SGM2549DYN6G/TR

SGM2549D CTIA/OMTP Headset Ground Pole Switch Autonomous Pole Position Fixing GENERAL DESCRIPTION FEATURES The SGM2549D senses ground pole and automatically • • • • • • • • • • • selects switches accordingly in either the driver side or the headset side, with no need of any external control input. If a plug-in of the earphone is misplaced, it will keep SGM2549D trying periodically until a correct microphone pole is found. It consumes 1.3μA when a microphone is identified. SGM2549D is available in Green UTDFN-1.5×2-6L and SOT-23-6 packages. It is rated over the -40℃ to +85℃ temperature range. Simple and Dedicated for One Purpose SGMICRO’s Patented Circuit w/o IP Conflict Autonomous Fixing CTIA/OMTP Ground Path Keep MIC Low When a 3-Pole Headset Identified Applicable to Both Driver Side and Earphone Side Low Ground Path Impedance Ground Path Voltage Drop Sensing Powered by Local Source or External Parasitics Ground Pin FM Antenna Path -40℃ to +85℃ Operating Temperature Range SGM2549D is Available in Green UTDFN-1.5×2-6L and SOT-23-6 Packages APPLICATIONS Phones/Pads/Computers/Media Players Earphones/Phone-Jack Key/Phone-Jack Button TYPICAL APPLICATION Driver Side Circuit (Optional) VCC GM2 PHR G MIC GM1 SGM2549D GM2 VCC G PHR Headset Side Circuit SGM2549D GM1 MIC The Headset Jack The Headset Socket CTIA Microphone Pole Position GND MIC OMTP Microphone Pole Position MIC Earphone w/o Microphone Pole GND Figure 1. Typical Application Circuits for the Driver Side and the Earphone Side SG Micro Corp www.sg-micro.com DECEMBER 2018 – REV. A CTIA/OMTP Headset Ground Pole Switch Autonomous Pole Position Fixing SGM2549D PACKAGE/ORDERING INFORMATION MODEL SGM2549D PACKAGE DESCRIPTION SPECIFIED TEMPERATURE RANGE ORDERING NUMBER PACKAGE MARKING PACKING OPTION UTDFN-1.5×2-6L -40℃ to +85℃ SGM2549DYUDT6G/TR ML8 XXX Tape and Reel, 3000 SOT-23-6 -40℃ to +85℃ SGM2549DYN6G/TR ML9XX Tape and Reel, 3000 MARKING INFORMATION NOTE: XXX = Date Code. XX = Date Code. UTDFN-1.5×2-6L YYY XXX Serial Number Date Code - Week Date Code - Year SOT-23-6 YYY X X Date Code - Month Date Code - Year Serial Number Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. ABSOLUTE MAXIMUM RATINGS VCC .................................................................... -0.3V to 5.5V Junction Temperature .................................................+150℃ Storage Temperature Range........................ -65℃ to +150℃ Lead Temperature (Soldering, 10s) ............................+260℃ ESD Susceptibility Any other Pins to G, HBM ............................................ 3000V GM1, GM2 to VCC, HBM ............................................. 3000V Rest other Pins to VCC, HBM ...................................... 3000V Any 2 Pins, MM.............................................................. 180V RECOMMENDED OPERATING CONDITIONS Supply Voltage Range: VMIC .....................................................................1.7V to 2.4V VCC .....................≥ VMIC - 0.15V, and in range of 1.7V to 5.5V VPPSGM (Parasitical Power from GM1/GM2) ........2.6V to 5.5V VPPSRC (Parasitical Power from R/L Driver) .........2.2V to 5.5V Junction Temperature Range ....................... -40℃ to +125℃ Environmental Temperature Range ............... -40℃ to +85℃ OVERSTRESS CAUTION Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Functional operation of the device at any conditions beyond those indicated in the Recommended Operating Conditions section is not implied. ESD SENSITIVITY CAUTION This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DISCLAIMER SG Micro Corp reserves the right to make any change in circuit design, or specifications without prior notice. SG Micro Corp www.sg-micro.com DECEMBER 2018 2 CTIA/OMTP Headset Ground Pole Switch Autonomous Pole Position Fixing SGM2549D PIN CONFIGURATIONS (TOP VIEW) GM2 1 G 2 GM1 3 GND (TOP VIEW) 6 VCC VCC 1 6 GM2 5 PHR PHR 2 5 G 4 MIC MIC 3 4 GM1 UTDFN-1.5×2-6L SOT-23-6 PIN DESCRIPTION PIN UTDFN-1.5×2-6L SOT-23-6 6 1 NAME TYPE VCC P FUNCTION Power input to circuit in this IC. The output of voltage drop along the earphone returning ground path. Signal picked at this node is used to suppress cross talk between 2 channels and between earphone driving and microphone output in either analog domain or digital domain. Microphone bias and input switch node and parasitic power to internal circuit if using microphone bias to power this IC. Connect to the microphone bias of the circuit that this circuit works for. One possible grounding node. It is connected to MIC by default at power up. 5 2 PHR I/O 4 3 MIC P 3 4 GM1 IO 2 5 G G Ground of the internal circuit and ground for the earphone. 1 6 GM2 IO Another possible grounding node. It is connected to G by default at power up. NOTE: I/O: Input or Output, G: Ground, P: Power for the circuit. SG Micro Corp www.sg-micro.com DECEMBER 2018 3 CTIA/OMTP Headset Ground Pole Switch Autonomous Pole Position Fixing SGM2549D ELECTRICAL CHARACTERISTICS (TA = +25℃, VCC = 3.6V, unless otherwise noted.) PARAMETER SYMBOL Supply Voltage VCC Supply Voltage VMIC CONDITIONS MIN TYP MAX UNITS 1.7 5.5 V Pull up through 2.5kΩ ~ 2.7kΩ resistor. 1.7 2.4 V Parasitical Power from GM1/GM2 VPPSGM With no VCC power supply. 2.6 3.3 5.5 V Parasitical Power from R/L Driver VPPSRC With no VCC power supply. 2.2 3.3 5.5 V 1.3 2.1 Operation Current IOP IOP1 VCC = 3.6V, VMIC = 2.1V, when an earphone w/MIC plugged in, or when nothing plugged in. VCC = 1.7V to 5.5V, VMIC = 1.7V to 2.4V, when an earphone w/MIC plugged in, or when nothing plugged in. VCC = 3.6V, VMIC = 2.1V, when an earphone w/o MIC plugged in. 2.2 μA 1.5 Switch Paths Path Set Time Path Detection Period tDECT VCC = 3.6V 7.5 ms t VCC = 3.6V 1.9 s GM1/GM2 to G Path Impedance RON1 VCC = 3.6V, VMIC = 2.1V 70 MIC to GM1/GM2 Path Impedance RON2 VCC = 3.6V, VMIC = 2.1V 10 Ω PHR to G Path Impedance RON3 VCC = 3.6V, VMIC = 2.1V 46 Ω Open Path Isolation RISO VCC = 5V, any of GM1/GM2 to G, to MIC, to PHR. 56 MΩ CC1k VCC = 3.6V, 1kHz 1VPP, 32Ω load. -52 dB CC10k VCC = 3.6V, 10kHz 1VPP, 32Ω load. -53 dB LR Crosstalk VCC = 3.6V, 1kHz 1VPP, 32Ω load. THD+N (1) VCC = 3.6V, 10kHz 1VPP, 32Ω load. LR to PHR Crosstalk FM Band Insertion Loss FM Impedance 100 mΩ See NOTE (1) SC1k VCC = 3.6V, 1kHz 1VRMS, feeding R/L through 32Ω. -55 dB SC10k VCC = 3.6V, 10kHz 1VRMS, feeding R/L through 32Ω. -55 dB IL 100MHz, G connected 50Ω//4.7pF to GND. ZGM 100MHz, -10dBm, from GM to G. ZG 100MHz, -10dBm, see Figure 6 for test circuit. -0.40 dB 0.05 + 4.4j Ω 50.36 - 1.98j Ω NOTE 1: See no difference by insertion of the SGM2549D in test load, checked with an audio tester, SYS-2722. SG Micro Corp www.sg-micro.com DECEMBER 2018 4 CTIA/OMTP Headset Ground Pole Switch Autonomous Pole Position Fixing SGM2549D TYPICAL APPLICATION CIRCUITS L1 100nF Correction Amp Input (optional) Z VCC PHR Z 100nF Audio GND MIC R Channel Driving Z L Channel Driving Z Detection Input Z C3 G VCC SGM2549D GM2 Z MIC Amp Input CZ FM rx LNA input (50Ω) L2 C1 C2 GM1 FM rx GND GND or MIC Sleeve MIC or GND Ring2 R Channel Ring1 L Channel TAP1 Detect TAP2 Ferrite beads 6 × 2.5k @100MHz Detection Bias 100nF Headset Socket FM band matching networks Component Reference Volumes: L1: 1μH; L2: 56nH; C1: 4.7nF; C2: 47pF; C3: 56pF; CZ: 4.7pF. System GND Plane 2 × 10nF 6 × 33pF, high frequency capacitors. Figure 2. The SGM2549D in the Headset-Antenna Circuit with ESD Strengthening Headset Jack Sleeve MIC TX Signal (MIC or other) VCC Power, by local source or by source seen at GM1/GM2 (MIC bias from driver side) GM2 Ring2 GM1 Ring1 C1 SGM2549D TAP G PHR Ground R Channel Signal L Channel Signal Figure 3. The Headset or Peripheral Side Application Circuit with Local Power or Parasitically Powered by Bias Input TX Signal (MIC or other) MIC Headset Jack Sleeve Ring2 Ring1 TAP GM2 GM1 VCC SGM2549D PHR Power, by local source or by source seen at GM1/GM2 (MIC bias from driver side) or rectified driving square wave at R channel or L channel. C1 G Ground R Channel Signal Driving Wave Rectifier L Channel Signal Figure 4. The Headset or Peripheral Side Application Circuit Powered by Driving Output of Source SG Micro Corp www.sg-micro.com DECEMBER 2018 5 CTIA/OMTP Headset Ground Pole Switch Autonomous Pole Position Fixing SGM2549D FUNCTIONAL BLOCK DIAGRAM Detection & Control Logic VCC GM2 PHR G GM1 MIC Figure 5. Functional Block Diagram TEST CIRCUIT T2-2 T2-1 T1-2 T1-1 10nF 10nF C1 10nF 2kΩ VCC 2kΩ PHR SGM2549D MIC 33nF 33nF 33nF CZ 4.7pF GM2 G GM1 R: 51Ω C: 10nF 22μH C2 J 1-0-2 Figure 6. FM Band Parameters Test Circuit SG Micro Corp www.sg-micro.com DECEMBER 2018 6 CTIA/OMTP Headset Ground Pole Switch Autonomous Pole Position Fixing SGM2549D TYPICAL PERFORMANCE CHARACTERISTICS TA = +25℃, unless otherwise noted. GM1/GM2 Path Impedance over VCC GM1/GM2 Path Impedance over Temperature 1.5 GM1/GN2 Path Impedance (Normalization) 1.8 GM1/GM2 Path Impedance (Normalization) 1.5 1.2 0.9 0.6 0.3 0 1.7 2.2 2.7 3.2 3.7 4.2 4.7 5.2 1.2 0.9 0.6 0.3 0 -40 -15 10 35 60 85 Temperature (℃) Input Voltage (V) Insertion Loss FM Impedance (ZGM) 0 Insertion Loss (dB) -0.2 -0.4 -0.6 -0.8 -1 80 85 90 95 100 105 110 115 120 Frequency (MHz) FM Impedance (ZG) SG Micro Corp www.sg-micro.com DECEMBER 2018 7 SGM2549D CTIA/OMTP Headset Ground Pole Switch Autonomous Pole Position Fixing FUNCTIONAL DESCRIPTION AND APPLICATIONS The CTIA and the OMTP define different ground pole and MIC pole positions for the headset socket. The SGM2549D continuously monitors poles’ states and makes right path selection for the ground pole and the MIC pole. If no pole stays high long enough, the SGM2549D will stop switching. The SGM2549D works at both driver (the phone side) and the peripheral side (the earphone side) with no external devices needed, as showed in Figure 1. Diagrams showed in Figure 2 to Figure 4 are application circuits for making an earphone antenna, for strengthening ESD protection, and etc. The SGM2549D could be powered by a power rail or by an external rectifier, as the Figure 3 or Figure 4 shows. Making an Earphone Cable a Wipe Antenna As showed in Figure 2, the LC networks composed of L2, C2 and C3 is essential for matching receiver input impedance, which is normally 50Ω and the impedance of a wipe antenna, 110Ω normally. The inductor L1 is to isolate the FM receiver ground from the ground of audio driver and ground plane of the whole circuit, which could be shorted if the ground of FM receiver is properly placed. The 6 units of 33pF caps provide current reflection terminations of rest wires in the earphone cable and make them a single string wipe antenna. Strengthening ESD Protection With its ESD cells on each GM1 pin and GM2 pin, and isolation effect of those ferrite beads, most of those transient voltage suppression diodes (TVS) showed in Figure 2 may not be necessary, except the one to protect the FM receiver input. However, those bond to socket contact always help in strengthening ESD protection. SG Micro Corp www.sg-micro.com Parasitic Power and MIC Bias As in Figure 3 and Figure 4, the SGM2549D is possibly powered by MIC bias, or audio signal from driver when it is used in peripheral side. The C1 stores power extracted from the MIC bias input or the driving waves of the R channel or L channel. The C1 could be eliminated if a true microphone is used at peripheral, as the microphone output only swings in several tens mV, which does not affect the circuitry much. Crosstalk and Side-Tone Suppression Figure 7 illustrates how the ground path inserts crosstalk between L and R channels and side-tone into the output of a microphone inherently. If the current in L channel speaker creates a voltage drop on the RON, then the R channel sees the drop as crosstalk. The sum of drops created by both L and R channels makes the ground reference to microphone, and then it adds into SMIC and causes the side-tone. L Driving R Driving SMIC Speakers Microphone SPHR SGM2549D VDROP GND RON Figure 7. The Ground Path Impedance Drop The conventional Howland is designed to correct the VDROP that is sensed at the PHR of the SGM2549D, here the recommended method is to sense the SPHR at the PHR pin and correct it digitally. DECEMBER 2018 8 CTIA/OMTP Headset Ground Pole Switch Autonomous Pole Position Fixing SGM2549D FUNCTIONAL DESCRIPTION AND APPLICATIONS (continued) An Evaluation Board cable, with or without a VCC power input at the I1 and the I2, to demonstrate the fixing by plugging in different types of headsets in the J3. Keep the JP2 open for this demonstration; close the JP1 if not using a VCC input. There are 2 sockets for connecting once to one kind of source with a 2-heads cable, 1 socket for connecting a headset or another 2-heads cable on the EVB170304 evaluation board, where the J1 is for connecting a CTIA source, the J2 for an OMTP source, and J3 for a headset or for a source. The EVB170304 is designed to demonstrate following cases: 3. Connect to any of the CTIA type or the OMTP type source at the J3 through a 2-heads cable, to demonstrate a headset or a circuit in headset side to plug in any source type, with a VCC input at I1 and I2, or parasitically powered by microphone biasing. Keep the JP1 and the JP2 open for this demonstration. 1. Use VCC input at the J1 and R1 to simulate a microphone biasing, to demonstrate the ground pole fixing. Headsets or earphones without any microphone are plugged in the J3. Fixing is observed by checking voltages at the TP5 and the TP6. The voltage at the TP5 is high for a CTIA type headset, high at the TP6 is for an OMTP type headset. None of them high is for an earphone without any microphone. 4. Input a square wave at the R channel from a CTIA or an OMTP source at the J3 through a 2-heads cable, to demonstrate how power is extracted from it. Keep the JP1 open, the JP2 close for this demonstration. 2. Connect one of CTIA type or OMTP type source at the J1 or the J2 correspondingly through a 2-heads VCC I1 GND VCC GND I2 TP7 TP8 R2 4.3kΩ JP3 D1 CTIA OMTP JP1 J1 J2 R1 2kΩ SGM2549D D2 C1 103F C2 103F VCC GM2 PHR G MIC GM1 Headset J3 JP2 TP1 TP2 TP3 TP4 TP5 TP6 L R MIC PHR GM1 GM2 Figure 8. The EVB170304 Circuit REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (DECEMBER 2018) to REV.A Changed from product preview to production data ............................................................................................................................................. All SG Micro Corp www.sg-micro.com DECEMBER 2018 9 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS UTDFN-1.5×2-6L e D N6 D1 L E1 E k N3 N1 b1 b BOTTOM VIEW TOP VIEW 1.10 0.55 A 0.90 2.60 A1 A2 SIDE VIEW 0.25 0.50 RECOMMENDED LAND PATTERN (Unit: mm) Symbol Dimensions In Millimeters MIN MAX Dimensions In Inches MIN MAX A 0.500 0.600 0.020 0.024 A1 0.000 0.050 0.000 0.002 A2 0.152 REF 0.006 REF D 1.400 1.600 0.055 0.063 D1 1.000 1.200 0.039 0.047 E 1.900 2.100 0.075 0.083 E1 0.800 1.000 0.031 k b 0.300 REF 0.200 0.039 0.012 REF 0.300 0.008 0.012 b1 0.180 REF 0.007 REF e 0.500 BSC 0.020 BSC L SG Micro Corp www.sg-micro.com 0.200 0.300 0.008 0.012 TX00115.001 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOT-23-6 D e1 e 2.59 E E1 0.99 b 0.95 0.69 RECOMMENDED LAND PATTERN (Unit: mm) L A A1 θ A2 Symbol Dimensions In Millimeters MIN MAX c 0.2 Dimensions In Inches MIN MAX A 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e 0.950 BSC 0.037 BSC e1 1.900 BSC 0.075 BSC SG Micro Corp www.sg-micro.com L 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° TX00034.000 PACKAGE INFORMATION TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P2 W P0 Q1 Q2 Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 Q3 Q4 B0 Reel Diameter K0 A0 P1 Reel Width (W1) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Reel Diameter Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P0 (mm) P1 (mm) P2 (mm) W (mm) Pin1 Quadrant UTDFN-1.5×2-6L 7″ 9.5 1.70 2.30 0.75 4.0 4.0 2.0 8.0 Q2 SOT-23-6 7″ 9.5 3.17 3.23 1.37 4.0 4.0 2.0 8.0 Q3 SG Micro Corp www.sg-micro.com TX10000.000 DD0001 Package Type PACKAGE INFORMATION CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Length (mm) Width (mm) Height (mm) Pizza/Carton 7″ (Option) 368 227 224 8 7″ 442 410 224 18 SG Micro Corp www.sg-micro.com DD0002 Reel Type TX20000.000