SGM8631/SGM8632/SGM8633
6MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
GENERAL DESCRIPTION
FEATURES
The SGM8631/2/3 are a family of single and dual
operational amplifiers, which are optimized for low
voltage, low noise and low power operation. These
devices can operate from 2V to 5.5V single supply,
while consuming low quiescent current. The supply
current of SGM8633 is less than 1μA in power-down
mode.
The SGM8631/2/3 feature a 3.5mV maximum input
offset voltage. The minimum input common mode
voltage is within 0.1V below the negative rail, and the
output swing is rail-to-rail with heavy loads. They
exhibit a high gain-bandwidth product of 6MHz and a
slew rate of 3.7V/μs. These specifications make the
operational amplifiers appropriate for various applications.
The SGM8631 is available in Green SC70-5, SOT-23-5
and SOIC-8 packages. The SGM8632 is available in
Green SOIC-8 and MSOP-8 packages. The SGM8633
is available in Green SOT-23-6 and SOIC-8 packages.
They are specified over the extended industrial
temperature range (-40℃ to +125℃).
Input Offset Voltage: 3.5mV (MAX)
High Gain-Bandwidth Product: 6MHz
High Slew Rate: 3.7V/μs
Settling Time to 0.1% with 2V Step: 0.5μs
Overload Recovery Time: 0.9μs
Low Noise: 13nV/√Hz
at 1kHz
Rail-to-Rail Input and Output
Supply Voltage Range: 2V to 5.5V
Input Voltage Range: -0.1V to 5.6V with VS = 5.5V
Low Supply Current:
SGM8631/3: 570μA (TYP)
SGM8632: 480μA/Amplifier (TYP)
SGM8633 Less than 1μA when Disabled
-40℃ to +125℃ Operating Temperature Range
Small Packaging:
SGM8631 Available in Green SC70-5, SOT-23-5
and SOIC-8 Packages
SGM8632 Available in Green MSOP-8 and
SOIC-8 Packages
SGM8633 Available in Green SOT-23-6 and
SOIC-8 Packages
APPLICATIONS
Sensors
Audio
Active Filters
A/D Converters
Communications
Test Equipment
Cellular and Cordless Phones
Laptops and PDAs
Photodiode Amplification
Battery-Powered Instrumentation
SG Micro Corp
www.sg-micro.com
JULY 2016 – REV. C. 3
SGM8631/SGM8632
SGM8633
6MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
PACKAGE/ORDERING INFORMATION
MODEL
SGM8631
SGM8632
SGM8633
PACKAGE
DESCRIPTION
SPECIFIED
TEMPERATURE
RANGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
SC70-5
-40℃ to +125℃
SGM8631XC5/TR
8631
Tape and Reel, 3000
SOT-23-5
-40℃ to +125℃
SGM8631XN5/TR
8631
Tape and Reel, 3000
SOIC-8
-40℃ to +125℃
SGM8631XS/TR
MSOP-8
-40℃ to +125℃
SGM8632XMS/TR
SOIC-8
-40℃ to +125℃
SGM8632XS/TR
SOT-23-6
-40℃ to +125℃
SGM8633XN6/TR
8633
Tape and Reel, 3000
SOIC-8
-40℃ to +125℃
SGM8633XS/TR
SGM8633XS
XXXXX
Tape and Reel, 2500
SGM8631XS
XXXXX
SGM8632
XMS
XXXXX
SGM8632XS
XXXXX
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 2500
MARKING INFORMATION
NOTE: XXXXX = Date Code and Vendor Code.
SOIC-8/MSOP-8
XXXXX
Vendor Code
Date Code - Week
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, +VS to -VS ................................................ 6V
Input Common Mode Voltage Range
.................................................... (-VS) - 0.3V to (+VS) + 0.3V
Package Thermal Resistance @ TA = +25℃
SC70-5, θJA .............................................................. 333℃/W
SOT-23-5, θJA .......................................................... 190℃/W
SOT-23-6, θJA .......................................................... 190℃/W
SOIC-8, θJA .............................................................. 125℃/W
MSOP-8, θJA ............................................................ 216℃/W
Junction Temperature .................................................+150℃
Storage Temperature Range ........................ -65℃ to +150℃
Lead Temperature (Soldering, 10s) ............................+260℃
ESD Susceptibility
HBM (SGM8631/2) ...................................................... 8000V
HBM (SGM8633) ......................................................... 4000V
MM ................................................................................. 400V
CDM ............................................................................ 1000V
RECOMMENDED OPERATING CONDITIONS
Operating Temperature Range ..................... -40℃ to +125℃
SG Micro Corp
www.sg-micro.com
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
JULY 2016
2
SGM8631/SGM8632
SGM8633
6MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
PIN CONFIGURATIONS
SGM8631 (TOP VIEW)
OUT
1
-VS
2
+IN
5
3
4
SGM8631/8633 (TOP VIEW)
NC
1
8
DISABLE
(SGM8633 ONLY)
-IN
2
7
+VS
+IN
3
6
OUT
-VS
4
5
NC
+VS
-IN
SC70-5/SOT-23-5
SOIC-8
SGM8633 (TOP VIEW)
SGM8632 (TOP VIEW)
OUT
1
6
+VS
-VS
2
5
DISABLE
+IN
3
4
SOT-23-6
SG Micro Corp
www.sg-micro.com
NC = NO CONNECT
OUTA
1
8
+VS
-INA
2
7
OUTB
+INA
3
6
-INB
-VS
4
5
+INB
-IN
SOIC-8/MSOP-8
JULY 2016
3
SGM8631/SGM8632
SGM8633
6MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
ELECTRICAL CHARACTERISTICS
(At TA = +25℃, VS = 5V, VCM = VS/2, RL = 600Ω, unless otherwise noted.)
SGM8631/2/3
PARAMETER
CONDITIONS
TYP
MIN/MAX OVER TEMPERATURE
+25℃
+25℃
0.9
3.5
-40℃ to
-40℃ to
+85℃
+125℃
3.7
3.8
UNITS
MIN/
MAX
mV
MAX
Input Characteristics
Input Offset Voltage (VOS)
Input Bias Current (IB)
1
pA
TYP
Input Offset Current (IOS)
1
pA
TYP
-0.1 to 5.6
V
TYP
dB
MIN
dB
MIN
dB
MIN
Input Common Mode Voltage Range (VCM)
VS = 5.5V
Common Mode Rejection Ratio
(CMRR)
VS = 5.5V, VCM = -0.1V to 4V
84
VS = 5.5V, VCM = -0.1V to 5.6V
76
RL = 600Ω, VOUT = 0.15V to 4.85V
86
RL = 10kΩ , VOUT = 0.05V to 4.95V
103
Open-Loop Voltage Gain (AOL)
68
79
67
73
66
69
dB
MIN
2.4
μV/℃
TYP
RL = 600Ω
0.079
V
TYP
RL = 10kΩ
0.007
V
TYP
mA
MIN
5.4
Ω
TYP
Turn-On Time
1.3
μs
TYP
Turn-Off Time
0.4
μs
TYP
Input Offset Voltage Drift (ΔVOS/ΔT)
Output Characteristics
Output Voltage Swing from Rail
Output Current (IOUT)
58
Closed-Loop Output Impedance
f = 200kHz, G = 1
40
30
26
Power-Down Disable (SGM8633 Only)
DISABLE Voltage-Off
0.8
V
MAX
DISABLE Voltage-On
2
V
MIN
Power Supply
2
2
2
2
V
MIN
5.5
5.5
5.5
5.5
V
MAX
VS = 2V to 5.5V, VCM = (-VS) + 0.5V
84
69
68
67
dB
MIN
SGM8632
IOUT = 0
480
620
720
790
μA
MAX
SGM8631/3
IOUT = 0
570
720
820
880
μA
MAX
0.5
8
9
10
μA
MAX
Operating Voltage Range
Power Supply Rejection Ratio (PSRR)
Quiescent Current/
Amplifier (IQ)
Supply Current when Disabled
(SGM8633 only)
Dynamic Performance
Gain-Bandwidth Product (GBP)
6
MHz
TYP
Phase Margin (φO)
63
°
TYP
Full Power Bandwidth (BWP)
< 1% distortion
250
kHz
TYP
Slew Rate (SR)
G = 1, 2V output step
3.7
V/μs
TYP
Settling Time to 0.1% (tS)
G = 1, 2V output step
0.5
μs
TYP
Overload Recovery Time
VIN × G = VS
0.9
μs
TYP
f = 1kHz
13
nV/ Hz
TYP
Noise Performance
Input Voltage Noise Density (en)
SG Micro Corp
www.sg-micro.com
JULY 2016
4
SGM8631/SGM8632
SGM8633
6MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
CMRR vs. Frequency
PSRR vs. Frequency
120
VS = 5V
100
100
80
80
PSRR (dB)
CMRR (dB)
120
60
40
20
VS = 5V
PSRR-
60
PSRR+
40
20
0
0.01
0.1
1
10
100
0
0.01
1000
0.1
1
Frequency (kHz)
Channel Separation vs. Frequency
Channel Separation vs. Frequency
120
90
Channel Separation (dB)
Channel Separation (dB)
1000
150
Channel A to B
Channel B to A
60
VS = 2V
RL = 620Ω
TA = +25℃
G=1
30
0.1
1
10
100
90
Channel A to B
60
VS = 5V
RL = 620Ω
TA = +25℃
G=1
30
0
1000
Channel B to A
120
0.1
1
Frequency (kHz)
Closed-Loop Output Voltage Swing
100
1000
Closed-Loop Output Voltage Swing
6
5
Output Voltage (VP-P)
2
1.5
1
VS = 2V
VIN = 2VP-P
TA = +25℃
RL = 10kΩ
G=1
0.5
0
10
Frequency (kHz)
2.5
Output Voltage (VP-P)
100
Frequency (kHz)
150
0
10
10
4
3
VS = 5V
VIN = 4.9VP-P
TA = +25℃
RL = 10kΩ
G=1
2
1
100
1000
Frequency (kHz)
SG Micro Corp
www.sg-micro.com
10000
0
10
100
1000
10000
Frequency (kHz)
JULY 2016
5
SGM8631/SGM8632
SGM8633
6MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
Small-Signal Overshoot vs. Load Capacitance
VS = 2V
RL = 10kΩ
TA = +25℃
G=1
40
30
20
10
0
10
100
Small-Signal Overshoot vs. Load Capacitance
50
Small-Signal Overshoot (%)
Small-Signal Overshoot (%)
50
VS = 5V
RL = 10kΩ
TA = +25℃
G=1
40
30
20
10
0
1000
10
100
Load Capacitance (pF)
Load Capacitance (pF)
Output Impedance vs. Frequency
Output Impedance vs. Frequency
100
VS = 2V
80
Output Impedance (Ω)
Output Impedance (Ω)
100
60
G = 10
40
0
G=1
G = 100
20
1
10
100
1000
60
0
10000
G=1
G = 100
20
1
10
100
1000
10000
Frequency (kHz)
Large-Signal Step Response
Voltage (1V/div)
Voltage (1V/div)
SG Micro Corp
www.sg-micro.com
G = 10
40
Large-Signal Step Response
Time (400ns/div)
VS = 5V
80
Frequency (kHz)
G=1
CL = 100pF
RL = 10kΩ
VS = 2V
1000
G=1
CL = 100pF
RL = 10kΩ
VS = 5V
Time (400ns/div)
JULY 2016
6
SGM8631/SGM8632
SGM8633
6MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
Voltage (50mV/div)
Small-Signal Step Response
Small-Signal Step Response
Voltage (50mV/div)
G=1
CL = 100pF
RL = 10kΩ
VS = 2V
G=1
CL = 100pF
RL = 10kΩ
VS = 5V
Time (1μs/div)
Time ((1μs/div)
Positive Overload Recovery
Negative Overload Recovery
VIN
VIN
VOUT
0V
0V
VS = 5V
VIN = 50mV
RL = 620Ω
G = -100
1V/div
1V/div
VS = 5V
VIN = 50mV
RL = 620Ω
G = -100
50mV/di
50mV/di
0V
0V
VOUT
Time (1µs/div)
Time (1µs/div)
Shutdown Current vs. Temperature
750
0.7
600
Shutdown Current (nA)
Supply Current (mA)
Supply Current vs. Temperature
0.8
0.6
VS = 2V
0.5
VS = 3V
VS = 5V
0.4
0.3
-50
-25
0
25
50
75
Temperature (℃)
SG Micro Corp
www.sg-micro.com
100
125
VS = 5V
450
300
VS = 3V
VS = 2V
150
0
-50
-25
0
25
50
75
100
125
Temperature (℃)
JULY 2016
7
SGM8631/SGM8632
SGM8633
6MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
CMRR vs. Temperature
110
VS = 5.5V
VS = 2V to 5.5V
100
VCM = -0.1V to 4V
90
90
PSRR (dB)
CMRR (dB)
100
80
70
VCM = -0.1V to 5.6V
60
50
PSRR vs. Temperature
110
80
70
60
-50
-25
0
25
50
75
Temperature (℃)
100
50
125
-50
VS = 2V
Open–Loop Voltage Gain (dB)
Open–Loop Voltage Gain (dB)
RL = 10kΩ
100
VS = 5V
90
80
70
-50
-25
0
25
50
75
25
100
100
VS = 2V
80
70
-50
-25
0
+25℃
+125℃
1
10
20
30
40
50
Output Current (mA)
SG Micro Corp
www.sg-micro.com
100
125
Sourcing Current
VS = 2V
1.5
-40℃
1
+125℃
+25℃
0.5
Sinking Current
0
75
Output Voltage Swing vs. Output Current
Output Voltage (V)
Output Voltage (V)
50
2
-40℃
0
25
Temperature (℃)
VS = 5V
2
125
90
60
125
Sourcing Current
3
100
VS = 5V
Output Voltage Swing vs. Output Current
4
75
RL = 600Ω
Temperature (℃)
5
50
Open-Loop Voltage Gain vs. Temperature
110
110
0
Temperature (℃)
Open-Loop Voltage Gain vs. Temperature
120
-25
60
70
80
0
Sinking Current
0
5
10
15
20
25
30
35
Output Current (mA)
JULY 2016
8
SGM8631/SGM8632
SGM8633
6MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
Input Voltage Noise Density vs. Frequency
VS = 5V
100
10
1
35
Percentage of Amplifiers (%)
Input Voltage Noise Density (nV/√Hz)
1000
10
100
1000
Frequency (Hz)
SG Micro Corp
www.sg-micro.com
10000
30
Offset Voltage Production Distribution
VS = 5V
20300 Samples
1 Production Lot
25
20
15
10
5
0
-4
-3
-2
-1
0
1
2
3
4
Offset Voltage (mV)
JULY 2016
9
SGM8631/SGM8632
SGM8633
6MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
APPLICATION INFORMATION
Rail-to-Rail Input
When SGM8631/2/3 work at the power supply between
2V and 5.5V, the input common mode voltage range is
from (-VS) - 0.1V to (+VS) + 0.1V. In Figure 1, the ESD
diodes between the inputs and the power supply rails
will clamp the input voltage not to exceed the rails.
+VS
VP
+
VN
_
Power Supply Decoupling and Layout
A clean and low noise power supply is very important in
amplifier circuit design, besides of input signal noise,
the power supply is one of important source of noise to
the amplifiers through +VS and -VS pins. Power supply
bypassing is an effective method to clear up the noise
at power supply, and the low impedance path to ground
of decoupling capacitor will bypass the noise to GND.
In application, 10μF ceramic capacitor paralleled with
0.1μF or 0.01μF ceramic capacitor is used in Figure 3.
The ceramic capacitors should be placed as close as
possible to +VS and -VS power supply pins.
+VS
-VS
+VS
10μF
10μF
0.1μF
0.1μF
Figure 1. Input Equivalent Circuit
Rail-to-Rail Output
The SGM8631/2/3 support rail-to-rail output operation.
In single power supply application, for example, when
+VS = 5V, -VS = GND, 10kΩ load resistor is tied from
OUT pin to ground, the typical output swing range is
from 0.007V to 4.993V.
VN
_
VN
_
VOUT
VP
+
VOUT
VP
+
10μF
-VS (GND)
Driving Capacitive Loads
0.1μF
The SGM8631/2/3 are designed for unity-gain stable for
capacitive load up to 1000pF. If greater capacitive load
must be driven in application, the circuit in Figure 2 can
be used. In this circuit, the IR drop voltage generated
by RISO is compensated by feedback loop.
RF
CF
_
VIN
+
RISO
VOUT
CL
Figure 2. Circuit to Drive Heavy Capacitive Load
SG Micro Corp
www.sg-micro.com
-VS
Figure 3. Amplifier Power Supply Bypassing
Grounding
In low speed application, one node grounding technique
is the simplest and most effective method to eliminate
the noise generated by grounding. In high speed
application, the general method to eliminate noise is to
use a complete ground plane technique, and the whole
ground plane will help distribute heat and reduce EMI
noise pickup.
Reduce Input-to-Output Coupling
To reduce the input-to-output coupling, the input traces
must be placed as far away from the power supply or
output traces as possible. The sensitive trace must not
be placed in parallel with the noisy trace in same layer.
They must be placed perpendicularly in different layers
to reduce the crosstalk. These PCB layout techniques
will help to reduce unwanted positive feedback and
noise.
JULY 2016
10
SGM8631/SGM8632
SGM8633
6MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
APPLICATION INFORMATION (continued)
Typical Application Circuits
Difference Amplifier
The circuit in Figure 4 is a design example of classical
difference amplifier. If R4/R3 = R2/R1, then VOUT = (VP VN) × R2/R1 + VREF.
R2
VN
VP
R1
Active Low-Pass Filter
The circuit in Figure 6 is a design example of active
low-pass filter, the DC gain is equal to -R2/R1 and the
-3dB corner frequency is equal to 1/2πR2C. In this design,
the filter bandwidth must be less than the bandwidth of
the amplifier, the resistor values must be selected as
low as possible to reduce ringing or oscillation generated
by the parasitic parameters in PCB layout.
_
C
VOUT
R3
R2
+
VIN
R4
R1
_
VOUT
VREF
+
Figure 4. Difference Amplifier
R3 = R1 // R2
High Input Impedance Difference Amplifier
The circuit in Figure 5 is a design example of high input
impedance difference amplifier, the added amplifiers at
the input are used to increase the input impedance and
eliminate drawback of low input impedance in Figure 4.
_
VN
Figure 6. Active Low-Pass Filter
R2
R1
+
_
VOUT
VP
+
+
R3
_
R4
VREF
Figure 5. High Input Impedance Difference Amplifier
SG Micro Corp
www.sg-micro.com
JULY 2016
11
SGM8631/SGM8632
SGM8633
6MHz, Rail-to-Rail I/O
CMOS Operational Amplifiers
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
JULY 2016 ‒ REV.C.2 to REV.C.3
Page
Changed Electrical Characteristics section .......................................................................................................................................................... 4
AUGUST 2015 ‒ REV.C.1 to REV.C.2
Page
New version....................................................................................................................................................................................................... All
February 2015 ‒ REV.C to REV.C.1
Page
Changed Package Outline Dimensions section ........................................................................................................................................... 17, 18
SG Micro Corp
www.sg-micro.com
JULY 2016
12
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SC70-5
D
e1
0.65
e
E1
1.9
E
0.75
b
0.4
1.3
RECOMMENDED LAND PATTERN (Unit: mm)
L
L1
A
θ
A1
c
0.20
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
0.900
1.100
0.035
0.043
A1
0.000
0.100
0.000
0.004
A2
0.900
1.000
0.035
0.039
b
0.150
0.350
0.006
0.014
c
0.080
0.150
0.003
0.006
D
2.000
2.200
0.079
0.087
E
1.150
1.350
0.045
0.053
E1
2.150
2.450
0.085
0.096
e
0.65 TYP
0.026 TYP
e1
1.300 BSC
0.051 BSC
L
0.525 REF
0.021 REF
L1
0.260
0.460
0.010
0.018
θ
0°
8°
0°
8°
SG Micro Corp
www.sg-micro.com
TX00043.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOT-23-5
1.90
D
e1
E1
2.59
E
0.99
b
e
0.69
0.95
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
c
0.2
Dimensions
In Inches
MIN
MAX
A
1.050
1.250
0.041
0.049
A1
0.000
0.100
0.000
0.004
A2
1.050
1.150
0.041
0.045
b
0.300
0.500
0.012
0.020
c
0.100
0.200
0.004
0.008
D
2.820
3.020
0.111
0.119
E
1.500
1.700
0.059
0.067
E1
2.650
2.950
0.104
0.116
e
0.950 BSC
0.037 BSC
e1
1.900 BSC
0.075 BSC
SG Micro Corp
www.sg-micro.com
L
0.300
0.600
0.012
0.024
θ
0°
8°
0°
8°
TX00033.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOT-23-6
D
e1
e
2.59
E
E1
0.99
b
0.95
0.69
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
c
0.2
Dimensions
In Inches
MIN
MAX
A
1.050
1.250
0.041
0.049
A1
0.000
0.100
0.000
0.004
A2
1.050
1.150
0.041
0.045
b
0.300
0.500
0.012
0.020
c
0.100
0.200
0.004
0.008
D
2.820
3.020
0.111
0.119
E
1.500
1.700
0.059
0.067
E1
2.650
2.950
0.104
0.116
e
0.950 BSC
0.037 BSC
e1
1.900 BSC
0.075 BSC
SG Micro Corp
www.sg-micro.com
L
0.300
0.600
0.012
0.024
θ
0°
8°
0°
8°
TX00034.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-8
0.6
D
e
2.2
E1
E
5.2
b
1.27
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
1.350
1.750
0.053
0.069
A1
0.100
0.250
0.004
0.010
A2
1.350
1.550
0.053
0.061
b
0.330
0.510
0.013
0.020
c
0.170
0.250
0.006
0.010
D
4.700
5.100
0.185
0.200
E
3.800
4.000
0.150
0.157
E1
5.800
6.200
0.228
0.244
e
SG Micro Corp
www.sg-micro.com
1.27 BSC
0.050 BSC
L
0.400
1.270
0.016
0.050
θ
0°
8°
0°
8°
TX00010.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
MSOP-8
b
E1
E
4.8
1.02
e
0.41
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
D
L
A
A1
c
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
0.820
1.100
0.032
0.043
A1
0.020
0.150
0.001
0.006
A2
0.750
0.950
0.030
0.037
b
0.250
0.380
0.010
0.015
c
0.090
0.230
0.004
0.009
D
2.900
3.100
0.114
0.122
E
2.900
3.100
0.114
0.122
E1
4.750
5.050
0.187
0.199
e
SG Micro Corp
www.sg-micro.com
0.650 BSC
0.026 BSC
L
0.400
0.800
0.016
0.031
θ
0°
6°
0°
6°
TX00014.000
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
W
P0
Q1
Q2
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
Q3
Q4
B0
Reel Diameter
A0
P1
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel
Diameter
Reel Width
W1
(mm)
A0
(mm)
B0
(mm)
K0
(mm)
P0
(mm)
P1
(mm)
P2
(mm)
W
(mm)
Pin1
Quadrant
SC70-5
7″
9.5
2.25
2.55
1.20
4.0
4.0
2.0
8.0
Q3
SOT-23-5
7″
9.5
3.20
3.20
1.40
4.0
4.0
2.0
8.0
Q3
SOT-23-6
7″
9.5
3.17
3.23
1.37
4.0
4.0
2.0
8.0
Q3
SOIC-8
13″
12.4
6.40
5.40
2.10
4.0
8.0
2.0
12.0
Q1
MSOP-8
13″
12.4
5.20
3.30
1.50
4.0
8.0
2.0
12.0
Q1
SG Micro Corp
www.sg-micro.com
TX10000.000
DD0001
Package Type
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Pizza/Carton
7″ (Option)
368
227
224
8
7″
442
410
224
18
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
DD0002
Reel Type
TX20000.000
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