SGM3209YTDE8G/TR

SGM3209 High Voltage, Charge Pump DC/DC Converter GENERAL DESCRIPTION FEATURES The SGM3209 is a charge pump voltage converter ● Input Voltage Range: 3V to 18V which is used to generate a negative supply from a ● Output Current: 100mA positive input. The 3V to 18V input voltage can be ● Pull-Low Resistor on EN Pin: 600kΩ converted into a corresponding -3V to -18V output ● Programmable Oscillator Frequency: 120kHz to 1.25MHz supply. The SGM3209 is also capable of delivering up to 100mA of output current. The switching frequency is ● No External Diodes Required resistor programmable from 120kHz to 1.25MHz. The ● Low Output Impedance: 15Ω (TYP) at IOUT = 20mA device also has the advantage of using a combination ● CMOS Construction of few external components to eliminate the inductors ● -40℃ to +85℃ Operating Temperature Range and their associated cost, size and EMI. ● Available in Green TDFN-2×2-8L and SOIC-8 Packages The SGM3209 enters into shutdown status by external enable control signal to reduce system power dissipation. The device is used for design requirements with higher output current and/or lower input/output APPLICATIONS Laptop Computers voltage drop. The SGM3209 is available in Green TDFN-2×2-8L and SOIC-8 packages. It operates over an ambient Disk Drives Process Instrumentation temperature range of -40℃ to +85℃. TYPICAL APPLICATION CFLY 10μF + RSET 82kΩ 4 7 CBP 100nF Input 3V to 18V CFLY+ RP EN On 6 Off SGM3209 8 CIN 10μF 2 CFLY- IN GND 3 OUT 5 + COUT 10μF Output -3V to -18V Figure 1. Typical Application Circuit SG Micro Corp www.sg-micro.com NOVEMBER 2020 – REV. A. 1 High Voltage, Charge Pump DC/DC Converter SGM3209 PACKAGE/ORDERING INFORMATION MODEL PACKAGE DESCRIPTION SPECIFIED TEMPERATURE RANGE ORDERING NUMBER PACKAGE MARKING PACKING OPTION SOIC-8 -40℃ to +85℃ SGM3209YS8G/TR SGM 3209YS8 XXXXX Tape and Reel, 2500 TDFN-2×2-8L -40℃ to +85℃ SGM3209YTDE8G/TR 3209 XXXX Tape and Reel, 3000 SGM3209 MARKING INFORMATION SOIC-8 TDFN-2×2-8L (1) XXXXX = Date Code, Trace Code and Vendor Code. (2) XXXX = Date Code. XXXXX XXXX Vendor Code Trace Code Date Code - Year Date Code - Week Date Code - Year Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. ABSOLUTE MAXIMUM RATINGS IN to GND .......................................................... -0.3V to 22V OUT to GND .......................................... -(VIN + 0.3V) to 0.3V EN, RP to GND .................................................... -0.3V to 6V Junction Temperature .................................................+150℃ Storage Temperature Range ........................ -65℃ to +150℃ Lead Temperature (Soldering, 10s) ............................+260℃ ESD Susceptibility HBM ............................................................................. 8000V MM ................................................................................. 400V CDM ............................................................................ 1000V RECOMMENDED OPERATING CONDITIONS Input Voltage Range ...............................................3V to 18V Operating Temperature Range ....................... -40℃ to +85℃ OVERSTRESS CAUTION Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Functional operation of the device at any conditions beyond those indicated in the Recommended Operating Conditions section is not implied. ESD SENSITIVITY CAUTION This integrated circuit can be damaged if ESD protections are not considered carefully. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because even small parametric changes could cause the device not to meet the published specifications. DISCLAIMER SG Micro Corp reserves the right to make any change in circuit design, or specifications without prior notice. SG Micro Corp www.sg-micro.com NOVEMBER 2020 2 High Voltage, Charge Pump DC/DC Converter SGM3209 PIN CONFIGURATIONS SGM3209 (TOP VIEW) SGM3209 (TOP VIEW) NC 1 8 IN CFLY+ 2 7 RP GND 3 6 EN CFLY- 4 5 OUT SOIC-8 NC 1 8 IN CFLY+ 2 7 RP GND 3 6 EN CFLY- 4 5 OUT TDFN-2×2-8L PIN DESCRIPTION PIN NAME FUNCTION TDFN-2×2-8L SOIC-8 1 1 NC 2 2 CFLY+ Positive Terminal of the Flying Capacitor. 3 3 GND Ground. 4 4 CFLY- Negative Terminal of the Flying Capacitor. 5 5 OUT Output Pin. 6 6 EN 7 7 RP 8 8 IN Power Input Pin. Exposed Pad - NC No Connection. SG Micro Corp www.sg-micro.com No Connection. Enable Control Pin. Logic high to enable chip and logic low to shut down chip. Switching Frequency Setting. Connect one resistor (RSET) between RP pin and GND to program switching frequency. The resistor should be located very close to this pin. Frequency range is from 120kHz to 1.25MHz. NOVEMBER 2020 3 High Voltage, Charge Pump DC/DC Converter SGM3209 ELECTRICAL CHARACTERISTICS (VIN = 15V, CIN = CFLY = COUT = 10μF, Full = -40℃ to +85℃. Typical values are at TA = +25℃, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS TEMP MIN TYP Input Voltage Range VIN Full 3 Maximum Output Current Range at OUT Pin IOUT +25℃ 100 Output Voltage VOUT +25℃ -VIN Output Voltage Ripple VPP Quiescent Current Internal Switching Frequency Impedance IQ fOSC RO +25℃ 250 +25℃ 40 IOUT = 100mA, RSET = 0Ω +25℃ 35 RP Floating, IOUT = 0mA 0.9 1.4 +25℃ 4.3 5.5 RSET = 0Ω, IOUT = 0mA +25℃ 5.3 7.0 Shutdown Mode, VEN = 0V +25℃ RSET = 0Ω 0.5 1.2 +25℃ 100 120 145 +25℃ 850 1000 1160 +25℃ 1050 1250 1520 19 IOUT = 20mA, RP Floating +25℃ 15 IOUT = 20mA, RSET = 82kΩ +25℃ 23 38 IOUT = 20mA, RSET = 0Ω +25℃ 33 57 VIH VIN = 3V to 18V Full VIL VIN = 3V to 18V Full Thermal Shutdown Temperature Thermal Shutdown Hysteresis SG Micro Corp www.sg-micro.com mVP-P +25℃ RSET = 82kΩ V V RSET = 82kΩ, IOUT = 0mA RP Floating UNITS mA IOUT = 100mA, RP Floating EN Logic Level Low RPULL-LOW 18 IOUT = 100mA, RSET = 82kΩ EN Logic Level High EN Internal Pull Low Resistance MAX 1.4 mA μA kHz Ω V 0.6 V 600 kΩ TSHDN 150 ℃ ΔTSHDN 20 ℃ +25℃ NOVEMBER 2020 4 High Voltage, Charge Pump DC/DC Converter SGM3209 TYPICAL PERFORMANCE CHARACTERISTICS At TA = +25℃, VIN = 15V, CIN = CFLY = COUT = 10μF, unless otherwise noted. Internal Switching Frequency vs. RSET Internal Switching Frequency vs. Input Voltage 1400 Internal Switching Frequency (kHz) Internal Switching Frequency (kHz) 1400 1200 1200 1000 800 600 400 200 RSET = 0Ω 1000 600 400 RSET = 510kΩ 200 RP Floating 0 0 200 400 600 800 1000 RSET = 82kΩ 800 1200 0 5 RSET (kΩ) 5.2 5.2 Quiescent Current (mA) Quiescent Current (mA) 6.2 4.2 3.2 2.2 1.2 400 600 800 1000 1200 Internal Switching Frequency (kHz) 4.2 RSET = 82kΩ 3.2 2.2 RSET = 510kΩ 1.2 0.2 1400 RSET = 0Ω RP Floating 0 Impedance vs. Input Voltage RSET = 0Ω RSET = 82kΩ 20 15 RSET = 510kΩ 10 RF Floating 0 5 SG Micro Corp www.sg-micro.com 10 15 Input Voltage (V) 15 20 RP Floating IOUT = 20mA 18 Impedance (Ω) Impedance (Ω) 10 Input Voltage (V) 20 IOUT = 20mA 5 5 Impedance vs. Input Voltage 30 25 20 Quiescent Current vs. Input Voltage 6.2 200 15 Input Voltage (V) Quiescent Current vs. Internal Switching Frequency 0.2 10 16 TA =+85℃ 14 TA = +25℃ 12 10 20 8 TA = -40℃ 0 5 10 15 20 Input Voltage (V) NOVEMBER 2020 5 High Voltage, Charge Pump DC/DC Converter SGM3209 TYPICAL PERFORMANCE CHARACTERISTICS (continued) At TA = +25℃, VIN = 15V, CIN = CFLY = COUT = 10μF, unless otherwise noted. Output Voltage vs. Input Voltage 0 Output Voltage vs. Output Current 0 RP Floating IOUT = 100mA -8 IOUT = 5mA -12 IOUT = 50mA -16 -20 Output Voltage (V) Output Voltage (V) -4 -5 4 8 12 16 VIN = 5V -10 VIN = 10V -15 -20 0 20 VIN = 15V VIN = 18V 0 20 Output Voltage vs. Input Voltage 0 IOUT = 100mA Output Voltage (V) Output Voltage (V) -4 -8 IOUT = 5mA IOUT = 50mA -16 60 80 100 Output Voltage vs. Output Current RSET = 82kΩ -12 40 Output Current (mA) Input Voltage (V) 0 VIN = 3V RP Floating RSET = 82kΩ VIN = 3V -5 VIN = 5V -10 VIN = 10V -15 VIN = 15V VIN = 18V -20 0 4 8 12 16 -20 20 0 20 Input Voltage (V) Output Voltage vs. Input Voltage 0 IOUT = 100mA Output Voltage (V) Output Voltage (V) 0 -8 IOUT = 5mA -12 IOUT = 50mA -16 -20 60 80 100 Output Voltage vs. Output Current RSET = 0Ω -4 40 Output Current (mA) RSET = 0Ω VIN = 3V -5 VIN = 5V -10 VIN = 10V -15 VIN = 15V VIN = 18V 0 4 8 12 Input Voltage (V) SG Micro Corp www.sg-micro.com 16 20 -20 0 20 40 60 80 100 Output Current (mA) NOVEMBER 2020 6 High Voltage, Charge Pump DC/DC Converter SGM3209 TYPICAL PERFORMANCE CHARACTERISTICS (continued) At TA = +25℃, VIN = 15V, CIN = CFLY = COUT = 10μF, unless otherwise noted. Efficiency vs. Output Current 100 VIN = 18V VIN = 15V VIN = 5V 70 VIN = 3V 100mV/div VIN = 10V 80 Output Voltage 90 Efficiency (%) Output Voltage Ripple 60 RP Floating 50 0 20 40 60 RP Floating, IOUT = 100mA 80 100 Time (10μs/div) Output Current (mA) Efficiency vs. Output Current 100 Output Voltage Ripple VIN = 18V 90 60 Output Voltage VIN = 15V VIN = 10V 70 VIN = 5V 50 40 30 20 RSET = 82kΩ 0 20 40 60 20mV/div Efficiency (%) 80 RSET = 82kΩ, IOUT = 100mA 80 100 Time (2μs/div) Output Current (mA) Efficiency vs. Output Current Output Voltage Ripple 100 VIN = 18V 90 Output Voltage 70 VIN = 15V 60 VIN = 10V 50 VIN = 5V 20mV/div Efficiency (%) 80 40 30 20 RSET = 0Ω, IOUT = 100mA RSET = 0Ω 0 20 40 60 Output Current (mA) SG Micro Corp www.sg-micro.com 80 100 Time (2μs/div) NOVEMBER 2020 7 High Voltage, Charge Pump DC/DC Converter SGM3209 TYPICAL PERFORMANCE CHARACTERISTICS (continued) At TA = +25℃, VIN = 15V, CIN = CFLY = COUT = 10μF, unless otherwise noted. Shutdown Current vs. Input Voltage Shutdown Current (μA) 0.7 0.6 0.5 0.4 0.3 0.2 0 5 10 Input Voltage (V) 15 20 REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. NOVEMBER 2020 ‒ REV.A to REV.A.1 Page Updated Marking Information section................................................................................................................................................................... 2 Changes from Original (JANUARY 2016) to REV.A Page Changed from product preview to production data ............................................................................................................................................. All SG Micro Corp www.sg-micro.com NOVEMBER 2020 8 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOIC-8 0.6 D e 2.2 E1 E 5.2 b 1.27 RECOMMENDED LAND PATTERN (Unit: mm) L A A1 c θ A2 Symbol Dimensions In Millimeters MIN MAX Dimensions In Inches MIN MAX A 1.350 1.750 0.053 0.069 A1 0.100 0.250 0.004 0.010 A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.006 0.010 D 4.700 5.100 0.185 0.200 E 3.800 4.000 0.150 0.157 E1 5.800 6.200 0.228 0.244 e SG Micro Corp www.sg-micro.com 1.27 BSC 0.050 BSC L 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8° TX00010.000 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS TDFN-2×2-8L e D N8 D1 L PIN 1# DETAIL A E1 E k PIN 1# N1 DETAIL B b BOTTOM VIEW TOP VIEW 1.20 0.65 A A1 0.60 1.95 A2 SIDE VIEW ALTERNATE A-1 ALTERNATE A-2 DETAIL A ALTERNATE B-1 ALTERNATE B-2 0.24 0.50 DETAIL B ALTERNATE PIN 1 CONSTRUCTION ALTERNATE TERMINAL CONSTRUCTION Symbol RECOMMENDED LAND PATTERN (Unit: mm) Dimensions In Millimeters MIN MOD MAX A 0.700 0.750 0.800 A1 0.000 - 0.050 A2 0.203 REF D 1.900 2.000 2.100 E 1.900 2.000 2.100 D1 1.100 1.200 1.300 E1 0.500 0.600 0.700 b 0.180 - 0.300 e 0.500 TYP k L 0.200 MIN 0.250 0.350 0.450 NOTE: This drawing is subject to change without notice. SG Micro Corp www.sg-micro.com TX00056.001 PACKAGE INFORMATION TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P2 W P0 Q1 Q2 Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 Q3 Q4 B0 Reel Diameter A0 P1 K0 Reel Width (W1) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Reel Diameter Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P0 (mm) P1 (mm) P2 (mm) W (mm) Pin1 Quadrant SOIC-8 13″ 12.4 6.40 5.40 2.10 4.0 8.0 2.0 12.0 Q1 TDFN-2×2-8L 7″ 9.5 2.30 2.30 1.10 4.0 4.0 2.0 8.0 Q1 SG Micro Corp www.sg-micro.com TX10000.000 DD0001 Package Type PACKAGE INFORMATION CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Length (mm) Width (mm) Height (mm) Pizza/Carton 7″ (Option) 368 227 224 8 7″ 442 410 224 18 13″ 386 280 370 5 SG Micro Corp www.sg-micro.com DD0002 Reel Type TX20000.000