GP1S25

GP1S25 GP1S25 Side Lead Type Ultra-compact Photointerrupter ■ Features ■ Outline Dimensions (Unit : mm) 2. Conforming to solder reflow Pre-heat : 160 ˚C, MAX. 120 sec Reflow : 200 ˚C, MAX. 60 sec 4 3 2 1 a-a section (0.3) Slit width 0.6 4.0 3.0 ■ Applications 1. CD-ROM drives 2. FDDs 3.4 1.0 1.6 1.25 Optical center S4 5.2 (0.85) 4. Gap : 1.6 mm + 0.2 0.1 (C0.3) 1 2 3 4 ■ Absolute Maximum Ratings Output *1 Soldering time : For 3 seconds (hand soldering) 6 φ 0.8 0.4 ❈ 0.87 Input Gate position (C0.3) 0.15 - Parameter Forward current Reverse voltage Power dissipation Collector-emitter voltage Emitter-collector voltage Collector current Collector power dissipation Total power dissipation Operating temperature Storage temperature *1 Soldering temperature Anode Collector Emitter Cathode a 3. Slit : 0.3 mm 1 2 3 4 (1) 240 ˚C, MAX. 10 sec ) Circuit diagram: Top View 2.5 ( Top View a 1. Side lead ultra-compact transmission type 1 2 3 4 * Tolerance : ± 0.2 mm * ( ) : Connector dimensions for reference * The dimensions indicated by ❈ refer to those measured from the lead base. * Dimensions shown do not include burr. Burr's dimension : 0.15 MAX. Rest of gate : 0.3 MAX. (Ta=25˚C) Symbol IF VR P V CEO V ECO IC PC P tot T opr T stg T sol Rating 50 6 75 35 6 20 75 100 - 25 to + 85 - 40 to + 100 260 ❈ 0.87 ❈ 0.8 Unit mA V mW V V mA mW mW ˚C ˚C ˚C GP1S25 ■ Electro-optical Characteristics Input Output Transfer characteristics (Ta=25 ˚C) Parameter Forward voltage Reverse current Dark current Collector current Collector-emitter saturation voltage Rise time Response time Fall time Symbol VF IR I CEO IC V CE(sat) tr tf MIN. 50 - TYP. 1.2 35 35 MAX. 1.4 10 100 300 0.4 100 100 60 120 50 100 40 30 20 10 Total power dissipation Input side power dissipation and 80 output side collector power dissipation 60 40 20 0 - 25 0 25 50 75 85 0 - 25 100 0 25 50 75 85 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Fig. 3 Forward Current vs. Forward Voltage Fig. 4 Collector Current vs. Forward Current 500 Ta= 75˚C 50˚C 100 VCE =5V Ta =25˚C 2.0 25˚C 0˚C - 25˚C Collector current I C (mA ) 200 Forward current I F (mA) Unit V µA nA µA V µs µs Fig. 2 Power dissipation vs. Ambient Temperature Power dissipation P (mW) Forward current I F (mA) Fig. 1 Forward Current vs. Ambient Temperature Conditions I F = 20mA V R = 3V V CE = 20V V CE = 5V, IF = 5mA I F = 10mA, I C = 50 µ A VCE = 5V, IC = 100 µ A R L = 1 000 Ω 50 20 10 5 1.6 1.2 0.8 0.4 2 1 0 0.5 1 1.5 2 Forward voltage V F (V) 2.5 3 0 0 4 8 12 Forward current IF (mA ) 16 20 GP1S25 Fig. 5 Collector Current vs. Collector-emitter Voltage Fig. 6 Relative Collector Current vs. Ambient Temperature 120 3.0 IF=5mA VCE=5V 110 Collector current I C (mA ) Collector current I C (mA ) 100 2.4 IF=50mA 1.8 40mA 30mA 1.2 20mA 0.6 0 90 80 70 60 50 40 30 20 10mA 5mA 0 2 4 6 8 10 0 - 25 10 0 Collector-emitter voltage VCE (V ) 75 85 Fig. 8 Dark Current vs. Ambient Temperature 0.20 10 VF =10mA IC =40µ A -6 VCE= 20V 5 2 10 0.14 0.12 0.10 0.08 -7 5 CEO (A) 0.16 Dark current I Collector-emitter saturation voltage VCE(sat) (V ) 50 Ambient temperature Ta (˚C) Fig. 7 Collector-emitter Saturation Voltage vs. Ambient Temperature 0.18 25 2 10 -8 5 2 10 -9 5 0.06 2 - 25 0 25 50 10 75 85 - 10 0 25 50 75 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Fig. 9 Response Time vs. Load Resistance 1000 VCE =5V 500 IC =100µ A Test Circuit for Response Time tr Response time (µs) tf 100 Input VCC 50 Input RD RL Output td ts Output 10% 90% 10 td 5 ts tr 0.1 1 5 10 50 100 Load resistance R L (kΩ ) 1000 tf GP1S25 Fig. 10 Detecting Position Characteristics (1) L=0 L 80 70 60 50 40 30 20 80 L=0 70 60 50 40 30 20 10 10 0 0 IF =5mA VCE =5V 90 Relative collector current (%) Relative collector current (%) 100 IF =5mA VCE =5V 90 L 100 Fig. 11 Detecting Position Characteristics (2) 0.5 1 1.5 2 2.5 Shield distance L (mm) ● Please refer to the chapter "Precautions for Use". 0 0 0.5 1 1.5 Shield distance L (mm) 2 Application Circuits NOTICE ●The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. ●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. ●Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). ●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. ●If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. ●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. ●Contact and consult with a SHARP representative if there are any questions about the contents of this publication. 115