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SGM4056-6.8YPS8G/TR

SGM4056-6.8YPS8G/TR

  • 厂商:

    SGMICRO(圣邦微)

  • 封装:

    SOIC8_150MIL_EP

  • 描述:

    高输入电压充电器

  • 数据手册
  • 价格&库存
SGM4056-6.8YPS8G/TR 数据手册
SGM4056 High Input Voltage Charger GENERAL DESCRIPTION FEATURES The SGM4056 is a cost-effective, fully integrated high ● Complete Charger for Single-Cell Li-Ion or input voltage single-cell Li-Ion battery charger. The Polymer Batteries charger uses a CC/CV charge profile required by Li-Ion ● Integrated Pass Element and Current Sensor battery. The charger accepts an input voltage up to ● No External Blocking Diode Required 26.5V but is disabled when the input voltage exceeds ● Low Component Count and Cost the OVP threshold, typically 6.8V (SGM4056-6.8) or ● Programmable Charge Current 10.5V (SGM4056-10.5), to prevent excessive power ● Programmable End-of-Charge Current dissipation. The 26.5V rating eliminates the over- ● Charge Current Thermal Foldback for Thermal voltage protection circuit required in a low input voltage Protection ● 2.55V Trickle Charge Threshold charger. The charge current and the end-of-charge (EOC) current are programmable with external resistors. When the battery voltage is lower than typically 2.55V, the charger preconditions the battery with typically 18% of the programmed charge current. When the charge current reduces to the programmable EOC current level during the CV charge phase, an EOC indication is provided by the CHG pin, which is an open-drain output. An internal thermal foldback function protects the charger from any thermal failure. Two indication pins ( PPR and CHG ) allow simple interface to a microprocessor or LEDs. When no adapter is attached or when disabled, the charger draws less than 1μA leakage current from the battery. ● 6.8V Input Over-Voltage Protection for SGM4056-6.8 ● 10.5V Input Over-Voltage Protection for SGM4056-10.5 ● 26.5V Maximum Voltage for the Power Input ● Power Presence and Charge Indications ● Less than 1μA Leakage Current off the Battery When No Input Power Attached or Charger Disabled ● Available in Green TDFN-3×3-8L, TDFN-2×3-8L, TDFN-2×2-8L and SOIC-8 (Exposed Pad) Packages APPLICATIONS Mobile Phones The SGM4056 is available in Green TDFN-3×3-8L, Blue-Tooth Devices TDFN-2×3-8L, TDFN-2×2-8L and SOIC-8 (Exposed PDAs Pad) packages and is rated over the -40℃ to +85℃ MP3 Players temperature range. Stand-Alone Chargers Other Handheld Devices SG Micro Corp www.sg-micro.com MAY 2017 – REV. A. 3 SGM4056 High Input Voltage Charger PACKAGE/ORDERING INFORMATION MODEL VOVP (V) SPECIFIED PACKAGE TEMPERATURE DESCRIPTION RANGE ORDER NUMBER PACKAGE MARKING PACKING OPTION 6.8V TDFN-3×3-8L -40℃ to +85℃ SGM4056-6.8YTDB8G/TR SGM G9DB XXXXX Tape and Reel, 3000 6.8V TDFN-2×3-8L -40℃ to +85℃ SGM4056-6.8YTDC8G/TR SGB XXXX Tape and Reel, 3000 6.8V TDFN-2×2-8L -40℃ to +85℃ SGM4056-6.8YTDE8G/TR SG7 XXXX Tape and Reel, 3000 6.8V SOIC-8 (Exposed Pad) -40℃ to +85℃ SGM4056-6.8YPS8G/TR SGM 4056-6.8YPS8 XXXXX Tape and Reel, 2500 10.5V TDFN-3×3-8L -40℃ to +85℃ SGM4056-10.5YTDB8G/TR SGM GADB XXXXX Tape and Reel, 3000 10.5V TDFN-2×3-8L -40℃ to +85℃ SGM4056-10.5YTDC8G/TR SGC XXXX Tape and Reel, 3000 10.5V TDFN-2×2-8L -40℃ to +85℃ SGM4056-10.5YTDE8G/TR SG8 XXXX Tape and Reel, 3000 10.5V SOIC-8 (Exposed Pad) -40℃ to +85℃ SGM4056-10.5YPS8G/TR SGM 4056-10.5YPS8 XXXXX Tape and Reel, 2500 SGM4056 NOTE: XXXX = Date Code. XXXXX = Date Code and Vendor Code. Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. ABSOLUTE MAXIMUM RATINGS VIN to GND ........................................................ -0.3V to 30V PPR , CHG , EN , IMIN, IREF, BAT to GND ....... -0.3V to 6V Storage Temperature Range ........................ -65℃ to +150℃ Package Thermal Resistance TDFN-3×3-8L, θJA ...................................................... 84℃/W TDFN-2×3-8L, θJA .................................................... 110℃/W TDFN-2×2-8L, θJA .................................................... 118℃/W SOIC-8 (Exposed Pad), θJA ....................................... 58℃/W Junction Temperature .................................................+150℃ Lead Temperature (Soldering 10 sec) ........................+260℃ ESD Susceptibility HBM ............................................................................. 4000V MM ................................................................................. 200V CDM ............................................................................ 1000V RECOMMENDED OPERATING CONDITIONS Operating Temperature Range ....................... -40℃ to +85℃ OVERSTRESS CAUTION Stresses beyond those listed may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational section of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. ESD SENSITIVITY CAUTION This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DISCLAIMER SG Micro Corp reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. SG Micro Corp www.sg-micro.com MAY 2017 2 SGM4056 High Input Voltage Charger PIN CONFIGURATIONS (TOP VIEW) VIN 8 1 CHG 3 EN 4 BAT 7 IREF 6 IMIN 5 GND SOIC-8 (Exposed Pad) VIN 1 8 BAT PPR 2 7 IREF CHG 3 6 IMIN EN 4 5 GND GND 2 GND PPR (TOP VIEW) TDFN-3×3-8L/TDFN-2×3-8L/TDFN-2×2-8L PIN DESCRIPTION PIN NAME FUNCTION 1 VIN Power Input. The absolute maximum input voltage is 26.5V. A 1μF or larger value X5R ceramic capacitor is recommended to be placed very close to the input pin for decoupling purpose. Additional capacitance may be required to provide a stable input voltage. 2 PPR 3 CHG 4 EN 5 GND Open-drain Power Presence Indication. The open-drain MOSFET turns on when the input voltage is above the POR threshold but below the OVP threshold and off otherwise. This pin is capable to sink 15mA (MIN) current to drive an LED. The maximum voltage rating for this pin is 5.5V. This pin is independent on the EN pin input. Open-drain Charge Indication. This pin outputs a logic low when a charge cycle starts and turns to high impedance when the end-of-charge (EOC) condition is qualified. This pin is capable to sink 15mA (MIN) current to drive an LED. When the charger is disabled, the CHG pin outputs high impedance. Enable Input. This is a logic input pin to disable or enable the charger. Drive to high to disable the charger. When this pin is driven to low or left floating, the charger is enabled. This pin has an internal 200kΩ pull-down resistor. System Ground. End-of-Charge (EOC) Current Programming Pin. Connect a resistor between this pin and the GND pin to set the EOC current. The EOC current IMIN can be programmed by the following equation: 6 = IMIN IMIN 10070 − 0.5 (mA) RIMIN where RIMIN is in kΩ. The programmable range covers 5% (or 10mA, whichever is higher) to 50% of IREF. When programmed to less than 5% or 10mA, the stability is not guaranteed. Charge-Current Programming and Monitoring Pin. Connect a resistor between this pin and the GND pin to set the charge current limit determined by the following equation: 7 8 = IREF IREF BAT 12080 − 4 (mA) RIREF where RIREF is in kΩ. The resistor should be located very close to this pin. The IREF pin voltage also monitors the actual charge current during the entire charge cycle, including the trickle, constant-current, and constant-voltage phases. When disabled, VIREF = 0V. Charger Output Pin. Connect this pin to the battery. A 1μF or larger X5R ceramic capacitor is recommended for decoupling and stability purposes. When the EN pin is pulled to logic high, the BAT output is disabled. SG Micro Corp www.sg-micro.com MAY 2017 3 SGM4056 High Input Voltage Charger ELECTRICAL CHARACTERISTICS (VIN = 5V, RIMIN = 243kΩ, TA = +25℃, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 26.5 V RECOMMENDED OPERATING CONDITIONS Maximum Supply Voltage Operating Supply Voltage SGM4056-6.8 4.55 6.10 SGM4056-10.5 4.55 9.35 100 900 mA Programmed Charge Current V POWER-ON RESET Rising POR Threshold VPOR Falling POR Threshold VPOR VBAT = 3.0V, RIREF = 120kΩ, use PPR to indicate the comparator output. 3.21 3.95 4.55 V 2.86 3.60 4.35 V 110 200 mV VIN-BAT OFFSET VOLTAGE Rising Edge VOS Falling Edge VOS VBAT = 4.5V, RIREF = 120kΩ, use PPR pin to indicate the comparator output. (1) 5 60 mV OVER-VOLTAGE PROTECTION Over-Voltage Protection Threshold SGM4056-6.8 OVP Threshold Hysteresis SGM4056-6.8 SGM4056-10.5 SGM4056-10.5 VOVP VOVPHYS VBAT = 4.3V, RIREF = 120kΩ, use PPR to indicate the comparator output. 6.10 6.80 7.26 9.35 10.50 11.15 140 220 300 245 340 430 V mV STANDBY CURRENT BAT Pin Sink Current ISTANDBY Charger disabled or the input is floating 1 μA VIN Pin Supply Current IVIN VBAT = 4.3V, RIREF = 24.3kΩ, charger disabled 200 275 μA VIN Pin Supply Current IVIN VBAT = 4.3V, RIREF = 24.3kΩ, charger enabled 270 320 μA VOLTAGE REGULATION Output Voltage PMOS On Resistance VCH RDS (ON) RIREF = 24.3kΩ, 4.55V < VIN < 6.10V, charge current = 20mA 4.152 4.2 4.248 RIREF = 24.3kΩ, 4.55V < VIN < 9.35V, charge current = 20mA 4.152 4.2 4.248 V VBAT = 3.8V, charge current = 500mA, RIREF = 10kΩ 0.7 Ω CHARGE CURRENT (2) IREF Pin Output Voltage VIREF VBAT = 3.8V, RIREF = 120kΩ 1.162 1.215 1.262 Constant Charge Current IREF Trickle Charge Current ITRK End-of-Charge Current IMIN RIREF = 24.3kΩ, VBAT = 2.8V to 3.8V 440 500 560 mA RIREF = 24.3kΩ, VBAT = 2.4V 55 90 135 mA RIREF = 24.3kΩ 20 40 75 mA RIREF = 24.3kΩ 315 370 435 mA VMIN RIREF = 24.3kΩ 2.46 2.55 2.65 V VMINHYS RIREF = 24.3kΩ 20 100 190 mV EOC Rising Threshold V PRECONDITIONING CHARGE THRESHOLD Preconditioning Charge Threshold Voltage Preconditioning Voltage Hysteresis NOTES: 1. The 4.5V VBAT is selected so that the PPR output can be used as the indication for the offset comparator output indication. If the VBAT is lower than the POR threshold, no output pin can be used for indication. 2. The charge current can be affected by the thermal foldback function if the IC under the test setup cannot dissipate the heat. SG Micro Corp www.sg-micro.com MAY 2017 4 SGM4056 High Input Voltage Charger ELECTRICAL CHARACTERISTICS (continued) (VIN = 5V, RIMIN = 243kΩ, TA = +25℃, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS INTERNAL TEMPERATURE MONITORING Charge Current Foldback Threshold TFOLD ℃ 115 LOGIC INPUT AND OUTPUTS 1.5 EN Pin Logic Input High V 0.8 EN Pin Logic Input Low EN Pin Internal Pull Down Resistance CHG Sink Current when LOW Pin Voltage = 1V CHG Leakage Current when High Impedance V CHG = 5.5V PPR Sink Current when LOW Pin Voltage = 1V PPR Leakage Current when High Impedance V PPR = 5.5V SG Micro Corp www.sg-micro.com 150 200 15 24 250 kΩ mA 20 15 V 24 μA mA 20 μA MAY 2017 5 SGM4056 High Input Voltage Charger TYPICAL PERFORMANCE CHARACTERISTICS Preconditioning Charge Threshold Voltage vs. Temperature 2.575 1.225 2.550 1.220 2.525 2.500 2.475 2.450 IREF Pin Output Voltage vs. Temperature 1.230 V IREF (V) V MIN (V) 2.600 V IN = 5V RIREF = 24.3kΩ 1.215 1.210 V IN = 5V RIREF = 120kΩ V BAT = 3.8V 1.205 1.200 -50 -25 0 25 50 75 100 -50 -25 0 Temperature (℃) V CH (V) 4.205 500 4.200 4.195 4.190 RIREF = 24.3kΩ 400 300 200 V IN = 5V V BAT = 3.8V TDFN-3×3-8L RIREF = 120kΩ 100 4.185 4.180 -25 0 25 50 75 0 -50 100 -25 0 Temperature (℃) 25.0 25.0 IPPR (mA) ICHG (mA) 27.5 22.5 17.5 15.0 V IN = 5V V BAT = 3.8V V CHG = 1V -50 -25 20.0 15.0 25 50 Temperature (℃) SG Micro Corp www.sg-micro.com 75 100 125 150 22.5 17.5 0 50 75 PPR Pin Current vs. Temperature (Sink) 30.0 27.5 20.0 25 Temperature (℃) CHG Pin Current vs. Temperature (Sink) 30.0 100 Charge Current vs. Temperature V IN = 5V RIREF = 24.3kΩ Charge Current = 20mA -50 75 600 IREF (mA) 4.210 50 Temperature (℃) Output Voltage vs. Temperature 4.215 25 100 V IN = 5V V BAT = 3.8V V PPR = 1V -50 -25 0 25 50 75 100 Temperature (℃) MAY 2017 6 SGM4056 High Input Voltage Charger TYPICAL PERFORMANCE CHARACTERISTICS (continued) VIN Pin Supply Current vs. Temperature 240 280 220 260 200 240 V IN = 5V RIREF = 24.3kΩ RIMIN = 243kΩ V BAT = 4.3V Charger Enabled 220 200 180 -50 IVIN (μA) IVIN (μA) VIN Pin Supply Current vs. Temperature 300 -25 0 25 50 75 180 V IN = 5V RIREF = 24.3kΩ RIMIN = 243kΩ V BAT = 4.3V Charger Disabled 160 140 120 -50 100 -25 Over-Voltage Protection Threshold vs. Temperature 6.85 10.51 6.84 10.50 6.83 6.82 V BAT = 4.3V RIREF = 120kΩ SGM4056-6.8 6.81 6.80 -50 -25 0 25 50 10.48 75 100 10.46 -50 0.8 80 ITRK (mA) RDS (ON) (Ω) 120 100 0.7 RIREF = 10kΩ Charge Current = 500mA V BAT = 3.8V 0.4 -50 -25 0 25 50 Temperature (℃) SG Micro Corp www.sg-micro.com 100 -25 0 25 50 75 100 Temperature (℃) 0.9 0.5 75 V BAT = 4.3V RIREF = 120kΩ SGM4056-10.5 10.47 PMOS On Resistance vs. Temperature 0.6 50 10.49 Temperature (℃) 1.0 25 Over-Voltage Protection Threshold vs. Temperature 10.52 V OVP (V) V OVP (V) 6.86 0 Temperature (℃) Temperature (℃) 75 100 60 Trickle Charge Current vs. Temperature RIREF = 24.3kΩ V IN = 5V V BAT = 2.4V 40 RIREF = 120kΩ 20 0 -50 -25 0 25 50 75 100 Temperature (℃) MAY 2017 7 SGM4056 High Input Voltage Charger TYPICAL PERFORMANCE CHARACTERISTICS (continued) Charge Current vs. Battery Voltage Charge Current vs. Battery Voltage 600 700 500 600 400 IREF (mA) IREF (mA) 800 500 400 V IN = 5V RIREF = 24.3kΩ TDFN-3×3-8L 300 200 2.5 2.75 3 T A = 0℃ T A = 25℃ 300 T A = 40℃ 200 V IN = 5V RIREF = 24.3kΩ TDFN-3×3-8L 100 3.25 3.5 3.75 4 0 2.0 4.25 2.4 2.8 V BAT (V) 200 RIREF = 120kΩ 80 40 20 0 0 5 6 7 8 9 10 V BAT = 2.4V SGM4056-10.5 60 100 4 RIREF = 24.3kΩ 100 V BAT = 3.8V TDFN-3×3-8L SGM4056-10.5 300 RIREF = 120kΩ 4 11 5 IREF Pin Voltage vs. Supply Voltage 1.218 4.200 V CH (V) V IREF (V) 4.205 1.216 RIREF = 120kΩ VBAT = 3.8V SGM4056-10.5 1.212 5 6 7 8 Supply Voltage (V) SG Micro Corp www.sg-micro.com 9 8 9 10 11 10 4.195 4.190 RIREF = 24.3kΩ Charge Current = 20mA SGM4056-10.5 4.185 1.210 4 7 Output Voltage vs. Supply Voltage 4.210 1.220 1.214 6 Supply Voltage (V) Supply Voltage (V) 1.222 4.4 Trickle Charge Current vs. Supply Voltage RIREF = 24.3kΩ 400 4.0 120 ITRK (mA) IREF (mA) 500 3.6 V BAT (V) Charge Current vs. Supply Voltage 600 3.2 11 4.180 4 5 6 7 8 9 Supply Voltage (V) 10 11 MAY 2017 8 SGM4056 High Input Voltage Charger CHG Pin I-V Curve 100 90 80 70 60 50 40 30 20 10 0 IPPR (mA) ICHG (mA) TYPICAL PERFORMANCE CHARACTERISTICS (continued) V IN = 5V V BAT = 3.8V V IN = 5V V BAT = 3.8V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 V CHG (V) V PPR (V) IREF Pin Voltage vs. Charge Current 1.2 Output Voltage vs. Charge Current 4.3 4.2 1.0 4.1 0.8 V CH (V) V IREF (V) PPR Pin I-V Curve 100 90 80 70 60 50 40 30 20 10 0 0.6 0.4 4.0 3.9 V IN = 5V RIREF = 10kΩ 3.8 V IN= 5V RIREF = 24.3kΩ 0.2 0.0 0 100 200 300 IREF (mA) 400 3.7 SOIC-8 (Exposed Pad) 3.6 500 0 100 200 300 400 500 600 IREF (mA) Complete Charge Cycle (1500mAh Battery) 6 500 5 Battery Voltage 400 300 200 100 4 Charge Current V IN = 5V RIREF = 24.3kΩ RIMIN = 243kΩ 3 2 1 CHG Voltage 0 Battery Voltage (V) Charge Current (mA) 600 0 0 1 2 3 4 Time (Hours) SG Micro Corp www.sg-micro.com MAY 2017 9 SGM4056 High Input Voltage Charger TYPICAL PERFORMANCE CHARACTERISTICS (continued) Charge Current Programming ±2σ Tolerance Guide 700 600 End-of-Charge Current Programming ±2σ Tolerance Guide 70 50 500 mean 400 300 IMIN (mA) IREF (mA) +2σ 60 +2σ -2σ 40 200 20 100 10 0 mean 30 -2σ 0 0 100 200 300 400 500 600 Programmed Charge Current (mA) SG Micro Corp www.sg-micro.com 700 0 10 20 30 40 50 60 70 Programmed End-of-Charge Current (mA) MAY 2017 10 SGM4056 High Input Voltage Charger TYPICAL APPLICATION CIRCUITS TO INPUT 1 VIN 6 IMIN 3 CHG OFF 4 R2 D1 D2 C2 2 PPR EN R1 RIMIN SGM4056 ON RIREF 7 IREF C1 TO BATTERY 8 BAT GND 5 Figure 1. Typical Application Circuit Interfacing to Indication LEDs 1 7 IREF C1 VCC R1 EN ON C2 RIMIN SGM4056 4 RIREF 6 IMIN OFF TO BATTERY 8 BAT VIN 3 CHG GND 2 PPR R2 TO MCU TO INPUT 5 Figure 2. Typical Application Circuit with the Indication Signals Interfacing to an MCU COMPONENT DESCRIPTION FOR FIGURE 1 PART DESCRIPTION C1 1μF X5R ceramic cap C2 1μF X5R ceramic cap RIREF 24.3kΩ, 1%, for 500mA charge current RIMIN 243kΩ, 1%, for 40mA EOC current R1, R2 300Ω, 5% D1, D2 LEDs for indication Trickle COMPONENT DESCRIPTION FOR FIGURE 2 PART DESCRIPTION C1 1μF X5R ceramic cap C2 1μF X5R ceramic cap RIREF 24.3kΩ, 1%, for 500mA charge current RIMIN 243kΩ, 1%, for 40mA EOC current R1, R2 100kΩ, 5% CC 4.2V CV Charge Voltage IREF 74% IREF 18% IREF CHG Charge Current IMIN CHG Indication Time Figure 3. Typical Charge Profile SG Micro Corp www.sg-micro.com MAY 2017 11 SGM4056 High Input Voltage Charger OPERATION The SGM4056 charges a Li-Ion battery using a CC/CV profile. The constant current IREF is set with the external resistor RIREF (see Figure 1) and the constant voltage is fixed at 4.2V. If the battery voltage is below a typical 2.55V trickle charge threshold, the SGM4056 charges the battery with a trickle current of 18% of IREF until the battery voltage rises above the trickle charge threshold. Fast charge CC mode is maintained at the rate determined by programming IREF until the cell voltage rises to 4.2V. When the battery voltage reaches 4.2V, the charger enters a CV mode and regulates the battery voltage at 4.2V to fully charge the battery without the risk of over charge. Upon reaching an end-of-charge (EOC) current, the charger indicates the charge completion with the CHG pin, but the charger continues to output the 4.2V voltage. Figure 3 shows the typical charge waveforms after the power is on. The EOC current level IMIN is programmable with the external resistor RIMIN (see Figure 1). The CHG pin turns to low when the trickle charge starts and rises to high impedance at the EOC. After the EOC is reached, the charge current has to rise to typically 74% IREF for the CHG pin to turn on again, as shown in Figure 3. The current surge after EOC can be caused by a load connected to the battery. A thermal foldback function reduces the charge current anytime when the die temperature reaches typically 115℃. This function guarantees safe operation when the printed circuit board (PCB) is not capable of dissipating the heat generated by the linear charger. The SGM4056 accepts an input voltage up to 26.5V but disables charging when the input voltage exceeds the OVP threshold, typically 6.8V for SGM4056-6.8 and 10.5V for SGM4056-10.5, to protect against unqualified or faulty AC adapters. PPR Indication The PPR pin is an open-drain output to indicate the presence of the AC adapter. Whenever the input voltage is higher than the POR threshold, the PPR pin turns on the internal open-drain MOSFET to indicate a logic low signal, independent on the EN pin input. When the internal open-drain FET is turned off, the PPR pin leaks less than 20µA current. When turned on, the PPR pin is able to sink at least 15mA current under all operating conditions. The PPR pin can be used to SG Micro Corp www.sg-micro.com drive an LED (see Figure 1) or to interface with a microprocessor. Power Good Range The power good range is defined by the following three conditions: 1. VIN > VPOR 2. VIN - VBAT > VOS 3. VIN < VOVP where the VOS is the offset voltage for the input and output voltage comparator, discussed shortly, and the VOVP is the over-voltage protection threshold given in the Electrical Characteristics table. All VPOR, VOS, and VOVP have hysteresis, as given in the Electrical Characteristics table. The charger will not charge the battery if the input voltage is not in the power good range. Input and Output Comparator The charger will not be enabled unless the input voltage is higher than the battery voltage by an offset voltage VOS. The purpose of this comparator is to ensure that the charger is turned off when the input power is removed from the charger. Without this comparator, it is possible that the charger will fail to power down when the input is removed and the current can leak through the PFET pass element to continue biasing the POR and the Pre-Regulator blocks. Dropout Voltage The constant current may not be maintained due to the RDS(ON) limit at a low input voltage. The worst case RDS(ON) is at the maximum allowable operating temperature. CHG Indication The CHG is an open-drain output capable of sinking at least 15mA current when the charger starts to charge, and turns off when the EOC current is reached. The CHG signal is interfaced either with a microprocessor GPIO or an LED for indication. MAY 2017 12 SGM4056 High Input Voltage Charger OPERATION (continued) EN Input EN is an active-low logic input to enable the charger. Drive the EN pin to low or leave it floating to enable the charger. This pin has a 200kΩ internal pull-down resistor so when left floating, the input is equivalent to logic low. Drive this pin to high to disable the charger. The threshold for high is given in the Electrical Characteristics table. IREF Pin The IREF pin has the two functions as described in the Pin Description section. When setting the fast charge current, the charge current is guaranteed to have 12% accuracy with the charge current set at 500mA. When monitoring the charge current, the accuracy of the IREF pin voltage vs. the actual charge current has the same accuracy as the gain from the IREF pin current to the actual charge current. SG Micro Corp www.sg-micro.com Operation without the Battery The SGM4056 relies on a battery for stability and works under LDO mode if the battery is not connected. With a battery, the charger will be stable with an output ceramic decoupling capacitor in the range of 1µF to 200µF. In LDO mode, its stability depends on load current, COUT, etc. The maximum load current is limited by the dropout voltage, the programmed IREF and the thermal foldback. Thermal Foldback The thermal foldback function starts to reduce the charge current when the internal temperature reaches a typical value of +115℃. MAY 2017 13 SGM4056 High Input Voltage Charger APPLICATION INFORMATION Input Capacitor Selection The input capacitor is required to suppress the power supply transient response during transitions. Mainly this capacitor is selected to avoid oscillation during the start up when the input supply is passing the POR threshold and the VIN-BAT comparator offset voltage. When the battery voltage is above the POR threshold, the VIN VBAT offset voltage dominates the hysteresis value. Typically, a 1µF X5R ceramic capacitor should be sufficient to suppress the power supply noise. Output Capacitor Selection The criterion for selecting the output capacitor is to maintain the stability of the charger as well as to bypass any transient load current. The minimum capacitance is a 1µF X5R ceramic capacitor. The actual capacitance connected to the output is dependent on the actual application requirement. Layout Guidance The SGM4056 uses thermally-enhanced TDFN and SOIC packages that have an exposed thermal pad at the bottom side of the packages. The layout should connect as much as possible to copper on the exposed pad. Typically the component layer is more effective in dissipating heat. The thermal impedance can be further reduced by using other layers of copper connecting to the exposed pad through a thermal via array. Each thermal via is recommended to have 0.3mm diameter and 1mm distance from other thermal vias. Input Power Sources The input power source is typically a well-regulated wall cube with 1-meter length wire or a USB port. The SGM4056 can withstand up to 26.5V on the input without damaging the IC. If the input voltage is higher than typically 6.8V (SGM4056-6.8) or 10.5V (SGM4056-10.5), the charger stops charging. REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. MAY 2017 ‒ REV.A.2 to REV.A.3 Changed Absolute Maximum Ratings section ...................................................................................................................................................... 2 MAY 2015 ‒ REV.A.1 to REV.A.2 Changed Pin Description section ......................................................................................................................................................................... 3 Added Typical Performance Characteristics section .......................................................................................................................................... 10 NOVEMBER 2014 ‒ REV.A to REV.A.1 Changed Electrical Characteristics section .......................................................................................................................................................... 4 Changes from Original (JANUARY 2013) to REV.A Changed from product preview to production data ............................................................................................................................................. All SG Micro Corp www.sg-micro.com MAY 2017 14 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS TDFN-3×3-8L D e N8 D1 k E E1 L N4 N1 b BOTTOM VIEW TOP VIEW 2.3 1.5 2.725 A A1 A2 0.675 SIDE VIEW 0.24 0.65 RECOMMENDED LAND PATTERN (Unit: mm) Symbol Dimensions In Millimeters MIN MAX Dimensions In Inches MIN MAX A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A2 0.203 REF 0.008 REF D 2.900 3.100 0.114 0.122 D1 2.200 2.400 0.087 0.094 E 2.900 3.100 0.114 0.122 E1 1.400 1.600 0.055 k b 0.200 MIN 0.180 e L SG Micro Corp www.sg-micro.com 0.300 0.007 0.575 0.015 0.650 TYP 0.375 0.063 0.008 MIN 0.012 0.026 TYP 0.023 TX00058.000 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS TDFN-2×3-8L D N5 e N8 k L E1 E D1 N4 b N1 BOTTOM VIEW TOP VIEW 1.50 0.60 1.50 A A1 3.00 A2 SIDE VIEW 0.25 0.50 RECOMMENDED LAND PATTERN (Unit: mm) Symbol Dimensions In Millimeters MIN MAX Dimensions In Inches MIN MAX A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A2 0.203 REF 0.008 REF D 1.924 2.076 0.076 0.082 D1 1.400 1.600 0.055 0.063 E 2.924 3.076 0.115 0.121 E1 1.400 1.600 0.055 0.063 k b 0.200 MIN 0.200 e L SG Micro Corp www.sg-micro.com 0.008 MIN 0.300 0.008 0.500 TYP 0.224 0.012 0.020 TYP 0.376 0.009 0.015 TX00057.000 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS TDFN-2×2-8L D e N8 E1 D1 L E k N4 N1 b BOTTOM VIEW TOP VIEW 1.20 0.65 0.60 1.95 A A1 A2 SIDE VIEW 0.24 0.50 RECOMMENDED LAND PATTERN (Unit: mm) Symbol Dimensions In Millimeters MIN MAX Dimensions In Inches MIN MAX A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A2 0.203 REF 0.008 REF D 1.900 2.100 0.075 0.083 D1 1.100 1.300 0.043 0.051 E 1.900 2.100 0.075 0.083 E1 0.500 0.700 0.020 0.028 k b 0.200 MIN 0.180 e L SG Micro Corp www.sg-micro.com 0.008 MIN 0.300 0.007 0.500 TYP 0.250 0.012 0.020 TYP 0.450 0.010 0.018 TX00056.000 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOIC-8 (Exposed Pad) 3.302 D e E E1 2.413 E2 5.56 1.91 b D1 1.27 0.61 RECOMMENDED LAND PATTERN (Unit: mm) L A A1 c θ A2 Symbol Dimensions In Millimeters MIN MAX Dimensions In Inches MIN MAX 1.700 0.067 A A1 0.000 0.000 0.004 A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.007 0.010 D 4.700 5.100 0.185 0.201 D1 3.202 3.402 0.126 0.134 E 3.800 4.000 0.150 0.157 E1 5.800 6.200 0.228 0.244 E2 2.313 2.513 0.091 0.099 e SG Micro Corp www.sg-micro.com 0.100 1.27 BSC 0.050 BSC L 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8° TX00013.000 PACKAGE INFORMATION TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P2 W P0 Q1 Q2 Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 Q3 Q4 B0 Reel Diameter K0 A0 P1 Reel Width (W1) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Reel Diameter Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P0 (mm) P1 (mm) P2 (mm) W (mm) Pin1 Quadrant TDFN-3×3-8L 13″ 12.4 3.35 3.35 1.13 4.0 8.0 2.0 12.0 Q1 TDFN-2×3-8L 7″ 9.5 2.30 3.30 1.10 4.0 4.0 2.0 8.0 Q2 TDFN-2×2-8L 7″ 9.5 2.30 2.30 1.10 4.0 4.0 2.0 8.0 Q1 SOIC-8 (Exposed Pad) 13″ 12.4 6.40 5.40 2.10 4.0 8.0 2.0 12.0 Q1 SG Micro Corp www.sg-micro.com TX10000.000 DD0001 Package Type PACKAGE INFORMATION CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Length (mm) Width (mm) Height (mm) Pizza/Carton 7″ (Option) 368 227 224 8 7″ 442 410 224 18 13″ 386 280 370 5 SG Micro Corp www.sg-micro.com DD0002 Reel Type TX20000.000