SGM7227
High Speed USB 2.0
(480Mbps) DPDT Analog Switch
GENERAL DESCRIPTION
FEATURES
The SGM7227 is a high-speed, low-power double-pole/
z
RON is Typically 5Ω at 3.0V
double-throw (DPDT) analog switch that operates from a
z
Voltage Operation: 1.8V to 4.3V
single 1.8V to 4.3V power supply.
z
Fast Switching Times:
tON 15ns
SGM7227 is designed for the switching of high-speed
tOFF 20ns
USB 2.0 signals in handset and consumer applications,
z
Crosstalk: -30dB at 250MHz
such as cell phones, digital cameras, and notebooks with
z
Off-Isolation: -35dB at 250MHz
hubs or controllers with limited USB I/Os.
z
Rail-to-Rail Input and Output Operation
z
Break-Before-Make Switching
The SGM7227 has low bit-to-bit skew and high
z
channel-to-channel noise isolation, and is compatible with
various standards, such as high-speed USB 2.0 (480
Mbps). Each switch is bidirectional and offers little or no
z
Extended Industrial Temperature Range:
-40℃ to +85℃
Available in Green UTQFN1.8×1.4-10L and
MSOP10 Packages
attenuation of the high-speed signals at the outputs. Its
bandwidth is wide enough to pass high-speed USB 2.0
differential signals (480 Mb/s) with good signal integrity.
BLOCK DIAGRAM
The SGM7227 contains special circuitry on the D+/Dpins which allows the device to withstand a VBUS short to
D+ or D- when the USB devices are either powered off or
HSD1+
D+
HSD2+
powered on.
SGM7227 is available in Green UTQFN1.8×1.4-10L and
MSOP10 packages. It operates over an ambient
HSD1DHSD2-
temperature range of -40℃ to +85℃.
LOGIC
APPLICATIONS
Route Signals for USB 2.0
MP3 and Other Personal Media Players
S
OE
Digital Cameras and Camcorders
Portable Instrumentation
Set-Top Box
PDAs
SG Micro Limited
www.sg-micro.com
REV. A
High Speed USB 2.0
(480Mbps) DPDT Analog Switch
SGM7227
PACKAGE/ORDERING INFORMATION
PINPACKAGE
SPECIFIED
TEMPERATURE
RANGE
MSOP10
-40℃ to +85℃
SGM7227YMS10G/TR
UTQFN1.8×1.4-10L
-40℃ to +85℃
SGM7227YUWQ10G/TR
MODEL
SGM7227
ORDERING
NUMBER
PACKAGE
MARKING
PACKAGE
OPTION
SGM7227YMS10
Tape and Reel, 3000
7227
Tape and Reel, 3000
ABSOLUTE MAXIMUM RATINGS
VCC to GND................................................................ 0V to 4.6V
Analog, Digital voltage range .....................-0.3V to (VCC) + 0.3V
Continuous Current HSDn or Dn……..............................±50mA
Peak Current HSDn or Dn……......................................±100mA
Operating Temperature Range............................-40℃ to +85℃
Junction Temperature....................................................... 150℃
Storage Temperature.........................................-65℃ to +150℃
Lead Temperature (soldering, 10s)...................................260℃
ESD Susceptibility
HBM (UTQFN1.8×1.4-10L)…………………………………4000V
MM (UTQFN1.8×1.4-10L) …………………………………...400V
NOTE:
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections
of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
CAUTION
This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause
damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
SG Micro Limited
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2
High Speed USB 2.0
(480Mbps) DPDT Analog Switch
SGM7227
PIN CONFIGURATIONS (TOP VIEW)
HSD2+ HSD27
8
5
HSD1+
VCC
9
4
HSD1-
S
10
3
GND
OE
VCC
1
10
OE
S
2
9
HSD2+
D+
3
8
HSD2-
D-
4
7
HSD1+
GND
5
6
HSD1-
6
1
2
D+
D-
UTQFN1.8×1.4-10L
MSOP10
PIN DESCRIPTION
PIN
UTQFN1.8×1.4-10L
9
3
10
8
5
4
7
6
1
2
MSOP10
1
5
2
10
7
6
9
8
3
4
NAME
VCC
GND
S
OE
HSD1+
HSD1HSD2+
HSD2D+
D-
FUNCTION
Power Supply
Ground
Select Input
Output Enable
Multiplexed Source Inputs
Multiplexed Source Inputs
Multiplexed Source Inputs
Multiplexed Source Inputs
USB Data Bus
USB Data Bus
FUNCTION TABLE
OE
S
HSD1+, HSD1-
HSD2+, HSD2-
0
0
1
0
1
×
ON
OFF
OFF
OFF
ON
OFF
Switches Shown For Logic “0” Input
SG Micro Limited
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3
High Speed USB 2.0
(480Mbps) DPDT Analog Switch
SGM7227
ELECTRICAL CHARACTERISTICS
(VCC = +3.3V, TA = +25℃, unless otherwise noted.)
PARAMETER
ANALOG SWITCH
Analog I/O Voltage
(HSD1+, HSD1-, HSD2+, HSD2-)
On-Resistance
On-Resistance Match
Between Channels
On-Resistance Flatness
Power Off Leakage Current (D+, D-)
Increase in ICC per Control Voltage
Source Off Leakage Current
Channel On Leakage Current
SYMBOL
CONDITIONS
ICCT
VCC = 3.0V, VIS = 0V to 0.4V,
ID = 8mA, Test Circuit 1
VCC = 3.0V, VIS = 0V to 0.4V,
ID = 8mA, Test Circuit 1
VCC = 3.0V, VIS = 0V to 1.0V,
ID = 8mA, Test Circuit 1
VCC = 0V, VD = 0V to 3.6V,
VS , V OE = 0V or 3.6 V
VCC = 3.6V, VS or V OE = 2.6V
IHSD2(OFF),
IHSD1(OFF)
IHSD2(ON),
IHSD1(ON)
VCC = 3.6V, VIS = 3.3V/ 0.3V,
VD = 0.3V/ 3.3V
VCC = 3.6V, VIS = 3.3V/ 0.3V,
VD = 3.3V/ 0.3V or floating
∆RON
RFLAT(ON)
IOFF
TYP
MAX
UNITS
VCC
V
5
9
Ω
0.3
0.8
Ω
1
2
Ω
1
µA
5
µA
1
µA
1
µA
0.5
V
1
µA
0
VIS
RON
MIN
DIGITAL INPUTS
Input High Voltage
VIH
Input Low Voltage
VIL
1.6
Input Leakage Current
IIN
VCC = 3.0V, VS , V OE = 0V or VCC
Turn-On Time
tON
Turn-Off Time
tOFF
VIS = 0.8V, RL = 50Ω, CL = 10pF,
Test Circuit 2
V
DYNAMIC CHARACTERISTICS
Break-Before-Make Time Delay
tD
Propagation Delay
tPD
Off Isolation
OISO
Channel-to-Channel Crosstalk
XTALK
–3dB Bandwidth
Channel-to-Channel Skew
Charge Injection Select Input to
Common I/O
HSD+, HSD-, D+, DON Capacitance
BW
tSKEW
Q
CON
15
ns
20
ns
VIS = 0.8V, RL = 50Ω, CL = 10pF,
Test Circuit 3
3.5
ns
RL = 50Ω, CL = 10pF
0.5
ns
-35
dB
-30
dB
550
MHz
Signal = 0dBm, RL = 50Ω,
f = 250MHz, Test Circuit 4
Signal = 0dBm, RL = 50Ω,
f = 250MHz, Test Circuit 5
Signal = 0dBm, RL = 50Ω,
CL = 5pF, Test Circuit 6
RL = 50Ω, CL = 10pF
130
ps
VG = GND, CL = 1.0nF, RG = 0Ω,
Q = CL x VOUT, Test Circuit 7
10
pC
f = 1MHz
6.5
f = 250MHz
pF
7
POWER REQUIREMENTS
Power Supply Range
VCC
Power Supply Current
ICC
1.8
VCC = 3.0V, VS , V OE = 0V or VCC
4.3
V
1
µA
Specifications subject to changes without notice.
SG Micro Limited
www.sg-micro.com
4
High Speed USB 2.0
(480Mbps) DPDT Analog Switch
SGM7227
TYPICAL PERFORMANCE CHARACTERISTICS
Response vs. Frequency
Response vs. Frequency
20
0
0
-20
-20
On Response (dB)
On Response (dB)
20
CROSSTALK
-40
-60
-80
-100
VCC = +3.3V
-120
OFF-ISOLATION
-40
-60
-80
-100
VCC = +3.3V
-120
TA = +25℃
-140
TA = +25℃
-140
0.1
1
10
100
Frequency (MHz)
SG Micro Limited
www.sg-micro.com
1000
0.1
1
10
100
Frequency (MHz)
1000
5
High Speed USB 2.0
(480Mbps) DPDT Analog Switch
SGM7227
TEST CIRCUITS
8mA
V1
HSDn
Dn
RON = V1/8mA
GND
Test Circuit 1. On Resistance
VIH
HSD1n
VIS
Dn
50%
50%
VIL
RL
0.1µF
VS
VOUT
HSD2n
CL
VOH
S
VS
90%
90%
VOUT
VOL
GND
tOFF
tON
Test Circuit 2. Switching Times (tON, tOFF)
VIS
VIH
HSD1n
VS
Dn
HSD2n
VOUT
0.1µF
RL
S
50%
VIL
VOH
90% of VOH
CL
VOUT
VS
GND
0
tD
Test Circuit 3. Break-Before-Make Time (tD)
SG Micro Limited
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6
High Speed USB 2.0
(480Mbps) DPDT Analog Switch
SGM7227
TEST CIRCUITS (Cont.)
VCC
0.1µF
VCC
HSD1n
Dn
VOUT
HSD2n
Source
Signal
RL
RL
S
GND
Test Circuit 4. Off Isolation
VCC
0.1µF
VCC
HSDn
Dn
RL
Source
Signal
N.C.
HSDn
Dn
VOUT
RL
S
GND
Channel To Channel Crosstalk = -20 × log
VHSDn
VOUT
Test Circuit 5. Channel-to-Channel Crosstalk
SG Micro Limited
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7
High Speed USB 2.0
(480Mbps) DPDT Analog Switch
SGM7227
TEST CIRCUITS (Cont.)
VCC
0.1μF
VCC
HSDn
Source
Signal
Dn
VOUT
RL
S
CL
GND
Test Circuit 6. -3dB Bandwidth
VIH
HSD1n
RG
VG
VS
Dn
VIL
VOUT
HSD2n
CL
S
VOUT
ΔOUT
VS
GND
Q = ΔVOUT × CL
Test Circuit 7. Charge Injection (Q)
SG Micro Limited
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8
SGM7227
High Speed USB 2.0
(480Mbps) DPDT Analog Switch
APPLICATION NOTES
Meeting USB 2.0 VBUS Short Requirements
Power-Off Protection
For a VBUS short circuit the switch is expected to withstand such a condition for at least 24 hours. The SGM7227 has
specially designed circuitry which prevents unintended signal bleed through as well as guaranteed system reliability
during a power-down, over-voltage condition. The protection has been added to the common pins (D+, D-).
Power-On Protection
The USB 2.0 specification also notes that the USB device should be capable of withstanding a VBUS short during
transmission of data. This modification works by limiting current flow back into the VCC rail during the over-voltage event
so current remains within the safe operating range.
SG Micro Limited
www.sg-micro.com
9
High Speed USB 2.0
(480Mbps) DPDT Analog Switch
SGM7227
SGM7227 USB2.0 Signal Quality Compliance Test Results
Figures 1 and 2 show the test results for USB eye diagram tests.
Figure 1. Waveform Plot
Figure 2. High Speed Signal Quality Eye Diagram Test (V+ = 3.3V)
SG Micro Limited
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10
SGM7227
High Speed USB 2.0
(480Mbps) DPDT Analog Switch
The following is a summary of the USB test Results. The SGM7227 passes the high speed signal quality, eye diagram
and jitter tests.
Required Tests
y Overall result:
Pass!
y Signal eye:
Eye passes
y EOP width: 7.91 bits
EOP width passes
y Measured signaling rate: 480.0551 MHz
Signal rate passes
y Rising Edge Rate: 901.28 V/us (710.10 ps equivalent risetime)
Passes
y Falling Edge Rate: 889.18 V/us (719.77 ps equivalent risetime)
Passes
Additional Information
Consecutive jitter range: -61.770 ps to 39.668 ps, RMS jitter 21.900 ps
Paired JK jitter range: -47.800 ps to 42.890 ps, RMS jitter 21.591 ps
Paired KJ jitter range: -50.590 ps to 49.704 ps, RMS jitter 23.281 ps
SG Micro Limited
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11
High Speed USB 2.0
(480Mbps) DPDT Analog Switch
SGM7227
PACKAGE OUTLINE DIMENSIONS
MSOP10
b
c
L
E1
E
e
θ
A
D
A1
A2
Symbol
Dimensions
In Millimeters
Min
Max
Dimensions
In Inches
Min
Max
A
0.820
1.100
0.032
0.043
A1
0.020
0.150
0.001
0.006
A2
0.750
0.950
0.030
0.037
b
0.180
0.280
0.007
0.011
c
0.090
0.230
0.004
0.009
D
2.900
3.100
0.114
0.122
E
2.900
3.100
0.114
0.122
E1
4.750
5.050
0.187
0.199
e
0.500 BSC
0.020 BSC
L
0.400
0.800
0.016
0.031
θ
0°
6°
0°
6°
SG Micro Limited
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12
High Speed USB 2.0
(480Mbps) DPDT Analog Switch
SGM7227
PACKAGE OUTLINE DIMENSIONS
UTQFN1.8×1.4-10L
0.400 ±0.050
(×9)
0.400 TYP
1.400 ± 0.050
1.800 ±0.050
PIN #1 IDENTIFICATION
CHAMFER 0.100×45°
0.800 REF
TOP VIEW
0.200±0.050
0.500±0.050
PIN #1 DOT
BY MARKING
BOTTOM VIEW
0.000-0.050
0.550±0.050
0.152 REF
SIDE VIEW
NOTE: All linear dimensions are in millimeters.
REV. A
SGMICRO is dedicated to provide high quality and high performance analog IC products to customers. All SGMICRO products
meet the highest industry standards with strict and comprehensive test and quality control systems to achieve world-class
consistency and reliability.
For more information regarding SGMICRO Corporation and its products, please visit www.sg-micro.com
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