SGM40561-4.2YTDE8G/TR

Preliminary Datasheet SGM40561 High Input Voltage Single Cell Charger GENERAL DESCRIPTION FEATURES The SGM40561 is a fully integrated high input voltage  4.2V/4.3V Charge Voltage single-cell Li-ion battery charger. The charger uses a  Precision 20mA to 200mA (TBD) Charger for Tiny CC/CV charge profile required by Li-ion battery. The Cell Li-ion or Polymer Batteries charger accepts an input voltage up to 26.5V but is  Integrated Pass Element and Current Sensor disabled when the input voltage exceeds the OVP  No External Blocking Diode Required threshold, typically 10.5V, to prevent excessive power  Low Component Count dissipation. The 26.5V rating eliminates the over-  Programmable Charge Current voltage protection circuit required in a low input voltage  Programmable Full-of-Charge Current charger.  Charge Current Thermal Foldback Protection  2.55V/2.62V Trickle Charge Threshold The charge current and the full-of-charge (FOC) current  10.5V Input Over-Voltage Protection are programmable with external resistors. When the  26.5V Maximum Voltage Power Input battery  Power Presence and Charging Indications voltage is lower than typically 2.55V (SGM40561-4.2) or 2.62V (SGM40561-4.3), the charger preconditions the battery with typically 18% of the programmed charge current. When the charge  Less than 1μA Leakage Current off the Battery When No Input Power Attached or Charger Disabled  Available in Green TDFN-2×2-8L Package current reduces to the programmable FOC current level during the CV charge phase, an FOC indication is provided by the CHG pin, which is an open-drain output. An internal thermal foldback function protects the charger from any thermal failure. Two indication pins ( PPR and CHG ) allow simple interface to a microprocessor or LEDs. When no adapter is attached or when disabled, the charger APPLICATIONS IOT Gadgets Wearable Devices Credential Keys Wireless Remote draws less than 1μA leakage current from the battery. The SGM40561 is available in Green TDFN-2×2-8L package and is rated over the -40℃ to +85℃ temperature range. December 16, 2014 SG Micro Corp www.sg-micro.com SGM40561 High Input Voltage Single Cell Charger PACKAGE/ORDERING INFORMATION MODEL VCH (V) PACKAGE DESCRIPTION SPECIFIED TEMPERATURE RANGE ORDERING NUMBER 4.2 TDFN-2×2-8L -40℃ to +85℃ SGM40561-4.2YTDE8G/TR 4.3 TDFN-2×2-8L -40℃ to +85℃ SGM40561-4.3YTDE8G/TR SGM40561 PACKAGE MARKING SZD XXXX SX7 XXXX PACKING OPTION Tape and Reel, 3000 Tape and Reel, 3000 NOTE: XXXX = Date Code. Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. ABSOLUTE MAXIMUM RATINGS OVERSTRESS CAUTION VIN to GND......................................................... 0.3V to 30V PPR , CHG , EN, IMIN, IREF, BAT to GND ........-0.3V to 6V Storage Temperature Range........................ -65℃ to +150℃ Package Thermal Resistance TDFN-2×2-8L, θJA .................................................... 118℃/W Junction Temperature .................................................. 150℃ Lead Temperature (Soldering 10 sec).......................... 260℃ ESD Susceptibility HBM............................................................................ 4000V MM................................................................................ 200V Stresses beyond those listed may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational section of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. RECOMMENDED OPERATING CONDITIONS Supply Voltage Range ................................... 4.55V to 9.35V Maximum Supply Voltage ............................................ 26.5V Programmed Charge Current ...................... 20mA to 200mA Operating Temperature Range ...................... -40℃ to +85℃ ESD SENSITIVITY CAUTION This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DISCLAIMER SG Micro Corp reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. SG Micro Corp www.sg-micro.com 2 SGM40561 High Input Voltage Single Cell Charger PIN CONFIGURATION SGM40561 (TOP VIEW) 1 8 BAT PPR 2 7 IREF CHG 3 6 IMIN EN 4 5 GND GND VIN TDFN-2×2-8L PIN DESCRIPTION PIN NAME 1 VIN 2 PPR 3 CHG 4 EN 5 GND FUNCTION Power Input. The absolute maximum input voltage is 26.5V. A 1μF or larger value X5R ceramic capacitor is recommended to be placed very close to the input pin for decoupling purpose. Additional capacitance may be required to provide a stable input voltage. Open-Drain Power Presence Indication. The open-drain MOSFET turns on when the input voltage is above the POR threshold but below the OVP threshold and off otherwise. This pin is capable to sink 15mA current to drive an LED. The maximum voltage rating for this pin is 5.5V. This pin is independent on the EN pin input. Open-Drain Charge Indication. This pin outputs a logic low when a charge cycle starts and turns to high impedance when the full-of-charge (FOC) condition is qualified. This pin is capable to sink 15mA current to drive an LED. When the charger is disabled, the CHG pin outputs high impedance. Enable Input. This is a logic input pin to disable or enable the charger. Drive to high to disable the charger. When this pin is driven to low or left floating, the charger is enabled. This pin has an internal 200kΩ pull-down resistor. System Ground. Full-of-Charge (FOC) Current Programming Pin. Connect a resistor between this pin and the GND pin to set the FOC current. The FOC current IMIN can be programmed by the following equation: 6 IMIN IMIN  9700 (mA) RIMIN where RIMIN is in kΩ. Charge-Current Programming and Monitoring Pin. Connect a resistor between this pin and the GND pin to set the charge current limit determined by the following equation: 7 8 IREF  IREF BAT 12150 (mA) RIREF where RIREF is in kΩ. The resistor should be located very close to this pin. The IREF pin voltage also monitors the actual charge current during the entire charge cycle, including the trickle, constant-current, and constant-voltage phases. When disabled, VIREF = 0V. Charger Output Pin. Connect this pin to the battery. A 1μF or larger X5R ceramic capacitor is recommended for decoupling and stability purposes. When the EN pin is pulled to logic high, the BAT output is disabled. SG Micro Corp www.sg-micro.com 3 SGM40561 High Input Voltage Single Cell Charger ELECTRICAL CHARACTERISTICS (VIN = 5V, RIMIN = 3MΩ, TA = 25℃, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS Rising POR Threshold VPOR Falling POR Threshold VPOR VBAT = 3.0V, RIREF = 602kΩ, use PPR to indicate the comparator output. MIN TYP MAX UNITS POWER-ON RESET 3.95 V 3.60 V VIN-BAT OFFSET VOLTAGE Rising Edge VOS Falling Edge VOS VBAT forced to 4.5V, RIREF = 602kΩ, use PPR (1) pin to indicate the comparator output. 110 mV 60 mV VBAT forced to 4.4V, RIREF = 602kΩ, use PPR to indicate the comparator output. 10.50 V 340 mV OVER-VOLTAGE PROTECTION Over-Voltage Protection Threshold VOVP VOVPHYS STANDBY CURRENT BAT Pin Sink Current ISTANDBY VIN Pin Supply Current IVIN VIN Pin Supply Current IVIN Charger disabled or the input is floating 1 VBAT forced to 4.4V, RIREF = 301kΩ, charger disabled VBAT forced to 4.4V, RIREF = 301kΩ, charger enabled μA 200 μA 270 μA VOLTAGE REGULATION SGM40561-4.2 4.2 VCH RIREF = 301kΩ, 4.55V < VIN < 9.35V, charge current = 3mA IREF Pin Output Voltage VIREF VBAT = 3.8V, RIREF = 602kΩ Constant Charge Current IREF RIREF = 301kΩ, VBAT = 2.8V to 3.8V Trickle Charge Current ITRK RIREF = 301kΩ, VBAT = 2.4V 7 mA Full-of-Charge Current IMIN RIREF = 301kΩ 3 mA RIREF = 301kΩ 30 mA Output Voltage CHARGE CURRENT SGM40561-4.3 V 4.3 (2) FOC Rising Threshold 1.215 V 40 mA PRECONDITIONING CHARGE THRESHOLD Preconditioning Charge Threshold Voltage SGM40561-4.2 VMIN RIREF = 60.4kΩ VMINHYS RIREF = 60.4kΩ SGM40561-4.3 Preconditioning Voltage Hysteresis 2.55 V 2.62 100 mV 115 ℃ INTERNAL TEMPERATURE MONITORING Charge Current Foldback Threshold TFOLD LOGIC INPUT AND OUTPUTS 1.5 EN Pin Logic Input High V 0.8 V 200 250 kΩ 42 67 Ω 20 μA 67 Ω 20 μA EN Pin Logic Input Low 150 EN Pin Internal Pull Down Resistance CHG Pin On-Resistance when LOW CHG Leakage Current when High Impedance Pin Voltage = 1V V CHG = 5.5V PPR Pin On-Resistance when LOW Pin Voltage = 1V PPR Leakage Current when High Impedance V PPR = 5.5V 42 NOTES: 1. The 4.5V VBAT is selected so that the PPR output can be used as the indication for the offset comparator output indication. If the VBAT is lower than the POR threshold, no output pin can be used for indication. 2. The charge current may be affected by the thermal foldback function. SG Micro Corp www.sg-micro.com 4 SGM40561 High Input Voltage Single Cell Charger TYPICAL PERFORMANCE CHARACTERISTICS IREF Pin Output Voltage vs. Temperature 2.600 1.230 2.575 1.225 2.550 1.220 VIREF (V) VMIN (V) Preconditioning Charge Threshold Voltage vs. Temperature 2.525 2.500 2.475 VIN = 5V RIREF = 60.4kΩ SGM40561-4.2 1.215 1.210 VIN = 5V RIREF = 602kΩ VBAT = 3.8V 1.205 2.450 1.200 -50 -25 0 25 50 Temperature (℃) 75 100 -50 Output Voltage vs. Temperature 4.215 -25 75 100 Charge Current vs. Temperature 150 4.210 0 25 50 Temperature (℃) 120 IREF (mA) VCH (V) 4.205 4.200 4.195 VIN = 5V RIREF = 301kΩ Charge Current = 3mA SGM40561-4.2 4.190 4.185 -25 0 25 50 75 60 VIN = 5V VBAT = 3.8V RIREF = 120kΩ 30 0 -50 4.180 -50 90 100 -25 0 Temperature (℃) CHG Pin On-Resistance vs. Temperature (Sink) 55 50 50 45 45 40 35 30 50 75 100 125 150 Temperature (℃) RPPR (Ω) RCHG (Ω) 55 25 40 35 VIN = 5V VBAT = 3.8V VCHG = 1V PPR Pin On-Resistance vs. Temperature (Sink) 30 VIN = 5V VBAT = 3.8V VPPR = 1V 25 25 -50 -25 0 25 50 Temperature (℃) SG Micro Corp www.sg-micro.com 75 100 -50 -25 0 25 50 75 100 Temperature (℃) 5 SGM40561 High Input Voltage Single Cell Charger TYPICAL PERFORMANCE CHARACTERISTICS VIN Pin Supply Current vs. Temperature VIN Pin Supply Current vs. Temperature 240 280 220 260 200 240 IVIN (μA) IVIN (μA) 300 VIN = 5V RIREF = 301kΩ RIMIN = 3MΩ VBAT forced to 4.4V Charger Enabled 220 200 180 VIN = 5V RIREF = 301kΩ RIMIN = 3MΩ VBAT forced to 4.4V Charger Disabled 160 140 180 120 -50 -25 0 25 50 75 100 -50 -25 0 Temperature (℃) Over-Voltage Protection Threshold vs. Temperature 10.51 4.205 10.50 4.200 10.49 75 100 4.195 4.190 10.48 VBAT forced to 4.4V RIREF = 602kΩ 10.47 50 Output Voltage vs. Supply Voltage 4.210 VCH (V) VOVP (V) 10.52 25 Temperature (℃) RIREF = 301kΩ Charge Current = 3mA SGM40561-4.2 4.185 4.180 10.46 -50 -25 0 25 50 75 100 Temperature (℃) 4 5 6 7 8 9 Supply Voltage (V) 10 11 IREF Pin Voltage vs. Supply Voltage 1.222 1.220 VIREF (V) 1.218 1.216 1.214 RIREF = 602kΩ VBAT = 3.8V 1.212 1.210 4 5 6 7 8 9 Supply Voltage (V) SG Micro Corp www.sg-micro.com 10 11 6 SGM40561 High Input Voltage Single Cell Charger TYPICAL APPLICATIONS TO BATTERY TO INPUT BAT VIN IREF RIREF C1 IMIN R2 D1 D2 C2 RIMIN SGM40561 CHG OFF R1 PPR EN GND ON Figure 1. Typical Application Circuit Interfacing to Indication LEDs TO INPUT TO BATTERY VIN BAT RIREF IREF C1 C2 IMIN OFF EN R1 CHG GND R2 TO MCU ON VCC RIMIN SGM40561 PPR Figure 2. Typical Application Circuit with the Indication Signals Interfacing to an MCU COMPONENT DESCRIPTION FOR Figure 1 PART DESCRIPTION COMPONENT DESCRIPTION FOR Figure 2 PART DESCRIPTION C1 1μF X5R ceramic cap C1 1μF X5R ceramic cap C2 1μF X5R ceramic cap C2 1μF X5R ceramic cap RIREF 301kΩ, for 40mA charge current RIREF 301kΩ, for 40mA charge current RIMIN 3MΩ, for 3mA FOC current RIMIN 3MΩ, for 3mA FOC current D1, D2 LEDs for indication SG Micro Corp www.sg-micro.com R1, R2 100kΩ, 5% 7 SGM40561 High Input Voltage Single Cell Charger Trickle CC CV 4.2V IREF Charge Voltage 74% IREF 2.55V 18% IREF CHG Charge Current IMIN CHG Indication Time Figure 3. Typical Charge Profile (SGM40561-4.2) OPERATION The SGM40561 charges a Li-ion battery using a CC/CV profile. The constant current IREF is set with the external resistor RIREF (see Figure 1) and the constant voltage is fixed at 4.2V or 4.3V. If the battery voltage is below a typical 2.55V or 2.62V trickle charge threshold, the SGM40561 charges the battery with a trickle current of 18% of IREF until the battery voltage rises above the trickle charge threshold. Fast charge CC mode is maintained at the rate determined by programming IREF until the cell voltage rises to 4.2V or 4.3V. When the battery voltage reaches 4.2V or 4.3V, the charger enters a CV mode and regulates the battery voltage at 4.2V or 4.3V to fully charge the battery without the risk of over charge. Upon reaching an full-of-charge (FOC) current, the charger indicates the charge completion with the CHG pin, but the charger continues to output the 4.2V or 4.3V voltage. Figure 3 shows the typical charge waveforms after the power is on. The FOC current level IMIN is programmable with the external resistor RIMIN (see Figure 1). The CHG pin turns to low when the trickle charge starts and rises to high impedance at the FOC. After the FOC is reached, the charge current has to rise to typically 74% of IREF for the CHG pin to turn on again, as shown in Figure 3. The current surge after FOC can be caused by a load connected to the battery. SG Micro Corp www.sg-micro.com A thermal foldback function reduces the charge current anytime when the die temperature reaches typically 115℃. This function guarantees safe operation when the printed circuit board (PCB) is not capable of dissipating the heat generated by the linear charger. The SGM40561 accepts an input voltage up to 26.5V but disables charging when the input voltage exceeds the OVP threshold, typically 10.5V, to protect against unqualified or faulty AC adapters. PPR Indication The PPR pin is an open-drain output to indicate the presence of the AC adapter. Whenever the input voltage is higher than the POR threshold, the PPR pin turns on the internal open-drain MOSFET to indicate a logic low signal, independent on the EN pin input. When the internal open-drain FET is turned off, the PPR pin leaks less than 20µA current. When turned on, the PPR pin is able to sink at least 15mA current under all operating conditions. The PPR pin can be used to drive an LED (see Figure 1) or to interface with a microprocessor. 8 SGM40561 High Input Voltage Single Cell Charger OPERATION Power Good Range EN Input The power good range is defined by the following three conditions: EN is an active-low logic input to enable the charger. Drive the EN pin to low or leave it floating to enable the charger. This pin has a 200kΩ internal pull-down resistor so when left floating, the input is equivalent to logic low. Drive this pin to high to disable the charger. The threshold for high is given in the Electrical Characteristics table. 1. VIN > VPOR 2. VIN - VBAT > VOS 3. VIN < VOVP where the VOS is the offset voltage for the input and output voltage comparator, discussed shortly, and the VOVP is the over-voltage protection threshold given in the Electrical Characteristics table. All VPOR, VOS, and VOVP have hysteresis, as given in the Electrical Characteristics table. The charger will not charge the battery if the input voltage is not in the power good range. Input and Output Comparator The charger will not be enabled unless the input voltage is higher than the battery voltage by an offset voltage VOS. The purpose of this comparator is to ensure that the charger is turned off when the input power is removed from the charger. Without this comparator, it is possible that the charger will fail to power down when the input is removed and the current can leak through the PFET pass element to continue biasing the POR and the Pre-Regulator blocks. Dropout Voltage The constant current may not be maintained due to the RDS (ON) limit at a low input voltage. The worst case RDS (ON) is at the maximum allowable operating temperature. IREF Pin The IREF pin has the two functions as described in the Pin Description section. When setting the fast charge current, the charge current is guaranteed to have 12% accuracy with the charge current set at 40mA. When monitoring the charge current, the accuracy of the IREF pin voltage vs. the actual charge current has the same accuracy as the gain from the IREF pin current to the actual charge current. Operation without the Battery The SGM40561 relies on a battery for stability and works under LDO mode if the battery is not connected. With a battery, the charger will be stable with an output ceramic decoupling capacitor in the range of 1µF to 200µF. In LDO mode, its stability depends on load current, COUT, etc. The maximum load current is limited by the dropout voltage, the programmed IREF and the thermal foldback. Thermal Foldback The thermal foldback function starts to reduce the charge current when the internal temperature reaches a typical value of 115℃. CHG Indication The CHG is an open-drain output capable of sinking at least 15mA current when the charger starts to charge, and turns off when the FOC current is reached. The CHG signal is interfaced either with a microprocessor GPIO or an LED for indication. SG Micro Corp www.sg-micro.com 9 SGM40561 High Input Voltage Single Cell Charger APPLICATION INFORMATION Design of IREF, IMIN and CHG Indication Output Capacitor Selection A higher IREF charges quicker, at the penalty of reduced battery life. The maximum IREF should be designed to follow battery vendor’s instruction for a given battery life expectation. The criterion for selecting the output capacitor is to maintain the stability of the charger as well as to bypass any transient load current. The minimum capacitance is a 1µF X5R ceramic capacitor. The actual capacitance connected to the output is dependent on the actual application requirement. IMIN is the end of charge current when CHG indicates a full of charge condition. All current out of the SGM40561 BAT pin should be counted into IMIN, including load current and the indication LED currents. As illustrated in Figure 3, the SGM40561 continues to supply current unless it is disabled by EN pulled high, regardless of the status of CHG pin. When charge current ever goes lower than IMIN, CHG pin stays high impendence until the charge current goes higher than 74% of IREF, which is another factor to consider in design of IREF, IREF should be high enough to so that 74% of IREF is higher than the current that is designed not to initiate CHG indication, while is low enough to assure the power source could deliver higher than 74% of IREF to initiate CHG indication. Layout Guidance The SGM40561 uses thermally-enhanced TDFN package that has an exposed thermal pad at the bottom side of the package. The layout should connect as much as possible to copper on the exposed pad. Typically the component layer is more effective in dissipating heat. The thermal impedance can be further reduced by using other layers of copper connecting to the exposed pad through a thermal via array. Each thermal via is recommended to have 0.3mm diameter and 1mm distance from other thermal vias. Input Capacitor Selection The input capacitor is required to suppress the power supply transient response during transitions. Mainly this capacitor is selected to avoid oscillation during the start up when the input supply is passing the POR threshold and the VIN-BAT comparator offset voltage. When the battery voltage is above the POR threshold, the VIN VBAT offset voltage dominates the hysteresis value. Typically, a 1µF X5R ceramic capacitor should be sufficient to suppress the power supply noise. SG Micro Corp www.sg-micro.com 10 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS TDFN-2×2-8L D e N8 E1 D1 L E k N4 N1 b BOTTOM VIEW TOP VIEW 1.20 0.65 0.60 1.95 A A1 A2 SIDE VIEW 0.24 0.50 RECOMMENDED LAND PATTERN (Unit: mm) Symbol Dimensions In Millimeters Dimensions In Inches MIN MAX MIN MAX A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A2 0.203 REF 0.008 REF D 1.900 2.100 0.075 0.083 D1 1.100 1.300 0.043 0.051 E 1.900 2.100 0.075 0.083 E1 0.500 0.700 0.020 0.028 k b 0.200 MIN 0.180 e L SG Micro Corp www.sg-micro.com 0.008 MIN 0.300 0.007 0.500 TYP 0.250 0.012 0.020 TYP 0.450 0.010 0.018 TX00056.000 PACKAGE INFORMATION TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P2 W P0 Q1 Q2 Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 Q3 Q4 B0 Reel Diameter P1 A0 K0 Reel Width (W1) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Reel Diameter Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P0 (mm) P1 (mm) P2 (mm) W (mm) Pin1 Quadrant TDFN-2×2-8L 7″ 9.5 2.30 2.30 1.10 4.00 4.00 2.00 8.00 Q1 SG Micro Corp www.sg-micro.com TX10000.000 DD0001 Package Type PACKAGE INFORMATION CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Length (mm) Width (mm) Height (mm) Pizza/Carton 7″ (Option) 368 227 224 8 7″ 442 410 224 18 SG Micro Corp www.sg-micro.com DD0002 Reel Type TX20000.000