SGM48000XS8G/TR

SGM48000/1/2 High Speed, Dual Power MOSFET Drivers GENERAL DESCRIPTION FEATURES The SGM48000/1/2 ICs are matched dual-drivers.  Improved Response Times Unique circuit design provides very high speed drivers  Matched Rise and Fall Times capable of delivering peak currents of 2A into highly  Reduced Clock Skew between Dual Channels capacitive loads. Improved speed and drive capability  Low Output Impedance are enhanced by matched rise and fall delay times.  Output is at LOW under UVLO Protection These matched delays maintain the integrity of  High Noise Immunity input-to-output pulse-widths to reduce timing errors and  Improved Clocking Rate clock skew problems. Dynamic switching losses are  Low Supply Current minimized with non-overlapped drive techniques.  Wide Operating Voltage Range  -40℃ to +85℃ Operating Temperature Range  Available in Green SOIC-8 and TDFN-2×2-8L The SGM48000/1/2 are available in Green SOIC-8 and TDFN-2×2-8L packages. They operate over an ambient temperature range of -40℃ to +85℃. Packages APPLICATIONS Clock/Line Drivers CCD Drivers Ultra-Sound Transducer Drivers Power MOSFET Drivers Switch Mode Power Supplies Class D Switching Amplifiers Ultrasonic and RF Generators Pulsed Circuits REV. A SG Micro Corp www.sg-micro.com SGM48000/1/2 High Speed, Dual Power MOSFET Drivers PACKAGE/ORDERING INFORMATION MODEL PACKAGE DESCRIPTION SPECIFIED TEMPERATURE RANGE ORDER NUMBER PACKAGE MARKING PACKING OPTION SOIC-8 -40℃ to +85℃ SGM48000YS8G/TR SGM 48000YS8 XXXXX Tape and Reel, 2500 TDFN-2×2-8L -40℃ to +85℃ SGM48000YTDE8G/TR SYA XXXX Tape and Reel, 3000 SOIC-8 -40℃ to +85℃ SGM48001YS8G/TR SGM 48001YS8 XXXXX Tape and Reel, 2500 TDFN-2×2-8L -40℃ to +85℃ SGM48001YTDE8G/TR SV8 XXXX Tape and Reel, 3000 SOIC-8 -40℃ to +85℃ SGM48002YS8G/TR SGM 48002YS8 XXXXX Tape and Reel, 2500 TDFN-2×2-8L -40℃ to +85℃ SGM48002YTDE8G/TR SV9 XXXX Tape and Reel, 3000 SGM48000 SGM48001 SGM48002 NOTE: XXXX = Date Code. XXXXX = Date Code and Vendor Code. Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. ABSOLUTE MAXIMUM RATINGS OVERSTRESS CAUTION VCC to GND ...................................................... -0.3V to 28V INA, INB to GND......................................-0.3V to VCC + 0.3V Combined Peak Output Current......................................... 4A Junction Temperature ...................................................150℃ Stresses beyond those listed may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational section of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Package Thermal Resistance SOIC-8, θJA .............................................................. 132℃/W TDFN-2×2-8L, θJA .................................................... 118℃/W Storage Temperature Range ........................-65℃ to +150℃ Lead Temperature (Soldering, 10sec) ..........................260℃ ESD Susceptibility HBM............................................................................. 6000V MM................................................................................. 200V RECOMMENDED OPERATING CONDITIONS Supply Voltage Range ......................................4.5V to 26.5V Operating Temperature Range .......................-40℃ to +85℃ ESD SENSITIVITY CAUTION This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DISCLAIMER SG Micro Corp reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. SG Micro Corp www.sg-micro.com 2 SGM48000/1/2 High Speed, Dual Power MOSFET Drivers PIN CONFIGURATIONS SGM48000 (TOP VIEW) SGM48000 (TOP VIEW) NC 1 8 NC INA 2 7 OUTA NC 1 INA 2 8 NC 7 OUTA GND GND 3 6 VCC INB 4 5 OUTB GND 3 6 VCC INB 4 5 OUTB SOIC-8 TDFN-2×2-8L SGM48001 (TOP VIEW) SGM48001 (TOP VIEW) NC 1 8 NC INA 2 7 OUTA NC 1 INA 2 8 NC 7 OUTA GND GND 3 6 VCC INB 4 5 OUTB GND 3 6 VCC INB 4 5 OUTB SOIC-8 TDFN-2×2-8L SGM48002 (TOP VIEW) SGM48002 (TOP VIEW) NC 1 8 NC INA 2 7 OUTA NC 1 INA 2 8 NC 7 OUTA GND GND 3 6 VCC INB 4 5 OUTB SOIC-8 SG Micro Corp www.sg-micro.com GND 3 6 VCC INB 4 5 OUTB TDFN-2×2-8L 3 SGM48000/1/2 High Speed, Dual Power MOSFET Drivers PIN DESCRIPTION PIN NAME FUNCTION TDFN-2×2-8L SOIC-8 1, 8 1, 8 NC No Connection. 2 2 INA Input for Channel A. Non-inverting input in SGM48000, inverting input in SGM48001, and inverting input in SGM48002. OUTA/ OUTA is held LOW if INA is unbiased or floating. 3 3 GND Ground. All signals referenced to this pin. 4 4 INB Input for Channel B. Non-inverting input in SGM48000, inverting input in SGM48001, and non-inverting input in SGM48002. OUTB/ OUTB is held LOW if INB is unbiased or floating. 5 5 OUTB/ OUTB 6 6 VCC 7 7 OUTA/ OUTA Exposed Pad — GND Output of Channel B. Supply Input. Output of Channel A. Exposed pad should be soldered to PCB board and connected to GND. FUNCTION TABLE SGM48000 SGM48001 SGM48002 INA INB OUTA OUTB OUTA OUTB OUTA OUTB L L L L H H H L L H L H H L H H H L H L L H L L H H H H L L L H Floating Floating L L L L L L SG Micro Corp www.sg-micro.com 4 SGM48000/1/2 High Speed, Dual Power MOSFET Drivers ELECTRICAL CHARACTERISTICS (VCC = 24V, TA = 25℃, unless otherwise noted.) PARAMETER CONDITIONS MIN TYP MAX UNITS INPUT Input Signal High Threshold (VIH) TA = -40℃ to +85℃ Input Signal Low Threshold (VIL) TA = -40℃ to +85℃ Input Signal Hysteresis (VHYS) TA = -40℃ to +85℃ 1.6 V 0.7 0.3 V 6 8 Non-Inverting Input Current, VINX = 24V 108 135 Inverting Input Current, VINX = 0V 102 115 Non-Inverting Input Current, VINX = 0V 0.1 1 Pull-Up Resistance (ROH) Source Current = 100mA 2.3 3.1 Ω Pull-Down Resistance (ROL) Sink Current = -100mA 1.6 2.2 Ω Input Signal High Current (IIH) Input Signal Low Current (IIL) Inverting Input Current, VINX = 24V V μA μA OUTPUT Peak Output Current (IPK) Continuous Output Current (IDC) Source Current, f = 1kHz, CL =0.1μF 2 Sink Current, f = 1kHz, CL =0.1μF -2 A Source/Sink Current ±200 mA Inputs Floating, SGM48000 1.14 1.54 Inputs Floating, SGM48001 1.29 1.72 Inputs Floating, SGM48002 1.19 1.60 POWER SUPPLY Power Supply Current (ICC) Operating Voltage Range (VCC) 4.5 mA 26.5 V 4 V Under-Voltage Lockout ON Threshold 3.6 Under-Voltage Lockout Hysteresis 0.5 V SWITCHING CHARACTERISTICS Rise Time (tR) CL = 1000pF 12 ns Fall Time (tF) CL = 1000pF 13 ns Turn-On Delay Time (tD1) See Figure 1, Figure 2 21 ns Turn-Off Delay Time (tD2) See Figure 1, Figure 2 23 ns Thermal Shutdown Threshold 150 ℃ Thermal Shutdown Threshold Hysteresis 15 ℃ OVER-TEMPERATURE PROTECTION SG Micro Corp www.sg-micro.com 5 SGM48000/1/2 High Speed, Dual Power MOSFET Drivers TYPICAL PERFORMANCE CHARACTERISTICS TA = +25℃, VCC = 24V, CIN = 4.7μF, CL = 1nF, unless otherwise noted. Power Supply Current vs. Supply Voltage Power Supply Current vs. Temperature 1.7 1.5 Inputs Floating 1.5 Power Supply Current (mA) Power Supply Current (mA) Inputs Floating 1.3 1.1 0.9 0.7 1.4 1.3 1.2 1.1 1.0 0.9 0 5 10 15 20 25 30 -50 -25 Supply Voltage (V) Pull-Up Resistance vs. Supply Voltage 75 100 Pull-Down Resistance vs. Supply Voltage 2.4 3.0 Source Current = 100mA Source Current = -100mA Pull-Down Resistance (Ω) 2.7 Pull-Up Resistance (Ω) 0 25 50 Temperature (℃) 2.4 2.1 1.8 1.5 2.1 1.8 1.5 1.2 0.9 0.6 1.2 0 5 10 15 20 Supply Voltage (V) SG Micro Corp www.sg-micro.com 25 30 0 5 10 15 20 Supply Voltage (V) 25 30 6 SGM48000/1/2 High Speed, Dual Power MOSFET Drivers TYPICAL PERFORMANCE CHARACTERISTICS TA = +25℃, VCC = 24V, CIN = 4.7μF, CL = 1nF, unless otherwise noted. Turn-On Delay Time tD1 (Non-Inverting) Turn-Off Delay Time tD2 (Non-Inverting) 2V/div VIN 10V/div 10V/div VOUT VOUT 2V/div VIN Time (20ns/div) Time (20ns/div) Rise Time tR (Non-Inverting) Fall Time tF (Non-Inverting) 10V/div 10V/div VOUT VOUT 2V/div VIN 2V/div VIN Time (20ns/div) Time (20ns/div) Turn-On Delay Time tD1 (Inverting) Turn-Off Delay Time tD1 (Inverting) 10V/div 10V/div VOUT VOUT 2V/div VIN 2V/div Time (20ns/div) SG Micro Corp www.sg-micro.com VIN Time (20ns/div) 7 SGM48000/1/2 High Speed, Dual Power MOSFET Drivers TYPICAL PERFORMANCE CHARACTERISTICS TA = +25℃, VCC = 24V, CIN = 4.7μF, CL = 1nF, unless otherwise noted. Rise Time tR (Inverting) Fall Time tF (Inverting) 10V/div 10V/div VOUT VOUT 2V/div VIN 2V/div VIN Time (20ns/div) Time (20ns/div) Quasi-Static Source Current Quasi-Static Sink Current CL = 0.1μF CL = 0.1μF 2A/div 2A/div IOUT IOUT Time (200ns/div) SG Micro Corp www.sg-micro.com VIN 5V/div 5V/div VIN 10V/div 10V/div VOUT VOUT Time (200ns/div) 8 SGM48000/1/2 High Speed, Dual Power MOSFET Drivers TIMING TABLE 5V 5V Input 2.5V Input 2.5V 0 0 Non-Inverting Output 90% Inverting Output 10% tD1 tR tD2 90% 10% tF tD1 Figure 1. Non-Inverting Input Driver Operation tF tD2 tR Figure 2. Inverting Input Driver Operation TEST CIRCUIT VCC 6 CIN 4.7μF VCC Input 2 INA OUTA 7 Output CL 1000pF GND 3 Figure 3. Standard Test Configuration SG Micro Corp www.sg-micro.com 9 SGM48000/1/2 High Speed, Dual Power MOSFET Drivers FUNCTIONAL BLOCK DIAGRAMS SGM48000 NC 1 8 NC 7 OUTA 6 VCC 5 OUTB 8 NC 7 OUTA 6 VCC 5 OUTB 8 NC 7 OUTA 6 VCC 5 OUTB VCC INA 2 100kΩ VCC GND 3 INB 4 UVLO VCC VCC 100kΩ Figure 4. SGM48000 Block Diagram NC 1 SGM48001 VCC VCC INA 2 100kΩ VCC GND 3 UVLO VCC INB VCC VCC 4 100kΩ Figure 5. SGM48001 Block Diagram NC 1 SGM48002 VCC VCC INA 2 100kΩ VCC GND 3 INB 4 UVLO VCC VCC 100kΩ Figure 6. SGM48002 Block Diagram SG Micro Corp www.sg-micro.com 10 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOIC-8 0.6 D e 2.2 E1 E 5.2 b 1.27 RECOMMENDED LAND PATTERN (Unit: mm) L A A1 θ c A2 Symbol Dimensions In Millimeters MIN MAX Dimensions In Inches MIN MAX A 1.350 1.750 0.053 0.069 A1 0.100 0.250 0.004 0.010 A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.006 0.010 D 4.700 5.100 0.185 0.200 E 3.800 4.000 0.150 0.157 E1 5.800 6.200 0.228 0.244 e 1.27 BSC 0.050 BSC L 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8° SG Micro Corp www.sg-micro.com TX00010.000 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS TDFN-2×2-8L D e N8 E1 D1 L E k N4 N1 b BOTTOM VIEW TOP VIEW 1.20 0.65 0.60 1.95 A A1 A2 SIDE VIEW 0.24 0.50 RECOMMENDED LAND PATTERN (Unit: mm) Symbol Dimensions In Millimeters Dimensions In Inches MIN MAX A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A2 MIN 0.203 REF MAX 0.008 REF D 1.900 2.100 0.075 0.083 D1 1.100 1.300 0.043 0.051 E 1.900 2.100 0.075 0.083 E1 0.500 0.700 0.020 k b 0.200 MIN 0.180 e L SG Micro Corp www.sg-micro.com 0.300 0.007 0.450 0.010 0.500 TYP 0.250 0.028 0.008 MIN 0.012 0.020 TYP 0.018 TX00056.000 PACKAGE INFORMATION TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P2 W P0 Q1 Q2 Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 Q3 Q4 B0 Reel Diameter P1 A0 K0 Reel Width (W1) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Reel Diameter Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P0 (mm) P1 (mm) P2 (mm) W (mm) Pin1 Quadrant SOIC-8 13″ 12.4 6.4 5.4 2.1 4.0 8.0 2.0 12.0 Q1 TDFN-2×2-8L 7″ 9.5 2.30 2.30 1.10 4.00 4.00 2.00 8.00 Q1 SG Micro Corp www.sg-micro.com DD0001 Package Type TX10000.000 PACKAGE INFORMATION CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Length (mm) Width (mm) Height (mm) Pizza/Carton 7″ (Option) 368 227 224 8 7″ 442 410 224 18 13″ 386 280 370 5 SG Micro Corp www.sg-micro.com DD0002 Reel Type TX20000.000