SGM330A-YS

SGM330A GENERAL DESCRIPTION The SGM330A is a Quad, bidirectional, single-pole/doublethrow (SPDT) CMOS Video analog switches (Mux/DeMux) designed to operate at a single +5V supply. This 2-channel multiplexer/demultiplexer is recommended for both RGB and composite video switching applications. The Video Switch can be driven from a current output RAMDAC or voltage output composite video source. Wide bandwidth (500MHz) , low On-Resistance (6Ω) , and low crosstalk make it suitable for high-frequency and other applications. Also this device has exceptionally high current capability which is far greater than most analog switches offered today. The SGM330A offers a high-performance, low-cost solution to switch between video sources. It is specified –40°C to +85°C temperature range. The SGM330A has lead (Pb) Quad, Wide-Bandwidth SPDT Video Analog Switch FEATURES − − − − − − − − − Wide Bandwidth: 500 MHz Low On-Resistance: 6Ω(TYP) Low Crosstalk: -60dB @ 10MHz(TYP) Single Power Operation: +5V Fast Switching Time Rail-to-Rail Operation Typical Power Consumption (0.1 µW) TTL/CMOS Compatible Micro size Package SO-16 TSSOP-16 QSOP-16 free SOIC-16, TSSOP-16 and QSOP-16 packages. PIN CONFIGURATIONS（TOP VIEW） APPLICATIONS Personal Video Recorders Terrestrial Set-Top Boxes Hard Disk Recorders DVD Players Game Consoles Digital VCRs Desktop Video Editors Audio and Video Switching IN S1A S2A DA S1B S2B DB GND 1 2 3 4 5 6 7 8 SGM330A 16 V+ 15 EN 14 S1D 13 S2D 12 DD 11 S1C 10 S2C 9 DC QSOP-16/SO-16/TSSOP-16 Shengbang Microelectronics Co, Ltd Tel: 86/451/84348461 www.sg-micro.com Rev. A ORDERING INFORMATION ORDERING NUMBER SGM330A-YS/TR SGM330A-YTS/TR SGM330A-YQS/TR PIN- PACKAGE SPECIFIED TEMPERATURE RANGE PACKAGE MARKING SGM330A-YS SGM330A-YTS SGM330A-YQS PACKAGE OPTION SO-16 TSSOP-16 QSOP-16 - 40°C to +85°C - 40°C to +85°C - 40°C to +85°C Tape and Reel, 2500 Tape and Reel, 3000 Tape and Reel, 3000 ABSOLUTE MAXIMUM RATINGS Supply Voltage to Ground Potential ( Inputs & V+ only )... - 0.5V to +6V Supply Voltage to Ground Potential ( Ouputs & D only ) .. - 0.5V to +6V DC Input Voltage ..................................................................... - 0.5V to +6V DC Output Current ............................................................................ 200mA Operating Temperature Range............................................ - 40°C to +85°C Junction Temperature.......................................................................+150°C Storage Temperature........................................................- 65°C to +150°C Package Thermal Resistance @ TA = 25℃ SO-16, θJA............................................................................................. 82℃/W TSSOP-16, θJA.....................................................................................100℃/W QSOP-16, θJA.......................................................................................103℃/W Lead Temperature ( soldering, 10s ) .................................................260°C ESD Susceptibility HBM........................................................................................................4000V MM........................................................................... ................................400V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. BLOCK DIAGRAM（positive logic） DA 4 2 3 DB 7 5 6 DC 9 11 10 DD 12 14 13 S1A S2A S1B S2B S1C S2C S1D S2D PIN DESCRIPTION NAME S1A, S1B, S1C, S1D S2A, S2B, S2C, S2D IN FUNCTION Analog video I/O Select input Switch-enable input Analog video I/O Ground Power supply EN DA, DB, DC, DD GND V+ DECODER/DRIVERS 15 EN 1 IN FUNCTION TABLE EN 0 0 1 IN 0 1 X ON Switch S1A, S1B, S1C, S1D S2A, S2B, S2C, S2D Disabled Notes: S1 is normally connected when IN is ʺ0ʺ. 2 SGM330A ELECTRICAL CHARACTERISTICS (Over the Operating Range, V+ = +5 V ± 10%, TA = - 40°C to +85°C.) PARAMETER DC CHARACTERISTICS Analog Signal Range On-Resistance Input High Voltage Input Low Voltage Input High Current Input Low Current Analog Output Leakage Current Short Circuit Current Clamp Diode Voltage Input Hysteresis at Control Pins DYNAMIC CHARACTERISTICS Turn-On Time Turn-Off Time Off Isolation Channel-to-Channel Crosstalk Bandwidth –3 dB Input/Enable Capacitance Switch OFF Capacitance Switch ON Capacitance Differential Gain Differential Phase POWER REQUIREMENTS Quiescent Power Supply Current Supply Current per Input @ TTL HIGH Supply Current per Input per MHz ICC △ICC V+ = +5.5V, IN = GND or 5V V+ = +5.5V, IN = 3.4V V+ = +5.5V,, S1, S2 and D Pins Open ICCD 0.1 20.0 300 µA uA mA/ MHz TON TOFF OIRR XTALK BW CIN COFF CON DG DP RL = 70Ω, CL = 20pF( Figure 1) RL = 70Ω, CL = 20pF( Figure 1) RL = 150Ω, f = 10MHz( Figure 5) RIN = 10Ω, RL = 150Ω, f = 10MHz( Figure 4) RL = 150Ω( Figure 3) VIN = 0V, f = 1MHz VIN = 0V, f = 1MHz VIN = 0V, f = 1MHz RL = 150Ω, f = 3.58MHz( Figure 2) RL = 150Ω, f = 3.58MHz( Figure 2) 0.51 0.01 14 4 -55 -60 500 5 5 8 17 7 ns ns dB dB MHz pF pF pF % ° VANALOG RON VIH VIL IIH IIL IO IOS VIK VH VCC = 4.5V, IIN = -18mA -0.7 V+ = 4.5V, VI = 1.0V, RL = 75Ω, ION = 13mA V+ = 4.5V, VI = 2.0V, RL = 75Ω, ION = 26mA Guaranteed Logic HIGH Level Guaranteed Logic LOW Level V+ = 5.5V, VIN = V+ V+ = 5.5V, VIN = GND 0 ≤ S1, S2, or D ≤ V+ , Switch OFF 230 -0.9 200 2.0 -0.5 0.8 ±1 ±1 ±1 0 6 7 2.0 9 10 V Ω Ω V V µA µA µA mA V mV SYMBOL CONDITIONS MIN TYP(1) MAX UNITS EN = GND Control Input Toggling 50% Duty Cycle 0.1 Specifications subject to change without notice. Notes: 1. Typical values are at VCC = 5.0V, TA = 25°C ambient and maximum loading. ３ SGM330A PARAMETER DEFINITIONS PARAMETER RON IO VIN VI VEN CIN COFF CON VIH VIL IIH (IIL) IOS TON TOFF BW XTALK DG DESCRIPTION Resistance between source and drain with switch in the ON state Output leakage current measured at S1, S2, and D with the switch OFF Digital voltage at the IN pin that selects between S1 and S2 analog inputs Voltage applied to the D or S1, S2 pins when D or S1, S2 is the switch input A voltage that ENABLES the chip Capacitance at the digital inputs Capacitance at analog I/O (S1, S2, D) with switch OFF Capacitance at analog I/O (S1, S2, D) with switch ON Minimum input voltage for logic HIGH Minimum input voltage for logic LOW Input current of the digital input Minimum short circuit current for S1, S2 and D Propagation delay measured between 50% of the digital input to 90% of the analog output when switch is turned ON. The peak analog voltage is 0.714V Propagation delay measured between 50% of the digital input to 90% of the analog output when switch is turned OFF. The peak analog voltage is 0.714V response of the switch in the ON state measured at 3dB down Is an unwanted signal coupled from channel to channel. Measured in –dB. XTALK = 20 LOG VOUT/VIN. This is non-adjacent crosstalk Magnitude variation between analog input and output pins when the switch is ON and the dc offset of composite-video signal varies at the analog input pin. In the NTSC standard, the frequency of the video signal is 3.58 MHz, and dc offset is from 0 to 0.714 V. Phase variation between analog input and output pins when the switch is ON and the dc offset of composite-video signal varies at the analog input pin. In the NTSC standard, the frequency of the video signal is 3.58 MHz, and dc offset is from 0 to 0.714 V. Off isolation is the resistance (measured in –dB) between the input and output with the switch off (NO) DP OIRR CAUTION This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. Shengbang Micro-electronics recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ４ SGM330A TYPICAL PERFORMANCE CHARACTERISTICS On Response vs.Frequency 3 V+ = +5V TA = +25℃ 0 On Response(dB) Power Supply Current vs.Enable Voltage 800 700 Power Supply Current( µA) 600 500 400 300 200 100 0 V+ = +5V TA = +25℃ -3 -6 -9 0.1 1 10 Frequency(MHz) 100 1000 0 1 2 3 Enable Voltage(V) 4 5 Crosstalk vs.Frequency -20 -30 -40 Crosstalk(dB) -50 -60 -70 -80 -90 -100 0.01 V+ = +5V TA = +25℃ Off Isolation(dB) -20 -30 -40 -50 -60 -70 -80 -90 -100 0.01 Off Isolation vs.Frequency V+ = +5V TA = +25℃ 0.1 1 10 Frequency(MHz) 100 1000 0.1 1 10 Frequency(MHz) 100 1000 ５ SGM330A TEST CIRCUITS VCC Input Generator VIN VG1 50Ω 50Ω IN S1 VS1 S2 VS2 DUT D EN VO CL(1) RL Test TON TOFF VCC 5V±0.5V 5V±0.5V 5V±0.5V 5V±0.5V RL 75 75 75 75 CL 20 20 20 20 VS1 GND 3V GND 3V VS2 3V GND 3V GND Output Control (VIN) 3V 50% 50% 0V Analog Ouput Waveform (VO) tON 90% 90% VOH 0V tOFF VOLTAGE WAVEFORMS TON AND TOFF TIMES NOTES: 1. CL includes probe and jig capacitance. 2. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. 3. The outputs are measured one at a time, with one transition per measurement. Figure 1. Test Circuit for Voltage Waveform and Switch Time ６ SGM330A TEST CIRCUITS(continued) EXT TRIGGER VBIAS P2 RL = 150Ω S1A BIAS Sawtooth Waveform Generator Network Analyzer (HP8753ES) P1 VCC DUT DA IN EN VEN VIN Figure 2. Test Circuit for Differential Gain/Phase Measurement Differential gain and phase are measured at the output of the ON channel. For example, when VIN = 0, VEN = 0, and DA is the input, the output is measured at S1A. HP8753ES Setup Average = 20 RBW = 300 Hz ST = 1.381 s P1 = –7 dBM CW frequency = 3.58 MHz Sawtooth Waveform Generator Setup VBIAS = 0 to 1 V Frequency = 0.905 Hz ７ SGM330A TEST CIRCUITS(continued) EXT TRIGGER P2 RL = 150Ω BIAS VBIAS S1A Network Analyzer (HP8753ES) P1 VCC DUT DA IN VIN EN VEN Figure3. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VIN = 0, VEN = 0, and DA is the input, the output is measured at S1A. All unused analog I/O ports are left open. HP8753ES Setup Average = 4 RBW = 3 Hz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM ８ SGM330A TEST CIRCUITS(continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 VCC DA IN S1A RL = 150Ω 50Ω(1) P2 VIN EN VEN DB RIN = 10Ω DUT S 1B RL = 150Ω NOTES: (1) A 50Ω termination resistor is needed for the network analyzer. Figure 4. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VIN = 0, VEN = 0, and DA is the input, the output is measured at S1B. All unused analog input (D) ports and output (S) ports are connected to GND through 10Ω and 50Ω pulldown resistors, respectively. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM ９ SGM330A TEST CIRCUITS(continued) EXT TRIGGER P2 RL = 150Ω S1A S2A RL = 150Ω 50Ω(1) BIAS VBIAS Network Analyzer (HP8753ES) P1 VCC DUT DA IN EN VIN VEN NOTES: (1) A 50Ω termination resistor is needed for the network analyzer. Figure 5. Test Circuit for Off Isolation (OIRR) Off isolation is measured at the output of the OFF channel. For example, when VIN = VCC, VEN = 0, and DA is the input, the output is measured at S1A. All unused analog input (D) ports are left open, and output (S) ports are connected to GND through 50Ω pulldown resistors. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM １０ SGM330A PACKAGE OUTLINE DIMENSIONS SO-16 D C L Symbol A A1 A2 b c D E E1 e L θ E1 Dimensions In Millimeters Min Max 1.350 1.750 0.100 0.250 1.350 1.550 0.330 0.510 0.170 0.250 9.800 10.20 3.800 4.000 5.800 6.200 1.270 (BSC) 0.400 1.270 0° 8° Dimensions In Inches Min Max 0.053 0.069 0.004 0.010 0.053 0.061 0.013 0.020 0.007 0.010 0.386 0.402 0.150 0.157 0.228 0.244 0.050 (BSC) 0.016 0.050 0° 8° E θ e A2 A1 b A １１ SGM330A PACKAGE OUTLINE DIMENSIONS TSSOP-16 A b Symbol E1 E Dimensions In Millimeters Min Max 5.100 4.500 0.300 0.200 6.550 1.100 0.800 1.000 0.020 0.150 0.65 (BSC) 0.500 0.700 0.25(TYP) 1° 7° 4.900 4.300 0.190 0.090 6.250 Dimensions In Inches Min Max 0.193 0.169 0.007 0.004 0.246 0.201 0.177 0.012 0.008 0.258 0.043 0.031 0.039 0.001 0.006 0.026 (BSC) 0.020 0.028 0.01(TYP) 1° 7° PIN #1 IDENT. e A2 A C θ D L H A1 A D E b c E1 A A2 A1 e L H θ １２ SGM330A PACKAGE OUTLINE DIMENSIONS QSOP-16 D 7o e ZD 0.254 (0.010) Symbol A A1 A2 b C D E E1 e h L α ZD Dimensions In Millimeters Min Max 1.35 1.75 0.10 0.25 1.37 1.50 0.20 0.30 0.19 0.25 4.8 4.98 5.79 6.20 3.81 3.99 0.635 BSC 0.22 0.49 0.40 0.27 0° 8° 0.230 REF E1 L PIN NO 1 b DETAIL-A 7o±3 o GAUGE PLANE A2 E h x 45o α DETAIL“A” A1 A C １３ SGM330A