GP2L26

GP2L09/GP2L24/GP2L26 GP2L09/GP2L24 GP2L26 s Features 1. Compact and thin GP2L09 : Compact DIP, long lead type GP2L24 : Compact DIP type GP2L26 : Flat lead type 2. Optimum detection distance: 0.6 to 0.8mm 3. High sensitivity ( IC: MIN. 0.5mA at I F = 4mA ) 4. Visible light cut-off type Subminiature, High Sensitivity Photointerrupter s Applications 1. Cassette tape recorders, VCRs 2. Floppy disk drives 3. Various microcomputerized control equipment s Outline Dimensions ( 0.4 ) Detector center ( 0.2 ) Emitter center ( 0.2 ) Emitter center ( 0.4 ) Detector center GP2L09 GP2L24 ( Unit : mm ) 4 3 C0.7 1 1.75 2 ∗Tolerance :± 0.15mm ∗( ): Reference dimensions ∗The dimensions indicated by g refer to those measured from the lead base. g 4.0 ± 0.2 3.0 + 0.2 - 0.1 4 3 C0.7 1 1.75 2 ∗Tolerance :± 0.15mm ∗( ) : Reference dimensions ∗The dimensions indicated by g refer to those measured from the lead base. g 4.0 ± 0.2 + 3.0 - 0.2 0.1 12.5 ± 1.0 1.7 ± 0.15 4.0 + 0.2 - 0.1 4.0 + 0.2 - 0.1 0.75 1.7 4 - (0.6) 4 - 0.5 + 0.2 - 0.1 0.8 4 - 0.2+ 0.3 -0 (4.0) θ θ : 0 to 20 ˚ 4 - 0.4 + 0.2 - 0.1 4 - 0.15 + 0.2 - 0.1 (4.0) ± 15˚ θ θ : 0 to 20 ˚ ± 15˚ GP2L26 ( 0.2 ) Emitter center ( 0.4 ) Detector center Internal connection diagram (Common to 3 models ) 4 3 1.75 4 3 C0.7 1 2 ± 20 ˚ 4.0 + 0.2 - 0.1 + 0.2 0.1 ∗Tolerance :± 0.15mm ∗( ): Reference dimensions 0.15 - 3.0 - + 0.2 0.1 1 2 1 2 3 4 Anode Emitter Collector Cathode 0.75 1.7 0.4 + 0.2 - 0.1 13.0 ± 1.0 “ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.” ± 30 ˚ 3.5 - 1.0 0 + GP2L09/GP2L24/GP2L26 s Absolute Maximum Ratings Parameter Forward current Reverse voltage Power dissipation Collector-emitter voltage Emitter-collector voltage Collector current Collector power dissipation Total power dissipation Operating temperature Storage temperature ∗1 Soldering temperature Symbol IF VR P V CEO V ECO IC PC P tot T opr T stg T sol Rating 50 6 75 35 6 50 75 100 - 25 to + 85 - 40 to + 100 260 ( Ta = 25˚C ) Unit mA V mW V V mA mW mW ˚C ˚C ˚C Input Output ∗1 Within 5 seconds ( Soldering areas for each model are shown below. ) GP2L09 , GP2L24 Soldering area The hatched area more than 1mm∗2 away from the lower edge of package as shown in the drawing below. GP2L26 Soldering area The hatched area more than 2.0mm away from the both edge of package as shown in the drawing below. ∗2 GP2L09 : 4mm 1mm∗2 2.0mm 2.0mm s Electro-optical Characteristics Input Output Transfercharacteristics Parameter Forward voltage Reverse current Collector dark current ∗3 Collector current Response time ∗4 ( Ta = 25˚C ) Symbol IF IR I CEO IC tr tf I LEAK Conditions I F = 20mA V R = 6V V CE = 10V, I F = 0 V CE = 2V, I F = 4mA V CE = 2V, I C = 10mA R L = 100Ω , d = 1mm I F = 4mA, V CE = 5V MIN. 0.5 TYP. MAX. 1.2 1.4 10 1x 10 - 6 3.0 15.0 80 400 70 400 5.0 Unit V µA A mA µs µs µA Rise time Fall time Leak current ∗3 The condition and arrangement of the reflective object are shown in the right drawing. ∗4 Without reflective object The ranking of collector current shall be classified into the following 6 ranks. (GP2L09 , GP2L24 , GP2L26) Rank A B C A or B B or C A, B or C ∗5 Collector current I C ( mA ) 0.5 to 1.9 1.45 to 5.4 4.0 to 15.0 0.5 to 5.4 1.45 to 15.0 0.5 to 15.0 Test Condition for Collector Current Al evaporation 1mm-thick glass ∗5 GP2L24 and GP2L26 don't have A rank. GP2L09/GP2L24/GP2L26 Fig. 1 Forward Current vs. Ambient Temperature 60 50 Forward current I F ( mA ) Power dissipation P ( mW ) Fig. 2 Power Dissipation vs. Ambient Temperature 120 P tot 100 80 75 60 P, P 40 C 30 20 10 0 - 25 40 20 0 - 25 0 25 50 Ambient temperature T a 75 85 ( ˚C ) 100 0 25 50 75 85 Ambient temperature T a ( ˚C ) 100 Fig. 3 Peak Forward Current vs. Duty Ratio 2000 Peak forward current I FM ( mA ) 1000 500 Pulse width