SGM4056
High Input Voltage Charger
GENERAL DESCRIPTION
FEATURES
The SGM4056 is a cost-effective, fully integrated high
● Complete Charger for Single-Cell Li-Ion or
input voltage single-cell Li-Ion battery charger. The
Polymer Batteries
charger uses a CC/CV charge profile required by Li-Ion
● Integrated Pass Element and Current Sensor
battery. The charger accepts an input voltage up to
● No External Blocking Diode Required
26.5V but is disabled when the input voltage exceeds
● Low Component Count and Cost
the OVP threshold, typically 6.8V (SGM4056-6.8) or
● Programmable Charge Current
10.5V (SGM4056-10.5), to prevent excessive power
● Programmable End-of-Charge Current
dissipation. The 26.5V rating eliminates the over-
● Charge Current Thermal Foldback for Thermal
voltage protection circuit required in a low input voltage
Protection
● 2.55V Trickle Charge Threshold
charger.
The charge current and the end-of-charge (EOC)
current are programmable with external resistors.
When the battery voltage is lower than typically 2.55V,
the charger preconditions the battery with typically 18%
of the programmed charge current. When the charge
current reduces to the programmable EOC current level
during the CV charge phase, an EOC indication is
provided by the CHG pin, which is an open-drain
output. An internal thermal foldback function protects
the charger from any thermal failure.
Two indication pins ( PPR and CHG ) allow simple
interface to a microprocessor or LEDs. When no
adapter is attached or when disabled, the charger
draws less than 1μA leakage current from the battery.
● 6.8V Input Over-Voltage Protection
for SGM4056-6.8
● 10.5V Input Over-Voltage Protection
for SGM4056-10.5
● 26.5V Maximum Voltage for the Power Input
● Power Presence and Charge Indications
● Less than 1μA Leakage Current off the Battery
When No Input Power Attached or Charger
Disabled
● Available in Green TDFN-3×3-8L, TDFN-2×3-8L,
TDFN-2×2-8L and SOIC-8 (Exposed Pad) Packages
APPLICATIONS
Mobile Phones
The SGM4056 is available in Green TDFN-3×3-8L,
Blue-Tooth Devices
TDFN-2×3-8L, TDFN-2×2-8L and SOIC-8 (Exposed
PDAs
Pad) packages and is rated over the -40℃ to +85℃
MP3 Players
temperature range.
Stand-Alone Chargers
Other Handheld Devices
SG Micro Corp
www.sg-micro.com
MAY 2017 – REV. A. 3
SGM4056
High Input Voltage Charger
PACKAGE/ORDERING INFORMATION
MODEL
VOVP
(V)
SPECIFIED
PACKAGE
TEMPERATURE
DESCRIPTION
RANGE
ORDER NUMBER
PACKAGE
MARKING
PACKING
OPTION
6.8V
TDFN-3×3-8L
-40℃ to +85℃
SGM4056-6.8YTDB8G/TR
SGM
G9DB
XXXXX
Tape and Reel, 3000
6.8V
TDFN-2×3-8L
-40℃ to +85℃
SGM4056-6.8YTDC8G/TR
SGB
XXXX
Tape and Reel, 3000
6.8V
TDFN-2×2-8L
-40℃ to +85℃
SGM4056-6.8YTDE8G/TR
SG7
XXXX
Tape and Reel, 3000
6.8V
SOIC-8
(Exposed Pad)
-40℃ to +85℃
SGM4056-6.8YPS8G/TR
SGM
4056-6.8YPS8
XXXXX
Tape and Reel, 2500
10.5V
TDFN-3×3-8L
-40℃ to +85℃
SGM4056-10.5YTDB8G/TR
SGM
GADB
XXXXX
Tape and Reel, 3000
10.5V
TDFN-2×3-8L
-40℃ to +85℃
SGM4056-10.5YTDC8G/TR
SGC
XXXX
Tape and Reel, 3000
10.5V
TDFN-2×2-8L
-40℃ to +85℃
SGM4056-10.5YTDE8G/TR
SG8
XXXX
Tape and Reel, 3000
10.5V
SOIC-8
(Exposed Pad)
-40℃ to +85℃
SGM4056-10.5YPS8G/TR
SGM
4056-10.5YPS8
XXXXX
Tape and Reel, 2500
SGM4056
NOTE: XXXX = Date Code. XXXXX = Date Code and Vendor Code.
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
VIN to GND ........................................................ -0.3V to 30V
PPR , CHG , EN , IMIN, IREF, BAT to GND ....... -0.3V to 6V
Storage Temperature Range ........................ -65℃ to +150℃
Package Thermal Resistance
TDFN-3×3-8L, θJA ...................................................... 84℃/W
TDFN-2×3-8L, θJA .................................................... 110℃/W
TDFN-2×2-8L, θJA .................................................... 118℃/W
SOIC-8 (Exposed Pad), θJA ....................................... 58℃/W
Junction Temperature .................................................+150℃
Lead Temperature (Soldering 10 sec) ........................+260℃
ESD Susceptibility
HBM ............................................................................. 4000V
MM ................................................................................. 200V
CDM ............................................................................ 1000V
RECOMMENDED OPERATING CONDITIONS
Operating Temperature Range ....................... -40℃ to +85℃
OVERSTRESS CAUTION
Stresses beyond those listed may cause permanent damage
to the device. Functional operation of the device at these or
any other conditions beyond those indicated in the operational
section of the specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
reliability.
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage
because very small parametric changes could cause the
device not to meet its published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, specification or other related things if necessary
without notice at any time.
SG Micro Corp
www.sg-micro.com
MAY 2017
2
SGM4056
High Input Voltage Charger
PIN CONFIGURATIONS
(TOP VIEW)
VIN
8
1
CHG
3
EN
4
BAT
7
IREF
6
IMIN
5
GND
SOIC-8 (Exposed Pad)
VIN
1
8
BAT
PPR
2
7
IREF
CHG
3
6
IMIN
EN
4
5
GND
GND
2
GND
PPR
(TOP VIEW)
TDFN-3×3-8L/TDFN-2×3-8L/TDFN-2×2-8L
PIN DESCRIPTION
PIN
NAME
FUNCTION
1
VIN
Power Input. The absolute maximum input voltage is 26.5V. A 1μF or larger value X5R ceramic
capacitor is recommended to be placed very close to the input pin for decoupling purpose. Additional
capacitance may be required to provide a stable input voltage.
2
PPR
3
CHG
4
EN
5
GND
Open-drain Power Presence Indication. The open-drain MOSFET turns on when the input voltage is
above the POR threshold but below the OVP threshold and off otherwise. This pin is capable to sink
15mA (MIN) current to drive an LED. The maximum voltage rating for this pin is 5.5V. This pin is
independent on the EN pin input.
Open-drain Charge Indication. This pin outputs a logic low when a charge cycle starts and turns to high
impedance when the end-of-charge (EOC) condition is qualified. This pin is capable to sink 15mA (MIN)
current to drive an LED. When the charger is disabled, the CHG pin outputs high impedance.
Enable Input. This is a logic input pin to disable or enable the charger. Drive to high to disable the
charger. When this pin is driven to low or left floating, the charger is enabled. This pin has an internal
200kΩ pull-down resistor.
System Ground.
End-of-Charge (EOC) Current Programming Pin. Connect a resistor between this pin and the GND pin
to set the EOC current. The EOC current IMIN can be programmed by the following equation:
6
=
IMIN
IMIN
10070
− 0.5 (mA)
RIMIN
where RIMIN is in kΩ. The programmable range covers 5% (or 10mA, whichever is higher) to 50% of
IREF. When programmed to less than 5% or 10mA, the stability is not guaranteed.
Charge-Current Programming and Monitoring Pin. Connect a resistor between this pin and the GND pin
to set the charge current limit determined by the following equation:
7
8
=
IREF
IREF
BAT
12080
− 4 (mA)
RIREF
where RIREF is in kΩ. The resistor should be located very close to this pin. The IREF pin voltage also
monitors the actual charge current during the entire charge cycle, including the trickle, constant-current,
and constant-voltage phases. When disabled, VIREF = 0V.
Charger Output Pin. Connect this pin to the battery. A 1μF or larger X5R ceramic capacitor is
recommended for decoupling and stability purposes. When the EN pin is pulled to logic high, the BAT
output is disabled.
SG Micro Corp
www.sg-micro.com
MAY 2017
3
SGM4056
High Input Voltage Charger
ELECTRICAL CHARACTERISTICS
(VIN = 5V, RIMIN = 243kΩ, TA = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
26.5
V
RECOMMENDED OPERATING CONDITIONS
Maximum Supply Voltage
Operating
Supply Voltage
SGM4056-6.8
4.55
6.10
SGM4056-10.5
4.55
9.35
100
900
mA
Programmed Charge Current
V
POWER-ON RESET
Rising POR Threshold
VPOR
Falling POR Threshold
VPOR
VBAT = 3.0V, RIREF = 120kΩ,
use PPR to indicate the comparator output.
3.21
3.95
4.55
V
2.86
3.60
4.35
V
110
200
mV
VIN-BAT OFFSET VOLTAGE
Rising Edge
VOS
Falling Edge
VOS
VBAT = 4.5V, RIREF = 120kΩ, use PPR pin to
indicate the comparator output. (1)
5
60
mV
OVER-VOLTAGE PROTECTION
Over-Voltage
Protection Threshold
SGM4056-6.8
OVP Threshold
Hysteresis
SGM4056-6.8
SGM4056-10.5
SGM4056-10.5
VOVP
VOVPHYS
VBAT = 4.3V, RIREF = 120kΩ,
use PPR to indicate the comparator output.
6.10
6.80
7.26
9.35
10.50
11.15
140
220
300
245
340
430
V
mV
STANDBY CURRENT
BAT Pin Sink Current
ISTANDBY
Charger disabled or the input is floating
1
μA
VIN Pin Supply Current
IVIN
VBAT = 4.3V, RIREF = 24.3kΩ, charger disabled
200
275
μA
VIN Pin Supply Current
IVIN
VBAT = 4.3V, RIREF = 24.3kΩ, charger enabled
270
320
μA
VOLTAGE REGULATION
Output Voltage
PMOS On Resistance
VCH
RDS (ON)
RIREF = 24.3kΩ, 4.55V < VIN < 6.10V,
charge current = 20mA
4.152
4.2
4.248
RIREF = 24.3kΩ, 4.55V < VIN < 9.35V,
charge current = 20mA
4.152
4.2
4.248
V
VBAT = 3.8V, charge current = 500mA,
RIREF = 10kΩ
0.7
Ω
CHARGE CURRENT (2)
IREF Pin Output Voltage
VIREF
VBAT = 3.8V, RIREF = 120kΩ
1.162
1.215
1.262
Constant Charge Current
IREF
Trickle Charge Current
ITRK
End-of-Charge Current
IMIN
RIREF = 24.3kΩ, VBAT = 2.8V to 3.8V
440
500
560
mA
RIREF = 24.3kΩ, VBAT = 2.4V
55
90
135
mA
RIREF = 24.3kΩ
20
40
75
mA
RIREF = 24.3kΩ
315
370
435
mA
VMIN
RIREF = 24.3kΩ
2.46
2.55
2.65
V
VMINHYS
RIREF = 24.3kΩ
20
100
190
mV
EOC Rising Threshold
V
PRECONDITIONING CHARGE THRESHOLD
Preconditioning Charge
Threshold Voltage
Preconditioning Voltage Hysteresis
NOTES:
1. The 4.5V VBAT is selected so that the PPR output can be used as the indication for the offset comparator output indication. If
the VBAT is lower than the POR threshold, no output pin can be used for indication.
2. The charge current can be affected by the thermal foldback function if the IC under the test setup cannot dissipate the heat.
SG Micro Corp
www.sg-micro.com
MAY 2017
4
SGM4056
High Input Voltage Charger
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 5V, RIMIN = 243kΩ, TA = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
INTERNAL TEMPERATURE MONITORING
Charge Current Foldback Threshold
TFOLD
℃
115
LOGIC INPUT AND OUTPUTS
1.5
EN Pin Logic Input High
V
0.8
EN Pin Logic Input Low
EN Pin Internal Pull Down Resistance
CHG Sink Current when LOW
Pin Voltage = 1V
CHG Leakage Current when High
Impedance
V CHG = 5.5V
PPR Sink Current when LOW
Pin Voltage = 1V
PPR Leakage Current when High
Impedance
V PPR = 5.5V
SG Micro Corp
www.sg-micro.com
150
200
15
24
250
kΩ
mA
20
15
V
24
μA
mA
20
μA
MAY 2017
5
SGM4056
High Input Voltage Charger
TYPICAL PERFORMANCE CHARACTERISTICS
Preconditioning Charge Threshold Voltage
vs. Temperature
2.575
1.225
2.550
1.220
2.525
2.500
2.475
2.450
IREF Pin Output Voltage vs. Temperature
1.230
V IREF (V)
V MIN (V)
2.600
V IN = 5V
RIREF = 24.3kΩ
1.215
1.210
V IN = 5V
RIREF = 120kΩ
V BAT = 3.8V
1.205
1.200
-50
-25
0
25
50
75
100
-50
-25
0
Temperature (℃)
V CH (V)
4.205
500
4.200
4.195
4.190
RIREF = 24.3kΩ
400
300
200
V IN = 5V
V BAT = 3.8V
TDFN-3×3-8L
RIREF = 120kΩ
100
4.185
4.180
-25
0
25
50
75
0
-50
100
-25
0
Temperature (℃)
25.0
25.0
IPPR (mA)
ICHG (mA)
27.5
22.5
17.5
15.0
V IN = 5V
V BAT = 3.8V
V CHG = 1V
-50
-25
20.0
15.0
25
50
Temperature (℃)
SG Micro Corp
www.sg-micro.com
75
100 125 150
22.5
17.5
0
50
75
PPR Pin Current vs. Temperature (Sink)
30.0
27.5
20.0
25
Temperature (℃)
CHG Pin Current vs. Temperature (Sink)
30.0
100
Charge Current vs. Temperature
V IN = 5V
RIREF = 24.3kΩ
Charge Current = 20mA
-50
75
600
IREF (mA)
4.210
50
Temperature (℃)
Output Voltage vs. Temperature
4.215
25
100
V IN = 5V
V BAT = 3.8V
V PPR = 1V
-50
-25
0
25
50
75
100
Temperature (℃)
MAY 2017
6
SGM4056
High Input Voltage Charger
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN Pin Supply Current vs. Temperature
240
280
220
260
200
240
V IN = 5V
RIREF = 24.3kΩ
RIMIN = 243kΩ
V BAT = 4.3V
Charger Enabled
220
200
180
-50
IVIN (μA)
IVIN (μA)
VIN Pin Supply Current vs. Temperature
300
-25
0
25
50
75
180
V IN = 5V
RIREF = 24.3kΩ
RIMIN = 243kΩ
V BAT = 4.3V
Charger Disabled
160
140
120
-50
100
-25
Over-Voltage Protection Threshold vs.
Temperature
6.85
10.51
6.84
10.50
6.83
6.82
V BAT = 4.3V
RIREF = 120kΩ
SGM4056-6.8
6.81
6.80
-50
-25
0
25
50
10.48
75
100
10.46
-50
0.8
80
ITRK (mA)
RDS (ON) (Ω)
120
100
0.7
RIREF = 10kΩ
Charge Current = 500mA
V BAT = 3.8V
0.4
-50
-25
0
25
50
Temperature (℃)
SG Micro Corp
www.sg-micro.com
100
-25
0
25
50
75
100
Temperature (℃)
0.9
0.5
75
V BAT = 4.3V
RIREF = 120kΩ
SGM4056-10.5
10.47
PMOS On Resistance vs. Temperature
0.6
50
10.49
Temperature (℃)
1.0
25
Over-Voltage Protection Threshold vs.
Temperature
10.52
V OVP (V)
V OVP (V)
6.86
0
Temperature (℃)
Temperature (℃)
75
100
60
Trickle Charge Current vs. Temperature
RIREF = 24.3kΩ
V IN = 5V
V BAT = 2.4V
40
RIREF = 120kΩ
20
0
-50
-25
0
25
50
75
100
Temperature (℃)
MAY 2017
7
SGM4056
High Input Voltage Charger
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Charge Current vs. Battery Voltage
Charge Current vs. Battery Voltage
600
700
500
600
400
IREF (mA)
IREF (mA)
800
500
400
V IN = 5V
RIREF = 24.3kΩ
TDFN-3×3-8L
300
200
2.5
2.75
3
T A = 0℃
T A = 25℃
300
T A = 40℃
200
V IN = 5V
RIREF = 24.3kΩ
TDFN-3×3-8L
100
3.25
3.5
3.75
4
0
2.0
4.25
2.4
2.8
V BAT (V)
200
RIREF = 120kΩ
80
40
20
0
0
5
6
7
8
9
10
V BAT = 2.4V
SGM4056-10.5
60
100
4
RIREF = 24.3kΩ
100
V BAT = 3.8V
TDFN-3×3-8L
SGM4056-10.5
300
RIREF = 120kΩ
4
11
5
IREF Pin Voltage vs. Supply Voltage
1.218
4.200
V CH (V)
V IREF (V)
4.205
1.216
RIREF = 120kΩ
VBAT = 3.8V
SGM4056-10.5
1.212
5
6
7
8
Supply Voltage (V)
SG Micro Corp
www.sg-micro.com
9
8
9
10
11
10
4.195
4.190
RIREF = 24.3kΩ
Charge Current = 20mA
SGM4056-10.5
4.185
1.210
4
7
Output Voltage vs. Supply Voltage
4.210
1.220
1.214
6
Supply Voltage (V)
Supply Voltage (V)
1.222
4.4
Trickle Charge Current vs. Supply Voltage
RIREF = 24.3kΩ
400
4.0
120
ITRK (mA)
IREF (mA)
500
3.6
V BAT (V)
Charge Current vs. Supply Voltage
600
3.2
11
4.180
4
5
6
7
8
9
Supply Voltage (V)
10
11
MAY 2017
8
SGM4056
High Input Voltage Charger
CHG Pin I-V Curve
100
90
80
70
60
50
40
30
20
10
0
IPPR (mA)
ICHG (mA)
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
V IN = 5V
V BAT = 3.8V
V IN = 5V
V BAT = 3.8V
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
V CHG (V)
V PPR (V)
IREF Pin Voltage vs. Charge Current
1.2
Output Voltage vs. Charge Current
4.3
4.2
1.0
4.1
0.8
V CH (V)
V IREF (V)
PPR Pin I-V Curve
100
90
80
70
60
50
40
30
20
10
0
0.6
0.4
4.0
3.9
V IN = 5V
RIREF = 10kΩ
3.8
V IN= 5V
RIREF = 24.3kΩ
0.2
0.0
0
100
200
300
IREF (mA)
400
3.7
SOIC-8 (Exposed Pad)
3.6
500
0
100
200
300
400
500
600
IREF (mA)
Complete Charge Cycle (1500mAh Battery)
6
500
5
Battery Voltage
400
300
200
100
4
Charge Current
V IN = 5V
RIREF = 24.3kΩ
RIMIN = 243kΩ
3
2
1
CHG Voltage
0
Battery Voltage (V)
Charge Current (mA)
600
0
0
1
2
3
4
Time (Hours)
SG Micro Corp
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MAY 2017
9
SGM4056
High Input Voltage Charger
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Charge Current Programming ±2σ Tolerance Guide
700
600
End-of-Charge Current Programming ±2σ Tolerance Guide
70
50
500
mean
400
300
IMIN (mA)
IREF (mA)
+2σ
60
+2σ
-2σ
40
200
20
100
10
0
mean
30
-2σ
0
0
100 200 300 400 500 600
Programmed Charge Current (mA)
SG Micro Corp
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700
0
10
20
30
40
50
60
70
Programmed End-of-Charge Current (mA)
MAY 2017
10
SGM4056
High Input Voltage Charger
TYPICAL APPLICATION CIRCUITS
TO INPUT
1
VIN
6
IMIN
3
CHG
OFF
4
R2
D1
D2
C2
2
PPR
EN
R1
RIMIN
SGM4056
ON
RIREF
7
IREF
C1
TO BATTERY
8
BAT
GND
5
Figure 1. Typical Application Circuit Interfacing to Indication LEDs
1
7
IREF
C1
VCC
R1
EN
ON
C2
RIMIN
SGM4056
4
RIREF
6
IMIN
OFF
TO BATTERY
8
BAT
VIN
3
CHG
GND
2
PPR
R2
TO MCU
TO INPUT
5
Figure 2. Typical Application Circuit with the Indication Signals Interfacing to an MCU
COMPONENT DESCRIPTION FOR FIGURE 1
PART
DESCRIPTION
C1
1μF X5R ceramic cap
C2
1μF X5R ceramic cap
RIREF 24.3kΩ, 1%, for 500mA charge current
RIMIN
243kΩ, 1%, for 40mA EOC current
R1, R2 300Ω, 5%
D1, D2 LEDs for indication
Trickle
COMPONENT DESCRIPTION FOR FIGURE 2
PART
DESCRIPTION
C1
1μF X5R ceramic cap
C2
1μF X5R ceramic cap
RIREF 24.3kΩ, 1%, for 500mA charge current
RIMIN
243kΩ, 1%, for 40mA EOC current
R1, R2 100kΩ, 5%
CC
4.2V
CV
Charge Voltage
IREF
74% IREF
18% IREF
CHG
Charge Current
IMIN
CHG Indication
Time
Figure 3. Typical Charge Profile
SG Micro Corp
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MAY 2017
11
SGM4056
High Input Voltage Charger
OPERATION
The SGM4056 charges a Li-Ion battery using a CC/CV
profile. The constant current IREF is set with the external
resistor RIREF (see Figure 1) and the constant voltage is
fixed at 4.2V. If the battery voltage is below a typical
2.55V trickle charge threshold, the SGM4056 charges
the battery with a trickle current of 18% of IREF until the
battery voltage rises above the trickle charge threshold.
Fast charge CC mode is maintained at the rate
determined by programming IREF until the cell voltage
rises to 4.2V. When the battery voltage reaches 4.2V,
the charger enters a CV mode and regulates the
battery voltage at 4.2V to fully charge the battery
without the risk of over charge. Upon reaching an
end-of-charge (EOC) current, the charger indicates the
charge completion with the CHG pin, but the charger
continues to output the 4.2V voltage. Figure 3 shows
the typical charge waveforms after the power is on.
The EOC current level IMIN is programmable with the
external resistor RIMIN (see Figure 1). The CHG pin
turns to low when the trickle charge starts and rises to
high impedance at the EOC. After the EOC is reached,
the charge current has to rise to typically 74% IREF for
the CHG pin to turn on again, as shown in Figure 3.
The current surge after EOC can be caused by a load
connected to the battery.
A thermal foldback function reduces the charge current
anytime when the die temperature reaches typically
115℃. This function guarantees safe operation when
the printed circuit board (PCB) is not capable of
dissipating the heat generated by the linear charger.
The SGM4056 accepts an input voltage up to 26.5V but
disables charging when the input voltage exceeds the
OVP threshold, typically 6.8V for SGM4056-6.8 and
10.5V for SGM4056-10.5, to protect against unqualified
or faulty AC adapters.
PPR Indication
The PPR pin is an open-drain output to indicate the
presence of the AC adapter. Whenever the input
voltage is higher than the POR threshold, the PPR pin
turns on the internal open-drain MOSFET to indicate a
logic low signal, independent on the EN pin input.
When the internal open-drain FET is turned off, the
PPR pin leaks less than 20µA current. When turned on,
the PPR pin is able to sink at least 15mA current under
all operating conditions. The PPR pin can be used to
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drive an LED (see Figure 1) or to interface with a microprocessor.
Power Good Range
The power good range is defined by the following three
conditions:
1. VIN > VPOR
2. VIN - VBAT > VOS
3. VIN < VOVP
where the VOS is the offset voltage for the input and
output voltage comparator, discussed shortly, and the
VOVP is the over-voltage protection threshold given in
the Electrical Characteristics table. All VPOR, VOS, and
VOVP have hysteresis, as given in the Electrical
Characteristics table. The charger will not charge the
battery if the input voltage is not in the power good
range.
Input and Output Comparator
The charger will not be enabled unless the input
voltage is higher than the battery voltage by an offset
voltage VOS. The purpose of this comparator is to
ensure that the charger is turned off when the input
power is removed from the charger. Without this
comparator, it is possible that the charger will fail to
power down when the input is removed and the current
can leak through the PFET pass element to continue
biasing the POR and the Pre-Regulator blocks.
Dropout Voltage
The constant current may not be maintained due to the
RDS(ON) limit at a low input voltage. The worst case
RDS(ON) is at the maximum allowable operating
temperature.
CHG Indication
The CHG is an open-drain output capable of sinking at
least 15mA current when the charger starts to charge,
and turns off when the EOC current is reached. The
CHG signal is interfaced either with a microprocessor
GPIO or an LED for indication.
MAY 2017
12
SGM4056
High Input Voltage Charger
OPERATION (continued)
EN Input
EN is an active-low logic input to enable the charger.
Drive the EN pin to low or leave it floating to enable
the charger. This pin has a 200kΩ internal pull-down
resistor so when left floating, the input is equivalent to
logic low. Drive this pin to high to disable the charger.
The threshold for high is given in the Electrical
Characteristics table.
IREF Pin
The IREF pin has the two functions as described in the
Pin Description section. When setting the fast charge
current, the charge current is guaranteed to have 12%
accuracy with the charge current set at 500mA. When
monitoring the charge current, the accuracy of the IREF
pin voltage vs. the actual charge current has the same
accuracy as the gain from the IREF pin current to the
actual charge current.
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Operation without the Battery
The SGM4056 relies on a battery for stability and works
under LDO mode if the battery is not connected. With a
battery, the charger will be stable with an output
ceramic decoupling capacitor in the range of 1µF to
200µF. In LDO mode, its stability depends on load
current, COUT, etc. The maximum load current is limited
by the dropout voltage, the programmed IREF and the
thermal foldback.
Thermal Foldback
The thermal foldback function starts to reduce the
charge current when the internal temperature reaches
a typical value of +115℃.
MAY 2017
13
SGM4056
High Input Voltage Charger
APPLICATION INFORMATION
Input Capacitor Selection
The input capacitor is required to suppress the power
supply transient response during transitions. Mainly this
capacitor is selected to avoid oscillation during the start
up when the input supply is passing the POR threshold
and the VIN-BAT comparator offset voltage. When the
battery voltage is above the POR threshold, the VIN VBAT offset voltage dominates the hysteresis value.
Typically, a 1µF X5R ceramic capacitor should be
sufficient to suppress the power supply noise.
Output Capacitor Selection
The criterion for selecting the output capacitor is to
maintain the stability of the charger as well as to
bypass any transient load current. The minimum
capacitance is a 1µF X5R ceramic capacitor. The
actual capacitance connected to the output is
dependent on the actual application requirement.
Layout Guidance
The SGM4056 uses thermally-enhanced TDFN and
SOIC packages that have an exposed thermal pad at
the bottom side of the packages. The layout should
connect as much as possible to copper on the exposed
pad. Typically the component layer is more effective in
dissipating heat. The thermal impedance can be further
reduced by using other layers of copper connecting to
the exposed pad through a thermal via array. Each
thermal via is recommended to have 0.3mm diameter
and 1mm distance from other thermal vias.
Input Power Sources
The input power source is typically a well-regulated wall
cube with 1-meter length wire or a USB port. The
SGM4056 can withstand up to 26.5V on the input
without damaging the IC. If the input voltage is higher
than typically 6.8V (SGM4056-6.8) or 10.5V
(SGM4056-10.5), the charger stops charging.
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
MAY 2017 ‒ REV.A.2 to REV.A.3
Changed Absolute Maximum Ratings section ...................................................................................................................................................... 2
MAY 2015 ‒ REV.A.1 to REV.A.2
Changed Pin Description section ......................................................................................................................................................................... 3
Added Typical Performance Characteristics section .......................................................................................................................................... 10
NOVEMBER 2014 ‒ REV.A to REV.A.1
Changed Electrical Characteristics section .......................................................................................................................................................... 4
Changes from Original (JANUARY 2013) to REV.A
Changed from product preview to production data ............................................................................................................................................. All
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MAY 2017
14
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-3×3-8L
D
e
N8
D1
k
E
E1
L
N4
N1
b
BOTTOM VIEW
TOP VIEW
2.3
1.5 2.725
A
A1
A2
0.675
SIDE VIEW
0.24
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A2
0.203 REF
0.008 REF
D
2.900
3.100
0.114
0.122
D1
2.200
2.400
0.087
0.094
E
2.900
3.100
0.114
0.122
E1
1.400
1.600
0.055
k
b
0.200 MIN
0.180
e
L
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0.300
0.007
0.575
0.015
0.650 TYP
0.375
0.063
0.008 MIN
0.012
0.026 TYP
0.023
TX00058.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×3-8L
D
N5
e
N8
k
L
E1
E
D1
N4
b
N1
BOTTOM VIEW
TOP VIEW
1.50
0.60
1.50
A
A1
3.00
A2
SIDE VIEW
0.25
0.50
RECOMMENDED LAND PATTERN (Unit: mm)
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A2
0.203 REF
0.008 REF
D
1.924
2.076
0.076
0.082
D1
1.400
1.600
0.055
0.063
E
2.924
3.076
0.115
0.121
E1
1.400
1.600
0.055
0.063
k
b
0.200 MIN
0.200
e
L
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0.008 MIN
0.300
0.008
0.500 TYP
0.224
0.012
0.020 TYP
0.376
0.009
0.015
TX00057.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-8L
D
e
N8
E1
D1
L
E
k
N4
N1
b
BOTTOM VIEW
TOP VIEW
1.20
0.65
0.60 1.95
A
A1
A2
SIDE VIEW
0.24
0.50
RECOMMENDED LAND PATTERN (Unit: mm)
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A2
0.203 REF
0.008 REF
D
1.900
2.100
0.075
0.083
D1
1.100
1.300
0.043
0.051
E
1.900
2.100
0.075
0.083
E1
0.500
0.700
0.020
0.028
k
b
0.200 MIN
0.180
e
L
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0.008 MIN
0.300
0.007
0.500 TYP
0.250
0.012
0.020 TYP
0.450
0.010
0.018
TX00056.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-8 (Exposed Pad)
3.302
D
e
E
E1
2.413
E2
5.56
1.91
b
D1
1.27
0.61
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
1.700
0.067
A
A1
0.000
0.000
0.004
A2
1.350
1.550
0.053
0.061
b
0.330
0.510
0.013
0.020
c
0.170
0.250
0.007
0.010
D
4.700
5.100
0.185
0.201
D1
3.202
3.402
0.126
0.134
E
3.800
4.000
0.150
0.157
E1
5.800
6.200
0.228
0.244
E2
2.313
2.513
0.091
0.099
e
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0.100
1.27 BSC
0.050 BSC
L
0.400
1.270
0.016
0.050
θ
0°
8°
0°
8°
TX00013.000
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
W
P0
Q1
Q2
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
Q3
Q4
B0
Reel Diameter
K0
A0
P1
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel
Diameter
Reel Width
W1
(mm)
A0
(mm)
B0
(mm)
K0
(mm)
P0
(mm)
P1
(mm)
P2
(mm)
W
(mm)
Pin1
Quadrant
TDFN-3×3-8L
13″
12.4
3.35
3.35
1.13
4.0
8.0
2.0
12.0
Q1
TDFN-2×3-8L
7″
9.5
2.30
3.30
1.10
4.0
4.0
2.0
8.0
Q2
TDFN-2×2-8L
7″
9.5
2.30
2.30
1.10
4.0
4.0
2.0
8.0
Q1
SOIC-8
(Exposed Pad)
13″
12.4
6.40
5.40
2.10
4.0
8.0
2.0
12.0
Q1
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TX10000.000
DD0001
Package Type
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Pizza/Carton
7″ (Option)
368
227
224
8
7″
442
410
224
18
13″
386
280
370
5
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DD0002
Reel Type
TX20000.000
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