Leadless Chip LED
GM5❏❏95200A series
3528 Size, 1.9mm Thickness,
Leadless Chip LED
GM5❏❏95200A series
■ Outline Dimensions
■ Radiation Diagram
(Unit : mm)
(Ta=25˚C)
3.5
3.2
2.4
2.8
2.2
-20˚
Cathode mark
Relative luminous intensity(%)
0.7
-40˚
Recommended PWB pattern for soldering
Device center
2.6
0.5
0.7
0.8
1.5
1.5
-60˚
0.15
4.5
0.1
1.9
0
+20˚
100
Anode
1.5
+40˚
80
60
+60˚
40
20
Cathode
-80˚
1. Pin connections
1Cathode
2Anode
1
+80˚
0
2
2.Unspecified tolerance: ±0.3
GM5UR95200A: polarity inversion type
■ Absolute Maximum Ratings
Model No. Radiation color Radiation material
GM5UR95200A
GM5HD95200A
GM5HY95200A
GM5EG95200A
Red(Super-luminosity)
Red
Yellow
Yellow-green
GaAlAs on GaAlAs
GaAsP on GaP
GaAsP on GaP
GaP
(Ta=25˚C)
Power dissipation Forward current Peak forward current
P
IF
IFM*1
(mW)
(mA)
(mA)
75
85
84
84
30
30
30
30
50
50
50
50
Derating factor Reverse voltage Operating temperature Storage temperature Soldering temperature
(mA/˚C)
VR
Topr
Tstg
Tsol*2
(V)
(˚C)
(˚C)
(˚C)
DC Pulse
0.40
0.40
0.35
0.40
0.67
0.67
0.59
0.67
4
5
5
5
-55 to +110
-55 to +110
-55 to +110
-55 to +110
-55 to +110
-55 to +110
-55 to +110
-55 to +110
295
295
295
295
*1 Duty ratio=1/10, Pulse width=0.1ms
*2 For 3s or less at the temperature of hand soldering. Temperature of reflow soldering is shown on the page 7.
■ Electro-optical Characteristics
Lens type
Model No.
GM5UR95200A
Colorless GM5HD95200A
transparency GM5HY95200A
GM5EG95200A
122
Notice
Internet
Forward voltage
VF(V)
TYP
1.85
2.0
2.0
2.1
MAX
2.5
2.8
2.8
2.8
(IF=20mA,Ta=25˚C)
Peak emission
wavelength
λp(nm)
TYP
660
635
585
565
Luminous
intensity
IV(mcd)
TYP
80
13.8
20
18.1
Spectrum radiation
bandwidth
∆λ(nm)
TYP
20
35
30
30
Reverse current
VR
(V)
IR(µA)
MAX
10
10
10
10
4
4
4
4
Terminal capacitance
Ct(pF)
TYP
25
20
35
35
(MHZ)
1
1
1
1
Page for
characteristics
diagrams
145
147
148
148
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
LED Lamp
Characteristics Diagrams
ZG series
Forward Current Derating Curve
Forward Current vs. Forward Voltage(Note)
Luminous Intensity vs. Ambient Temperature(Note)
(Ta=25˚C)
100
60
(1F=20mA)
1000
50
500
30
20
10
5.0
1.0
0.5
100
50
LED Lamp
40
Relative luminous intensity(%)
Forward current IF(mA)
Forward current IF(mA)
50
5.0
10
0
-40
0
25
50
75 85
00
0.1
1.0
125
10
1.2
1.4
Ambient temperature Ta(˚C)
1.6
1.8
2.0
2.2
2.4
2.6
-40
-20
Forward voltage VF(V)
Luminous Intensity vs. Forward Current(Note)
Peak Forward Current Derating Curve
20
40
60
80
100
Duty Ratio vs. Peak Forward Current
(Ta=25˚C)
1000
120
0
Ambient temperature Ta(˚C)
(Ta=25˚C)
500
500
200
200
80
60
40
Peak forward current IF(mA)
Relative luminous intensity(%)
Peak forward current IFM(mA)
100
100
50
20
10
100
50
20
10
5.0
5.0
2.0
2.0
20
0
-40
0
25
50
75 85
100
1.0
0.1
125
1
0.2
0.5
1
2
5
10
20
50
1/50
1/20 1/10
Forward current IF(mA)
Ambient temperature Ta(˚C)
1/5
1/2
1
Duty ratio DR
UR,U series
Forward Current Derating Curve
Forward Current vs. Forward Voltage(Note)
60
Luminous Intensity vs. Ambient Temperature(Note)
(Ta=25˚C)
100
(Ta=25˚C)
1000
50
500
40
30
20
Relative luminous intensity(%)
Forward current IF(mA)
Forward current IF(mA)
50
10
5.0
1.0
0.5
100
50
10
5.0
10
0
-25
0
25
50
75 85
100
0.1
1.0
125
1.0
1.2
1.4
Ambient temperature Ta(˚C)
1.6
1.8
2.0
2.2
2.4
2.6
-20
0
Forward voltage VF(V)
Luminous Intensity vs. Forward Current(Note)
Peak Forward Current Derating Curve
40
60
80
100
120
Duty Ratio vs. Peak Forward Current
(Ta=25˚C)
1000
60
20
Ambient temperature Ta(˚C)
(Ta=25˚C)
500
500
200
200
40
30
20
Peak forward current IFM(mA)
Relative luminous intensity(%)
Peak forward current IFM(mA)
50
100
50
20
10
5.0
100
50
20
10
5.0
10
2.0
0
-25
0
25
50
75 85
Ambient temperature Ta(˚C)
100
125
1.0
0.1
2.0
1.0
0.2
0.5
1
2
5
10
20
Forward current IF(mA)
50
1/50
1/20 1/10
1/5
1/2
1
Duty ratio DR
Note)Characteristics shown in diagrams are typical values. (not assurance value)
Notice
Internet
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
145
LED Lamp
Characteristics Diagrams
HD,D series
Forward Current vs. Forward Voltage(Note)
Forward Current Derating Curve
Luminous Intensity vs. Ambient Temperature(Note)
(Ta=25˚C)
100
60
(Ta=25˚C)
1000
50
500
30
20
10
5.0
1.0
0.5
100
50
LED Lamp
40
Relative luminous intensity(%)
Forward current IF(mA)
Forward current IF(mA)
50
10
5.0
10
0
-25
0
25
50
75 85
100
0.1
1.0
125
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
-20
0
20
Forward voltage VF(V)
Ambient temperature Ta(˚C)
80
100
120
(Ta=25˚C)
(Ta=25˚C)
1000
60
60
Duty Ratio vs. Peak Forward Current
Luminous Intensity vs. Forward Current(Note)
Peak Forward Current Derating Curve
40
Ambient temperature Ta(˚C)
500
500
200
200
40
30
20
Peak forward current IFM(mA)
Relative luminous intensity(%)
Peak forward current IFM(mA)
50
100
50
20
10
5.0
100
50
20
10
5.0
10
2.0
2.0
0
-25
0
25
50
75 85
100
1.0
0.1
125
1.0
0.2
0.5
1
2
5
10
20
1/50
50
1/20 1/10
1/5
1/2
1
Duty ratio DR
Forward current IF(mA)
Ambient temperature Ta(˚C)
HS,S series
Forward Current Derating Curve
Forward Current vs. Forward Voltage(Note)
60
Luminous Intensity vs. Ambient Temperature(Note)
(Ta=25˚C)
100
50
500
30
20
Relative luminous intensity(%)
Forward current IF(mA)
Forward current IF(mA)
50
40
20
10
5
3
2
10
0
25
50
75 85
100
0.5
1.0
125
200
100
50
20
1
0
-25
(IF=20mA)
1000
10
1.2
1.4
Ambient temperature Ta(˚C)
1.6
1.8
2.0
2.2
2.4
-20
0
Forward voltage VF(V)
60
500
50
200
40
60
80
100
Duty Ratio vs. Peak Forward Current
Luminous Intensity vs. Forward Current(Note)
Peak Forward Current Derating Curve
20
Ambient temperature Ta(˚C)
(Ta=25˚C)
(Ta=25˚C)
500
40
30
20
100
Peak forward current IF(mA)
Relative luminous intensity(%)
Peak forward current IFM(mA)
300
50
20
10
5
10
0
25
50
75 85
Ambient temperature Ta(˚C)
100
125
1
0.1
50
30
10
2
0
-25
100
5
0.2
0.5
1
2
5
10
20
Forward current IF(mA)
50
1/50
1/20
1/10
1/5
1/2
1
Duty ratio DR
Note)Characteristics shown in diagrams are typical values. (not assurance value)
Notice
Internet
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
147
LED Lamp
Characteristics Diagrams
HY,H series
Forward Current Derating Curve
Forward Current vs. Forward Voltage(Note)
60
Luminous Intensity vs. Ambient Temperature(Note)
(Ta=25˚C)
100
(Ta=25˚C)
1000
50
500
40
30
20
Relative luminous intensity(%)
Forward current IF(mA)
Forward current IF(mA)
50
10
5.0
1.0
0.5
100
50
10
5.0
10
0
-25
0
25
50
75 85
100
0.1
1.0
125
1.0
1.2
1.4
Ambient temperature Ta(˚C)
1.6
1.8
2.0
2.2
2.4
2.6
-20
0
Forward voltage VF(V)
60
80
100
120
(Ta=25˚C)
(Ta=25˚C)
1000
60
40
Duty Ratio vs. Peak Forward Current
Luminous Intensity vs. Forward Current(Note)
Peak Forward Current Derating Curve
20
Ambient temperature Ta(˚C)
500
500
200
200
40
30
20
Peak forward current IFM(mA)
Relative luminous intensity(%)
Peak forward current IFM(mA)
50
100
50
20
10
5.0
100
50
20
10
5.0
10
2.0
2.0
0
-25
0
25
50
75 85
100
1.0
0.1
125
1.0
0.2
0.5
1
2
5
10
20
1/50
50
1/20 1/10
1/5
1/2
1
Duty ratio DR
Forward current IF(mA)
Ambient temperature Ta(˚C)
EG,E series
Forward Current vs. Forward Voltage(Note)
Forward Current Derating Curve
Luminous Intensity vs. Ambient Temperature(Note)
(Ta=25˚C)
100
60
(Ta=25˚C)
1000
50
500
40
30
20
Relative luminous intensity(%)
Forward current IF(mA)
Forward current IF(mA)
50
10
5.0
1.0
0.5
100
50
10
5.0
10
0
-25
0
25
50
75 85
100
0.1
1.0
125
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
-20
0
Forward voltage VF(V)
Ambient temperature Ta(˚C)
Peak Forward Current Derating Curve
40
60
80
100
120
Duty Ratio vs. Peak Forward Current
Luminous Intensity vs. Forward Current(Note)
60
20
Ambient temperature Ta(˚C)
(Ta=25˚C)
(Ta=25˚C)
1000
500
500
200
200
40
30
20
Peak forward current IFM(mA)
Relative luminous intensity(%)
Peak forward current IFM(mA)
50
100
50
20
10
5.0
100
50
20
10
5.0
10
2.0
2.0
0
-25
0
25
50
75 85
Ambient temperature Ta(˚C)
100
125
1.0
0.1
1.0
0.2
0.5
1
2
5
10
20
Forward current IF(mA)
50
1/50
1/20 1/10
1/5
1/2
1
Duty ratio DR
Note)Characteristics shown in diagrams are typical values. (not assurance value)
148
Notice
Internet
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
■ Cleaning
E: Chip LED Device Type
■ Mounting to a PWB
Design the product so that the devices will not be mounted in the same direction
as the warp of the PWB.
Not acceptable
Acceptable
Conditions
300˚C ± 5˚C within 5 seconds
™
™
×
×
×
(2) Cleaning Methods
Cleaning Method
Solvent cleaning
™
Remarks
Immersion up to one minute at room temperature
v
Preheating 100˚C to 150˚C within 2 minutes
Soldering 245˚C ± 5˚C within 5 seconds
Gradual cooling (Avoid quenching)
Usable
Test the cleaning under actual conditions and
check for abnormalities before actual use.
Within 5 s
245
Ultrasonic cleaning
200
150
™ : Acceptable
: Acceptability depends on device type and conditions
(Notes)¡The affect on the device from ultrasonic cleaning differs depending on the size
of the cleaning bath, ultrasonic output, duration, board size and device mounting
method. Test the cleaning method under actual conditions and check for
abnormalities before actual use.
¡Please contact our representative before using a cleaning solvent or method not
given above.
¡Since the device is very small, it may be damaged by excessive stress. So, pay
special attention to the transport method and handling.
v
Temperature(˚C)
Usable
™ : Acceptable
× : Not acceptable
(Notes)¡There is a world-wide movement to restrict the use of chrolofluorocarbon (CFC)
based solvents and we recommend that you avoid their use. However, before
using a CFC substitute solvent, carefully check that it will not penetrate the
package resin.
Solder the lead pins under the following conditions.
2. Reflow soldering
(1) Solvents
The package resin may be penetrated by solvents used in cleaning. Refer to the
table below for usable solvents.
Solvent
Ethyl alcohol
Isopropyl alcohol
Chlorosen
Acetone
Trichloroethylene
■ Soldering Conditions
Type of Soldering
1. Manual soldering
General Description
General Description of Light Emitting Diodes
100
0
Within 2 min.
30 s
¡In manual soldering, do not move the lead pins with the soldering edge.
¡Avoid applying excessive solder reinforcement.
¡In using surface mount type numeric LEDs, please refer to the specification
sheet because conditions shall be changed.
,
,,,
,
,
,,
,,,
,
,,
Not acceptable
Acceptable
¡Do not try to correct the position of the devices after soldering.
¡Do not warp PWB after soldering.
Not acceptable
Notice
Internet
Not acceptable
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
7
■ Leadless Chip LED(Unit : mm)
1.55
4.0
0.2
3.2
Cathode
4.0
0.2
1.5
0.1
1.2
LT1❏40A series 4 000 pcs. /reel
4.0
0.2
3.5
8.0
4.0
LT1❏67A series 4 000 pcs. /reel
4.0
1.5
4.0
0.2
1.5
1.75
1.75
1.5
2.0
Cathode
4.0
LT1Z❏95 series
5.5
8.0
1.9
3.8
2.0
Anode
4.0
2.3
0.25
5.5
3.5
3.5
8.0
0.1
2.0
Cathode
1.0
1.75
0.1
5.5
2.3
1.55
1.2
1.75
1.75
1.5
1.75
0.3
4.0
3.5
8.0
3.5
8.0
1.9
5.5
1.9
5.5
1.9
8.0
1.0
5.5
3.9
yy
,,
3.5
2.9
0.1
2.0
LT1❏90A series 3 000 pcs. / reel
Cathode
0.1
1.2
4.0
LT1❏97A series 5 000 pcs. / reel
4.0
1.75
4.5
4.0
8.0
3.5
5.5
3.4
0.8
0.6
0.4
3.3
ø60
ø178
2.0
0.8
0.6
0.4
1.5
2.0
Cathode
LT1❏❏67A series/LT1W67A 4 000 pcs. /reel
0.2
yy,y
,,
0.25
2.0
0.1
1.2
4.0
ø13
Cathode
0.2
1.9
0.1
1.9
2.0
Cathode
4.0
Label
1.5
10
LT1❏❏90A series 3 000 pcs. / reel
154
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In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
Application Circuits
NOTICE
●The circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
●Observe the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
●If the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
●Contact and consult with a SHARP representative if there are any questions about the contents of this
publication.
115
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