GL4800E0000F

GL4800E0000F GL4800E0000F Infrared Emitting Diode ■ Features 1. Side view emission type 2. Plastic mold with resin lens 3. Medium directivity angle (Δθ: ±30° TYP.) Peak emission wavelength: 950 nm TYP. 4. Radiant flux φe: 0.7 mW MIN. 5. Lead free and RoHS directive component ■ Agency Approvals/Compliance 1. Compliant with RoHS directive (2002/95/EC) 2. Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Products Regulation” (popular name: China RoHS) (Chinese: ); refer to page 7 ■ Applications 1. 2. 3. 4. 5. 6. 7. 8. Optoelectronic switching Office automation equipment Audio visual equipment Home appliances Telecommunication equipment Measuring equipment Tooling machines Computers Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D1-A01001EN Date: March 30, 2007 ©SHARP Corporation GL4800E0000F ■ Outline Dimensions 1.5 (R.45) 3.0 2 - C0.5 1.6 1.25 0.8 0.3 MAX. Gate burr 2° 1.65 0.8 1.8 φ1.5E.PIN 2 - 0.9 2 - 0.45 +0.3 -0.1 2 - 0.25 +0.3 -0.1 Name Cathode Anode 0.1 MAX. 8° φ1.0E.PIN 0.1 MAX. 0.7 2° Pin Arrangement 1 No. 1 2 NOTES: 1. Units: mm 2. Unspecified tolerances: ±0.2 3. Package: Pink transparent epoxy resin 4. ( ): Reference dimensions 5. The thin burr thickness (0.05 mm MAX.) and the gate burr (0.3 mm MAX.) shall not be included in the outline dimensions. 6. Protruded resin 0.3 mm MAX. However, the thin burr adheres to the lead 1.8 mm MAX. from the resin. 2° 2° 2 0.8 1.0 8° 1.6 3.5 0.5 MIN. 0.2 MAX. Resin burr 0.3 MAX. Resin burr 1 2 (2.54) 8° 8° 8° 8° 17.5 ±0.5 1.7 (φ0.8) Sheet No.: D1-A01001EN 2 GL4800E0000F ■ Absolute Maximum Ratings Parameter Forward current Peak forward current *1 Reverse voltage Power dissipation Operating temperature Storage temperature Soldering temperature *2 Symbol IF IFM VR P Topr Tstg Tsol 50 1 6 75 -25 to +85 -40 to +85 260 (Ta = 25°C) Rating Unit mA A V mW °C °C °C ratio: 0.01 *1 Pulse width: 100 µs, Duty mm from the resin edge. *2 3 s (MAX.) positioned 1.8 ■ Electro-optical Characteristics Parameter Forward voltage Peak forward voltage Reverse current Radiant flux Peak emission wavelength Half intensity wavelength Terminal capacitance Cut-off frequency Symbol VF VFM IR φe λp Δλ Ct fC Conditions IF = 20 mA IFM = 0.5 A VR = 3 V IF = 20 mA IF = 5 mA IF = 5 mA VR = 0, f = 1 MHz – MIN. – – – 0.7 – – – – TYP. 1.2 3.0 – 1.6 950 45 70 300 MAX. 1.4 4.0 10 3.0 – – – – (Ta = 25°C) Unit V V µA mW nm nm pF kHz Fig. 1 Forward Current vs. Ambient Temperature 60 50 Forward current IF (mA) 40 30 20 10 0 -25 Fig. 2 Peak Forward Current vs. Duty Ratio 10,000 P u lse w idth ≤ 1 00 µ s T a = 2 5°C Peak forward current IFM (mA) 1,000 100 10 10-4 10-3 10-2 Duty ratio 10-1 100 0 25 50 75 85 100 Ambient temperature Ta (°C) Sheet No.: D1-A01001EN 3 GL4800E0000F Fig. 3 Radiation Diagram -20° -10° 0° 100 -30° Relative radiant intensity (%) 80 +10° +20° Ta = 25°C +30° Fig. 5 Peak Emission Wavelength vs. Ambient Temperature 1,000 IF = 5 mA Peak emission wavelength λP (nm) 975 -40° 60 +40° -50° -60° -70° -80° -90° 40 +50° +60° 950 20 +70° +80° 0 +90° 925 Angular displacement θ 900 -25 0 25 50 75 100 Ambient temperature Ta (°C) Fig. 4 Spectral Distribution 100 IF = 5 mA Ta = 25°C 80 Relative radiant intensity (%) Fig. 6 Forward Current vs. Forward Voltage 500 Ta = 75°C 200 Forward current IF (mA) 50°C 25°C 0°C -20°C 60 100 50 20 10 5 2 40 20 0 880 900 920 940 960 9 80 1,000 1,020 1,040 1 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Wavelength λ (mm) Forward voltage VF (V) Sheet No.: D1-A01001EN 4 GL4800E0000F Fig. 7 Relative Radiant Flux vs. Ambient Temperature 20 10 5 IF = const. Fig. 9 Relative Radiant Intensity vs. Distance 100 Ta = 25°C Relative radiant intensity (%) Relative radiant flux 10 2 1 0.5 1 0.2 0.1 -25 0.1 0 25 50 75 100 0.1 1 10 100 Ambient temperature Ta (°C) Distance to detector (mm) Fig. 8 Radiant Flux vs. Forward Current 10 5 2 Radiant flux Φe (mW) 1 0.5 DC 0.2 0.1 0.05 0.02 0.01 1 10 100 1,000 Pulse (Pulse width ≤ 100 µs) Ta = 25°C Fig. 10 Relative Collector Current vs. Distance (Detector: PT4800) 100 IF = 20 mA Ta = 25°C Relative collector current (%) 10 1 Forward current IF (mA) 0.1 0.1 1 10 100 Distance to detector (mm) Sheet No.: D1-A01001EN 5 GL4800E0000F ■ Design Considerations Design Guidelines 1. Allow for natural degradation of the LED as a result of long continuous operation. This part will have 50% degradation in output after 5 years of continuous use. 2. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant. ■ Manufacturing Guidelines Cleaning Instructions 1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the optical characteristics. 2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less. 3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning time, PCB size and device mounting circumstances. Sharp recommends testing using actual production conditions to confirm the harmlessness of the ultrasonic cleaning methods. 4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol. Soldering Instructions 1. Sharp recommends not soldering this part using preheat or solder reflow methods. 2. If hand soldering, use temperatures ≤ 260°C for ≤ 3 seconds. 3. When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the solder, the pad, and the circuit board. 4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. Internal connections may be severed due to mechanical force placed on the package due to the PCB flexing during the soldering process. Storage and Handling 1. Sharp recommends storing these parts between 5°C and 30°C, at a relative humidity of less than 60%. 2. After breaking the package seal, Sharp recommends maintaining the environment within 5° to 30°C, at a relative humidity of less than 60%. ■ Packing Specifications 1. 2. 3. 4. Parts are packed in a vinyl bag, at an average quantity of 1,000 pieces per bag. Bags are secured in a box as shown in illustration on page 7. Product mass: 0.07 g (approximately) Sharp guarantees the following: a. Missing parts will not make up more than 0.1% of the total quantity. b. Parts will be easily removed from the packing. Sheet No.: D1-A01001EN 6 GL4800E0000F ■ Presence of ODCs (RoHS Compliance) This product shall not contain the following materials, and they are not used in the production process for this product: • Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). • Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). • Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Products Regulation” (Chinese: ) Toxic and Hazdardous Substances Category Lead (Pb) mercury (Hg) Cadmium (Cd) ✓ ✓ ✓ Hexavalent chromiun (Cr6+) ✓ Polybrominated biphenyls (PBB) ✓ Polybrominated diphenyl ethers (PBDE) ✓ Infrared Emitting Diode NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard. Sheet No.: D1-A01001EN 7 GL4800E0000F ■ Package Specification Inner packing Product (1,000 pieces) Vinyl bag NOTES: 1. Inner packing material : Vinyl bag (Polyethylene) 2. Quantity: 1,000 pieces/bag Outer packing Cushioning material (2 sheets) Vinyl bag with products (2 bags) Cushioning material (2 sheets) Packing case Cellophane tape NOTES: 1. Outer material : Packing case (Corrugated cardboard), Cushioning material (Urethane), Cellophane tape 2. Quantity: 5,000 pieces/ box 3. Regular packaged mass: Approximately 460 g 4. Indication: Model No., quantity, and Lot No. Model No., Quantity, and Lot No. Sheet No.: D1-A01001EN 8 GL4800E0000F ■ Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP’s devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment (terminal) --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliabilty such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment (trunk lines) --- Nuclear power control equipment --- Medical and other life support equipment (e.g. scuba) · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D1-A01001EN 9