SGM721/SGM722/SGM723/SGM724
11MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
GENERAL DESCRIPTION
FEATURES
The SGM721 (single), SGM722 (dual), SGM723 (single
● Rail-to-Rail Input and Output
with shutdown) and SGM724 (quad) are low noise, low
● Input Offset Voltage: 4mV (MAX)
voltage and low power operational amplifiers, that can
● High Gain-Bandwidth Product: 11MHz
be designed into a wide range of applications. The
● High Slew Rate: 8.5V/μs
SGM721/2/3/4 have a high gain-bandwidth product of
● Settling Time to 0.1% with 2V Step: 0.21μs
11MHz and a slew rate of 8.5V/μs. The SGM723 has a
● Overload Recovery Time: 0.6μs
power-down disable feature that reduces the supply
● Low Noise: 8.5nV/√Hz at 10kHz
current to less than 1μA.
● Supply Voltage Range: 2.1V to 5.5V
The SGM721/2/3/4 are designed to provide optimal
performance in low voltage and low noise systems.
They provide rail-to-rail output swing into heavy loads.
The input common mode voltage range includes ground,
and the maximum input offset voltage is 4mV for
SGM721/2/3/4. They are specified over the extended
industrial temperature range (-40℃ to +125℃). The
operating supply range is from 2.1V to 5.5V.
The single version, SGM721 is available in Green
SC70-5, SOT-23-5 and SOIC-8 packages. SGM723 is
available in Green SOT-23-6 and SOIC-8 packages.
The dual version SGM722 is available in Green SOIC-8,
MSOP-8 and TSSOP-8 packages. The quad version
SGM724 is available in Green SOIC-14 and TSSOP-14
packages.
● Input Voltage Range: -0.1V to 5.6V with VS = 5.5V
● Low Power:
SGM721/3: 1.2mA (TYP)
SGM722/4: 1.1mA/Amplifier (TYP)
SGM723 Less than 1μA when Disabled
● -40℃ to +125℃ Operating Temperature Range
● Small Packaging:
SGM721 Available in Green SC70-5, SOT-23-5 and
SOIC-8 Packages
SGM722 Available in Green MSOP-8, SOIC-8 and
TSSOP-8 Packages
SGM723 Available in Green SOT-23-6 and SOIC-8
Packages
SGM724 Available in Green TSSOP-14 and
SOIC-14 Packages
APPLICATIONS
Sensors
Audio
Active Filters
A/D Converters
Communications
Test Equipment
Cellular and Cordless Phones
Laptops and PDAs
Photodiode Amplification
Battery-Powered Instrumentation
SG Micro Corp
www.sg-micro.com
NOVEMBER 2019 - REV. C. 3
SGM721/SGM722
SGM723/SGM724
11MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
PACKAGE/ORDERING INFORMATION
MODEL
SGM721
SGM722
PACKAGE
DESCRIPTION
SPECIFIED
TEMPERATURE
RANGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
SC70-5
-40℃ to +125℃
SGM721XC5/TR
721
Tape and Reel, 3000
SOT-23-5
-40℃ to +125℃
SGM721XN5/TR
721
Tape and Reel, 3000
SOIC-8
-40℃ to +125℃
SGM721XS/TR
SGM721XS
XXXXX
Tape and Reel, 2500
MSOP-8
-40℃ to +125℃
SGM722XMS/TR
SGM722
XMS
XXXXX
Tape and Reel, 3000
SOIC-8
-40℃ to +125℃
SGM722XS/TR
SGM722XS
XXXXX
Tape and Reel, 2500
TSSOP-8
-40℃ to +125℃
SGM722XTS8G/TR
SGM722
XTS8
XXXXX
Tape and Reel, 4000
SOT-23-6
-40℃ to +125℃
SGM723XN6/TR
723
Tape and Reel, 3000
SOIC-8
-40℃ to +125℃
SGM723XS/TR
SGM723XS
XXXXX
Tape and Reel, 2500
SOIC-14
-40℃ to +125℃
SGM724XS14/TR
SGM724XS14
XXXXX
Tape and Reel, 2500
TSSOP-14
-40℃ to +125℃
SGM724XTS14/TR
SGM724
XTS14
XXXXX
Tape and Reel, 3000
SGM723
SGM724
MARKING INFORMATION
NOTE: XXXXX = Date Code and Vendor Code.
SOIC-8/MSOP-8/TSSOP-8/SOIC-14/TSSOP-14
XXXXX
Vendor Code
Date Code - Week
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
SG Micro Corp
www.sg-micro.com
NOVEMBER 2019
2
SGM721/SGM722
SGM723/SGM724
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, +VS to -VS ................................................ 7V
Input Common Mode Voltage Range
.................................................... (-VS) - 0.3V to (+VS) + 0.3V
Package Thermal Resistance @ TA = +25℃
SC70-5, θJA .............................................................. 333℃/W
SOT-23-5, θJA .......................................................... 190℃/W
SOT-23-6, θJA .......................................................... 190℃/W
SOIC-8, θJA .............................................................. 125℃/W
MSOP-8, θJA ............................................................ 216℃/W
TSSOP-8, θJA........................................................... 170℃/W
Junction Temperature .................................................+150℃
Storage Temperature Range ........................ -65℃ to +150℃
Lead Temperature (Soldering, 10s) ............................+260℃
ESD Susceptibility
HBM (SGM721/2/4) ..................................................... 8000V
HBM (SGM723) ........................................................... 4000V
MM ................................................................................. 400V
CDM ............................................................................ 1000V
RECOMMENDED OPERATING CONDITIONS
Operating Temperature Range ..................... -40℃ to +125℃
SG Micro Corp
www.sg-micro.com
11MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
NOVEMBER 2019
3
SGM721/SGM722
SGM723/SGM724
11MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
PIN CONFIGURATIONS
SGM721 (TOP VIEW)
OUT
-VS
+IN
SGM721/723 (TOP VIEW)
5
1
+VS
NC
1
8
DISABLE
(SGM723 ONLY)
-IN
2
7
+VS
+IN
3
6
OUT
-VS
4
5
NC
2
3
4
-IN
SC70-5/SOT-23-5
SOIC-8
SGM723 (TOP VIEW)
OUT
1
6
-VS
2
5
+IN
3
NC = NO CONNECT
4
SGM722 (TOP VIEW)
OUTA
1
8
+VS
-INA
2
7
OUTB
+INA
3
6
-INB
-VS
4
5
+INB
+VS
DISABLE
-IN
SOT-23-6
SOIC-8/MSOP-8/TSSOP-8
SGM724 (TOP VIEW)
OUTA
1
14
OUTD
-INA
2
13
-IND
+INA
3
12
+IND
+VS
4
11
-VS
+INB
5
10
+INC
-INB
6
9
-INC
OUTB
7
8
OUTC
TSSOP-14/SOIC-14
SG Micro Corp
www.sg-micro.com
NOVEMBER 2019
4
SGM721/SGM722
SGM723/SGM724
11MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
ELECTRICAL CHARACTERISTICS
(At TA = +25℃, VS = +5V, VCM = VS/2, RL = 600Ω, unless otherwise noted.)
SGM721/2/3/4
PARAMETER
CONDITIONS
TYP
MIN/MAX OVER TEMPERATURE
+25℃
+25℃
1.5
4
-40℃ to -40℃ to
+85℃
+125℃
4.3
4.6
UNITS
MIN/
MAX
mV
MAX
Input Characteristics
Input Offset Voltage (VOS)
Input Bias Current (IB)
1
pA
TYP
Input Offset Current (IOS)
1
pA
TYP
-0.1 to 5.6
V
TYP
dB
MIN
Input Common Mode Voltage Range (VCM)
Common Mode Rejection Ratio (CMRR)
Open-Loop Voltage Gain (AOL)
VS = 5.5V
VS = 5.5V, VCM = - 0.1V to 4V
83
67
66
65
VS = 5.5V, VCM = - 0.1V to 5.6V
75
60
59
56
dB
MIN
RL = 600Ω ,VOUT = 0.15V to 4.85V
89
82
74
71
dB
MIN
RL = 10kΩ ,VOUT = 0.05V to 4.95V
102
96
85
83
dB
MIN
2.1
μV/℃
TYP
RL = 600Ω
0.076
V
TYP
RL = 10kΩ
0.006
Input Offset Voltage Drift (ΔVOS/ΔT)
Output Characteristics
Output Voltage Swing from Rail
V
TYP
mA
MIN
8.5
Ω
TYP
Turn-On Time
1.1
μs
TYP
Turn-Off Time
0.3
μs
TYP
Output Current (IOUT)
67
Closed-Loop Output Impedance
f = 1MHz, G = 1
52
42
36
Power-Down Disable (SGM723 Only)
DISABLE Voltage-Off
0.8
V
MAX
DISABLE Voltage-On
2
V
MIN
Power Supply
Operating Voltage Range
Power Supply Rejection Ratio (PSRR)
Quiescent Current/Amplifier (IQ)
VS = 2.1V to 5.5V,
VCM = (-VS) + 0.5V
2.1
2.1
2.1
2.1
V
MIN
5.5
5.5
5.5
5.5
V
MAX
82
68
67
64
dB
MIN
SGM722/4
IOUT = 0
1.10
1.40
1.60
1.75
mA
MAX
SGM721/3
IOUT = 0
1.2
1.5
1.7
1.85
mA
MAX
0.5
8
9
10
μA
MAX
Supply Current when Disabled (SGM723 only)
Dynamic Performance
Gain-Bandwidth Product (GBP)
11
MHz
TYP
Phase Margin (φO)
62
°
TYP
Full Power Bandwidth (BWP)
＜1% distortion
400
kHz
TYP
Slew Rate (SR)
G = 1, 2V output step
8.5
V/μs
TYP
Settling Time to 0.1% (tS)
G = 1, 2V output step
0.21
μs
TYP
Overload Recovery Time
VIN × G = VS
0.6
μs
TYP
f = 1kHz
12.5
nV/√Hz TYP
f = 10kHz
8.5
nV/√Hz TYP
Noise Performance
Input Voltage Noise Density (en)
SG Micro Corp
www.sg-micro.com
NOVEMBER 2019
5
SGM721/SGM722
SGM723/SGM724
11MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
Supply Current vs. Temperature
Shutdown Current vs. Temperature
1.5
750
VS = 2.1V
Shutdown Current (nA)
Supply Current (mA)
1.3
1.1
VS = 5V
VS = 3V
0.9
0.7
0.5
-50
-25
0
25
50
75
100
600
450
300
VS = 3V
150
0
125
VS = 5V
VS = 2.1V
-50
-25
0
Temperature (℃)
VS = 5.5V
70
VCM = -0.1V to 5.6V
60
100
125
VS = 2.1V to 5.5V
90
80
70
50
60
-50
-25
0
25
50
75
Temperature (℃)
100
125
-50
Open-Loop Voltage Gain vs. Temperature
110
RL = 10kΩ
110
VS = 5V
100
VS = 2.1V
90
80
-50
-25
0
25
50
Temperature (℃)
SG Micro Corp
www.sg-micro.com
75
100
-25
0
25
50
75
Temperature (℃)
Open-Loop Voltage Gain vs. Temperature
Open–Loop Voltage Gain (dB)
Open–Loop Voltage Gain (dB)
125
100
PSRR (dB)
CMRR (dB)
VCM = -0.1V to 4V
80
70
100
110
90
120
75
PSRR vs. Temperature
120
100
50
Temperature (℃)
CMRR vs. Temperature
110
25
125
RL = 600Ω
100
VS = 5V
90
VS = 2.1V
80
70
60
-50
-25
0
25
50
75
100
125
Temperature (℃)
NOVEMBER 2019
6
SGM721/SGM722
SGM723/SGM724
11MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
Output Voltage Swing vs. Output Current
5
Sourcing Current
Output Voltage (V)
3
+125℃
2
+25℃
Sourcing Current
1.5
+125℃
1.0
+25℃
-40℃
0.5
1
0
VS = 2.1V
2.0
VS = 5V
-40℃
Sinking Current
0
10
20
30
40
50
60
70
80
0.0
Sinking Current
0
5
10
15
20
25
30
35
40
Output Current (mA)
Output Current (mA)
Large-Signal Step Response
Large-Signal Step Response
G=1
CL = 200pF
RL = 10kΩ
VS = 2.1V
G=1
CL = 200pF
RL = 10kΩ
VS = 5V
Voltage (1V/div)
Voltage (1V/div)
Time (1μs/div)
Time (1μs/div)
Small-Signal Step Response
Small-Signal Step Response
G=1
CL = 100pF
RL = 10kΩ
VS = 2.1V
Time (200ns/div)
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Voltage (50mV/div)
Voltage (50mV/div)
Output Voltage (V)
4
Output Voltage Swing vs. Output Current
2.5
G=1
CL = 100pF
RL = 10kΩ
VS = 5V
Time (200ns/div)
NOVEMBER 2019
7
SGM721/SGM722
SGM723/SGM724
11MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
Positive Overload Recovery
Negative Overload Recovery
VOUT
VIN
0V
0V
VOUT
Time (1μs/div)
Time (1μs/div)
CMRR vs. Frequency
PSRR vs. Frequency
120
VS = 5V
100
100
80
80
PSRR (dB)
CMRR (dB)
120
60
40
20
0
VS = 5V
PSRR-
60
PSRR+
40
20
1
10
100
1000
Frequency (kHz)
0
10000
1
10
Channel Separation vs. Frequency
120
90
Channel Separation (dB)
Channel Separation (dB)
10000
150
Channel B to A
Channel A to B
60
0
100
1000
Frequency (kHz)
Channel Separation vs. Frequency
150
30
1V/div
VS = 5V
VIN = 50mV
RL = 10kΩ
G = -100
0V
1V/div
VS = 5V
VIN = 50mV
RL = 10kΩ
G = -100
50mV/div
50mV/div
0V
VIN
VS = 2.1V
RL = 620Ω
G=1
0.1
1
10
Frequency (kHz)
SG Micro Corp
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100
1000
Channel A to B
120
90
Channel B to A
60
30
0
VS = 5V
RL = 620Ω
G=1
0.1
1
10
100
1000
Frequency (kHz)
NOVEMBER 2019
8
SGM721/SGM722
SGM723/SGM724
11MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
Closed-Loop Output Voltage Swing
Closed-Loop Output Voltage Swing
2.5
6
5
Output Voltage (VP-P)
1.5
1.0
VS = 2.1V
VIN = 2.1VP-P
RL = 2kΩ
G=1
0.5
0.0
10
100
1000
Frequency (kHz)
2
0
10000
VS = 5V
VIN = 4.9VP-P
RL = 2kΩ
G=1
10
100
0
VS = 5V
100
10
40
-60
20
-90
0
1000
1
10000
10
1000
10000
-180
100000
Output Impedance vs. Frequency
60
VS = 2.1V
50
VS = 5V
30
G = 100
G = 10
20
G=1
Output Impedance (Ω)
50
40
40
30
G = 100
G = 10
20
G=1
10
10
0
100
Frequency (kHz)
Output Impedance vs. Frequency
60
-150
RL = 600Ω
CL = 10pF
-40
100
-120
Phase
-20
10
-30
Open-Loop Gain
Frequency (Hz)
Output Impedance (Ω)
10000
Open-Loop Gain and Phase vs. Frequency
80
60
1
1000
Frequency (kHz)
Open-Loop Gain (dB)
Input Voltage Noise Density (nV/√Hz)
3
1
Input Voltage Noise Density vs. Frequency
1000
4
1
10
100
Frequency (kHz)
SG Micro Corp
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1000
10000
0
1
10
100
1000
10000
Frequency (kHz)
NOVEMBER 2019
9
Phase (degree)
Output Voltage (VP-P)
2.0
SGM721/SGM722
SGM723/SGM724
11MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
Small-Signal Overshoot vs. Load Capacitance
50
VS = 2.1V
RL = 10kΩ
G=1
40
Small-Signal Overshoot (%)
Small-Signal Overshoot (%)
50
Small-Signal Overshoot vs. Load Capacitance
30
20
10
0
10
100
1000
40
VS = 5V
RL = 10kΩ
G=1
30
20
10
0
10
100
1000
Load Capacitance (pF)
Load Capacitance (pF)
Input Offset Voltage Production Distribution
Percentage of Amplifiers (%)
30
25
21100 Samples
1 Production Lot
VS = 5V
20
15
10
5
0
-4
-3
-2
-1
0
1
2
3
4
5
6
Input Offset Voltage (mV)
SG Micro Corp
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NOVEMBER 2019
10
SGM721/SGM722
SGM723/SGM724
11MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
APPLICATION NOTES
Driving Capacitive Loads
The SGM721/2/3/4 can directly drive 4700pF in
unity-gain without oscillation. The unity-gain follower
(buffer) is the most sensitive configuration to capacitive
loading. Direct capacitive loading reduces the phase
margin of amplifiers and this results in ringing or even
oscillation. Applications that require greater capacitive
driving capability should use an isolation resistor
between the output and the capacitive load like the
circuit in Figure 1. The isolation resistor RISO and the
load capacitor CL form a zero to increase stability. The
bigger the RISO resistor value, the more stable VOUT will
be. Note that this method results in a loss of gain
accuracy because RISO forms a voltage divider with the
RLOAD.
RISO
SGM721
VOUT
VIN
CL
Figure 1. Indirectly Driving Heavy Capacitive Load
An improved circuit is shown in Figure 2. It provides
DC accuracy as well as AC stability. RF provides the
DC accuracy by connecting the inverting input with the
output. CF and RISO serve to counteract the loss of
phase margin by feeding the high frequency component
of the output signal back to the amplifier’s inverting
input, thereby preserving phase margin in the overall
feedback loop.
Power Supply Bypassing and Layout
The SGM72x family operates from either a single 2.1V
to 5.5V supply or dual ±1.05V to ±2.75V supplies. For
single-supply operation, bypass the power supply +VS
with a 0.1µF ceramic capacitor which should be placed
close to the +VS pin. For dual-supply operation, both
the +VS and the -VS supplies should be bypassed to
ground with separate 0.1µF ceramic capacitors. 2.2µF
tantalum capacitor can be added for better performance.
Good PC board layout techniques optimize performance
by decreasing the amount of stray capacitance at the
operational amplifier’s inputs and output. To decrease
stray capacitance, minimize trace lengths and widths
by placing external components as close to the device
as possible. Use surface-mount components whenever
possible.
For the operational amplifier, soldering the part to the
board directly is strongly recommended. Try to keep
the high frequency current loop area small to minimize
the EMI (electromagnetic interference).
+VS
+VS
10μF
10μF
0.1μF
0.1μF
VN
VN
SGM721
VOUT
VOUT
SGM721
VP
10μF
VP
CF
RF
SGM721
VIN
0.1μF
-VS (GND)
RISO
VOUT
CL
RL
Figure 2. Indirectly Driving Heavy Capacitive Load with
DC Accuracy
For non-buffer configuration, there are two other ways
to increase the phase margin: (a) by increasing the
amplifier’s closed-loop gain or (b) by placing a capacitor
in parallel with the feedback resistor to counteract the
parasitic capacitance associated with inverting node.
-VS
Figure 3. Amplifier with Bypass Capacitors
Grounding
A ground plane layer is important for SGM72x circuit
design. The length of the current path in an inductive
ground return will create an unwanted voltage noise.
Broad ground plane areas will reduce the parasitic
inductance.
Input-to-Output Coupling
To minimize capacitive coupling, the input and output
signal traces should not be in parallel. This helps
reduce unwanted positive feedback.
SG Micro Corp
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NOVEMBER 2019
11
SGM721/SGM722
SGM723/SGM724
11MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
TYPICAL APPLICATION CIRCUITS
Differential Amplifier
The circuit shown in Figure 4 performs the difference
function. If the resistor ratios are equal (R4/R3 = R2/R1),
then VOUT = (VP - VN) × R2/R1 + VREF.
R2
R1
VN
SGM721
VOUT
VP
Active Low-Pass Filter
The low-pass filter shown in Figure 6 has a DC gain of
(-R2/R1) and the -3dB corner frequency is 1/2πR2C.
Make sure the filter bandwidth is within the bandwidth of
the amplifier. Feedback resistors with large values can
couple with parasitic capacitance and cause undesired
effects such as ringing or oscillation in high-speed
amplifiers. Keep resistor values as low as possible and
consistent with output loading consideration.
C
R3
R2
R4
R1
VIN
VREF
Figure 4. Differential Amplifier
SGM721
VOUT
Instrumentation Amplifier
The circuit in Figure 5 performs the same function as
that in Figure 4 but with a high input impedance.
R2
R3 = R1 // R2
Figure 6. Active Low-Pass Filter
R1
SGM721
VN
SGM721
VP
R3
VOUT
R4
SGM721
VREF
Figure 5. Instrumentation Amplifier
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
NOVEMBER 2019 ‒ REV.C.2 to REV.C.3
Page
Updated Absolute Maximum Ratings section ....................................................................................................................................................... 3
JANUARY 2018 ‒ REV.C.1 to REV.C.2
Page
Added Open-Loop Gain and Phase vs. Frequency .............................................................................................................................................. 9
SEPTEMBER 2017 ‒ REV.C to REV.C.1
Page
Changed Supply Voltage ..................................................................................................................................................................................... 2
SG Micro Corp
www.sg-micro.com
NOVEMBER 2019
12
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SC70-5
D
e1
0.65
e
E1
1.9
E
0.75
b
0.4
1.3
RECOMMENDED LAND PATTERN (Unit: mm)
L
L1
A
θ
A1
c
0.20
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
0.900
1.100
0.035
0.043
A1
0.000
0.100
0.000
0.004
A2
0.900
1.000
0.035
0.039
b
0.150
0.350
0.006
0.014
c
0.080
0.150
0.003
0.006
D
2.000
2.200
0.079
0.087
E
1.150
1.350
0.045
0.053
E1
2.150
2.450
0.085
0.096
e
0.65 TYP
0.026 TYP
e1
1.300 BSC
0.051 BSC
L
0.525 REF
0.021 REF
L1
0.260
0.460
0.010
0.018
θ
0°
8°
0°
8°
SG Micro Corp
www.sg-micro.com
TX00043.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOT-23-5
1.90
D
e1
E1
2.59
E
0.99
b
e
0.69
0.95
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
c
0.2
Dimensions
In Inches
MIN
MAX
A
1.050
1.250
0.041
0.049
A1
0.000
0.100
0.000
0.004
A2
1.050
1.150
0.041
0.045
b
0.300
0.500
0.012
0.020
c
0.100
0.200
0.004
0.008
D
2.820
3.020
0.111
0.119
E
1.500
1.700
0.059
0.067
E1
2.650
2.950
0.104
0.116
e
0.950 BSC
0.037 BSC
e1
1.900 BSC
0.075 BSC
SG Micro Corp
www.sg-micro.com
L
0.300
0.600
0.012
0.024
θ
0°
8°
0°
8°
TX00033.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOT-23-6
D
e1
e
2.59
E
E1
0.99
b
0.95
0.69
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
c
0.2
Dimensions
In Inches
MIN
MAX
A
1.050
1.250
0.041
0.049
A1
0.000
0.100
0.000
0.004
A2
1.050
1.150
0.041
0.045
b
0.300
0.500
0.012
0.020
c
0.100
0.200
0.004
0.008
D
2.820
3.020
0.111
0.119
E
1.500
1.700
0.059
0.067
E1
2.650
2.950
0.104
0.116
e
0.950 BSC
0.037 BSC
e1
1.900 BSC
0.075 BSC
SG Micro Corp
www.sg-micro.com
L
0.300
0.600
0.012
0.024
θ
0°
8°
0°
8°
TX00034.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
MSOP-8
b
E1
E
4.8
1.02
e
0.41
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
D
L
A
A1
c
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
0.820
1.100
0.032
0.043
A1
0.020
0.150
0.001
0.006
A2
0.750
0.950
0.030
0.037
b
0.250
0.380
0.010
0.015
c
0.090
0.230
0.004
0.009
D
2.900
3.100
0.114
0.122
E
2.900
3.100
0.114
0.122
E1
4.750
5.050
0.187
0.199
e
SG Micro Corp
www.sg-micro.com
0.650 BSC
0.026 BSC
L
0.400
0.800
0.016
0.031
θ
0°
6°
0°
6°
TX00014.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSSOP-8
D
e
E1
E
5.94
1.78
b
0.42
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
A2
Symbol
H
θ
Dimensions
In Millimeters
MIN
MAX
A
Dimensions
In Inches
MIN
MAX
1.100
0.043
A1
0.050
0.150
0.002
0.006
A2
0.800
1.000
0.031
0.039
b
0.190
0.300
0.007
0.012
c
0.090
0.200
0.004
0.008
D
2.900
3.100
0.114
0.122
E
4.300
4.500
0.169
0.177
E1
6.250
6.550
0.246
0.258
e
L
0.650 BSC
0.500
H
θ
SG Micro Corp
www.sg-micro.com
0.026 BSC
0.700
0.02
0.25 TYP
1°
c
0.028
0.01 TYP
7°
1°
7°
TX00018.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-8
0.6
D
e
2.2
E1
E
5.2
b
1.27
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
1.350
1.750
0.053
0.069
A1
0.100
0.250
0.004
0.010
A2
1.350
1.550
0.053
0.061
b
0.330
0.510
0.013
0.020
c
0.170
0.250
0.006
0.010
D
4.700
5.100
0.185
0.200
E
3.800
4.000
0.150
0.157
E1
5.800
6.200
0.228
0.244
e
SG Micro Corp
www.sg-micro.com
1.27 BSC
0.050 BSC
L
0.400
1.270
0.016
0.050
θ
0°
8°
0°
8°
TX00010.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSSOP-14
D
E
E1
5.94
1.78
e
b
0.42
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
1.200
0.047
A
A1
c
H
0.050
0.150
0.002
0.006
A2
0.800
1.050
0.031
0.041
b
0.190
0.300
0.007
0.012
c
0.090
0.200
0.004
0.008
D
4.860
5.100
0.191
0.201
E
4.300
4.500
0.169
0.177
E1
6.250
6.550
0.246
0.258
0.700
0.02
e
L
0.650 BSC
0.500
H
θ
SG Micro Corp
www.sg-micro.com
0.026 BSC
0.25 TYP
1°
0.028
0.01 TYP
7°
1°
7°
TX00019.001
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-14
D
E
5.2
E1
2.2
e
b
0.6
1.27
RECOMMENDED LAND PATTERN (Unit: mm)
L1
R1
R
A3
A A2
h
L2
θ
A1
Symbol
h
L
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
A2
1.25
1.65
0.049
0.065
A3
0.55
0.75
0.022
0.030
b
0.36
0.49
0.014
0.019
D
8.53
8.73
0.336
0.344
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
e
L
1.27 BSC
0.45
L1
0.80
0.018
1.04 REF
L2
0.157
0.050 BSC
0.032
0.040 REF
0.25 BSC
0.01 BSC
R
0.07
0.003
R1
0.07
0.003
h
0.30
0.50
0.012
0.020
θ
0°
8°
0°
8°
SG Micro Corp
www.sg-micro.com
TX00011.001
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
W
P0
Q1
Q2
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
Q3
Q4
B0
Reel Diameter
A0
P1
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel
Diameter
Reel Width
W1
(mm)
A0
(mm)
B0
(mm)
K0
(mm)
P0
(mm)
P1
(mm)
P2
(mm)
W
(mm)
Pin1
Quadrant
SC70-5
7″
9.5
2.25
2.55
1.20
4.0
4.0
2.0
8.0
Q3
SOT-23-5
7″
9.5
3.2
3.2
1.4
4.0
4.0
2.0
8.0
Q3
SOT-23-6
7″
9.5
3.17
3.23
1.37
4.0
4.0
2.0
8.0
Q3
SOIC-8
13″
12.4
6.4
5.4
2.1
4.0
8.0
2.0
12.0
Q1
MSOP-8
13″
12.4
5.2
3.3
1.5
4.0
8.0
2.0
12.0
Q1
TSSOP-8
13″
12.4
6.76
3.3
1.8
4.0
8.0
2.0
12.0
Q1
TSSOP-14
13″
12.4
6.95
5.6
1.2
4.0
8.0
2.0
12.0
Q1
SOIC-14
13″
16.4
6.6
9.3
2.1
4.0
8.0
2.0
16.0
Q1
SG Micro Corp
www.sg-micro.com
TX10000.000
DD0001
Package Type
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Pizza/Carton
7″ (Option)
368
227
224
8
7″
442
410
224
18
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
DD0002
Reel Type
TX20000.000
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湘ICP备2023018690号
