GP1A057SGKLF

GP1A057SGKLF GP1A057SGKLF Case Type With Encoder Function Digital 2 Output (A Phase / B Phase) Transmissive Photointerrupter ■Description ■Agency approvals/Compliance GP1A057SGKLF is a transmissive photointerrupter with digital 2 output (phase A/B) encoder function. Using this with a linear scale (or rotation disk) that forms a slit pattern, this product detects the movement (rotation) direction and the amount of movement (number of revolutions, rotation angle). 1. Compliant with RoHS directive (2002/95/EC) ■Applications 1. Detects direction of movement, the amount of movement, rotation angle of equipment and device that move horizontally or rotate. Example : printer, copier, robot, motor control, etc. ■Features 1. Transmissive Photointerrupter 2. Case type, with encoder function 3. Output signal : Digital 2 output (A Phase / B Phase) 4. Resolution : Linear scale slit pitch 0.56 [mm] (45LPI) 5. Package : 12.2×7.4×8.27mm Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: OP13023EN 1 GP1A057SGKLF ■Outline Drawing No.CY14112i02 Scale : 2/1 Unit : mm Sheet No.: OP13023EN 2 GP1A057SGKLF ■Block diagram PD4 Vcc Comparator 10kΩ Amp. Amp. PD2 Anode VoB － ＋ Amp. 10kΩ PD3 Comparator Amp. Cathode Amp. PD1 VoA ＋ － Amp. GND Supply voltage VCC=2.7 to 5.5V ■Absolute maximum ratings Parameter Input Output Ta=25°C Unit Symbol Rating IF 30 mA Reverse voltage VR 4 V Supply voltage Vcc 6 V Low level output current IOL 8 mA Power dissipation Po 150 mW Operating temperature Topr -10 to +70 °C Storage temperature Tstg -40 to +80 °C Forward current *1 *1 Soldering temperature *2 Tsol 260 °C *1 The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1, 2. *2 Soldering time : 5s or less Sheet No.: OP13023EN 3 GP1A057SGKLF ■Electro-optical characteristics Ta=25°C Transfer characteristics *1 Output Input Parameter Symbol Conditions MIN. TYP. MAX. Unit Forward voltage VF IF=20mA - 2.1 2.6 V Reverse current IR VR=1V - - 100 μA 2.7 3.3 5.5 V Operating supply voltage range VCC - Low level output voltage VOL Vcc=3.3V, IF=20mA IOL=8mA - - 0.4 V High level output voltage VOH Vcc=3.3V, IF=20mA 2.4 3.2 - V Supply current ICC Vcc=3.3V, IF=20mA Phases A and B both at low level - 2.2 5.5 mA 35 50 65 % 45 90 135 ° - 1.0 2.0 - 1.0 2.0 - - 25 DA Duty DB θAB1 to 4 Phase difference tr Response Vcc=3.3V IF=20mA f=2.5kHz 0.1mm＜Z≦1.35mm *2 tf Response frequency fmax Vcc=3.3V, IF=20mA 0.1mm＜Z≦1.35mm *2 μs kHz *1 The test condition is according to Fig.3 (CY14439i06) And transfer characteristics value does not include any error of code-wheel (Liner scale). The error of slit-pattern shall not be included. *2 Z stands for distance between code-wheel (Liner scale) surface (patterned surface) and detector holder surface, and patterned surface shall be arranged face to face with detector holder surface. The code-wheel (Liner scale) shall not contact with the holder surface. Note: It is recommended that the GP1A057SGKLF be used under the condition of typical IF=20mA for which it is designed. ■Output waveform tAP tAH A output θAB1 θAB2 θAB3 θAB4 B output tBH tBP ＤＡ＝ tAH tAP ×100 ＤＢ＝ tBH tBP ×100 Refer to note 1 in Fig.3 (CY14439i06) for the rotation direction of code-wheel (Liner scale). 90% A, B output 90% 10% 10% tr tf Sheet No.: OP13023EN 4 GP1A057SGKLF Fig.1 Forward current vs. ambient temperature Forward current IF (mA) 80 60 40 30 20 0 -10 0 20 25 40 60 70 80 100 Ambient temperature Ta (°C) Output power dissipation Po (mW) Fig.2 Output power dissipation vs. ambient temperature 150 100 60 50 0 -10 0 20 25 40 Ambient temperature 60 70 80 100 Ta (°C) Sheet No.: OP13023EN 5 GP1A057SGKLF Fig.3 GP1A057SGKLF Test Condition (Drawing No.CY14439i06) Scale : Free Unit : 1/1mm Sheet No.: OP13023EN 6 GP1A057SGKLF ■Supplements ●Parts Refer to the attached sheet, Page 9. ●Packing Refer to the attached drawing No. CY14440i09A, Page 10. ●ODS materials This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFCS, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methyl chloroform) ●Specified brominated flame retardants Specified brominated flame retardants (PBB and PBDE) are not used in this device at all. ●Compliance with each regulation 1) The RoHS directive(2002/95/EC) This product complies with the RoHS directive(2002/95/EC) Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) 2) Content of six substances specified in Management Method for Control of Pollution Caused by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法). Toxic and hazardous substances Hexavalent Polybrominated Polybrominated Category Lead Mercury Cadmium chromium biphenyls diphenyl ethers (Pb) (Hg) (Cd) (Cr6+) (PBB) (PBDE) Photointerrupter ✓ ✓ ✓ ✓ ✓ ✓ ✓: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard. ●Product mass : Approximately 0.6g ●Country of origin : Japan, China, Indonesia Sheet No.: OP13023EN 7 GP1A057SGKLF ■Notes ●The recommendation conditions of forward current: This product is designed in consideration of using this product under the condition of typical I F=20mA as a standard. ●In order to stabilize power supply line, it is recommended to have a by-pass capacitor of 0.1μF or more between Vcc and GND near the device. ●Lens is made from resin, as to cleaning, this photointerrupter should not be cleaned by cleaning materials absolutely. (Dust and stain shall be cleaned by air blow.) ●Soldering To solder onto lead pins, please solder at 260°C for 5s or less with longer distance than 1.6mm from the bottom surface of the package. Please take care not to let any external force exert on lead pins when soldering or just after soldering. Please don't do soldering by reflow. ●OPIC chip due to micro design is easily affected by the Electro static discharge. At operating, in order to prevent the destruction and the defect of characteristics by Electro static discharge, please take a general countermeasure of the Electro static discharge. ●Prevention of malfunction For this product, the transparent material is used as the case material . Before using this product, please confirm the following items with the actual equipment. 1) The product does not malfunction by the ambient light illuminating the photo-detector surface. 2) Other equipment is not affected by the light leaking from the light-emitting device. ●Storage and usage environment Polycarbonate is used as the case material of this product. If polycarbonate contacts with the hot liquid and the alkaline solution (alkaline atmosphere), polycarbonate is hydrolyzed. Therefore, please do not store and use this product in such an environment. Sheet No.: OP13023EN 8 GP1A057SGKLF ■Parts This product uses the below parts. ●Light detector (Quantity : 1) (Using a silicon photodiode as light detecting portion, and a bipolar IC as signal processing circuit.) Type Maximum sensitivity wavelength (nm) Sensitivity wavelength (nm) Response time (μs) Photodiode 780 400 to 1200 40 ●Light emitter (Quantity : 1) Type Material Maximum light emitting wavelength (nm) Light emitting diode (Non-coherent) A1GaInP /GaAs 652 ●Material Holder integrated with Lens Lead flame finish Transparent polycarbonate resin Solder dip (Sn-Ag-Cu) ●Others This product shall not be radiation flux proof. Laser generator is not used. Sheet No.: OP13023EN 9 GP1A057SGKLF ■Packing (Drawing No.:CY14440i09A) Sheet No.: OP13023EN 10 GP1A057SGKLF ■Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: OP13023EN 11