SGM4871YS8/TR

SGM4871 2.4W Audio Power Amplifier with Shutdown Mode GENERAL DESCRIPTION FEATURES The SGM4871 is a mono bridged audio power amplifier  Output Power at THD+N = 10%, 1kHz that is designed for portable communication device SGM4871YPS8: 2.4W (TYP) into 4Ω Load applications and demanding applications in mobile SGM4871YS8: 1.5W (TYP) into 8Ω Load phones. SGM4871YPS8 is capable of delivering 2.4W of  Unity Gain Stable continuous average power into a 4Ω load with typically  2.5V to 5.5V Operation 10% distortion (THD+N) from a 5V battery voltage. It  Shutdown Current: 0.07μA (TYP) operates from 2.5V to 5.5V power supply.  Thermal Overload Protection Circuitry  No Output Coupling Capacitors, Bootstrap The SGM4871’s micro-power shutdown mode (ISD = Capacitors or Snubber Networks Required 0.07µA TYP) is activated when V+ is applied to the SHDN  External Gain Configuration Capability pin. Since the SGM4871 does not require output coupling  -40℃ to +85℃ Operating Temperature Range capacitors, bootstrap capacitors, or snubber networks, it  Available in Green SOIC-8 (Exposed Pad) and is ideally suited for low power portable systems that SOIC-8 Packages require minimum volume and weight. The SGM4871 is unity-gain stable and can be configured by external gain-setting resistors. Additionally, the SGM4871 features an internal thermal shutdown protection mechanism. The SGM4871 is available in Green SOIC-8 and SOIC-8 (Exposed Pad) packages. It operates over an ambient APPLICATIONS Portable Systems Wireless Handsets Mobile Phone PDAs temperature range of -40℃ to +85℃. SG Micro Corp www.sg-micro.com REV. A. 2 2.4W Audio Power Amplifier with Shutdown Mode SGM4871 PACKAGE/ORDERING INFORMATION MODEL SGM4871 ORDER NUMBER PACKAGE DESCRIPTION PACKAGE OPTION MARKING INFORMATION SGM4871YPS8/TR SGM4871YS8/TR SOIC-8 (Exposed Pad) Tape and Reel, 2500 SGM4871YPS8 SOIC-8 Tape and Reel, 2500 SGM4871YS8 ABSOLUTE MAXIMUM RATINGS CAUTION Supply Voltage …………………………………………………5.5V Input Voltage…………………………….…… -0.1V to (V+) + 0.1V Storage Temperature Range…………….…… -65℃ to +150℃ This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Junction Temperature ……………………………………… 150℃ Operating Temperature Range………………...…-40℃ to +85℃ Lead Temperature Range (Soldering 10 sec) …………………………………………………………………260℃ ESD Susceptibility HBM…………………………………………………..………2000V MM……………………………………………………...………200V NOTE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SGMICRO reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. Please contact SGMICRO sales office to get the latest datasheet. PIN CONFIGURATIONS (TOP VIEW) SGM4871 SHDN 1 8 VO2 Bypass 2 7 GND +IN 3 6 V+ -IN 4 5 VO1 SOIC-8/SOIC-8 (Exposed Pad) SG Micro Corp www.sg-micro.com 2 2.4W Audio Power Amplifier with Shutdown Mode SGM4871 ELECTRICAL CHARACTERISTICS (The following specifications apply for TA = +25℃, V+ = 5V and RL = 8Ω, unless otherwise specified.) PARAMETER SYMBOL Supply Voltage V+ Output Offset Voltage VOS CONDITIONS V 65 mV No Load 5.2 9 RL = 8Ω 5.3 Shutdown Current ISD V+ = 5.0V, VSHDN = 5.0V, IO = 0mA VSDIL Output Power (4Ω) PO Output Power (8Ω) PO UNITS 5.5 VSHDN = GND Shutdown Voltage Input Low MAX 5.5 IQ VSDIH TYP 2.5 Quiescent Power Supply Current Shutdown Voltage Input High MIN 0.07 2 1.2 0.4 mA μA V f = 1kHz, THD+N = 1% 1.9 W f = 1kHz, THD+N = 10% 2.4 W f = 1kHz, THD+N = 1% 1.2 W f = 1kHz, THD+N = 10% 1.5 W Total Harmonic Distortion + Noise THD+N 20Hz < f < 20kHz, RL = 8Ω, PO = 1W 0.2 % Power Supply Rejection Ratio PSRR VSHDN = GND, V+ = 4.9V to 5.1V 70 dB SG Micro Corp www.sg-micro.com 3 2.4W Audio Power Amplifier with Shutdown Mode SGM4871 TYPICAL PERFORMANCE CHARACTERISTICS (SGM4871YS8) THD+N vs. Frequency 0.1 Output Power vs. Supply Voltage 2 V+ = +5V PO = 1.0W RL = 8Ω AV = 2 No Filters 0.01 0.01 Output Power (W) THD+N (%) 1 f = 1kHz BW < 80kHz RL = 8Ω 1.5 1 10% THD+N 1% THD+N 0.5 0 0.1 1 10 Frequency (kHz) 100 2 THD+N vs. Output Power V+ = +5V AV = 2 f = 1kHz RL = 8Ω BW < 80kHz 1 Supply Current (mA) THD+N (%) 5 5.5 6 0.1 0.01 0.01 VIN = 0V No Load 5.5 5 4.5 4 3.5 3 0.1 1 Output Power (W) 10 2 PSRR vs. Frequency 0.7 80 0.6 70 60 V+ = +5V CB = 1.0μF RL = 8Ω VRIPPLE = 200mVrms 50 40 0.1 1 Frequency (kHz) SG Micro Corp www.sg-micro.com 10 2.5 3 3.5 4 4.5 Supply Voltage (V) 5 5.5 Power Dissipation vs. Output Power 90 Power Dissipation (W) PSRR (dB) 3 3.5 4 4.5 Supply Voltage (V) Supply Current vs. Supply Voltage 10 30 0.01 2.5 100 0.5 0.4 0.3 0.2 V+ = +5V, f = 1kHz, RL = 8Ω 0.1 THD + N ≤ 1%, BW < 80kHz 0 0 0.5 1 Output Power (W) 1.5 4 2.4W Audio Power Amplifier with Shutdown Mode SGM4871 TYPICAL PERFORMANCE CHARACTERISTICS (SGM4871YPS8) THD+N vs. Frequency 0.1 THD+N vs. Frequency 1 V+ = +5V PO = 1.0W RL = 8Ω AV = 2 No Filters 0.01 0.01 0.1 THD+N (%) THD+N (%) 1 1 10 Frequency (kHz) 0.1 V+ = +5V PO = 1.6W RL = 4Ω AV = 2 No Filters 0.01 0.01 100 THD+N vs. Output Power THD+N (%) THD+N (%) 0.1 0.1 1 Output Power (W) V+ = +5V AV = 2 f = 1kHz RL = 4Ω BW < 80kHz 1 0.1 0.01 0.01 10 0.6 1.2 0.5 0.4 0.3 0.2 V+ = +5V, f = 1kHz, RL = 8Ω THD+N ≤ 1%, BW < 80kHz 0 0 0.5 1 Output Power (W) SG Micro Corp www.sg-micro.com 0.1 1 Output Power (W) 10 Power Dissipation vs. Output Power 1.4 Power Dissipation (W) Power Dissipation (W) Power Dissipation vs. Output Power 0.7 0.1 100 10 V+ = +5V AV = 2 f = 1kHz RL = 8Ω BW < 80kHz 0.01 0.01 1 10 Frequency (kHz) THD+N vs. Output Power 10 1 0.1 1 0.8 0.6 0.4 V+ = +5V, f = 1kHz, RL = 4Ω 0.2 THD+N ≤ 1%, BW < 80kHz 0 1.5 0 0.5 1 1.5 Output Power (W) 2 2.5 5 2.4W Audio Power Amplifier with Shutdown Mode SGM4871 TYPICAL PERFORMANCE CHARACTERISTICS (SGM4871YPS8) Clipping Voltage vs. Supply Voltage PSRR vs. Frequency 1 90 Dropout Voltage (V) PSRR (dB) 80 70 60 V+ = +5V CB = 1.0μF RL = 8Ω VRIPPLE = 200mVrms 50 40 30 0.01 0.8 0.6 8Ω Top Side 0.4 8Ω Bottom Side 0.2 0 0.1 1 Frequency (kHz) 10 100 2 3 3.5 4 4.5 Supply Voltage (V) 5 5.5 Supply Current vs. Supply Voltage Output Power vs. Load Resistance 6 2 V+ = +5V f = 1kHz BW < 80kHz 1.5 1 Supply Current (mA) Output Power (W) 2.5 10% THD+N 1% THD+N 0.5 VIN = 0V No Load 5.5 5 4.5 4 3.5 3 0 0 10 20 30 Load Resistance (Ω) 40 2 2.5 3 3.5 4 4.5 Supply Voltage (V) 5 5.5 Output Power vs. Supply Voltage 2.5 f = 1kHz BW < 80kHz RL = 8Ω Output Power (W) 2 1.5 10% THD+N 1 0.5 1% THD+N 0 2.5 3 3.5 4 4.5 Supply Voltage (V) SG Micro Corp www.sg-micro.com 5 5.5 6 2.4W Audio Power Amplifier with Shutdown Mode SGM4871 TYPICAL APPLICATION RF 20kΩ V+ + CS 1.0μF Audio Input RI 20kΩ -IN 4 +IN 3 6 VO1 CI 0.39μF 5 + RL 8Ω V+ CB 1.0μF Bypass 2 SHDN 1 NC AV = -1 + VO2 8 Bias RPU V+ /2 10kΩ 7 GND NOTE: 1. A 10kΩ resistor must be serially connected to SHDN pin. SG Micro Corp www.sg-micro.com 7 2.4W Audio Power Amplifier with Shutdown Mode SGM4871 APPLICATION NOTES PCB Design Recommendations (Thermal Design Considerations) With proper thermal design considerations, SGM4871YPS8 is capable of delivering 2.4W of continuous average power into a 4Ω load. Thermal Land The SOIC-8 (Exposed Pad) thermal land is a metal (normally copper) region centrally located under the package and on top of the PCB. It has a rectangular or square shape and should match the dimensions of the exposed pad on the bottom of the package (1:1 ratio). For certain high power applications, the PCB land may be modified to a "dog bone" shape that enhances thermal performance. The packages used with the "dog bone" lands will be a dual inline configuration (see Figure 1). Top View Figure 1. Dog Bone Thermal Vias Thermal vias are necessary. They conduct heat from the exposed pad of the package to the ground plane. The number of vias is application specific and is dependent upon electrical requirements and power dissipation. The via diameter should be 0.2mm to 0.33mm with 1oz. copper via barrel plating. It is important to plug the via to avoid any solder wicking inside the via during the soldering process. The thermal vias can be tented with solder mask on the top surface of the PCB. The solder mask diameter should be at least 75microns (or 3mils) larger than the via diameter. The solder mask thickness should be the same across the entire PCB. A package thermal performance may be improved by increasing the number of vias. SG Micro Corp www.sg-micro.com 8 2.4W Audio Power Amplifier with Shutdown Mode SGM4871 PACKAGE OUTLINE DIMENSIONS SOIC-8 0.6 D e 2.2 E1 E 5.2 b 1.27 RECOMMENDED LAND PATTERN (Unit: mm) L A A1 θ c A2 Symbol Dimensions In Millimeters MIN MAX Dimensions In Inches MIN MAX A 1.350 1.750 0.053 0.069 A1 0.100 0.250 0.004 0.010 A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.006 0.010 D 4.700 5.100 0.185 0.200 E 3.800 4.000 0.150 0.157 E1 5.800 6.200 0.228 e 1.27 BSC 0.244 0.050 BSC L 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8° SG Micro Corp www.sg-micro.com 9 2.4W Audio Power Amplifier with Shutdown Mode SGM4871 PACKAGE OUTLINE DIMENSIONS SOIC-8 (Exposed Pad) 3.302 D e E1 E 2.413 E2 5.56 1.91 b D1 1.27 0.61 RECOMMENDED LAND PATTERN (Unit: mm) L A θ A1 c A2 Symbol Dimensions In Millimeters MIN MAX A A1 Dimensions In Inches MIN MAX 1.700 0.000 0.067 0.100 0.000 0.004 A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.007 0.010 D 4.700 5.100 0.185 0.201 D1 3.202 3.402 0.126 0.134 E 3.800 4.000 0.150 0.157 E1 5.800 6.200 0.228 0.244 E2 2.313 2.513 0.091 0.099 e 1.27 BSC 0.050 BSC L 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8° SG Micro Corp www.sg-micro.com 10 2.4W Audio Power Amplifier with Shutdown Mode SGM4871 TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P2 W P0 Q1 Q2 Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 Q3 Q4 B0 Reel Diameter P1 A0 K0 DIRECTION OF FEED Reel Width (W1) NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Package Type Reel Diameter Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P0 (mm) P1 (mm) P2 (mm) W (mm) Pin1 Quadrant SOIC-8 13″ 12.4 6.4 5.4 2.1 4.0 8.0 2.0 12.0 Q1 SOIC-8 (Exposed Pad) 13″ 12.4 6.4 5.4 2.1 4.0 8.0 2.0 12.0 Q1 SG Micro Corp www.sg-micro.com 11 2.4W Audio Power Amplifier with Shutdown Mode SGM4871 CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Reel Type Length (mm) Width (mm) Height (mm) Pizza/Carton 13″ 386 280 370 5 SG Micro Corp www.sg-micro.com 12