
-1
0
1
2
3
VO Load Regulation
753
897
3
Output Current (A)
VO Load Regulation
898
2
600
903
— TJ = -40℃
— TJ = 0℃
— TJ = +25℃
— TJ = +85℃
1
601
Output Current (A)
899
0
VO Load Regulation
603
Output Voltage (mV)
Output Voltage (mV)
VO Load Regulation
— TJ = -40℃
— TJ = 0℃
— TJ = +25℃
— TJ = +85℃
-1
Output Current (A)
678
674
VREFIN = 0.75V,
VVIN = 3.3V
DDR3
2
751
750
749
748
3
747
— TJ = -40℃
— TJ = 0℃
— TJ = +25℃
— TJ = +85℃
-3
-2
VREFIN = 0.75V,
VVIN = 2.5V
DDR3
-1
0
1
2
3
Output Current (A)
JANUARY 2022
6
Sink and Source
DDR Termination Regulator
SGM2054
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TJ = +25℃, VVLDOIN = 1.8V, VVOSNS = 0.9V, VEN = VVIN, CVO = 3 × 10μF, unless otherwise noted.
VO Load Regulation
603
677
602
Output Voltage (mV)
Output Voltage (mV)
VO Load Regulation
678
676
675
674
673
672
— TJ = -40℃
— TJ = 0℃
— TJ = +25℃
— TJ = +85℃
-3
-2
VREFIN = 0.675V,
VVIN = 2.5V
DDR3L
-1
0
1
601
600
599
598
2
597
3
— TJ = -40℃
— TJ = 0℃
— TJ = +25℃
— TJ = +85℃
-3
-2
-1
Output Current (A)
903
753
901
899
895
-10
-5
VREFIN = 0.9V,
VVIN = 3.3V
DDR2
0
5
747
745
10
— TJ = -40℃
— TJ = 0℃
— TJ = +25℃
— TJ = +85℃
-10
603
Output Voltage (mV)
Output Voltage (mV)
678
676
674
-5
VREFIN = 0.675V,
VVIN = 3.3V
DDR3L
0
5
REFOUT Output Current (mA)
SG Micro Corp
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0
5
10
REFOUT Load Regulation
605
-10
-5
VREFIN = 0.75V,
VVIN = 3.3V
DDR3
REFOUT Output Current (mA)
REFOUT Load Regulation
670
3
749
680
— TJ = -40℃
— TJ = 0℃
— TJ = +25℃
— TJ = +85℃
2
751
REFOUT Output Current (mA)
672
1
REFOUT Load Regulation
755
Output Voltage (mV)
Output Voltage (mV)
REFOUT Load Regulation
— TJ = -40℃
— TJ = 0℃
— TJ = +25℃
— TJ = +85℃
0
Output Current (A)
905
897
VREFIN = 0.6V,
VVIN = 2.5V
DDR4
601
599
597
10
595
— TJ = -40℃
— TJ = 0℃
— TJ = +25℃
— TJ = +85℃
-10
-5
VREFIN = 0.6V,
VVIN = 3.3V
DDR4
0
5
10
REFOUT Output Current (mA)
JANUARY 2022
7
Sink and Source
DDR Termination Regulator
SGM2054
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TJ = +25℃, VVLDOIN = 1.8V, VVOSNS = 0.9V, VEN = VVIN, CVO = 3 × 10μF, unless otherwise noted.
Load Transient Response
2A/div
IVO
20mV/div
VREFOUT
VVIN = 3.3V, IVO = -1.5A to 1.5A
20mV/div
VVO
Time (1ms/div)
SG Micro Corp
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JANUARY 2022
8
Sink and Source
DDR Termination Regulator
SGM2054
FUNCTIONAL BLOCK DIAGRAM
VLDOIN
+
REFIN
REFOUT
UVLO1
-
0.38V
Discharge 1
+
+
UVLO2
-
VIN
Discharge 2
+
2.25V
VO
-
PGND
EN
VOSNS
GND
+
1.2 × VREFOUT
-
0.8 × VREFOUT
+
-
PGOOD
Start-Up
Delay
SGM2054
Figure 2. Block Diagram
SG Micro Corp
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JANUARY 2022
9
Sink and Source
DDR Termination Regulator
SGM2054
DETAILED DESCRIPTION
Sink and Source Regulator (VO Pin is the
Output)
and VO pins. For sinking, it discharges output capacitors
from the REFOUT and VO pins to GND. When VO is
outside of the power-good window, the clamping
current is one-half of the full over-current limit (OCL).
When VO is inside the power-good window, the
clamping current will switch to the full OCL.
The SGM2054 has a built-in high-side N-MOSFET for
current sourcing and a low-side N-MOSFET for current
sinking. To support the fast load transient response of
DDR memory, the feedback loop of the SGM2054 is
very fast, it can get fast load transient response using
small ceramic capacitors and save cost. The VOSNS
remote sensing pin is used to compensate the dropout
voltage generated by the PCB trace resistance and it
should be connected to the remote node of load which
is powered by VO.
Enable Control
The SGM2054 is an ultra-low dropout voltage, sink and
source linear regulator which is specifically designed as
the termination voltage of DDR memory. It can provide
up to 3A output current capability.
Reference Input (REFIN Pin)
The input voltage range of the REFIN pin is from 0.5V
to 1.8V and it is used to generate the reference voltage
(VREFOUT) of DDR memory. It is set by an external
equivalent ratio voltage divider connected to the
memory power supply bus (VDDQ). In application,
VREFOUT, VTT and VDDQ must meet the equation:
VREFOUT = VTT = VDDQ / 2
REFOUT and VO must track the reference input at the
REFIN pin.
Reference Output (REFOUT Pin)
REFOUT is independent of the EN pin state. The output
voltage is tightly regulated to track the reference voltage
applied at the REFIN pin. When REFIN voltage rises to
380mV and VVIN is above the UVLO threshold,
REFOUT will become active. When VREFOUT is lower
than 360mV, REFOUT is disabled, and it will be
discharged to GND by an internal 130Ω (TYP) MOSFET.
The SGM2054 uses the EN pin to enable/disable the
device. When the EN pin voltage is lower than 0.5V, the
device is in shutdown state. In this state, the internal
discharge transistor is active to pull the output voltage to
ground through a 16Ω (TYP) resistor.
When the EN pin voltage is higher than 1V, the device
is in active state, the input voltage is regulated to the
output voltage and the internal discharge transistor is
turned off.
Power-Good
The PGOOD pin is an open-drain that asserts high with
2ms (TYP) delay time after the VO enters power-good
window which is VVO within +20% of VREFOUT. When the
VO is outside the PGOOD window, PGOOD de-asserts
within 0.2μs (TYP). 100kΩ (TYP) pull-up resistor is
recommended, which should be connected to a stable
and right power supply to interface with digital
controller.
Output Current Limit
When overload events happen, the output current is
internally limited.
Under-Voltage Lockout (UVLO)
REFOUT can source and sink 10mA to/from load. It is
used as DDR termination voltage (VTT) of DDR memory.
The UVLO circuit monitors the input voltage to prevent
the device from turning on before VVIN rises above the
VUVLO threshold. The UVLO circuit responds quickly to
glitches on the VIN pin and attempts to disable the
output of the device if any of these rails collapses. The
local input capacitance prevents severe brownouts in
most applications.
Soft-Start
Thermal Shutdown
The VO pin has soft-start function using current clamp
method. It limits inrush current when charging the
output capacitors. The soft-start function and overcurrent protection are completely symmetrical for
sourcing and sinking current. For sourcing, it charges
output capacitors from the VLDOIN pin to the REFOUT
SG Micro Corp
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The SGM2054 can detect the temperature of die. When
the die temperature exceeds the threshold value of
thermal shutdown, the SGM2054 will be in shutdown
state and remain in this state until the die temperature
decreases to +130℃.
JANUARY 2022
10
SGM2054
Sink and Source
DDR Termination Regulator
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (JANUARY 2022) to REV.A
Page
Changed from product preview to production data .................................................................................................................................................All
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JANUARY 2022
11
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-3×3-10L
D
e
N10
D1
k
E
E1
N1
N5
b
L
BOTTOM VIEW
TOP VIEW
2.4
1.7
A
2.8
A1
A2
0.6
SIDE VIEW
0.24
0.5
RECOMMENDED LAND PATTERN (Unit: mm)
Symbol
Dimensions
In Millimeters
MIN
MAX
A
0.700
A1
0.000
A2
Dimensions
In Inches
MIN
MAX
0.800
0.028
0.050
0.000
0.203 REF
0.031
0.002
0.008 REF
D
2.900
3.100
0.114
0.122
D1
2.300
2.600
0.091
0.103
E
2.900
3.100
0.114
0.122
E1
1.500
1.800
0.059
0.071
0.300
0.007
k
b
0.200 MIN
0.180
e
L
0.008 MIN
0.500 TYP
0.300
0.012
0.020 TYP
0.500
0.012
0.020
NOTE: This drawing is subject to change without notice.
SG Micro Corp
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TX00060.000
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
W
P0
Q1
Q2
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
Q3
Q4
B0
Reel Diameter
A0
P1
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel
Diameter
Reel Width
W1
(mm)
A0
(mm)
B0
(mm)
K0
(mm)
P0
(mm)
P1
(mm)
P2
(mm)
W
(mm)
Pin1
Quadrant
TDFN-3×3-10L
13″
12.4
3.35
3.35
1.13
4.0
8.0
2.0
12.0
Q2
SG Micro Corp
www.sg-micro.com
TX10000.000
DD0001
Package Type
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
DD0002
Reel Type
TX20000.000