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SGM7227YUWQ10G/TR

SGM7227YUWQ10G/TR

  • 厂商:

    SGMICRO(圣邦微)

  • 封装:

    UTQFN10_1.8X1.4MM

  • 描述:

    高速USB 2.0(480Mbps)DPDT模拟开关

  • 数据手册
  • 价格&库存
SGM7227YUWQ10G/TR 数据手册
SGM7227 High Speed USB 2.0 (480Mbps) DPDT Analog Switch GENERAL DESCRIPTION FEATURES The SGM7227 is a high-speed, low-power double-pole/ z RON is Typically 5Ω at 3.0V double-throw (DPDT) analog switch that operates from a z Voltage Operation: 1.8V to 4.3V single 1.8V to 4.3V power supply. z Fast Switching Times: tON 15ns SGM7227 is designed for the switching of high-speed tOFF 20ns USB 2.0 signals in handset and consumer applications, z Crosstalk: -30dB at 250MHz such as cell phones, digital cameras, and notebooks with z Off-Isolation: -35dB at 250MHz hubs or controllers with limited USB I/Os. z Rail-to-Rail Input and Output Operation z Break-Before-Make Switching The SGM7227 has low bit-to-bit skew and high z channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps). Each switch is bidirectional and offers little or no z Extended Industrial Temperature Range: -40℃ to +85℃ Available in Green UTQFN1.8×1.4-10L and MSOP10 Packages attenuation of the high-speed signals at the outputs. Its bandwidth is wide enough to pass high-speed USB 2.0 differential signals (480 Mb/s) with good signal integrity. BLOCK DIAGRAM The SGM7227 contains special circuitry on the D+/Dpins which allows the device to withstand a VBUS short to D+ or D- when the USB devices are either powered off or HSD1+ D+ HSD2+ powered on. SGM7227 is available in Green UTQFN1.8×1.4-10L and MSOP10 packages. It operates over an ambient HSD1DHSD2- temperature range of -40℃ to +85℃. LOGIC APPLICATIONS Route Signals for USB 2.0 MP3 and Other Personal Media Players S OE Digital Cameras and Camcorders Portable Instrumentation Set-Top Box PDAs SG Micro Limited www.sg-micro.com REV. A High Speed USB 2.0 (480Mbps) DPDT Analog Switch SGM7227 PACKAGE/ORDERING INFORMATION PINPACKAGE SPECIFIED TEMPERATURE RANGE MSOP10 -40℃ to +85℃ SGM7227YMS10G/TR UTQFN1.8×1.4-10L -40℃ to +85℃ SGM7227YUWQ10G/TR MODEL SGM7227 ORDERING NUMBER PACKAGE MARKING PACKAGE OPTION SGM7227YMS10 Tape and Reel, 3000 7227 Tape and Reel, 3000 ABSOLUTE MAXIMUM RATINGS VCC to GND................................................................ 0V to 4.6V Analog, Digital voltage range .....................-0.3V to (VCC) + 0.3V Continuous Current HSDn or Dn……..............................±50mA Peak Current HSDn or Dn……......................................±100mA Operating Temperature Range............................-40℃ to +85℃ Junction Temperature....................................................... 150℃ Storage Temperature.........................................-65℃ to +150℃ Lead Temperature (soldering, 10s)...................................260℃ ESD Susceptibility HBM (UTQFN1.8×1.4-10L)…………………………………4000V MM (UTQFN1.8×1.4-10L) …………………………………...400V NOTE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. SG Micro Limited www.sg-micro.com 2 High Speed USB 2.0 (480Mbps) DPDT Analog Switch SGM7227 PIN CONFIGURATIONS (TOP VIEW) HSD2+ HSD27 8 5 HSD1+ VCC 9 4 HSD1- S 10 3 GND OE VCC 1 10 OE S 2 9 HSD2+ D+ 3 8 HSD2- D- 4 7 HSD1+ GND 5 6 HSD1- 6 1 2 D+ D- UTQFN1.8×1.4-10L MSOP10 PIN DESCRIPTION PIN UTQFN1.8×1.4-10L 9 3 10 8 5 4 7 6 1 2 MSOP10 1 5 2 10 7 6 9 8 3 4 NAME VCC GND S OE HSD1+ HSD1HSD2+ HSD2D+ D- FUNCTION Power Supply Ground Select Input Output Enable Multiplexed Source Inputs Multiplexed Source Inputs Multiplexed Source Inputs Multiplexed Source Inputs USB Data Bus USB Data Bus FUNCTION TABLE OE S HSD1+, HSD1- HSD2+, HSD2- 0 0 1 0 1 × ON OFF OFF OFF ON OFF Switches Shown For Logic “0” Input SG Micro Limited www.sg-micro.com 3 High Speed USB 2.0 (480Mbps) DPDT Analog Switch SGM7227 ELECTRICAL CHARACTERISTICS (VCC = +3.3V, TA = +25℃, unless otherwise noted.) PARAMETER ANALOG SWITCH Analog I/O Voltage (HSD1+, HSD1-, HSD2+, HSD2-) On-Resistance On-Resistance Match Between Channels On-Resistance Flatness Power Off Leakage Current (D+, D-) Increase in ICC per Control Voltage Source Off Leakage Current Channel On Leakage Current SYMBOL CONDITIONS ICCT VCC = 3.0V, VIS = 0V to 0.4V, ID = 8mA, Test Circuit 1 VCC = 3.0V, VIS = 0V to 0.4V, ID = 8mA, Test Circuit 1 VCC = 3.0V, VIS = 0V to 1.0V, ID = 8mA, Test Circuit 1 VCC = 0V, VD = 0V to 3.6V, VS , V OE = 0V or 3.6 V VCC = 3.6V, VS or V OE = 2.6V IHSD2(OFF), IHSD1(OFF) IHSD2(ON), IHSD1(ON) VCC = 3.6V, VIS = 3.3V/ 0.3V, VD = 0.3V/ 3.3V VCC = 3.6V, VIS = 3.3V/ 0.3V, VD = 3.3V/ 0.3V or floating ∆RON RFLAT(ON) IOFF TYP MAX UNITS VCC V 5 9 Ω 0.3 0.8 Ω 1 2 Ω 1 µA 5 µA 1 µA 1 µA 0.5 V 1 µA 0 VIS RON MIN DIGITAL INPUTS Input High Voltage VIH Input Low Voltage VIL 1.6 Input Leakage Current IIN VCC = 3.0V, VS , V OE = 0V or VCC Turn-On Time tON Turn-Off Time tOFF VIS = 0.8V, RL = 50Ω, CL = 10pF, Test Circuit 2 V DYNAMIC CHARACTERISTICS Break-Before-Make Time Delay tD Propagation Delay tPD Off Isolation OISO Channel-to-Channel Crosstalk XTALK –3dB Bandwidth Channel-to-Channel Skew Charge Injection Select Input to Common I/O HSD+, HSD-, D+, DON Capacitance BW tSKEW Q CON 15 ns 20 ns VIS = 0.8V, RL = 50Ω, CL = 10pF, Test Circuit 3 3.5 ns RL = 50Ω, CL = 10pF 0.5 ns -35 dB -30 dB 550 MHz Signal = 0dBm, RL = 50Ω, f = 250MHz, Test Circuit 4 Signal = 0dBm, RL = 50Ω, f = 250MHz, Test Circuit 5 Signal = 0dBm, RL = 50Ω, CL = 5pF, Test Circuit 6 RL = 50Ω, CL = 10pF 130 ps VG = GND, CL = 1.0nF, RG = 0Ω, Q = CL x VOUT, Test Circuit 7 10 pC f = 1MHz 6.5 f = 250MHz pF 7 POWER REQUIREMENTS Power Supply Range VCC Power Supply Current ICC 1.8 VCC = 3.0V, VS , V OE = 0V or VCC 4.3 V 1 µA Specifications subject to changes without notice. SG Micro Limited www.sg-micro.com 4 High Speed USB 2.0 (480Mbps) DPDT Analog Switch SGM7227 TYPICAL PERFORMANCE CHARACTERISTICS Response vs. Frequency Response vs. Frequency 20 0 0 -20 -20 On Response (dB) On Response (dB) 20 CROSSTALK -40 -60 -80 -100 VCC = +3.3V -120 OFF-ISOLATION -40 -60 -80 -100 VCC = +3.3V -120 TA = +25℃ -140 TA = +25℃ -140 0.1 1 10 100 Frequency (MHz) SG Micro Limited www.sg-micro.com 1000 0.1 1 10 100 Frequency (MHz) 1000 5 High Speed USB 2.0 (480Mbps) DPDT Analog Switch SGM7227 TEST CIRCUITS 8mA V1 HSDn Dn RON = V1/8mA GND Test Circuit 1. On Resistance VIH HSD1n VIS Dn 50% 50% VIL RL 0.1µF VS VOUT HSD2n CL VOH S VS 90% 90% VOUT VOL GND tOFF tON Test Circuit 2. Switching Times (tON, tOFF) VIS VIH HSD1n VS Dn HSD2n VOUT 0.1µF RL S 50% VIL VOH 90% of VOH CL VOUT VS GND 0 tD Test Circuit 3. Break-Before-Make Time (tD) SG Micro Limited www.sg-micro.com 6 High Speed USB 2.0 (480Mbps) DPDT Analog Switch SGM7227 TEST CIRCUITS (Cont.) VCC 0.1µF VCC HSD1n Dn VOUT HSD2n Source Signal RL RL S GND Test Circuit 4. Off Isolation VCC 0.1µF VCC HSDn Dn RL Source Signal N.C. HSDn Dn VOUT RL S GND Channel To Channel Crosstalk = -20 × log VHSDn VOUT Test Circuit 5. Channel-to-Channel Crosstalk SG Micro Limited www.sg-micro.com 7 High Speed USB 2.0 (480Mbps) DPDT Analog Switch SGM7227 TEST CIRCUITS (Cont.) VCC 0.1μF VCC HSDn Source Signal Dn VOUT RL S CL GND Test Circuit 6. -3dB Bandwidth VIH HSD1n RG VG VS Dn VIL VOUT HSD2n CL S VOUT ΔOUT VS GND Q = ΔVOUT × CL Test Circuit 7. Charge Injection (Q) SG Micro Limited www.sg-micro.com 8 SGM7227 High Speed USB 2.0 (480Mbps) DPDT Analog Switch APPLICATION NOTES Meeting USB 2.0 VBUS Short Requirements Power-Off Protection For a VBUS short circuit the switch is expected to withstand such a condition for at least 24 hours. The SGM7227 has specially designed circuitry which prevents unintended signal bleed through as well as guaranteed system reliability during a power-down, over-voltage condition. The protection has been added to the common pins (D+, D-). Power-On Protection The USB 2.0 specification also notes that the USB device should be capable of withstanding a VBUS short during transmission of data. This modification works by limiting current flow back into the VCC rail during the over-voltage event so current remains within the safe operating range. SG Micro Limited www.sg-micro.com 9 High Speed USB 2.0 (480Mbps) DPDT Analog Switch SGM7227 SGM7227 USB2.0 Signal Quality Compliance Test Results Figures 1 and 2 show the test results for USB eye diagram tests. Figure 1. Waveform Plot Figure 2. High Speed Signal Quality Eye Diagram Test (V+ = 3.3V) SG Micro Limited www.sg-micro.com 10 SGM7227 High Speed USB 2.0 (480Mbps) DPDT Analog Switch The following is a summary of the USB test Results. The SGM7227 passes the high speed signal quality, eye diagram and jitter tests. Required Tests y Overall result: Pass! y Signal eye: Eye passes y EOP width: 7.91 bits EOP width passes y Measured signaling rate: 480.0551 MHz Signal rate passes y Rising Edge Rate: 901.28 V/us (710.10 ps equivalent risetime) Passes y Falling Edge Rate: 889.18 V/us (719.77 ps equivalent risetime) Passes Additional Information Consecutive jitter range: -61.770 ps to 39.668 ps, RMS jitter 21.900 ps Paired JK jitter range: -47.800 ps to 42.890 ps, RMS jitter 21.591 ps Paired KJ jitter range: -50.590 ps to 49.704 ps, RMS jitter 23.281 ps SG Micro Limited www.sg-micro.com 11 High Speed USB 2.0 (480Mbps) DPDT Analog Switch SGM7227 PACKAGE OUTLINE DIMENSIONS MSOP10 b c L E1 E e θ A D A1 A2 Symbol Dimensions In Millimeters Min Max Dimensions In Inches Min Max A 0.820 1.100 0.032 0.043 A1 0.020 0.150 0.001 0.006 A2 0.750 0.950 0.030 0.037 b 0.180 0.280 0.007 0.011 c 0.090 0.230 0.004 0.009 D 2.900 3.100 0.114 0.122 E 2.900 3.100 0.114 0.122 E1 4.750 5.050 0.187 0.199 e 0.500 BSC 0.020 BSC L 0.400 0.800 0.016 0.031 θ 0° 6° 0° 6° SG Micro Limited www.sg-micro.com 12 High Speed USB 2.0 (480Mbps) DPDT Analog Switch SGM7227 PACKAGE OUTLINE DIMENSIONS UTQFN1.8×1.4-10L 0.400 ±0.050 (×9) 0.400 TYP 1.400 ± 0.050 1.800 ±0.050 PIN #1 IDENTIFICATION CHAMFER 0.100×45° 0.800 REF TOP VIEW 0.200±0.050 0.500±0.050 PIN #1 DOT BY MARKING BOTTOM VIEW 0.000-0.050 0.550±0.050 0.152 REF SIDE VIEW NOTE: All linear dimensions are in millimeters. REV. A SGMICRO is dedicated to provide high quality and high performance analog IC products to customers. All SGMICRO products meet the highest industry standards with strict and comprehensive test and quality control systems to achieve world-class consistency and reliability. For more information regarding SGMICRO Corporation and its products, please visit www.sg-micro.com SG Micro Limited www.sg-micro.com 13