SGM321/SGM358/SGM324
1MHz, 60μA, Rail-to-Rail I/O
CMOS Operational Amplifiers
GENERAL DESCRIPTION
FEATURES
The SGM321 (single), SGM358 (dual) and SGM324
• Low Cost
(quad) are low cost, rail-to-rail input and output voltage
• Rail-to-Rail Input and Output
feedback amplifiers. They have a wide input common
• Input Offset Voltage: 5mV (MAX)
mode voltage range and output voltage swing, and take
• Unity Gain Stable
the minimum operating supply voltage down to 2.1V.
• Gain-Bandwidth Product: 1MHz
The maximum recommended supply voltage is 5.5V.
• Very Low Input Bias Current: 10pA
All are specified over the extended -40℃ to +85℃
• Supply Voltage Range: 2.1V to 5.5V
temperature range.
• Input Voltage Range:
The SGM321/358/324 provide 1MHz bandwidth at a
low current consumption of 60μA/amplifier. Very low
input bias currents of 10pA enable SGM321/358/324 to
be used for integrators, photodiode amplifiers and
piezoelectric sensors. Rail-to-rail input and output are
useful to designers for buffering ASIC in single-supply
systems.
Applications for this series of amplifiers include safety
monitoring, portable equipment, battery and power
supply control, and signal conditioning and interfacing
for transducers in very low power systems.
The SGM321 is available in Green SOT-23-5 and
SC70-5 packages. The SGM358 is available in Green
SOIC-8, MSOP-8 and DIP-8 packages. The SGM324 is
available in Green SOIC-14 and TSSOP-14 packages.
-0.1V to 5.6V with VS = 5.5V
• Low Supply Current: 60μA/Amplifier
• Small Packaging:
SGM321 Available in SOT-23-5 and SC70-5
SGM358 Available in SOIC-8, MSOP-8 and DIP-8
SGM324 Available in SOIC-14 and TSSOP-14
APPLICATIONS
ASIC Input or Output Amplifier
Sensor Interface
Piezoelectric Transducer Amplifier
Medical Instrumentation
Mobile Communication
Audio Output
Portable System
Smoke Detector
Notebook PC
PCMCIA Card
Battery-Powered Equipment
DSP Interface
SG Micro Corp
www.sg-micro.com
APRIL 2019 – REV. E. 2
1MHz, 60μA, Rail-to-Rail I/O
CMOS Operational Amplifiers
SGM321/SGM358/SGM324
PACKAGE/ORDERING INFORMATION
MODEL
SGM321
SGM358
SGM324
PACKAGE
DESCRIPTION
SPECIFIED
TEMPERATURE
RANGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
SC70-5
-40℃ to +85℃
SGM321YC5/TR
321
Tape and Reel, 3000
SOT-23-5
-40℃ to +85℃
SGM321YN5/TR
321
Tape and Reel, 3000
SOT-23-5
-40℃ to +85℃
SGM321BYN5/TR
321B
Tape and Reel, 3000
SOIC-8
-40℃ to +85℃
SGM358YS/TR
MSOP-8
-40℃ to +85℃
SGM358YMS/TR
DIP-8
-40℃ to +85℃
SGM358YP
SOIC-14
-40℃ to +85℃
SGM324YS14/TR
TSSOP-14
-40℃ to +85℃
SGM324YTS14/TR
SGM358YS
XXXXX
SGM358
YMS
XXXXX
SGM358YP
XXXXX
SGM324YS14
XXXXX
SGM324
YTS14
XXXXX
Tape and Reel, 4000
Tape and Reel, 3000
20 Tube (1000pcs)
Tape and Reel, 2500
Tape and Reel, 3000
MARKING INFORMATION
NOTE: XXXXX = Date Code and Vendor Code.
XXXXX
Vendor Code
Date Code - Week
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, +VS to -VS................................................. 6V
Input Common Mode Voltage Range
.................................................... (-VS) - 0.3V to (+VS) + 0.3V
Package Thermal Resistance @ TA = +25℃
SC70-5, θJA .............................................................. 333℃/W
SOT-23-5, θJA .......................................................... 190℃/W
SOIC-8, θJA .............................................................. 125℃/W
MSOP-8, θJA ............................................................ 216℃/W
Junction Temperature .................................................+150℃
Storage Temperature Range ....................... -65℃ to +150℃
Lead Temperature (Soldering, 10s) ............................+260℃
ESD Susceptibility
HBM ............................................................................. 4000V
MM ................................................................................ .400V
RECOMMENDED OPERATING CONDITIONS
Operating Temperature Range ....................... -40℃ to +85℃
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage
because very small parametric changes could cause the
device not to meet its published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
APRIL 2019
2
1MHz, 60μA, Rail-to-Rail I/O
CMOS Operational Amplifiers
SGM321/SGM358/SGM324
PIN CONFIGURATIONS
SGM321YN5/
SGM321YC5 (TOP VIEW)
1
-VS
2
-IN
3
5
+VS
OUT
1
-VS
2
+IN
3
5
+VS
4
-IN
+
+IN
SGM321BYN5 (TOP VIEW)
_
4
OUT
SOT-23-5/SC70-5
+
_
SOT-23-5
SGM324 (TOP VIEW)
SGM358 (TOP VIEW)
OUTA
1
-INA
2
_
+INA
3
+
-VS
4
8
+VS
7
OUTB
_
6
-INB
+
5
+INB
OUTA
1
-INA
2
_
+INA
3
+
+VS
4
+INB
5
-INB
6
OUTB
7
14
OUTD
_
13
-IND
+
12
+IND
11
-VS
10
+INC
9
-INC
8
OUTC
+
+
_
_
SOIC-8/MSOP-8/DIP-8
TSSOP-14/SOIC-14
SG Micro Corp
www.sg-micro.com
APRIL 2019
3
1MHz, 60μA, Rail-to-Rail I/O
CMOS Operational Amplifiers
SGM321/SGM358/SGM324
ELECTRICAL CHARACTERISTICS
(At VS = +5V, RL = 100kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted.)
SGM321/358/324
PARAMETER
SYMBOL
CONDITIONS
TYP
MIN/MAX OVER TEMPERATURE
+25℃
+25℃
0.8
5
-40℃ to
+85℃
UNITS
MIN/MAX
mV
MAX
INPUT CHARACTERISTICS
Input Offset Voltage
VOS
VCM = VS/2
5.6
Input Bias Current
IB
10
pA
TYP
Input Offset Current
IOS
10
pA
TYP
Input Common Mode Voltage Range
VCM
-0.1 to 5.6
V
TYP
dB
MIN
dB
MIN
μV/℃
TYP
4.970
V
MIN
Common Mode Rejection Ratio
CMRR
Open-Loop Voltage Gain
AOL
Input Offset Voltage Drift
ΔVOS/ΔT
VS = 5.5V
VS = 5.5V, VCM = -0.1V to 4V
70
62
62
VS = 5.5V, VCM = -0.1V to 5.6V
68
56
55
RL = 5kΩ, VOUT = 0.1V to 4.9V
80
70
70
RL = 100kΩ, VOUT = 0.035V to 4.965V
84
80
80
2.7
OUTPUT CHARACTERISTICS
VOH
Output Voltage Swing from Rail
Output Current
RL = 100kΩ
4.997
4.980
VOL
RL = 100kΩ
5
20
30
mV
MAX
VOH
RL = 10kΩ
4.992
4.970
4.960
V
MIN
VOL
RL = 10kΩ
8
30
40
mV
MAX
84
60
45
75
60
45
mA
MIN
ISOURCE
ISINK
RL = 10Ω to VS/2
POWER SUPPLY
2.1
2.5
V
MIN
5.5
5.5
V
MAX
82
60
58
dB
MIN
60
80
86
μA
MAX
1
MHz
TYP
Operating Voltage Range
Power Supply Rejection Ratio
Quiescent Current/Amplifier
PSRR
VS = 2.5V to 5.5V, VCM = 0.5V
IQ
DYNAMIC PERFORMANCE (CL = 100pF)
Gain-Bandwidth Product
Slew Rate
Settling Time to 0.1%
GBP
SR
G = +1, 2V Output Step
0.52
V/μs
TYP
tS
G = +1, 2V Output Step
5.3
μs
TYP
VIN ·G = VS
2.6
μs
TYP
f = 1kHz
27
nV/
Hz
TYP
f = 10kHz
20
nV/
Hz
TYP
Overload Recovery Time
NOISE PERFORMANCE
Input Voltage Noise Density
SG Micro Corp
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en
APRIL 2019
4
1MHz, 60μA, Rail-to-Rail I/O
CMOS Operational Amplifiers
SGM321/SGM358/SGM324
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃, VS = 5V, and RL = 100kΩ connected to VS/2, unless otherwise noted.
Supply Current vs. Temperature
75
110
70
65
60
55
50
Open-Loop Gain vs. Temperature
120
Open–Loop Gain (dB)
Supply Current/Amplifier (μA)
80
RL = 100kΩ
100
90
RL = 5kΩ
80
70
-50
-25
0
25
50
75
100
125
60
150
Temperature (℃)
-50
Common Mode Rejection Ratio vs. Temperature
25
-VS < VCM < (+VS) - 1.5V
100
125
150
110
PSRR (dB)
100
90
-VS < VCM < (+VS)
80
70
90
80
70
-50
-25
0
25
50
75
100
125
60
150
-50
-25
0
25
Temperature (℃)
70
100
Short-Circuit Current (mA)
120
60
50
40
30
20
10
1
2
SG Micro Corp
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3
4
5
Supply Voltage (V)
75
100
125
150
Short-Circuit Current vs. Supply Voltage
80
0
50
Temperature (℃)
Supply Current vs. Supply Voltage
Supply Current/Amplifier (μA)
75
Power Supply Rejection Ratio vs. Temperature
100
0
50
120
110
CMRR (dB)
0
Temperature (℃)
120
60
-25
6
7
80
60
40
20
0
-20
0
1
2
3
4
5
Supply Voltage (V)
6
7
APRIL 2019
5
1MHz, 60μA, Rail-to-Rail I/O
CMOS Operational Amplifiers
SGM321/SGM358/SGM324
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VS = 5V, and RL = 100kΩ connected to VS/2, unless otherwise noted.
Output Voltage Swing vs. Output Current
6
Sourcing Current
+135℃
+25℃
4
-55℃
3
VS = 5V
2
-55℃
1
+135℃
0
20
40
60
+25℃
80
+135℃
2.0
1.5
VS = 3V
1.0
0.5
Sinking Current
100
120
140
0.0
160
+135
0
10
Maximum Output Voltage vs. Frequency
VS = 5.5V
VS = 2.5V
CMRR and PSRR (dB)
Output Voltage (Vp-p)
Maximum Output Voltage
without Slew Rate
Induced Distortion
2
1
0
40
50
60
80
70
60
CMRR
50
40
PSRR
30
20
10
1
10
100
1000
0
0.01
10000
0.1
1
10
100
1000
Input Voltage Noise Density vs. Frequency
Open-Loop Gain and Phase vs. Frequency
80
1000
RL = 10kΩ
CL = 100pF
Open-Loop Gain (dB)
60
100
Open-Loop Gain
0.1
1
Frequency (kHz)
SG Micro Corp
www.sg-micro.com
10
100
0
-30
40
-60
20
-90
Phase
0
-120
-20
10
0.01
10000
Frequency (kHz)
Frequency (kHz)
Inout Voltage Noise Density (nV/√Hz)
Sinking Current
90
VS = 5V
3
30
-55℃
CMRR and PSRR vs. Frequency
100
6
4
20
+25℃
Output Current (mA)
Output Current (mA)
5
+25℃ -55℃
2.5
-40
Phase (Degree)
0
Sourcing Current
3.0
Output Voltage (V)
5
Output Voltage (V)
Output Voltage Swing vs. Output Current
3.5
-150
0.1
1
10
100
1000
-180
10000
Frequency (kHz)
APRIL 2019
6
1MHz, 60μA, Rail-to-Rail I/O
CMOS Operational Amplifiers
SGM321/SGM358/SGM324
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VS = 5V, and RL = 100kΩ connected to VS/2, unless otherwise noted.
Small-Signal Overshoot vs. Load Capacitance
Small-Signal Overshoot vs. Load Capacitance
60
50
G = -1
RFB = 100kΩ
40
30
G = +1
RL = 100kΩ
20
G = -1
RFB = 5kΩ
10
0
Small-Signal Overshoot (%)
Small-Signal Overshoot (%)
60
10
100
1000
50
40
30
20
10
0
10000
Load Capacitance (pF)
100
1000
10000
Large-Signal Step Response
G = +1
CL = 100pF
RL = 100kΩ
Output Voltage (500mV/div)
Output Voltage (20mV/div)
Time (2μs/div)
10
Load Capacitance (pF)
Small-Signal Step Response
G = +1
CL = 100pF
RL = 100kΩ
G = -5
RFB = 100kΩ
Time (10μs/div)
Overload Recovery Time
2.5V
VS = 5V
G = -5
VIN = 500mV
0V
500mV
0V
Time (2μs/div)
SG Micro Corp
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APRIL 2019
7
1MHz, 60μA, Rail-to-Rail I/O
CMOS Operational Amplifiers
SGM321/SGM358/SGM324
APPLICATION NOTES
Driving Capacitive Loads
The SGM321/SGM358/SGM324 can directly drive
250pF in unity-gain without oscillation. The unity-gain
follower (buffer) is the most sensitive configuration to
capacitive loading. Direct capacitive loading reduces
the phase margin of amplifiers and this results in
ringing or even oscillation. Applications that require
greater capacitive driving capability should use an
isolation resistor between the output and the capacitive
load like the circuit in Figure 1. The isolation resistor
RISO and the load capacitor CL form a zero to increase
stability. The bigger the RISO resistor value, the more
stable VOUT will be. Note that this method results in a
loss of gain accuracy because RISO forms a voltage
divider with the RLOAD.
_
Power Supply Bypassing and Layout
The SGM321/SGM358/SGM324 can operate from
either a single 2.1V to 5.5V supply or dual ±1.05V to
±2.75V supplies. For single-supply operation, bypass
the power supply +VS with a 0.1µF ceramic capacitor
which should be placed close to the +VS pin. For
dual-supply operation, both the +VS and the -VS
supplies should be bypassed to ground with separate
0.1µF ceramic capacitors. 2.2µF tantalum capacitor
can be added for better performance.
RISO
SGM321
+VS
VOUT
+
VIN
For non-buffer configuration, there are two other ways
to increase the phase margin: (a) by increasing the
amplifier’s closed-loop gain or (b) by placing a
capacitor in parallel with the feedback resistor to
counteract the parasitic capacitance associated with
inverting node.
+VS
CL
10μF
10μF
0.1μF
0.1μF
Figure 1. Indirectly Driving Heavy Capacitive Load
An improved circuit is shown in Figure 2. It provides DC
accuracy as well as AC stability. RF provides the DC
accuracy by connecting the inverting input with the
output. CF and RISO serve to counteract the loss of
phase margin by feeding the high frequency component
of the output signal back to the amplifier’s inverting
input, thereby preserving phase margin in the overall
feedback loop.
RF
SGM321
VIN
+
VN
_
VOUT
SGM321
VP
_
VOUT
SGM321
VP
+
+
10μF
0.1μF
-VS (GND)
-VS
CF
_
VN
Figure 3. Amplifier with Bypass Capacitors
RISO
VOUT
CL
RL
Figure 2. Indirectly Driving Heavy Capacitive Load with
DC Accuracy
SG Micro Corp
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APRIL 2019
8
1MHz, 60μA, Rail-to-Rail I/O
CMOS Operational Amplifiers
SGM321/SGM358/SGM324
TYPICAL APPLICATION CIRCUITS
Differential Amplifier
The circuit shown in Figure 4 performs the difference
function. If the resistor ratios are equal (R4/R3 = R2/R1),
then VOUT = (VP - VN) × R2/R1 + VREF.
R2
R1
VN
_
SGM321
VP
R3
VOUT
Active Low-Pass Filter
The low-pass filter shown in Figure 6 has a DC gain of
(-R2/R1) and the -3dB corner frequency is 1/2πR2C.
Make sure the filter bandwidth is within the bandwidth
of the amplifier. Feedback resistors with large values
can couple with parasitic capacitance and cause
undesired effects such as ringing or oscillation in
high-speed amplifiers. Keep resistor values as low as
possible and consistent with output loading consideration.
+
C
R2
R1
R4
VIN
VREF
_
SGM321
VOUT
+
Figure 4. Differential Amplifier
Instrumentation Amplifier
R3 = R1 // R2
The circuit in Figure 5 performs the same function as
that in Figure 4 but with a high input impedance.
Figure 6. Active Low-Pass Filter
R2
_
R1
SGM321
VN
_
+
SGM321
VOUT
+
VP
+
R3
R4
SGM321
_
VREF
Figure 5. Instrumentation Amplifier
SG Micro Corp
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APRIL 2019
9
SGM321/SGM358/SGM324
1MHz, 60μA, Rail-to-Rail I/O
CMOS Operational Amplifiers
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
APRIL 2019 ‒ REV.E.1 to REV.E.2
Page
Added Open-Loop Gain and Phase vs. Frequency .............................................................................................................................................. 6
MARCH 2017 ‒ REV.E to REV.E.1
Page
Updated Package/Ordering Information section ................................................................................................................................................... 2
NOVEMBER 2015 ‒ REV.D.4 to REV.E
Page
Updated Packing Option of DIP-8 ........................................................................................................................................................................ 2
Updated SOIC-14 and TSSOP-14 packages ............................................................................................................................................... 14, 15
JANUARY 2013 ‒ REV.D.3 to REV.D.4
Page
Added Tape and Reel Information section ................................................................................................................................................... 16, 17
SG Micro Corp
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APRIL 2019
10
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOT-23-5
1.90
D
e1
E1
2.59
E
0.99
b
e
0.69
0.95
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
c
0.2
Dimensions
In Inches
MIN
MAX
A
1.050
1.250
0.041
0.049
A1
0.000
0.100
0.000
0.004
A2
1.050
1.150
0.041
0.045
b
0.300
0.500
0.012
0.020
c
0.100
0.200
0.004
0.008
D
2.820
3.020
0.111
0.119
E
1.500
1.700
0.059
0.067
E1
2.650
2.950
0.104
0.116
e
0.950 BSC
0.037 BSC
e1
1.900 BSC
0.075 BSC
SG Micro Corp
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L
0.300
0.600
0.012
0.024
θ
0°
8°
0°
8°
TX00033.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SC70-5
D
e1
0.65
e
E1
1.9
E
0.75
b
0.4
1.3
RECOMMENDED LAND PATTERN (Unit: mm)
L
L1
A
θ
A1
c
0.20
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
0.900
1.100
0.035
0.043
A1
0.000
0.100
0.000
0.004
A2
0.900
1.000
0.035
0.039
b
0.150
0.350
0.006
0.014
c
0.080
0.150
0.003
0.006
D
2.000
2.200
0.079
0.087
E
1.150
1.350
0.045
0.053
E1
2.150
2.450
0.085
0.096
e
0.65 TYP
0.026 TYP
e1
1.300 BSC
0.051 BSC
L
0.525 REF
0.021 REF
L1
0.260
0.460
0.010
0.018
θ
0°
8°
0°
8°
SG Micro Corp
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TX00043.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-8
0.6
D
e
2.2
E1
E
5.2
b
1.27
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
1.350
1.750
0.053
0.069
A1
0.100
0.250
0.004
0.010
A2
1.350
1.550
0.053
0.061
b
0.330
0.510
0.013
0.020
c
0.170
0.250
0.006
0.010
D
4.700
5.100
0.185
0.200
E
3.800
4.000
0.150
0.157
E1
5.800
6.200
0.228
0.244
e
SG Micro Corp
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1.27 BSC
0.050 BSC
L
0.400
1.270
0.016
0.050
θ
0°
8°
0°
8°
TX00010.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
MSOP-8
b
E1
E
4.8
1.02
e
0.41
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
D
L
A
A1
c
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
0.820
1.100
0.032
0.043
A1
0.020
0.150
0.001
0.006
A2
0.750
0.950
0.030
0.037
b
0.250
0.380
0.010
0.015
c
0.090
0.230
0.004
0.009
D
2.900
3.100
0.114
0.122
E
2.900
3.100
0.114
0.122
E1
4.750
5.050
0.187
0.199
e
SG Micro Corp
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0.650 BSC
0.026 BSC
L
0.400
0.800
0.016
0.031
θ
0°
6°
0°
6°
TX00014.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-14
D
E
5.2
E1
2.2
e
b
0.6
1.27
RECOMMENDED LAND PATTERN (Unit: mm)
L1
R1
R
A3
A A2
h
L2
θ
A1
Symbol
h
L
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
A2
1.25
1.65
0.049
0.065
A3
0.55
0.75
0.022
0.030
b
0.36
0.49
0.014
0.019
D
8.53
8.73
0.336
0.344
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
e
L
1.27 BSC
0.45
L1
0.80
0.018
1.04 REF
L2
0.157
0.050 BSC
0.032
0.040 REF
0.25 BSC
0.01 BSC
R
0.07
0.003
R1
0.07
0.003
h
0.30
0.50
0.012
0.020
θ
0°
8°
0°
8°
SG Micro Corp
www.sg-micro.com
TX00011.001
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSSOP-14
D
E
E1
5.94
1.78
e
b
0.42
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
1.200
0.047
A
A1
c
H
0.050
0.150
0.002
0.006
A2
0.800
1.050
0.031
0.041
b
0.190
0.300
0.007
0.012
c
0.090
0.200
0.004
0.008
D
4.860
5.100
0.191
0.201
E
4.300
4.500
0.169
0.177
E1
6.250
6.550
0.246
0.258
0.700
0.02
e
L
0.650 BSC
0.500
H
θ
SG Micro Corp
www.sg-micro.com
0.026 BSC
0.25 TYP
1°
0.028
0.01 TYP
7°
1°
7°
TX00019.001
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
DIP-8
E1
b1
e
A2
A
A1
L
b
c
E2
D
E
Symbol
Dimensions
In Millimeters
MIN
MAX
A
3.710
A1
0.510
A2
3.200
3.600
0.126
0.142
b
0.380
0.570
0.015
0.022
b1
4.310
Dimensions
In Inches
MIN
MAX
0.146
0.170
0.020
1.524 BSC
0.060 BSC
c
0.204
0.360
0.008
0.014
D
9.000
9.400
0.354
0.370
E
6.200
6.600
0.244
0.260
E1
7.320
7.920
0.288
0.312
e
2.540 BSC
0.100 BSC
L
3.000
3.600
0.118
0.142
E2
8.400
9.000
0.331
0.354
SG Micro Corp
www.sg-micro.com
TX00051.000
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
W
P0
Q1
Q2
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
Q3
Q4
B0
Reel Diameter
K0
A0
P1
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel
Diameter
Reel Width
W1
(mm)
A0
(mm)
B0
(mm)
K0
(mm)
P0
(mm)
P1
(mm)
P2
(mm)
W
(mm)
Pin1
Quadrant
SOT-23-5
7″
9.5
3.20
3.20
1.40
4.0
4.0
2.0
8.0
Q3
SC70-5
7″
9.5
2.25
2.55
1.20
4.0
4.0
2.0
8.0
Q3
SOIC-8
13″
12.4
6.40
5.40
2.10
4.0
8.0
2.0
12.0
Q1
MSOP-8
13″
12.4
5.20
3.30
1.50
4.0
8.0
2.0
12.0
Q1
SOIC-14
13″
16.4
6.60
9.30
2.10
4.0
8.0
2.0
16.0
Q1
TSSOP-14
13″
12.4
6.95
5.60
1.20
4.0
8.0
2.0
12.0
Q1
SG Micro Corp
www.sg-micro.com
TX10000.000
DD0001
Package Type
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Pizza/Carton
7″ (Option)
368
227
224
8
7″
442
410
224
18
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
DD0002
Reel Type
TX20000.000
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湘ICP备2023018690号
