GM2BB50BM0C

㩷 Doc. No. DG-097015C ISSUED January 15, 2010 SYSTEM DEVICE DIVISION Υ ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION ઀᭽ᦠ SPECIFICATIONS ຠฬ ⴫㕙ታⵝဳ LED Product name Surface Mount LED ᒻฬ GM2BB50BM0C Model No. 㪩㪼㪽㪼 㔚ሶ࠺ࡃࠗࠬ੐ᬺᧄㇱ ࠪࠬ࠹ࡓ࠺ࡃࠗࠬ╙ਃ੐ᬺㇱ ╙ੑ㐿⊒ㇱ Development Department Τ System Device Division Υ Electronic Components and Devices Group SHARP Corporation 㫉㪼 㫅 㪺 㪼 Model No. GM2BB50BM0C Doc. No. DG-097015C Page 1/ 23 ຠ ฬ Product name ᒻ ฬ Model No. ⴫㕙ታⵝဳ LED Surface Mount LED GM2BB50BM0C 㪩㪼㪽㪼 㫉㪼 㫅 㪺 㪼 ٤ ᧄ઀᭽ᦠߪᑷ␠ߩ⪺૞ᮭ╬ߦଥࠆౝኈ߽฽߹ࠇߡ޿߹ߔߩߢ‫ޔ‬ขࠅᛒ޿ߦߪలಽߏᵈᗧ㗂ߊߣ౒ߦ‫઀ᧄޔ‬᭽ᦠߩౝኈࠍᑷ ␠ߦήᢿߢⶄ⵾ߒߥ޿ࠃ߁߅㗿޿↳ߒ਄ߍ߹ߔ‫ޕ‬ ٤ ᧄ⵾ຠߩߏ૶↪ߦ㓙ߒߡߪ‫઀ᧄޔ‬᭽ᦠߦ⸥タߐࠇߚ૶↪᧦ઙ෸߮એਅߩᵈᗧ੐㗄ࠍㆩ቞㗿޿߹ߔ‫ޕ‬ ᧄ઀᭽ᦠ⸥タߩ૶↪᧦ઙ޽ࠆ޿ߪએਅߩᵈᗧ੐㗄ࠍㅺ⣕ߒߚᧄ⵾ຠߩ૶↪╬ߦ⿠࿃ߔࠆ៊ኂߦ㑐ߒߡ‫ޔ‬ᑷ␠ߪ৻ಾߘߩ⽿ ࠍ⽶޿߹ߖࠎ‫ޕ‬ 㧔ᵈᗧ੐㗄㧕 Ԙ ߅ቴ᭽߇ᧄ઀᭽ᦠߩౝኈߦၮߠ߈‫߅ޔ‬ቴ᭽ߩ໡ຠߩࠞ࠲ࡠࠣ‫ޔ‬ขᛒ޿⺑᣿ᦠ╬ࠍ૞ᚑߐࠇࠆ႐วߦߪ‫⵾ᧄޔ‬ຠࠍ߅ቴ ᭽ߩ໡ຠߦ⚵ߺㄟࠎߛ⁁ᘒߢ‫ߩߘޔ‬วℂ⊛ᩮ᜚ߩ᦭ήࠍߏᬌ⸽㗂߈߹ߔࠃ߁߅㗿޿⥌ߒ߹ߔ‫ޕ‬ ԙ ᧄ⵾ຠߪේೣߣߒߡਅ⸥ߩ↪ㅜߦ૶↪ߔࠆ⋡⊛ߢ⵾ㅧߐࠇߚ⵾ຠߢߔ‫ޕ‬   ዏ‫ޔ‬ਅ⸥ߩ↪ㅜߢ޽ߞߡ߽‫ޔ‬Ԛߦ⸥タߩฦ⒳቟ోⵝ⟎ߦ૶↪ߐࠇࠆ႐วߪԚߩᵈᗧ੐㗄ࠍㆩ቞㗿޿߹ߔ‫ޕ‬   ෶‫ޔ‬ਅ⸥ߩ↪ㅜߢ޽ߞߡ߽‫߇ࠇߘޔ‬ԛߦ⸥タߩฦᯏེࠍ᭴ᚑߔࠆ႐วߪߏ૶↪ߦߥࠄߥ޿ߢਅߐ޿‫ޕ‬ ࡮⸘ེ᷹ ࡮Ꮏ૞ᯏེ ࡮AV ᯏེ ࡮OA ᯏེ ࡮ኅ㔚⵾ຠ ࡮ㅢାᯏེ㧔ᐙ✢એᄖ㧕 Ԛ ․ߦ㜞޿ା㗬ᕈ߇ᔅⷐߣߐࠇࠆਅ⸥ߩᯏེߦᧄ⵾ຠࠍ૶↪ߐࠇࠆ႐วߪ‫ޔ‬ᔅߕ੐೨ߦᑷ␠⽼ᄁ⓹ญ߹ߢߏㅪ⛊㗂ߊߣ ౒ߦ‫࡮ࡓ࠹ࠬࠪߩࠄࠇߎޔ‬ᯏེో૕ߩା㗬ᕈ߅ࠃ߮቟ోᕈ⛽ᜬߩߚ߼ߦ߅ቴ᭽ߩ⽿છߦ߅޿ߡᯏེ஥ߩࡈࠚ࡯࡞࠮࡯ ࡈ⸳⸘߿౬㐳⸳⸘╬ߩㆡಾߥភ⟎ࠍ⻠ߓߡ㗂ߊࠃ߁߅㗿޿⥌ߒ߹ߔ‫ޕ‬ ࡮ㆇㅍᯏེ㧔⥶ⓨᯏ‫ޔ‬೉ゞ‫⥄ޔ‬േゞ╬㧕ߩ೙ᓮ߹ߚߪฦ⒳቟ోᕈߦ߆߆ࠊࠆ࡙࠾࠶࠻ ࡮ᄢဳ㔚▚ᯏ ࡮੤ㅢାภᯏ ࡮ࠟࠬṳࠇᬌ⍮ㆤᢿᯏ ࡮㒐ἴ㒐‽ⵝ⟎ ࡮ߘߩઁฦ⒳቟ోⵝ⟎╬    ╬ ԛ ᯏ⢻࡮♖ᐲ╬ߦ߅޿ߡᭂ߼ߡ㜞޿ା㗬ᕈ߇ⷐ᳞ߐࠇࠆએਅߩᯏེߦߪߏ૶↪ߦߥࠄߥ޿ߢਅߐ޿‫ޕ‬ ࡮⥶ⓨቝቮᯏེ ࡮ㅢାᯏེ㧔ᐙ✢㧕 ࡮ේሶജ೙ᓮᯏེ   ࡮↢๮⛽ᜬߦ߆߆ࠊࠆක≮ᯏེ    ╬ Ԝ ਄⸥Ԙ㨮ԙ㨮Ԛ㨮ԛߩ޿ߕࠇߦ⹥ᒰߔࠆ߆⇼⟵ߩ޽ࠆ႐วߪᑷ␠⽼ᄁ⓹ญ߹ߢߏ⏕⹺㗿޿߹ߔ‫ޕ‬ ٤ ᧄ⵾ຠߦߟ߈ߏਇ᣿ߥὐ߇޽ࠅ߹ߒߚࠄ੐೨ߦᑷ␠⽼ᄁ⓹ญ߹ߢߏㅪ⛊㗂߈߹ߔࠃ߁߅㗿޿⥌ߒ߹ߔ‫ޕ‬ ٤ Handle this document carefully for it contains material protected by international copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission of the company. ٤ When using the products covered herein, please observe the conditions written herein and the precautions outlined in the following paragraphs. In no event shall the company be liable for any damages resulting form failure to strictly adhere to these conditions and precautions. (Precautions) (1) Please do verify the validity of this part after assembling it in customer’s products, when customer wants to make catalogue and instruction manual based on the specification sheet of this part. (2)The products covered herein are designed and manufactured for the following application areas. When using the products covered herein for the equipment listed in paragraph (3), even for the following application areas, be sure to observe the precautions given in Paragraph (3). Never use the products for the equipment listed in Paragraph (4). * OA equipment * Instrumentation and measuring equipment * Machine tools * Audiovisual equipment * Home appliances * Communication equipment other than for trunk lines (3) These contemplating using the products covered herein for the following equipment which demands high reliability, should first contact a sales representative of the company and then accept responsibility for incorporating into the design fail-safe operation, redundancy, and other appropriate measures for ensuring reliability and safety of the equipment and the overall system. * Control and safety devices for airplanes, trains, automobiles, and other transportation equipment * Mainframe computers * Traffic control systems * Gas leak detectors and automatic cutoff devices * Rescue and security equipment * Other safety devices and safety equipment, etc. (4) Do not use the products covered herein for the following equipment which demands extremely high performance in terms of functionality, reliability, or accuracy. * Aerospace equipment * Communications equipment for trunk lines * Control equipment for the nuclear power industry * Medical equipment related to life support, etc. (5) Please direct all queries and comments regarding the interpretation of the above four Paragraphs to a sales representative of the company. ٤ Please direct all queries regarding the products covered herein to a sales representative of the company. Model No. GM2BB50BM0C Doc. No. DG-097015C Page 2/ 23 㪩㪼㪽㪼 GM2BB50BM0C ઀᭽ᦠ 㫉㪼 㫅 㪺 GM2BB50BM0C Specification Ɣㆡ↪▸࿐ Application ᧄ઀᭽ᦠߪ‫⊒ޔ‬శ᧚ᢱߦ InGaN 㕍⦡ LED ࠴࠶ࡊ㧗✛⦡Ⱟశ૕㧗⿒⦡Ⱟశ૕ࠍ૶↪ߒߚ⊕⦡ 㧔㜞Ṷ⦡㧕LED‫ޔ‬GM2BB50BM0C ߦㆡ↪ߐࠇ߹ߔ‫ޕ‬ ਥߥ↪ㅜ㧦ᾖ᣿↪శḮ These specifications apply to light emitting diode Model No. GM2BB50BM0C. [White LED (High colorrendering) composed of InGaN blue LED chip and green and red phosphors] Main application : Illumination 1 ቯᩰ෸߮․ᕈ Ratings and characteristics ............................................................................ 3 1.1 ⛘ኻᦨᄢቯᩰ Absolute maximum ratings........................................................................ 3 1.2 㔚᳇⊛෸߮శቇ⊛․ᕈ Electro-optical characteristics.................................................... 4 1.3 ࡜ࡦࠢ⴫ Rank table.......................................................................................................... 5 1.4 ૐᷫᦛ✢ Derating Curve .................................................................................................. 7 1.5 ․ᕈ࿑㧔ᮡḰ୯㧕 Characteristics Diagram (TYP.) ........................................................ 8 2 ᄖᒻ෸߮ౝㇱ╬ଔ࿁〝࿑ External dimensions and equivalent circuit.............................. 9 3 ା 㗬 ᕈ Reliability............................................................................................................... 10 3.1 ⹜㛎㗄⋡෸߮⹜㛎᧦ઙ Test items and test conditions ................................................. 10 3.2 ᡿㓚್ቯၮḰ Failure criteria ......................................................................................... 12 4 ຠ⾰᳓Ḱ Quality level........................................................................................................... 13 4.1 ㆡ↪ⷙᩰ Applied standard ............................................................................................. 13 4.2 ᛮขᣇᑼ Sampling inspection........................................................................................ 13 4.3 ᬌᩏ㗄⋡෸߮ᰳὐ್ቯၮḰ Inspection items and defect criteria ................................. 13 5 ⵬⿷੐㗄 Supplements........................................................................................................... 14 5.1 ࠹࡯ࡇࡦࠣ Taping ......................................................................................................... 14 5.2 ࡜ࡌ࡞㧔࡝࡯࡞㧕 Label (on reel㧕 .............................................................................. 17 5.3 ൮ⵝ Packing.................................................................................................................... 18 5.4 ⅣႺ⽶⩄‛⾰ߩ㕖฽᦭⁁ᴫ Information on environmental impact substances ........... 19 6 ૶↪਄ߩᵈᗧ Precautions .................................................................................................... 20 6.1 ৻⥸⊛ߥ૶↪਄ߩᵈᗧ General handling ..................................................................... 20 6.2 ߪࠎߛઃߌߦߟ޿ߡ Soldering ..................................................................................... 22 6.3 ᵞᵺߦߟ޿ߡ Cleaning .................................................................................................. 23 㪼 Model No. GM2BB50BM0C Doc. No. DG-097015C Page 3/ 23 㪩㪼㪽㪼 1 ቯᩰ෸߮․ᕈ Ratings and characteristics 㫉㪼 㫅 㪺 1.1 ⛘ኻᦨᄢቯᩰ Absolute maximum ratings 㗄⋡ Parameter േ૞᷷ᐲ(Note 1) Operating temperature ଻ሽ᷷ᐲ(Note 2) Storage temperature ⸵ኈ៊ᄬ(Note 3) Power dissipation ૐᷫ₸ Derating factor 㗅㔚ᵹ(Note 3, 4) Forward current ૐᷫ₸ Derating factor ⸥ภ Symbol ㆡ↪᷷ᐲ [͠] Applied temperature ቯ ᩰ ୯ Rating න૏ Unit Tc - -30 to +100 ͠ Tstg - -40 to +100 ͠ P -30 ҇ Topr ҇ 85 912 mW - 85 㧨 Topr ҇ 100 25 mW/ ͠ IF -30 ҇ Topr ҇ 85 240 mA - 85 㧨 Topr ҇ 100 6 mA/ ͠ IFM -30 ҇ Topr ҇ 85 300 mA - 85 㧨 Topr ҇ 100 8 mA/ ͠ VR Tc = 25 5 V Tsol - 350 ͠ ው㗡㗅㔚ᵹ(Note 3, 4) Peak pulsed forward current ૐᷫ₸ Derating factor ㅒ㔚࿶ Reverse voltage ߪࠎߛઃߌ᷷ᐲ(Note 5) Soldering temperature (Note 1) േ૞᷷ᐲ▸࿐ߪࠤ࡯᷷ࠬᐲTc ߢⷙቯߒߡ޿߹ߔ‫ޕ‬ ࠤ࡯᷷ࠬᐲ᷹ቯ૏⟎ߦߟ޿ߡߪ‫ޔ‬9㗁 ᄖᒻ෸߮ౝㇱ╬ଔ࿁〝࿑ࠍෳᾖߒߡਅߐ޿‫ޕ‬ The range of operating temperature is prescribed by case temperature, Case temperature (Refer to Page 9, External dimensions and equivalent circuit) (Note 2) ଻ሽ᷷ᐲߪ⵾ຠන૕⁁ᘒ‫ޔ‬൮ⵝ⁁ᘒࠍ໧ࠊߕߎߩ▸࿐ౝߣߒ߹ߔ‫ޕ‬ (ૉߒ‫ᤨࠣࡦࠠ࡯ࡌޔ‬෸߮ታⵝᤨࠍ㒰ߊ‫)ޕ‬ ផᅑ଻▤᧦ઙߟ޿ߡߪ‫ޔ‬18㗁ࠍෳᾖਅߐ޿‫ޕ‬ Do not exceed specified temperature range under any packing condition. (Except when baking and soldering) Refer to Page 18, for recommended storage conditions. (Note 3) േ૞㔚ᵹ୯ߪૐᷫᦛ✢ߦᓥ޿߹ߔ‫ޕ‬7㗁ૐᷫᦛ✢ࠍෳᾖߒߡਅߐ޿‫ޕ‬ The operating current value follows the derating curve. (Refer to Page7) (Note 4) ࠺ࡘ࡯࠹ࠖᲧ=1/30‫ࠬ࡞ࡄޔ‬᏷= 100 ms Duty ratio = 1/30, Pulse width = 100 ms. (Note 5) ߎߡవ᷷ᐲ350͠એਅ/3 ⑽એౝ1 ࿁㒢ࠅ‫ޕ‬ኈ㊂60W એਅߩߪࠎߛߎߡࠍ૶↪ߒߡਅߐ޿‫ޕ‬ ࡝ࡈࡠ࡯᷷ᐲߪ22㗁ࠍෳᾖߒߡਅߐ޿‫ޕ‬ Each terminal must be soldered with the soldering iron (under 60W) within 3 seconds (only once). Solder tip temperature: under 350͠ As for the reflow soldering profile, please refer to Page 22. 㪼 Model No. GM2BB50BM0C Doc. No. DG-097015C Page 4/ 23 㪩㪼㪽㪼 1.2 㔚᳇⊛෸߮శቇ⊛․ᕈ Electro-optical characteristics 㫉㪼 㫅 㪺 (Tc=25 ͠) 㗄⋡ ⸥ภ ᧦ઙ Parameter Symbol Conditions 㗅㔚࿶ Forward voltage ోశ᧤(Note 1) Luminous flux ⦡ᐲᐳᮡ(Note 2) Chromaticity coordinates Ṷ⦡ᕈ⹏ଔᜰᢙ(Note 3) Color rendering index ㅒ㔚ᵹ Reverse current VF ĭV MIN. TYP. MAX. IF=150 mA - 㧔3.45㧕 3.8 IF=220 mA - (3.65) - IF=150 mA 25 㧔38㧕 50 IF=220 mA - (51) - 0.3366 (0.3447) 0.3551 0.3369 (0.3553) 0.3760 80 (85) - - - 10 x y IF=150 mA Ra IR VR = 5V (Note 1)ࠪࡖ࡯ࡊᮡḰߩ8 ࠗࡦ࠴Ⓧಽ⃿ߦߡ᷹ቯ‫ޕ‬ (After 20 ms drive) (᷹ቯ⺋Ꮕ±10%) Monitored by 8 inch integrating sphere of Sharp Standard. (After 20 ms drive) (Tolerance: ±10%) (Note 2) ⦡ᐲᐳᮡ᷹ቯߪ‫ࡊ࡯ࡖࠪޔ‬ᮡḰߩ8 ࠗࡦ࠴Ⓧಽ⃿ߦߡ᷹ቯ‫ޕ‬ (After 20 ms drive) (᷹ቯ⺋Ꮕ㧦x, y : ±0.01) Measured by 8 inch integrating sphere of Sharp Standard. (After 20ms drive) (Tolerance: ±0.01) (Note 3) Ṷ⦡ᕈ⹏ଔᜰᢙߪ‫ࡊ࡯ࡖࠪޔ‬ᮡḰߩ8 ࠗࡦ࠴Ⓧಽ⃿ߦߡ᷹ቯ‫ޕ‬ (After 20 ms drive) (᷹ቯ⺋Ꮕ㧦±5) Measured by 8 inch integrating sphere of Sharp Standard. (After 20ms drive) (Tolerance: ±5) (Note 4)ࠞ࠶ࠦౝߩ୯ߪෳ⠨୯ߢ޽ࠅ‫⸽଻ޔ‬୯ߢߪ޽ࠅ߹ߖࠎ‫ޕ‬ Values inside parentheses are indicated only for reference, and are not guaranteed. න૏ Unit V lm ȝA 㪼 Model No. GM2BB50BM0C Doc. No. DG-097015C Page 5/ 23 㪩㪼㪽㪼 㪈㪅㪊 䊤䊮䉪⴫㩷 㪩㪸㫅㫂㩷㫋㪸㪹㫃㪼㩷 㫉㪼 㫅 㪺 㪈㪅㪊㪅㪈 ోశ᧤䊤䊮䉪⴫㩷 㪣㫌㫄㫀㫅㫆㫌㫊㩷㪽㫃㫌㫏㩷㫉㪸㫅㫂㩷㫋㪸㪹㫃㪼㩷 㩿㪫㪺㪔㪉㪌㩷 㷄㪀㩷 ᧦ઙ ࡜ࡦࠢ ోశ᧤ න૏ Rank Luminous flux Unit Condition lm IF=150 mA A 25 㧙 30 B 30 㧙 35 C 35 㧙 40 D 40 㧙 45 E 45 㧙 50 㪼 ᷹ቯ⸵ኈ⺋Ꮕ Tolerancer (Note 1)ోశ᧤࡜ࡦࠢಽᏓ߇਄ᣇߦࠪࡈ࠻ߒߚ႐ว‫ᤨߩߘޔ‬ὐߢᣂߚߦ਄૏࡜ࡦࠢߩ⸳ቯ‫ޔ‬ਅ૏࡜ࡦࠢߩ೥㒰ࠍ ⴕ޿߹ߔ‫ޔߚ߹ޕ‬ฦ࡜ࡦࠢߩ⚊౉Ყ₸ߪ໧ࠊߥ޿߽ߩߣߒ߹ߔ‫ޕ‬ If the range of luminous flux level is shifted upward, the highest rank is added, and the lowest rank is deleted. Let the delivery rate of each rank be unquestioned. 㪈㪅㪊㪅㪉 ⦡ᐲ䊤䊮䉪⴫㩷 㪚㪿㫉㫆㫄㪸㫋㫀㪺㫀㫋㫐㩷㫉㪸㫅㫂㩷㫋㪸㪹㫃㪼㩷 (IF=150mA,Tc=25 ͠) Point 4 x y ࡜ࡦࠢ Rank e1 x y x y x y 0.3447 0.3553 0.3371 0.3490 0.3366 0.3369 0.3436 0.3426 e2 0.3458 0.3685 0.3376 0.3616 0.3371 0.3490 0.3447 0.3553 f1 0.3533 0.3621 0.3447 0.3553 0.3436 0.3426 0.3515 0.3487 f2 0.3551 0.3760 0.3458 0.3685 0.3447 0.3553 0.3533 0.3621 (᷹ቯ⸵ኈ⺋Ꮕ Tolerance: ±0.01) Point 1 Point 2 Point 3 ᵎᵌᵑᵖ ᵎᵌᵑᵕ ᶄᵐ ᵎᵌᵑᵔ ᵡᵧᵣᵽᶗ ᶃᵐ ᶄᵏ ᵎᵌᵑᵓ ᶃᵏ ᵎᵌᵑᵒ ᵎᵌᵑᵑ ᵎᵌᵑᵐ ᵎᵌᵑᵑ ᵎᵌᵑᵒ ᵎᵌᵑᵓ ᵡᵧᵣᵽᶖ ⦡ᐲ࿑                  Chromaticity diagram ᵎᵌᵑᵔ ᵎᵌᵑᵕ Model No. GM2BB50BM0C Doc. No. DG-097015C Page 6/ 23 㪩㪼㪽㪼 㪈㪅㪊㪅㪊 㗅㔚࿶䊤䊮䉪㩷 㪝㫆㫉㫎㪸㫉㪻㩷㫍㫆㫃㫋㪸㪾㪼㩷㫉㪸㫅㫂㩷㫋㪸㪹㫃㪼㩷 㩿㪫㪺㪔㪉㪌㩷 㷄㪀㩷 ᧦ઙ ࡜ࡦࠢ 㗅㔚࿶ න૏ Rank Forward voltage Unit Condition V IF=150 mA 2 3.0 㧙 3.2 3 3.2 㧙 3.4 4 3.4 㧙 3.6 5 3.6 㧙 3.8 㫉㪼 㫅 㪺 ᷹ቯ⸵ኈ⺋Ꮕ Tolerance: ±0.1V)㩷 (Note 1)ฦ࡜ࡦࠢߩ⚊౉Ყ₸ߪ໧ࠊߥ޿߽ߩߣߒ߹ߔ‫ޕ‬ Let the delivery rate of each rank be unquestioned. 㪼 Model No. GM2BB50BM0C Doc. No. DG-097015C Page 7/ 23 㪩㪼㪽㪼 1.4 ૐᷫᦛ✢ Derating Curve ው㗡㗅㔚ᵹૐᷫᦛ✢ 㗅㔚ᵹૐᷫᦛ✢ 㩷㪝㫆㫉㫎㪸㫉㪻㩷㪚㫌㫉㫉㪼㫅㫋㩷㪛㪼㫉㪸㫋㫀㫅㪾㩷㪚㫌㫉㫍㪼 㩷㪧㪼㪸㫂㩷㪧㫌㫃㫊㪼㪻㩷㪝㫆㫉㫎㪸㫉㪻㩷㪚㫌㫉㫉㪼㫅㫋㩷㪛㪼㫉㪸㫋㫀㫅㪾㩷㪚㫌㫉㫍㪼 㪋㪇㪇 ው㗡㗅㔚ᵹ㩷㪠㪝㪤㩷㩿㫄㪘㪀 㪉㪌㪇 㪉㪋㪇 㪉㪇㪇 㪈㪌㪇 㪈㪇㪇 㪌㪇 㪄㪊㪇 㪄㪋㪇 㪄㪉㪇 㪇 㪉㪇  㪋㪇 㪍㪇 㪏㪇 㪈㪇㪇 㪈㪉㪇 㪉㪇㪇 㪈㪏㪇 㪈㪇㪇 㪇 㪄㪊㪇 㪄㪋㪇 㪄㪉㪇 㪇 㪉㪇 㪋㪇 㪍㪇  㪏㪇 㪈㪇㪇 㪈㪉㪇 䉬䊷䉴᷷ᐲ㩷㩷㪫㪺㩷㩿㷄㪀 㪚㪸㫊㪼㩷㪫㪼㫄㫇㪼㫉㪸㫋㫌㫉㪼 㪚㪸㫊㪼㩷㪫㪼㫄㫇㪼㫉㪸㫋㫌㫉㪼 㪋㪇㪇 ው㗡㗅㔚ᵹ㩷㩷㪠㩷 㪝㪤㩷㩿㫄㪘㪀 㪧㪼㪸㫂㩷㪧㫌㫃㫊㪼㪻㩷㪝㫆㫉㫎㪸㫉㪻㩷㪚㫌㫉㫉㪼㫅㫋 㪊㪇㪇 䉬䊷䉴᷷ᐲ㩷㩷㪫㪺㩷㩿㷄㪀 䊂䊠䊷䊁䉞Ყ㩷䋭ው㗡㗅㔚ᵹ 㪧㪼㪸㫂㩷㪧㫌㫃㫊㪼㪻㩷㪝㫆㫉㫎㪸㫉㪻㩷㪚㫌㫉㫉㪼㫅㫋㩷㫍㫊㪅㩷㪛㫌㫋㫐㩷㪩㪸㫋㫀㫆 㩷㩷㩿㪫㪺㪔㪉㪌㩷㷄㪀 㪊㪇㪇 㪉㪋㪇 㪉㪇㪇 㪈㪇㪇 㪇 㪈㪆㪈㪇㪇 㪧㪼㪸㫂㩷㪧㫌㫃㫊㪼㪻㩷㪝㫆㫉㫎㪸㫉㪻㩷㪚㫌㫉㫉㪼㫅㫋 㪝㫆㫉㫎㪸㫉㪻㩷㪚㫌㫉㫉㪼㫅㫋 㗅㔚ᵹ㩷㩷㪠㪝㩷㩿㫄㪘㪀 㪊㪇㪇 㪇 㫉㪼 㫅 㪺 㪈㪆㪈㪇 䊂䊠䊷䊁䉞Ყ 㪛㫌㫋㫐㩷㪩㪸㫋㫀㫆 㩷 㪈 㪈 㪼 Model No. GM2BB50BM0C Doc. No. DG-097015C Page 8/ 23 㪩㪼㪽㪼 㪈㪅㪌 ․ᕈ࿑䋨ᮡḰ୯䋩㩷 㪚㪿㪸㫉㪸㪺㫋㪼㫉㫀㫊㫋㫀㪺㫊㩷㪛㫀㪸㪾㫉㪸㫄㩷㩿㪫㪰㪧㪅㪀㩷 㩷 㩷 㩷 ⋧ኻశ᧤㩷㩷䋭㩷㗅㔚ᵹ․ᕈ ⋧ኻశ᧤㩷㩷䋭㩷㩷䉬䊷䉴᷷ᐲ․ᕈ 㪩㪼㫃㪸㫋㫀㫍㪼㩷㪣㫌㫄㫀㫅㫆㫌㫊㩷㪝㫃㫌㫏㩷㫍㫊㪅㩷㪝㫆㫉㫎㪸㫉㪻㩷㪚㫌㫉㫉㪼㫅㫋 㩿㪫㪺㩷㪔㩷㪉㪌㩷㷄㪀 㪩㪼㫃㪸㫋㫀㫍㪼㩷㪣㫌㫄㫀㫅㫆㫌㫊㩷㪝㫃㫌㫏㩷㫍㫊㪅㩷㪚㪸㫊㪼㩷㪫㪼㫄㫇㪼㫉㪸㫋㫌㫉㪼 㩿㪠㪝㩷㪔㩷㪈㪌㪇㩷㫄㪘㪀 ⋧ኻశ᧤㩷㩷㩿㩼㪀 㪈㩷㪇㪇㪇 㩷㪈㪇㪇 㪩㪼㫃㪸㫋㫀㫍㪼㩷㪣㫌㫄㫀㫅㫆㫌㫊㩷㪝㫃㫌㫏 ⋧ኻశ᧤㩷㩷㩿㩼㪀 㪩㪼㫃㪸㫋㫀㫍㪼㩷㪣㫌㫄㫀㫅㫆㫌㫊㩷㪝㫃㫌㫏 㪈㩷㪇㪇㪇 㫉㪼 㫅 㪺 㩷㪈㪇 㩷㪈㪇㪇 㩷㪈㪇 㪈㪇 㪈㪇㪇 㪈㪇㪇㪇 㪄㪊㪇 㪄㪉㪇 㪄㪈㪇 㪈㪇㪇㪇 㪇 㪈㪇 㪉㪇 㪊㪇 㪋㪇 㪌㪇 㪍㪇 㗅㔚ᵹ㩷㪠㪝㩷㩷㩿㫄㪘㪀 䉬䊷䉴᷷ᐲ㩷㪫㪺㩷㩿㷄㪀 㪝㫆㫉㫎㪸㫉㪻㩷㪚㫌㫉㫉㪼㫅㫋 㪚㪸㫊㪼㩷㪫㪼㫄㫇㪼㫉㪸㫋㫌㫉㪼 㪎㪇 㪏㪇 㪐㪇 㪈㪇㪇 㗅㔚ᵹ㩷䋭㩷㗅㔚࿶․ᕈ 㗅㔚࿶㩷㩷䋭㩷㩷䉬䊷䉴᷷ᐲ․ᕈ 㪝㫆㫉㫎㪸㫉㪻㩷㪚㫌㫉㫉㪼㫅㫋㩷㫍㫊㪅㩷㪝㫆㫉㫎㪸㫉㪻㩷㪭㫆㫃㫋㪸㪾㪼 㩿㪫㪺㩷㪔㩷㪉㪌㩷㷄㪀 㪝㫆㫉㫎㪸㫉㪻㩷㪭㫆㫃㫋㪸㪾㪼㩷㫍㫊㪅㩷㪚㪸㫊㪼㩷㪫㪼㫄㫇㪼㫉㪸㫋㫌㫉㪼 㩿㪠㪝㩷㪔㩷㪈㪌㪇㩷㫄㪘㪀 㪋㪅㪇 㗅㔚࿶㩷㩷㩿㪭㪀 㪝㫆㫉㫎㪸㫉㪻㩷㪭㫆㫃㫋㪸㪾㪼 㪝㫆㫉㫎㪸㫉㪻㩷㪚㫌㫉㫉㪼㫅㫋 㗅㔚ᵹ㩷㪠㪝㩷㩷㩿㫄㪘㪀 㪊㪅㪏 㪈㪇㪇 㪈㪇 㪊㪅㪍 㪊㪅㪋 㪊㪅㪉 㪊㪅㪇 㪈 㪉㪅㪇 㪉㪅㪌 㪊㪅㪇 㪊㪅㪌 㪄㪊㪇 㪄㪉㪇 㪄㪈㪇 㪋㪅㪇 㗅㔚࿶㩷㪭㪝㩷㩷㩷㩿㪭㪀 㪈㪇 㪉㪇 㪊㪇 㪋㪇 㪌㪇 㪍㪇 㪎㪇 㪏㪇 㪐㪇 㪈㪇㪇 䉬䊷䉴᷷ᐲ㩷㪫㪺㩷㩿㷄㪀 㪝㫆㫉㫎㪸㫉㪻㩷㪭㫆㫃㫋㪸㪾㪼 㪇㪅㪇㪈㪇 㪇 㪚㪸㫊㪼㩷㪫㪼㫄㫇㪼㫉㪸㫋㫌㫉㪼 ⦡ᐲᐳᮡ㪄㗅㔚ᵹ․ᕈ ⦡ᐲᐳᮡ㩷䋭㩷䉬䊷䉴᷷ᐲ․ᕈ 㪚㪿㫉㫆㫄㪸㫋㫀㪺㫀㫋㫐㩷㪺㫆㫆㫉㪻㫀㫅㪸㫋㪼㫊㩷㫍㫊㪅㩷㪝㫆㫉㫎㪸㫉㪻㩷㪚㫌㫉㫉㪼㫅㫋 㩿㪫㪺㩷㪔㩷㪉㪌㷄㪀 㪚㪿㫉㫆㫄㪸㫋㫀㪺㫀㫋㫐㩷㪺㫆㫆㫉㪻㫀㫅㪸㫋㪼㫊㩷㫍㫊㪅㩷㪚㪸㫊㪼㩷㪫㪼㫄㫇㪼㫉㪸㫋㫌㫉㪼 㩿㪠㪝㩷㪔㩷㪈㪌㪇㫄㪘㪀 㪇㪅㪇㪊 㪇㪅㪇㪉 ͠ 㪇㪅㪇㪇㪌 㪇㪅㪇㪈 O# 㪇㪅㪇㪇㪇 㰱㪚㪠㪜㪶㫐 㰱㪚㪠㪜㪶㫐 O# O# ͠ ͠ 㪇㪅㪇㪇 ͠ O# 㪄㪇㪅㪇㪇㪌 ͠ O# 㪄㪇㪅㪇㪉 㪄㪇㪅㪇㪈㪇 㪄㪇㪅㪇㪈㪇 㪄㪇㪅㪇㪇㪌 㪇㪅㪇㪇㪇 㪇㪅㪇㪇㪌 ͠ 㪄㪇㪅㪇㪈 O# 㪇㪅㪇㪈㪇 㪄㪇㪅㪇㪊 㪄㪇㪅㪇㪊 ͠ 㪄㪇㪅㪇㪉 㰱㪚㪠㪜㪶㫏 (Note) ᧄ․ᕈߪෳ⠨୯ߢ޽ࠅ‫⸽଻ޔ‬୯ߢߪ޽ࠅ߹ߖࠎ‫ޕ‬ Characteristic data shown here is for reference purpose only. (Not guaranteed data) 㪄㪇㪅㪇㪈 㪇㪅㪇㪇 㰱㪚㪠㪜㪶㫏 㪇㪅㪇㪈 㪇㪅㪇㪉 㪇㪅㪇㪊 㪼 Model No. GM2BB50BM0C Doc. No. DG-097015C Page 9/ 23 㪩㪼㪽㪼 㩷 2 ᄖᒻ෸߮ౝㇱ╬ଔ࿁〝࿑ External dimensions and equivalent circuit 㫉㪼 㫅 㪺    㽳㩷 㽲㩷     OKP  㪫㪺㩷 㽳 䋭 Cathode      㸠Protection Resistance 㽲 No. Name Ԙ ࠕࡁ࡯࠼ ԙ ࠞ࠰࡯࠼ + Anode ౝㇱ╬ଔ࿁〝࿑ Equivalent circuit Anode Cathode (Notes) 1. ᜰ␜ή߈ኸᴺ౏Ꮕߪ‫ޔ‬±0.2 Unspecified tolerance to be ±0.2 ૉߒ‫ޔ‬᮸⢽෸߮ၮ᧼ߩࡃ࡝ߪኸᴺ౏Ꮕߦ฽߹ߥ޿‫ޕ‬ ࡃ࡝ߦߟ޿ߡߪ13㗁ߩⷙቯߦᓥ߁‫ޕ‬ This tolerance does not include dimensions of resin and substrate burr remained on edge. Burr size is prescribed in page 13. 2. ࠞ࠶ࠦ୯ߪෳ⠨୯ Values inside parentheses are reference values. 3. Tc: ࠤ࡯᷷ࠬᐲ᷹ቯࡐࠗࡦ࠻ Tc: Measurement point of case temperature න ૏ Unit ᧚ ⾰ Material ઀ ਄ ߍ Finish ࿑ ⇟ Drawing No. ၮ᧼ㇱ䋺䉶䊤䊚䉾䉪䉴㩷 mm 㪪㫌㪹㫊㫋㫉㪸㫋㪼㩷㪑㩷㪚㪼㫉㪸㫄㫀㪺㫊㩷 ┵ሶㇱ䋺㪘㫌 䉄䈦䈐㩷 䊧䊮䉵ㇱ䋺䉲䊥䉮䊷䊮᮸⢽㩷 Terminal㧦Au plating 㪣㪼㫅㫊㩷㪑㩷㪪㫀㫃㫀㪺㫆㫅㪼㩷㫉㪼㫊㫀㫅㩷 52107012 㪼 Model No. GM2BB50BM0C Doc. No. DG-097015C Page 10/ 23 㪩㪼㪽㪼 ା 㗬 ᕈ Reliability 3 㫉㪼 㫅 㪺 ⵾ຠߩା㗬ᕈߦߟ޿ߡߪ‫ޔ‬ਅ⸥ౝኈࠍḩ⿷ߔࠆ߽ߩߣߒ߹ߔ‫ޕ‬ The reliability of product shall satisfy the items listed below. 㪼 3.1 ⹜㛎㗄⋡෸߮⹜㛎᧦ઙ Test items and test conditions 㧔ା㗬᳓Ḱ Confidence level㧦90 %㧕 No. 1 2 3 4 ⹜㛎㗄⋡ Test items ᷷ᐲࠨࠗࠢ࡞⹜㛎 Temperature cycle 㜞᷷㜞Ḩ଻ሽ⹜㛎 Temperature humidity storage 㜞᷷଻ሽ⹜㛎 High temperature storage ૐ᷷଻ሽ⹜㛎 Low temperature storage ଏ⹜ᢙ ᡿㓚ᢙ Samples Defective n C -40 ͠ (30 min) to +100 ͠ (30 min), 100 cycles 22 0 10 Tstg = +60 ͠, RH = 90㧑, Time = 1 000 h 22 0 10 Tstg=+100͠, Time=1 000 h 22 0 10 Tstg=-40͠, Time =1 000 h 22 0 10 Tc=+25 ͠, IF =240mA, Time = 1 000 h 22 0 10 Tc=+100 ͠, IF =150 mA, Time = 1 000 h 22 0 10 Tc=+60 ͠, RH=90%, IF =240 mA, Time = 500 h 22 0 10 Tc=-30 ͠, IF =240 mA, Time = 1 000 h 22 0 10 11 0 20 ⹜ 㛎 ᧦ ઙ Test conditions LTPD 㧔%㧕 ቶ᷷ㅪ⛯േ૞ኼ๮⹜㛎 5 Steady state operating life at room temperature 6 Steady state operating life at high temperature 7 Steady state operating life at high temperature and elevated humidity 8 Steady state operating life at low temperature 㜞᷷േ૞ኼ๮⹜㛎 㜞᷷㜞Ḩേ૞ኼ๮⹜㛎 ૐ᷷േ૞ኼ๮⹜㛎 9 ⴣ᠄⹜㛎 Shock ടㅦᐲ㧦15 000 m/s2, ࡄ࡞ࠬ᏷ 0.5 ms, Tc = +25 ͠ ⴣ᠄ᣇะ㧦X㨯Y㨯Z ᣇะ ࿁ᢙ㧦3 ࿁ 2 Acceleration: 15 000 m/s , Pulse width: 0.5 ms, Tc = +25 ͠ Direction: X, Y and Z, 3 trials in each direction Model No. GM2BB50BM0C Doc. No. DG-097015C Page 11/ 23 ടㅦᐲ㧦200 m/s2, ๟ᵄᢙ㧦100㨪2 000 Hz 㧝ᓔᓳ 4 ಽ Tc = +25 ͠ 10 11 12 นᄌ๟ᵄᢙᝄേ⹜㛎 Vibration ߪࠎߛ⠴ᾲᕈ⹜㛎 Resistance to soldering heat ߪࠎߛઃߌᕈ⹜㛎 (ᶐẃᴺ) Solderability (Solder dip) ᝄേᣇะ㧦X㨯Y㨯Z ᣇะ ࿁ᢙ㧦4 ࿁ 㪩㪼㪽㪼 㫉㪼 㫅 㪺 㪼 11 0 20 11 0 20 11 0 20 Acceleration: 200 m/s2 Frequency: 100 to 2 000 Hz (round-trip) 4 min Tc = +25 ͠ Direction: X, Y and Z 4 trials in each direction 22㗁⸥タߩ࡝ࡈࡠ࡯ߪࠎߛઃߌ᧦ઙߦࠃࠅ 2 ࿁ 2 trials, under the reflow condition mentioned in Page 22. 150͠㜞᷷᡼⟎ 1 ᤨ㑆ᓟ ߪࠎߛઃߌ᷷ᐲ㧦240±5͠ ᶐẃᤨ㑆㧦5r1 s ߪࠎߛࡈ࡜࠶ࠢࠬ㧦M705-221BM5/ ESR-250 㧔ජ૑㊄ዻᎿᬺᩣᑼળ␠⵾㧕 Solder temperature: 240±5 ͠, Soldering time: 5±1 s Solder/ Flux: M705-221BM5/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) After exposed to 150͠ for 1 hour Model No. GM2BB50BM0C Doc. No. DG-097015C Page 12/ 23 㪩㪼㪽㪼 㫉㪼 㫅 㪺 3.2 ᡿㓚್ቯၮḰ Failure criteria 3.2.1 ߪࠎߛઃߌᕈߩ᡿㓚್ቯၮḰ Solderability failure criterion ਅ⸥ߪࠎߛኻ⽎㗔ၞߩ 90㧑એ਄ߦߪࠎߛ߇ઃ޿ߡ޿ࠆߎߣ‫ޕ‬ Solder should be applied at 90% or more of each solderability judgment area. ߪࠎߛઃߌᕈ್ቯࠛ࡝ࠕ㧦 ⵾ຠⵣ㕙┵ሶ㧔࿑ਛᢳ✢ㇱ㗔ၞ㧕 Solderability judgment area: Bottom of the lead (Shaded portion in the figure) 3.2.2 ߘߩઁߩ᡿㓚್ቯၮḰ Failure criteria for the other reliability tests No. 1 2 ᷹ቯ㗄⋡ ⸥ภ ᡿㓚್ቯၮḰ Parameter Symbol Failure criteria VF VF > U.S.L. × 1.2 㗅㔚࿶ Forward Voltage శ᧤ Luminous intensity ĭV ĭV < ೋᦼ୯×0.5, ĭV > ೋᦼ୯×2.0 ĭV < Initial value × 0.5, ĭV > Initial value × 2.0 (Note 1) ᷹ቯ᧦ઙߪ㔚᳇⊛෸߮శቇ⊛․ᕈߩ㗄ߦ␜ߒߚ᧦ઙߦ৻⥌ߒ߹ߔ‫ޕ‬ Measuring conditions shall accord with the paragraph mentioned about the electro-optical characteristics. (Note 2) U.S.L ߪⷙᩰ਄㒢୯ࠍ⴫ߒ߹ߔ‫ޕ‬ U.S.L. stands for Upper Specification Limit.. 㪼 Model No. GM2BB50BM0C Doc. No. DG-097015C Page 13/ 23 㪩㪼㪽㪼 4 ຠ⾰᳓Ḱ Quality level 㫉㪼 㫅 㪺 㪼 4.1 ㆡ↪ⷙᩰ Applied standard ISO 2859-1 4.2 ᛮขᣇᑼ Sampling inspection ࠽ࡒᬌᩏ㧝࿁ᛮ߈ขࠅ࡮᳓ḰS-4 A single normal sampling plan, level S-4 4.3 ᬌᩏ㗄⋡෸߮ᰳὐ್ቯၮḰ Inspection items and defect criteria No. 1 2 3 ᬌᩏ㗄⋡ ᰳὐ್ቯၮḰ ಽ㘃 Inspection items Defect criteria Classification ਇἮ No radiation ⊒శ⦡ Radiation color ࠹࡯ࡇࡦࠣ Taping ․ᕈ 4 Electro-optical characteristics 5 ᄖᒻኸᴺ External dimensions ోߊ⊒శߒߥ޿߽ߩ No light emitting ⷙቯߩ⊒శ⦡ߢߥ޿߽ߩ Different from the specified color ᧄ઀᭽ᦠߦ⸥タߐࠇߡ޿ࠆ࠹࡯ࡇࡦࠣะ߈ߣ⋧ ㆑ߔࠆ߽ߩ ㊀ᰳὐ Major defect VF ,IR, ĭV,⦡ᐲᐳᮡ߇઀᭽୯ࠍḩ⿷ߒߡ޿ߥ޿߽ ߩ (4㗁ෳᾖ) Not satisfied with specified values for VF, IR, Ǿ and  chromaticity coordinates mentioned in Page 4 ⷙቯኸᴺࠍḩ⿷ߒߡ޿ߥ޿߽ߩ (9㗁ෳᾖ) Not satisfied with specified dimensions in Page 9 シᰳὐ ᄖⷰ Appearance 0.1% Not conforming to the inserted direction shown in the specification ⊒శㇱߦ⊒శ⁁ᘒߦᡰ㓚ߩ޽ࠆ⇣‛࡮ࠠ࠭ (ขࠅ㒰߈น⢻ߥ⇣‛ߪ㒰ߊ) 6 AQL Foreign substances and scratches of light emitting face which are obstructed light emitting condition. (Except removable foreign substance) 0.3mm ࠍ⿧߃ࠆ᮸⢽෸߮ၮ᧼ߩࡃ࡝ Resin or substrate burr which is over 0.3mm Ǿ0.3 mm ࠍ⿧߃ࠆ᮸⢽࡮┵ሶᰳ Resin crack and terminal crack, which are over Ǿ0.3 mm Minor defect 0.4 % Model No. GM2BB50BM0C Doc. No. DG-097015C Page 14/ 23 㪩㪼㪽㪼 ⵬⿷੐㗄 Supplements 㫉㪼 㫅 㪺 5.1 ࠹࡯ࡇࡦࠣ Taping 5.1.1 ࠹࡯ࡊᒻ⁁෸߮ኸᴺ㧔ෳ⠨୯㧕 Shape and dimensions of tape (Ref.) 2 2 # ࠹࡯ࡊᒁ߈಴ߒᣇะ Feeding direction 9 9 ( ' V $ 5 V V 2 䉦䉸䊷䊄䊙䊷䉪 Cathode Mark 㗄⋡ ⸥ภ ኸᴺ [mm] ஻⠨ Parameter Symbol Dimension [mm] Remarks A 3.13 B 3.13 P1 4.0 D0 1.5 P0 4.0 ❑ Length ࠛࡦࡏࠬㇱ ᮮ Pocket (embossed) Width ࡇ࠶࠴ Pitch ⋥ᓘ ㅍࠅਣⓣ Diameter Sprocket hole ࡇ࠶࠴ Pitch ㅍࠅਣⓣ૏⟎ Sprocket hole position ࠛࡦࡏࠬㇱ૏⟎ Pocket position ᏷ ࠞࡃ࡯࠹࡯ࡊ Width ෘߐ Cover tape Thickness ᏷ ࠠࡖ࡝ࠕ࠹࡯ࡊ Width ෘߐ Carrier tape Thickness ࠹࡯ࡊ✚ෘߐ Overall thickness of the taping ౝᐩߩ㓈ߩ R ㇱࠍ㒰޿ߚኸᴺ Measured at inside bottom square corner ⚥Ⓧ⺋Ꮕ±0.5 mm/10 ࡇ࠶࠴ Accumulated error ±0.5 mm/ 10 pitch ࠹࡯ࡊ┵߆ࠄㅍࠅਣⓣߩਛᔃ߹ߢ ߩ〒㔌 E 1.75 P2 2.0 ࠛࡦࡏࠬㇱߩਛᔃߣㅍࠅਣⓣߩਛ ᔃ✢㑆〒㔌 F 3.5 Dimension at the extension of the center lines of the pocket to the center line of the sprocket hole W1 5.3 t3 0.1 W0 8.0 t1 0.25 t2 2.6 Dimension from the edge of the tape to the center of the sprocket hole ࠹࡯ࡊᐩ㕙߆ࠄࠞࡃ࡯࠹࡯ࡊ਄㕙 ߹ߢߩኸᴺ Including the thickness of cover and carrier tape 㪼 Model No. GM2BB50BM0C Doc. No. DG-097015C Page 15/ 23 㪩㪼㪽㪼 5.1.2 ࡝࡯࡞ᒻ⁁෸߮ኸᴺ㧔ෳ⠨୯㧕 Shape and dimensions of reel (Ref.) 㪼 # % $ 7     ࡜ࡌ࡞⴫␜ ⴫␜࡜ࡌ࡞ Label     ' 㫉㪼 㫅 㪺 V 9 㗄⋡ Parameter ⋥ᓘ Diameter ࡈ࡜ࡦࠫ Flange ෘߐ Thickness ਔࡈ࡜ࡦࠫߩౝ஥㑆㓒 Clearance between the flanges ᄖ๟⋥ᓘ External diameter ࠬࡇࡦ࠼࡞ⓣߩ⋥ᓘ ࡂࡉ Spindle hole diameter Hub ᏷ ࠠ࡯Ḵ Key slit Width ᷓߐ Depth ᯏ⒳ฬ╬ߩ⴫␜ Indication of Model No. etc. ᧚⾰㧦ࡐ࡝ࠬ࠴࡟ࡦ Materials: Polystyrene ⸥ภ ኸᴺ[mm] (Ref.) ஻⠨ Symbol Dimension [mm] Remarks A 180 t 1.5 W 10 B 60 C 13 E 2.0 U 4.5 ኸᴺߪゲਛᔃㇱߣߔࠆ Dimension measured close to the core ࡈ࡜ࡦࠫߩ 㕙ߦᯏ⒳ฬ㨮ᢙ㊂㨮ࡠ࠶࠻ࠍ⸥タߒߚ࡜ࡌ࡞ࠍ⾍ઃ Label attached on flange (Model No., quantity, Lot No. etc.) Model No. GM2BB50BM0C Doc. No. DG-097015C Page 16/ 23 㪩㪼㪽㪼 5.1.3 ࠹࡯ࡇࡦࠣ઀᭽ Taping technical specification 㫉㪼 㫅 㪺 㪼 ᒁ߈಴ߒᣇะ Feeding direction ⓨㇱ Empty 160mmએ਄ M IN. 160mm ࡝࡯࠳࡯ㇱ(ⓨㇱ) Leader(Empty) 400mmએ਄ M IN. 400mm ⵾ຠ෼⚊ㇱ LEDs inside 䊁䊷䊒೸㔌ᒝᐲ䇭㪇㪅㪈㪥䌾㪈㪅㪇㪥㩷㩿㱔㩷㪔㪇䌾㪈㪇㫦㪀 ࠹࡯ࡊ೸㔌ᒝᐲ㧦‫ޓ‬0㨪0 0.1N䌾0.8N (ș=0䌾10°) 0‫ޓ‬㨪0 㪚㫆㫍㪼㫉㩷㫋㪸㫇㪼㩷㫊㪼㫇㪸㫉㪸㫋㫀㫆㫅 㪝㪔㪇㪅㪈㫕㪈㪅㪇㩷㩷㪥㩷㩿㱔㪔㪈㪇㫦㫆㫉㩷㫃㪼㫊㫊㪀 䉦䊋䊷䊁䊷䊒 㧲㪝 㪚㫆㫍㪼㫉㩷㪫㪸㫇㪼 ࠞࡃ࡯࠹࡯ࡊ 㪇䌾㪈㪇㩷㫦 㨪q 㩷㩷㩷㩷䊁䊷䊒ㅍ䉍ㅦᐲ䋺㪌㩷㫄㫄㪆㫊 ࠹࡯ࡊㅍࠅㅦᐲ 㪫㪸㫇㪼㩷㫊㫇㪼㪼㪻㪑㩷㪌㩷㫄㫄㪆㫊 㩷㩷㩷㩷 㪌㩷㫄㫄㪆㫊 OOU ࠹࡯ࡊㅍࠅᣇะ 䊁䊷䊒ㅍ䉍ᣇะ 㪝㫆㫉㫎㪸㫉㪻 ࠠࡖ࡝ࠕ࠹࡯ࡊ 䉨䊞䊥䉝䊁䊷䊒 Stuffed 㪚㪸㫉㫉㫀㪼㫉㩷㪫㪸㫇㪼 (1) ࠹࡯ࡊᦛߍᒝᐲ㧦ඨᓘ 30 mm એਅߢ࠹࡯ࡊࠍᦛߍࠆߣ‫ޔ‬ ࠞࡃ࡯࠹࡯ࡊ߇೸߇ࠇࠆߎߣ߇޽ࠅ߹ߔ‫ޕ‬ Tape strength against bending: The radius of curvature should be more than 30 mm. If i bent at less than 30 mm, the cover may peel off. (2) ࠹࡯ࡊߩ⛮߉㧦㧝࡝࡯࡞ౝߢߩࠞࡃ࡯࠹࡯ࡊ෸߮ࠠࡖ࡝ࠕ࠹࡯ࡊߩ⛮߉ߪ޽ࠅ߹ߖࠎ‫ޕ‬ Joint of the tape: No joint of cover tape or carrier tape in one reel (3) ൮ⵝᢙ㊂㧦ᮡḰᢙ㊂ 2 000 ୘㧛࡝࡯࡞ Quantity: 2 000 pcs. per reel (standard) (4) ⵾ຠ⾰㊂㧦⚂ 30 mg㧔⵾ຠ㧝୘޽ߚࠅߩ⾰㊂㧛ෳ⠨୯㧕 Product mass: Approx. 30 mg (One piece of LED/ Reference value) (5) ߘߩઁ Others: Ԙ ⵾ຠ෼⚊ㇱߦ߅ߌࠆ⵾ຠߩㅪ⛯ᛮߌߪή޿߽ߩߣߒ߹ߔ‫ޕ‬ There are no continuous empty pockets except leader and trailer part. ԙ ㇱຠᰳ⪭ᢙߪ‫✚࡞࡯࡝ޔ‬ㇱຠᢙߩ 0.1%એਅߣߒ߹ߔ‫ޕ‬ The quantity of the products lacking should be less than 0.1% of total product quantity. Ԛ⵾ຠߩࠞࡃ࡯࠹࡯ࡊ߳ߩઃ⌕ߪ޽ࠅ߹ߖࠎ‫ޕ‬ Products should not be attached to the cover tape when it peeled off. Model No. GM2BB50BM0C Doc. No. DG-097015C Page 17/ 23 㪩㪼㪽㪼 5.2 ࡜ࡌ࡞㧔࡝࡯࡞㧕 Label (on reel㧕 ࡝࡯࡞ߦߪEIAJ C-3 ࠦ࡯࠼㧔ࡈࠜ࡯ࡑ࠶࠻e㧕ኻᔕ࡜ࡌ࡞ࠍ⾍ઃߒ߹ߔ‫ޕ‬ EIAJC-3 compliant bar code (format e) label is attached on each reel. ‫ ଀␜⴫ޝ‬Example‫ޞ‬ SHARP CORPORATION PART No. GM2BB50BM0C QUANTITY 2 000 ĸ ᯏ⒳ฬ Model No. ĸ ᢙ㊂ Product quantity ĸ EIAJ C-3 ࡃ࡯ࠦ࡯࠼ EIAJ C-3 Bar codes LOT No. XX09F11㪆 RANK ٤ٌٌ㧙‫غ‬ ‫ޛ‬EIAJ C-3‫ ޜ‬MADE IN XXXX ĸ ࡠ࠶࠻⇟ภ㪆࡜ࡦࠢ LOT number and rank ĸ ේ↥࿖ Production country ‫ ߡ޿ߟߦ␜⴫࠻࠶ࡠޝ‬LOT Number‫ޞ‬ XX 0 9 F Ԙ ԙ Ԛ 11 ԛ Ԙ ↢↥Ꮏ႐⇛ภ (ࠕ࡞ࡈࠔࡌ࠶࠻⴫⸥) Production plant code (to be indicated alphabetically) ԙ ↢↥ᐕ (⷏ᥲᐕภᧃየ2 ᩴ) Year of production (the last two figures of the year) Ԛ ↢↥᦬ (1 ᦬߆ࠄABC 㗅ߢ⴫⸥) Month of production (to be indicated alphabetically with January corresponding to A) ԛ ↢↥ᣣ (01㨪31) Date of production (01 to 31) ‫ ߡ޿ߟߦ␜⴫ࠢࡦ࡜ޝ‬Rank‫ޞ‬ RANK ٤ٌٌ㧙‫غ‬㧦 ٤ ోశ᧤࡜ࡦࠢ Luminous flux rank ٌٌ⦡ᐲ࡜ࡦࠢ Chromaticity rank ‫ غ‬㗅㔚࿶࡜ࡦࠢ Forward voltage rank 㫉㪼 㫅 㪺 㪼 Model No. GM2BB50BM0C Doc. No. DG-097015C Page 18/ 23 㪩㪼㪽㪼 5.3 ൮ⵝ Packing 㫉㪼 㫅 㪺 㪼 5.3.1 㒐Ḩ൮ⵝ Moisture proof packing ⵾ຠߩャㅍਛ෸߮଻▤ਛߩๆḨࠍㆱߌࠆߚ߼‫ࠆࠃߦࠢ࠶ࡄࡒ࡞ࠕޔ‬㒐Ḩ൮ⵝࠍⴕߞߡ޿߹ߔ‫ޕ‬ In order to avoid the absorption of humidity while transport and storage, the devices are packed in moisture proof aluminum bags. 䉝䊦䊚䊌䉾䉪 䊤䊔䊦 㪘㫃㫄㫀㫅㫌㫄㩷㪹㪸㪾 㪣㪸㪹㪼㫃 䉲䊥䉦䉭䊦 㪪㫀㫃㫀㪺㪸㩷㪾㪼㫃 䊥䊷䊦 㪩㪼㪼㫃 㩿㪜㪠㪘㪡㩷㪚㪄㪊ኻᔕ䍵䍫䍼䍷㪀 㪣㪸㪹㪼㫃㩷㩿㪜㪠㪘㪡㩷㪚㪄㪊㩷㪺㫆㫄㫇㫃㫀㪸㫅㫋㪀 5.3.2 ផᅑ଻▤᧦ઙ Recommended storage conditions ᷷ᐲ㧦5㨪30 ͠‫ ޔ‬Ḩᐲ㧦85 % RH એਅ Temperature: 5͠ to 30 ͠ Relative humidity: 85% or less 5.3.3 㐿ኽᓟߩᵈᗧὐ Precautions after opening aluminum bags Ԙ 㐿ኽᓟߪએਅߩⅣႺߦߡ 7 ᣣએౝߦ૶↪㧔ߪࠎߛಣℂ㧕ߒߡਅߐ޿‫ޕ‬ ᷷ᐲ㧦5㨪30 ͠‫ޔ‬Ḩᐲ㧦60%RH એਅ Please be sure to give them the soldering within 7 days under the following conditions. Temperature: 5 ͠ to 30 ͠ Relative humidity: 60% or less ԙ 㐿ኽᓟ㐳ᦼ㑆૶↪ߒߥ޿႐วߪ‫ߪߚ߹▤଻ࠬࠢ࠶ࡏࠗ࡜࠼ޔ‬Ꮢ⽼ߩࠪ࡯࡜࡯╬ߢ ੇ῎೷ߣ౒ߦౣኒኽߒ‫ޔ‬5.3.2ߣห╬ߩⅣႺߦ଻▤ߒߡߊߛߐ޿‫ޕ‬ Storage in a dry box is recommended in case that the products are not used for a long time after opened. Or repack the reels with a desiccative by the sealer and store them under the same conditions mentioned in 5.3.2. Ԛ એਅߩ႐วߪ‫⋥↪૶ޔ‬೨ߦਅ⸥⸥タߩផᅑ᧦ઙߢࡌ࡯ࠠࡦࠣಣℂࠍⴕߞߡਅߐ޿‫ޕ‬ Please perform the baking treatment under the recommended conditions in the following cases; ࡮ࠪ࡝ࠞࠥ࡞ࠗࡦࠫࠤ࡯࠲ߩ㕍⦡߇ᄌ⦡෸߮ㅌ⦡ߒߡ޿ࠆ႐ว The blue indicator of silica gel changes its color or fades. ࡮㐿ኽᓟߩ଻▤᧦ઙਅߢ 7 ᣣ⚻ㆊߒߚ႐ว 7days passed after opened under the specified storage conditions. ࡮㐿ኽᓟ଻▤᧦ઙએᄖߢ଻▤ߔࠆ႐ว Products were stored out of storage condition. 㧔ផᅑ᧦ઙ㧕 (Recommended baking conditions): 㨯࠹࡯ࡇࡦࠣ⁁ᘒ Products with taping ᷷ᐲ㧦60㨪65 ͠‫ᤨޔ‬㑆㧦36㨪48 ᤨ㑆 Temperature: 60 ͠ to 65 ͠, Time: 36 to 48 hours Model No. GM2BB50BM0C Doc. No. DG-097015C Page 19/ 23 㨯⵾ຠන૕⁁ᘒ㧔ၮ᧼਄ߦ઒ᱛ߼‫ߪߊߒ߽ޔ‬㊄ዻ࠻࡟ࠗ਄㧕 Single piece of the products (on PCB or metallic tray) ᷷ᐲ㧦100 ͠㨪120 ͠‫ᤨޔ‬㑆㧦2~3 ᤨ㑆 Temperature: 100 ͠ to 120 ͠, Time: 2 to 3 hours. 㪩㪼㪽㪼 㫉㪼 㫅 㪺 㪼 ࡌ࡯ࠠࡦࠣߪ⵾ຠࠍⓍߺ㊀ߨߚࠅ‫ޔ‬ ᔕജࠍ߆ߌߚࠅߒߚ⁁ᘒߢⴕߥ߁ߣ࡝࡯࡞╬ߩᄌᒻ߇⊒↢ߔࠆ႐ว ߇޽ࠅ߹ߔߩߢߏᵈᗧਅߐ޿‫ࠣࡦࠠ࡯ࡌޕ‬ᓟߪᏱ᷷⁁ᘒߦᚯߞߚߎߣࠍߏ⏕⹺ਅߐ޿‫ޕ‬ Avoid piling up the reels or applying stress to them during baking so as to protect from deformation. Please be sure to cool them to room temperature after baking. 5.4 ⅣႺ⽶⩄‛⾰ߩ㕖฽᦭⁁ᴫ Information on environmental impact substances 5.4.1 RoHS ᜰ઎ኻᔕ⵾ຠ RoHS compliant product ᑷ␠ࠣ࡝࡯ࡦ࠺ࡃࠗࠬࠟࠗ࠼࡜ࠗࡦߦၮߠ߈ࠣ࡝࡯ࡦ᧚ᢱࠍ↪޿ߡ⸳⸘ߐࠇ߹ߒߚ RoHS ᜰ઎ኻᔕ⵾ຠߢߔ‫(ޕ‬2001 ᐕ 4 ᦬એ㒠ߩ↢↥ຠ߇ኻ⽎ߢߔ‫)ޕ‬ This is a RoHS compliant product designed and manufactured in accordance with Sharp's Green Device Guidelines. (Applied to the products manufactured in and after April of 2001) 5.4.2 ࠝ࠱ࡦጀ⎕უൻቇ‛⾰ߩ᦭ή Ozone Depleting Substances ࡮ᧄ⵾ຠߦߪਅ⸥ൻቇ‛⾰ࠍ฽᦭ߒߡ߅ࠅ߹ߖࠎ‫ޕ‬ This product does not contain the following Ozone Depleting Substances. ࡮ᧄ⵾ຠߪ⵾ㅧᎿ⒟ߦ߅޿ߡਅ⸥ൻቇ‛⾰ࠍ૶↪ߒߡ߅ࠅ߹ߖࠎ‫ޕ‬ This product does not have a production line whose process requires the following Ozone Depleting Substances. ࡮ⷙ೙ኻ⽎‛⾰㧦CFCs࡮ࡂࡠࡦ࡮྾Ⴎൻ὇⚛࡮1, 1, 1-࠻࡝ࠢࡠࡠࠛ࠲ࡦ (ࡔ࠴࡞ࠢࡠࡠࡎ࡞ࡓ) Restricted substances: CFCs, Halones, CCl4, and 1, 1, 1-Trichloroethane (Methyl chloroform) Model No. GM2BB50BM0C Doc. No. DG-097015C Page 20/ 23 6 ૶↪਄ߩᵈᗧ Precautions 㪩㪼㪽㪼 㫉㪼 㫅 㪺 㪼 6.1 ৻⥸⊛ߥ૶↪਄ߩᵈᗧ General handling Ԙ ᧄ࠺ࡃࠗࠬߩ৻ኻߩ㔚ᭂߦශടߐࠇࠆ㔚࿶ߪ‫ޔ‬㗅ᣇะߩߺߣߒ㕖ὐἮᤨߦߪ‫ޔ‬ਔ㔚ᭂߦ㔚૏Ꮕ߇↢ߓߥ޿ ࠃ߁ᓮ㈩ᘦਅߐ޿‫ޕ‬ ․ߦㅒᣇะߩ㔚࿶߇ടࠊࠆߣࡑࠗࠣ࡟࡯࡚ࠪࡦ߇⊒↢ߔࠆෂ㒾ᕈ߇᦭ࠅ‫ޔ‬㐳ᦼ㑆ߩߏ૶↪ߢ࿁〝ߩ⍴⛊߇ ᔨ ߐࠇ߹ߔ‫ޕ‬ The voltage must be applied to LED only as a forward direction. Moreover, please design circuit diagram considering no voltage gap between Anode and Cathode during off state. If the reverse voltage is applied to LED for a long term, the electro-migration is generated and there is a possibility of the short-circuit of the circuit. ԙᧄ⵾ຠߪ㕒㔚᳇߿ࠨ࡯ࠫߦኻߒߡᢅᗵߢ޽ࠅ‫᧦↪૶ޔ‬ઙߦࠃࠅ⚛ሶߩ៊்߿ା㗬ᕈૐਅࠍ߅ߎߔߎߣ߇޽ࠅ ߹ߔߩߢ⵾ຠߩขࠅᛒ޿ߦ㓙ߒ‫ޔ‬චಽߥ㕒㔚ኻ╷ࠍⴕߞߡਅߐ޿‫⵾ᧄߚ߹ޕ‬ຠࠍታⵝᓟߦ߅޿ߡ߽‫ޔ‬㔗᠄߿㕒 㔚᳇‫࠴࠶ࠗࠬޔ‬㐿㐽ᠲ૞╬ߦࠃࠆࠨ࡯ࠫߦࠃࠅ LED ߇⎕უߔࠆน⢻ᕈ߇޽ࠅ߹ߔ‫ࠍࠇߎޕ‬㒐ᱛߔࠆߚ߼‫ᧄޔ‬ ⵾ຠߣਗ೉ߦ࠷ࠚ࠽࠳ࠗࠝ࡯࠼߿TVS(ㆊᷰ㔚࿶ᛥ࿶ེ)╬ߩ଻⼔⚛ሶࠍធ⛯ߔࠆߎߣࠍផᅑ⥌ߒ߹ߔ‫ޕ‬ This product is sensitive for electrostatic voltage and surge voltage. Static electrocity or surge voltage can deteriorate product and its reliability. Please make sure that all devices and equipments must be grounded. We recommend to built in zener diode or TVS(Transient Voltage Suppression) as protection circuit against static electricity. Ԛ ᧄ⵾ຠߦߪ‫⊒ޔ‬శ᧚ᢱߦ㕍⦡LED ࠴࠶ࡊߣ․ᱶⰯశ૕ࠍ૶↪ߒߡ߅ࠅ߹ߔ‫ߩߎޕ‬ὑ‫ޔ‬๟࿐᷷ᐲ‫ޔ‬േ૞㔚ᵹ ୯╬૶↪⁁ᘒߦࠃࠅᄙዋ⦡⺞ߩᄌൻ߇޽ࠅ߹ߔ‫ࠬ࡞ࡄޔߚ߹ޕ‬㚟േߢߩߏ૶↪ߩ㓙ߪ‫Ⱟޔ‬శ૕ߩᱷశߦࠃࠅ⦡ ⺞߇ᄌൻߔࠆߎߣ߇޽ࠅ߹ߔߩߢ‫ޔ‬චಽߏ⏕⹺ߩ਄‫↪૶ߏޔ‬ਅߐ޿‫ޕ‬ This product is composed of blue LED chip and special phosphor. Color tone is possible to vary in some degree, depending on the operating conditions such as ambient temperature or current amount. Also it is subject to variation due to the afterglow of the phosphor in pulse drive. So please verify the performance before use. ԛ ಴ജࠍ਄ߍߚ⁁ᘒߢᧄ⵾ຠࠍ⋥ⷞߒ߹ߔߣ‫ࠆ߼்ࠍ⋡ޔ‬ᕟࠇ߇޽ࠅ߹ߔߩߢߏᵈᗧਅߐ޿‫ޕ‬ Do not look directly at LEDs with unshielded eyes, or damage to your eyes may result. Ԝᧄ⵾ຠߪ‫ޔ‬LED ὐἮߢ⊒↢ߒߚᾲࠍ࠺ࡃࠗࠬᄖㇱߦㅏߍᤃߊߔࠆߚ߼‫ޔ‬ᾲવዉߩ⦟޿᧚ᢱࠍ૶↪ߒ ߡ޿߹ߔ‫߼ߚߩߘޕ‬ၮ᧼⸳⸘ߩ㓙‫ޔ‬LED એᄖߩᾲḮ(଀‫ޔ‬ᛶ᛫╬)߇ㄭߊߦ޽ࠆߣ‫ߩߘޔ‬ᾲ߇࠺ࡃࠗࠬౝߦ ࠳ࡔ࡯ࠫࠍਈ߃ࠆᕟࠇ߇޽ࠅ߹ߔ‫ޕ‬ၮ᧼⸳⸘ߢߪᾲḮࠍLED ߆ࠄ㆙ߑߌ‫ޔ‬ၮ᧼ߩᾲ߇ᄖㇱߦ ㅏߍࠆࠃ߁ߦ⸳⸘ߒߡਅߐ޿‫ࠬ࡯ࠤޕ‬᷷ᐲߪ‫⥄ޔ‬Ꮖ⊒ᾲࠍ฽߼100 ͠એਅ(ὐἮᤨ)ߦ⸳⸘ߒߡਅߐ޿‫ޕ‬ Materials with high thermal conductivity are used in this product in order to allow generated heat to escape effectively out of the product. Avoid locating other heat sources (ex. resistance, etc.) near the products on circuit board to protect the devices from the heatdamage. Please make sure that case temperature is always under 100 ͠ during operation, including the self-heating. ԝ⊒శㇱߦࠧࡒ߇ઃ⌕ߔࠆߣขࠇߦߊߊ‫ޔ‬శᐲ߇ૐਅߔࠆ႐ว߇޽ࠅ߹ߔߩߢ‫ߩࡒࠧޔ‬ઃ⌕ߒߦߊ޿ⅣႺߢ ߏ૶↪ਅߐ޿‫ޕ‬ Since dust on the surface of the radiation part is hard to remove and may decrease the luminous intensity, please handle the products in a clean, non-dusty condition. Ԟᧄ⵾ຠߩ࡟ࡦ࠭ㇱߪࠪ࡝ࠦ࡯ࡦ᮸⢽ߢᒻᚑߐࠇߡ޿߹ߔ‫ޕ‬వ┵߇㍈೑ߥ߽ߩߢ᛼ߐ߃ߥ޿᭽‫ޔ‬ขࠅᛒ޿ߊߛ ߐ޿‫࠭ࡦ࡟ޕ‬ㇱߩࠢ࡜࠶ࠢ㧘೸㔌߿ࡢࠗࡗ࡯ᄌᒻ߇⊒↢ߒਇὐἮߩේ࿃ߣߥࠅ߹ߔ‫ޕ‬ The lens of this product is formed with silicone resin. In the case of handling this device, please do not push the lens portion by the sharp tools. The crack and peel off of the lens, and the wire deformation are generated and it causes not lighting. ࡮⵾ຠ࡟ࡦ࠭ㇱߩ஥ᣇ߆ࠄ⩄㊀ࠍដߌߥ޿ߢਅߐ޿‫ޕ‬ Especially do not apply the load from horizontal direction to the side of the lens of this product. ࡮⵾ຠ࡟ࡦ࠭ㇱߩᢳ߼45 ᐲ߆ࠄశゲᣇะߦ߆ߌߡߪ‫ޔ‬2.5㧺એ਄ߩ㕒⩄㊀(1.4mmij એਅ㧕ࠍដߌߥ޿ߢਅߐ޿‫ޕ‬ Please do not apply the static load of 2.5N or more (1.4mmij or less)from the diagonal 45 degrees of this products lens portion to the direction of an optical axis. 㪩㪼㪽㪼 㫉㪼 㫅 㪺 Model No. GM2BB50BM0C Doc. No. DG-097015C Page 21/ 23 ԟ⵾ຠ߇ዊဳߢ‫࠭ࡦ࡟ޔߟ߆ޔ‬ㇱ(⊒శㇱ)߇ࠪ࡝ࠦ࡯ࡦ᮸⢽ߢ޽ࠆߚ߼‫ޔ‬ᄖㇱࠬ࠻࡟ࠬߢ⎕៊ߔࠆ႐ว߇޽ࠅ ߹ߔ‫࡝ࡉࡦ࠮ࠕޕ‬ᓟⴣ᠄߇ടࠊࠄߥ޿᭽‫ޔ‬ขࠅᛒ޿ਅߐ޿‫ޕ‬ This product is the small size and the lens portion is formed by silicone resin, there is a possibility to have a damage by the external stress. ࡮ࡇࡦ࠮࠶࠻ߢߩขࠅᛒ޿ In the case of the handling with the tweezers ࡇࡦ࠮࠶࠻ߦߡ⵾ຠࠍขࠅᛒ߁႐ว‫࠭ࡦ࡟ޔ‬ㇱߦ⸅ࠇߥ޿ࠃ߁࠮࡜ࡒ࠶ࠢၮ᧼ㇱࠍឞ߻᭽߅ขᛒ޿ߊߛߐ޿‫ޕ‬ In the case of the handling with the tweezers, please pick up the products with the sides of the ceramic substrate and do not touch the lens portion . 㪼 ࡮ታⵝᤨߩขࠅᛒ޿ In the case of the mount of the product ታⵝᯏߩࠦ࡟࠶࠻╬ߦࠃࠅ⵾ຠ᮸⢽ㇱߦㆊᄢߥ ⩄㊀߇߆߆ߞߚ႐ว‫⵾ޔ‬ຠ߇⎕៊ߔࠆᕟࠇ߇޽ࠅ߹ߔߩߢ‫ޔ‬ ታⵝ᧦ઙࠍ⏕⹺ߩ਄ߏ૶↪ਅߐ޿‫ޕ‬ ផᅑࠦ࡟࠶࠻ߪ‫ޔ‬ฝ࿑ࠍෳᾖߒߡߊߛߐ޿‫ޕ‬ Please use this product after confirming the mouting condition, because there is a possibility to have a damage by the external stress when the load is applied by the collet of the mouter.. Please see the recommended collet of this product as right picture. Ԡታⵝᓟ߽‫࠭ࡦ࡟ޔ‬ㇱߦᄖജ߇ടࠊࠄߥ޿ࠃ߁ߦᵈᗧߒߡਅߐ޿‫࡝ࡉࡦ࠮ࠕޕ‬ᓟ‫ޔ‬ၮ᧼߇ᦛ߇ࠆߣ⵾ຠߦᄖㇱ ࠬ࠻࡟ࠬ߇ടࠊߞߚࠅ‫ޔ‬ඨ↰ઃߌㇱಽߦࠢ࡜࠶ࠢ߇⊒↢ߔࠆ႐ว߇޽ࠅ߹ߔ‫ߩ࡝ࡉࡦ࠮ࠕޕ‬㓙ߪ‫ޔ‬ၮ᧼ߩ෻ࠅ ߦኻߒߡ‫߇ࠬ࡟࠻ࠬޔ‬ടࠊࠄߥ޿ะ߈ߦ⵾ຠࠍ㈩⟎ߒߡߊߛߐ޿‫ޕ‬ Please make sure not to apply any external stress to resin after mounted as well. When the substrate bends after mounted, the product might be applied by an external stress, and the crack will be generated in the soldering part. Please arrange the product in the direction not stressed for the warp of the substrate after mounted. ԡᧄ⵾ຠታⵝᓟߩၮ᧼ߪⓍߺ㊀ߨߥ޿ߢߊߛߐ޿‫ޕ‬ၮ᧼߇ᧄ⵾ຠ࡟ࡦ࠭ㇱߦⴣ᠄ࠍਈ߃‫࠭ࡦ࡟ޔ‬ㇱߩ்߿ࠢ࡜ ࠶ࠢ‫ࡗࠗࡢޔ‬ᄌᒻ╬ߦࠃࠆਇὐἮߩේ࿃ߦߥࠅ߹ߔ‫ޕ‬ Please do not pile the substrate after this product is mounted. This product will be damaged by the substrate, and it causes the crack of the lens and not lighting by the inner-wire deformation or wiring disconnection. Ԣ ᧄ⵾ຠߪ‫ޔ‬ਅ⸥․ᱶⅣႺߢߩ૶↪ࠍᗧ࿑ߒߚ⸳⸘ߪⴕߞߡ߅ࠅ߹ߖࠎ‫ޕ‬ਅ⸥․ᱶⅣႺߢߩߏ૶↪ߩ㓙ߪ‫ޔ‬ ⾆␠ߦߡᕈ⢻࡮ା㗬ᕈߥߤࠍචಽߏ⏕⹺ߩ਄ߢߏ૶↪ਅߐ޿‫ޕ‬ The products are not designed for the use under any of the following conditions. Please verify their performance and reliability well enough if you use under any of the following conditions; (1) ᳓ಽ‫⚿ޔ‬㔺‫ޔ‬ầ㘑‫ޔ‬⣣㘩ᕈࠟࠬ(Cl‫ޔ‬H2S‫ޔ‬NH3‫ޔ‬SO2‫ޔ‬NOx ߥߤ) ߩᄙ޿႐ᚲߢߩߏ૶↪‫ޕ‬ In a place with a lot of moisture, dew condensation, briny air, and corrosive gas (Cl, H2S, NH3, SO2, NOX, etc.) (2) ⋥኿ᣣశ‫ޔ‬ደᄖ᥸㔺‫ޔ‬Ⴒ၎ਛߢߩߏ૶↪‫ޕ‬ Under the direct sunlight, outdoor exposure, and in a dusty place (3) ᳓‫ޔ‬ᴤ‫⮎ޔ‬ᶧ‫᦭ޔ‬ᯏṁ೷ߥߤߩ㔓࿐᳇ਛߢߩߏ૶↪‫ޕ‬ In water, oil, medical fluid, and organic solvents ԣ ᧄ⵾ຠߩຠ⾰ߦ㑐ߔࠆ଻㓚ߪ‫઀ᧄޔ‬᭽ᦠߦቯ߼ࠆຠ⾰ⷙᩰߦㆡวߔࠆ੐ߦ㒢ቯߐߖߡ㗂߈‫ޔ‬ ࠕ࠮ࡦࡉ࡝෸߮૶↪ⅣႺࠍ฽߼ߚᦨ⚳↪ㅜ߳ߩㆡวᕈߦ㑐ߒߡߪ଻⸽ߔࠆ߽ߩߢߪ޽ࠅ߹ߖࠎ‫ޕ‬ ᦨ⚳⵾ຠߢຠ⾰ߦ⇣Ᏹ߇⊒↢ߒߚ႐วߦߪ‫ޔ‬ਔ⠪ද⼏ߩ਄೎ㅜኻᔕߣ⥌ߒ߹ߔ‫ޕ‬ Guarantee covers the compliance to the quality standards mentioned in the Specifications; however it does not cover the compatibility with application in the end-use, including assembly and usage environment. In case any quality problems occurred in the application of end-use, details will be separately discussed and determined between the parties hereto. Model No. GM2BB50BM0C Doc. No. DG-097015C Page 22/ 23 㪩㪼㪽㪼 6.2 ߪࠎߛઃߌߦߟ޿ߡ Soldering 㫉㪼 㫅 㪺 ᧄ⵾ຠߪ࡝ࡈࡠ࡯ኻᔕߢߔ߇㧔࡝ࡈࡠ࡯࿁ᢙ 2 ࿁߹ߢ㧕ߢߔ߇‫ߪߦࡊ࠶ࠖ࠺ߛࠎߪޔ‬ኻᔕߒߡ ߅ࠅ߹ߖࠎ‫ޕ‬ This product is reflow ready model (within 2 times), but it is not ready for solder dipping. 㪼 6.2.1 ࡝ࡈࡠ࡯ Reflow Ԙ ࡄ࠶ࠤ࡯᷷ࠫᐲ߇ਅ⸥᷷ᐲࡊࡠࡈࠔࠗ࡞ߩ᧦ઙౝߦߥࠆ᭽ߦߏ૶↪ਅߐ޿‫ޕ‬ዏ‫ޔ‬ਅ⸥᷷ᐲࡊࡠࡈࠔ ࠗ࡞ߩ᧦ઙౝߢ޽ߞߡ߽‫ޔ‬ၮ᧼ߩ෻ࠅ࡮ᦛ߇ࠅ╬ߦࠃࠅࡄ࠶ࠤ࡯ࠫߦᔕജ߇ടࠊߞߚ႐ว‫ࠫ࡯ࠤ࠶ࡄޔ‬ ౝㇱߩਇౕวࠍ⺃⊒ߔࠆᕟࠇ߇޽ࠅ߹ߔߩߢ‫ޔ‬ ᓮ␠࡝ࡈࡠ࡯ⵝ⟎ߦ߅޿ߡචಽ⵾ㅧ᧦ઙ⏕⹺ߩ਄ߢߏ૶ ↪ਅߐ޿‫ޕ‬ Package temperature at reflow soldering is defined in the Fig. below. However, even when it is under the profile condition, external stress can damage the internal packages. Please test your reflow method and verify the solderability before use. ԙ ࠕ࡞ࡒⴼ㐿ኽᓟߪ‫ޔ‬಴᧪ࠆߛߌㅦ߿߆ߦߪࠎߛઃߌࠍⴕߞߡਅߐ޿‫ࠍߛࠎߪ࡯ࡠࡈ࡝ޕ‬㧞࿁ⴕߥ߁ ႐วߪ‫ޔ‬㐿ኽᓟ 7 ᣣએౝ(᷷ᐲ 5㨪30͠‫ޔ‬Ḩᐲ 60%RH એਅ)ߦታᣉߒߡਅߐ޿‫ޕ‬ 㧔࡝ࡈࡠ࡯߹ߢߩ㑆ߪ‫ࠍ▤଻ࠬࠢ࠶ࡏࠗ࡜࠼ޔ‬ផᅑߒ߹ߔ‫ޕ‬㧕 Giving the soldering process promptly after opened aluminum package is recommended.Soldering process must be completed including 2ndreflow as repairing within 7 days (Temperature: 5 ͠ to 30 ͠ Relative humidity: 60% or less) after opened.(Storage in a dry box after the first reflow is recommended.) Ԛផᅑߪࠎߛࡍ࡯ࠬ࠻ Recommended solder paste ߪࠎߛࡍ࡯ࠬ࠻㧦M705-221BM5-42-11(ජ૑㊄ዻᎿᬺ(ᩣ)⵾) Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) 㪫㪼㫄㫇㪼㫉㪸㫋㫌㫉㪼㩷㪲㷄㪴 ԛផᅑ᷷ᐲࡊࡠࡈࠔࠗ࡞ Recommended Temperature Profile 㪉㪍㪇㩿㩷㪤㪘㪯㪀 㪈㩷㫋㫆㩷㪋㷄㪆㫊 㪉㪉㪇 㪉㪇㪇 㪈㪌㪇 㪈㩷㫋㫆㩷㪉㪅㪌㷄㪆㫊 㪍㪇㫊㩷㩷㩿㪤㪘㪯㪀 㪍㪇㩷㫋㫆㩷㪈㪉㪇㫊 㪌㫊㩷㩷㩿㪤㪘㪯㪀 㪈㩷㫋㫆㩷㪋㷄㪆㫊 㪉㪌 㪫㫀㫄㪼㩷㪲㫊㪼㪺㫆㫅㪻㪴 ផᅑ᷷ᐲࡊࡠࡈࠔࠗ࡞ࠍឭ␜ߒߡ߅ࠅ߹ߔ߇‫⵾ޔ‬ຠߩຠ⾰଻⼔ߩὑ‫ࠢ࡯ࡇޔ‬᷷ᐲߪૐߊ‫ߩ࡯ࡠࡈ࡝ޔ‬಄ ළᤨ㑆ߪ㐳ߊ‫ޔ‬಄ළ᷷ᐲ൨㈩ߪ಴᧪ࠆߛߌࠁࠆ߿߆ߦߔࠆߎߣࠍ߅൘߼ߒ߹ߔ‫઀ߩ⟎ⵝ࡯ࡠࡈ࡝ߚ߹ޕ‬ ᭽෸߮ၮ᧼ߩᄢ߈ߐ‫ߩ߳ࠬࠗࡃ࠺ޔࠅࠃߦ╬࠻࠙ࠕࠗ࡟ޔ‬ᾲߩવࠊࠅᣇߦᏅ߇಴ࠆน⢻ᕈ߇޽ࠅ߹ߔߩ ߢ‫ޔ‬୘೎ߩ⹏ଔࠍ߅㗿޿ߒ߹ߔ‫ޕ‬ ߹ߚ‫ੌ⚳࡯ࡠࡈ࡝ޔ‬ᓟߦ‫ޔ‬LED ┵ሶ㑆ߩࡈ࡜࠶ࠢࠬਛߦᵴᕈ೷߇ᱷ⇐ߔࠆߣ‫ޔ‬LED േ૞ᤨߩ᷷ᐲ਄᣹ ߦ઻޿‫ޔ‬ᱷ⇐ߒߚᵴᕈ೷߇෻ᔕࠍ⿠ߎߒ‫ޕߔ߹ࠅ޽߇ߣߎࠆߔ↢⊒ࠍࠢ࡯࡝ࠆࠃߦࡦ࡚ࠪ࡯࡟ࠣࠗࡑޔ‬ ታ㓙ߩታⵝ⁁ᘒߢࡑࠗࠣ࡟࡯࡚ࠪࡦ߇⊒↢ߒߥ޿ߎߣࠍߏ⏕⹺ᓟ‫↪૶ߏޔ‬ਅߐ޿‫ޕ‬ In order to secure the product reliability, it is recommended to control the peak temperature and temperature gradient. Moreover, since the thermal conduction to the products depends on the specification of the reflow machine, and the size and layout of the PCBs please test your solder conditions carefully. 㪩㪼㪽㪼 㫉㪼 㫅 㪺 Model No. GM2BB50BM0C Doc. No. DG-097015C Page 23/ 23 㪼 Moreover, after the reflow process, if the activator remains in the flux between anode and cathode, the remaining activator might react during high temperature operation, and the electro-migration is generated and there will be a possibility of a short-circuit. Please use it after confirming the electro-migration is not generated while mounted actual. Ԝ ផᅑࡄ࠲࡯ࡦ Recommended solder pad design ࠬࠢ࡝࡯ࡦශ೚ߩࡔ࠲࡞ࡑࠬࠢߣߒߡߪ‫ޔ‬0.15mm ෘ⒟ᐲࠍផᅑߒ߹ߔ‫᧦࡯ࡠࡈ࡝ࠆࠇߐ↪૶ߏޕ‬ઙ‫ޔ‬ ߪࠎߛࡍ࡯ࠬ࠻߅ࠃ߮ၮ᧼᧚⾰╬ߦࠃࠅ‫ߛࠎߪޔ‬ઃߌᕈ߇ᄌേߔࠆߎߣ߇޽ࠅ߹ߔߩߢ‫ޔ‬ታ૶↪᧦ઙߦ ߡචಽߏ⏕⹺ߩ਄ߢߏ૶↪ਅߐ޿‫ޕ‬ ߹ߚ‫࡞࠲ࡔޔ‬㐿ญㇱߩ㑆㓒߿ࡔ࠲࡞ෘߺߦࠃߞߡߪ‫ࠬࠢ࠶࡜ࡈޔ‬ਛߦᵴᕈ೷߇ᱷ⇐ߒ߿ߔߊߥࠆߎߣ߇ ޽ࠅ‫ޔ‬LED ┵ሶ㑆ߢߩࡑࠗࠣ࡟࡯࡚ࠪࡦߦࠃࠆ࡝࡯ࠢ߇⊒↢ߔࠆน⢻ᕈ߇޽ࠅ߹ߔ‫ޕ‬ታ㓙ߩታⵝ⁁ᘒ ߢ‫⹺⏕ߏࠍߣߎ޿ߥߒ↢⊒߇ࡦ࡚ࠪ࡯࡟ࠣࠗࡑޔ‬ᓟ‫↪૶ߏޔ‬ਅߐ޿‫ޕ‬ We recommend the metal mask of thickness 0.15mm for screen-printing. Solderability depends on the reflow conditions, solder paste, and materials of the PCBs etc. Please test and verify the solderability under the actual solder method. Moreover, it might have a risk of short-circuit (leakage) with the electro-migration by the remining activator in the flux. Please make a suitable selection and test of the metal mask in terms of pitch size and thikness before mass production.          (න૏ Unit : mm)  ԝ ࡝ࡈࡠ࡯ᓟߩో㕙ⵣ㕙࠺ࠖ࠶ࡊ Precautions for PCB backside dip process ⸳⸘ߦߡ࡝ࡈࡠ࡯㕙ߩⵣ㕙ࠍ࠺ࠖ࠶ࡊߔࠆ႐วߪ‫ޔ‬ ၮ᧼ⵣ㕙஥ߩ࠺ࠖ࠶ࡊᤨߩᾲ෸߮ၮ᧼ߩ෻ࠅ╬ߦࠃ ࠅ‫ࠫ࡯ࠤ࠶ࡄޔ‬ౝㇱߩਇౕวࠍ⺃⊒ߔࠆᕟࠇ߇޽ࠅ߹ߔߩߢ‫ޔ‬ᓮ␠ߩ⵾ㅧ᧦ઙߦߡ‫ޔ‬లಽߏ⏕⹺޿ߚߛ ޿ߚ਄‫↪૶ߏޔ‬ਅߐ޿‫ੌ⚳࡯ࡠࡈ࡝ޔߚ߹ޕ‬ᓟߪߢ߈ࠆߛߌㅦ߿߆ߦⵣ㕙࠺ࠖ࠶ࡊಣℂࠍⴕߥߞߡਅߐ ޿‫ⵣߌߛࠆ߈ߢޕ‬㕙࠺ࠖ࠶ࡊታᣉᓟ‫⵾ᧄޔ‬ຠߩ࡝ࡈࡠ࡯ಣℂࠍ߅㗿޿ߒ߹ߔ‫ޕ‬ Please verify your conditions carefully in giving the dip process on the backside of the PCBs, since the warped boards caused by heat and heat itself affect the inside of the package. It is recommended to give the reflow process after dip process. Though it is also available to give the reflow process before the dip process, the interval of the two processes should be as short as possible. 6.3 ᵞᵺߦߟ޿ߡ Cleaning ࡮ ᵞᵺߦࠃࠅࡄ࠶ࠤ࡯ࠫ෸߮᮸⢽߇ଚߐࠇࠆᕟࠇ߇ߏߑ޿߹ߔߩߢ‫ޔ‬ၮᧄ⊛ߦߪήᵞᵺ࠲ࠗࡊߩߪࠎߛࠍ૶ ↪ߒ‫ޔ‬ᵞᵺߪⴕߥࠊߥ޿ߢਅߐ޿‫ޕ‬ Avoid cleaning the PCBs, since packages and resin are eroded by cleaning. Please use the soldering paste without need of cleaning. ࡮ ⿥㖸ᵄᵞᵺߪⴕߥࠊߥ޿ߢਅߐ޿‫ޕ‬ Avoid ultrasonic cleaning.