GP2S27ABJ00F

GP2S27J0000F Series GP2S27J0000F Series SMT, Detecting Distance : 0.7mm Phototransistor Output, Compact Reflective Photointerrupter ■ Description GP2S27J0000F Series is a compact-package, phototransistor output, reflective photointerrupter, with emitter and detector facing the same direction in a molding that provides non-contact sensing. The compact package series is a result of unique technology, combing transfer and injection molding, that also blocks visible light to minimize false detection. This photointerrupter can be ordered in different CTR ranks, and comes in a surface-mount, gullwing lead package, suitable for reflow soldering. ■ Agency approvals/Compliance 1. Compliant with RoHS directive ■ Applications 1. Detection of object presence or motion. 2. Example : printer, optical storage ■ Features 1. Reflective with Phototransistor Output 2. Highlights : • Compact Size • Surface Mount Type (SMT), reflow soldering, with gullwing leads • Optional Tape and Reel (T&R) 1 000 pcs per reel 3. Key Parameters : • Optimal Sensing Distance : 0.7mm • Package : 4×3×1.7mm • Visible light cut resin to prevent 4. Lead free and RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D3-A01901EN Date Oct. 3. 2005 © SHARP Corporation GP2S27J0000F Series ■ Internal Connection Diagram 1 2 1 2 3 4 3 4 Anode Emitter Collector Cathode ■ Outline Dimensions (0.4) Detector center (Unit : mm) C0.7 2 1 3 4 1.75 4−0.1 0.75 0.15−0.1 +0.2 +0.2 (0.2) Emitter center 3−0.1 +0.2 1.7 0.4 5 MAX. (0.4) • Tolerance : ±0.15mm. • ( ) : Reference dimensions. • The parallerism in 4 leads are 0.15mm. • The dimensions shown do not include burr. Burr's dimension : 0.15mm MAX. • The shaded portion has no SnCu plating. Date code mark Product mass : approx. 0.03g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D3-A01901EN 2 GP2S27J0000F Series Date code (Symbol) January July February August March September April October May November June December Rank mark There is no rank indicator. Country of origin Japan Sheet No.: D3-A01901EN 3 GP2S27J0000F Series ■ Absolute Maximum Ratings Parameter Forward current Input Reverse voltage Power dissipation Collector-emitter voltage Emitter-collector voltage Output Collector current Collector power dissipation Total power dissipation Operating temperature Storage temperature ∗1 Soldering temperature ∗ Symbol Rating IF 50 VR 6 P 75 VCEO 35 VECO 6 20 IC 75 PC 100 Ptot Topr −25 to +85 Tstg −40 to +100 Tsol 260 (Ta=25˚C) Unit mA V mW V V mA mW mW ˚C ˚C ˚C Soldering area: The hatched area more than 0.5mm away from the lower edge of package as shown in the figure below. 0.5mm 0.5mm 1 For 5s or less ■ Electro-optical Characteristics Parameter Forward voltage Input Reverse current Output Collector dark current ∗2 Collector Current Transfer Rise time Response time characFall time teristics ∗3 Leak current ∗ Symbol VF IR ICEO IC tr tf ILEAK Condition IF=20mA VR=6V VCE=20V IF=4mA, VCE=2V VCE=2V, IC=100μA, RL=1kΩ, d=1mm IF=4mA, VCE=2V MIN. − − − 20 − − − TYP. 1.2 − 1 45 20 20 − (Ta=25˚C) MAX. Unit 1.4 V 10 μA 100 nA 120 μA 100 μs 100 100 nA 2 The condition and arrangement of the reflective object are shown below. The rank splitting of collector current (IC) shall be executed according to the table below. Rank A B C Collector current, IC [μA] (IF=4mA, VCE=2V) 20 to 42 34 to 71 58 to 120 Package oleeve color Yellow Transparent Green ∗ 3 Without reflective object. ● Test Condition and Arrangement for Collector Current Al evaporation d = 1mm glass plate Sheet No.: D3-A01901EN 4 GP2S27J0000F Series ■ Model Line-up Package Sleeve 50 pcs/sleeve GP2S27J0000F GP2S27BJ000F GP2S27CJ000F GP2S27ABJ00F GP2S27BCJ00F Taping 1 000 pcs/reel GP2S27TJ000F GP2S27T2J00F GP2S27T3J00F GP2S27T5J00F GP2S27T6J00F Rank A, B or C B C A or B B or C Collector current IC[μA] (IF=4mA, VCE=2V, Ta=25˚C) 20 to 120 34 to 71 58 to 120 20 to 71 34 to 120 Model No ∗ The ratio of each rank can not be guaranteed. Please contact a local SHARP sales representative to see the actial status of the produiction. Sheet No.: D3-A01901EN 5 GP2S27J0000F Series Fig.1 Forward Current vs. Ambient Temperature 60 50 Fig.2 Power Dissipation vs. Ambient Temperature 120 100 Power dissipation P (mW) 80 75 60 40 20 15 Ptot Forward current IF (mA) 40 30 20 10 0 −25 P, PC 0 25 50 75 85 100 0 −25 Ambient temperature Ta (˚C) 0 25 50 75 85 Ambient temperature Ta (˚C) 100 Fig.3 Forward Current vs. Forward Voltage Ta = 75˚C 50˚C 25˚C Fig.4 Collector Current vs. Forward Current 700 600 Collector current IC (μA) 500 400 300 200 100 VCE=2V Ta=25˚C Forward current IF (mA) 100 0˚C −25˚C 10 1 0 0.5 1 1.5 2 Forward voltage VF (V) 2.5 3 0 0 5 10 15 20 Forward current IF (mA) 25 30 Fig.5 Collector Current vs. Collector-Emitter Voltage 350 300 Collector current IC (μA) 250 10mA 200 150 100 4mA 50 2mA 0 0 2 4 6 8 10 Collector-emitter voltage VCE (V) 12 Ta= 25˚C IF=15mA Fig.6 Relative Collector Current vs. Ambient Temperature 120 100 80 60 40 20 0 −25 IF=4mA VCE=2V 7mA Relative collector current IC (%) 0 25 50 75 Ambient temperature Ta (˚C) 100 Sheet No.: D3-A01901EN 6 GP2S27J0000F Series Fig.7 Collector Dark Current vs. Ambient Temperature 10 −6 VCE = 20V Fig.8 Response Time vs. Load Resistance 1 000 VCE = 2V IC = 100μA Ta = 25˚C 100 Response time (μs) Collector dark current ICEO (A) 10 −7 tr tf 10 −8 10 td ts 10 −9 1 10 −10 0 25 50 75 Ambient temperature Ta (˚C) 100 0.1 0.1 1 10 100 1 000 Load resistance RL (kΩ) Fig.9 Test Circuit for Response Time Fig.10 Relative Collector Current vs. Distance (Reference value) 100 IF=4mA VCE=2V Ta=25˚C Input RD RL Output Output td tr 10% 90% ts tf Relative collector current (%) Reflector Plate VCC Input 80 60 40 20 0 0 1 2 3 4 5 Distance between sensor and Al evaporation glass d (mm) Fig.11 Detecting Position Characteristics (1) 100 IF=4mA VCE=2V d=1mm Ta=25˚C Fig.12 Detecting Position Characteristics (2) 100 IF=4mA VCE=2V d=1mm Ta=25˚C Relative collector current (%) 60 Relative collector current (%) 80 80 60 40 40 20 20 0 −2 −1 0 2 4 1 3 5 Card moving distance L (mm) 6 7 0 −3 −2 −1 1 3 0 2 4 Card moving distance L (mm) 5 6 Sheet No.: D3-A01901EN 7 GP2S27J0000F Series Fig.13 Test Condition for Distance & Detecting Position Characteristics Al evaporated glass Correspond to Fig.10 d Fig.14 Freauency Response 5 VCE =2V IC =100μA Ta =25˚C 0 Voltage gain AV (dB) Correspond to Fig.11 Test condition IF = 4mA VCE = 2V d = 1mm OMS card White d Black 1mm d Correspond to Fig.12 Test condition IF = 4mA VCE = 2V d = 1mm OMS card White Black 1mm −5 RL =10kΩ 1kΩ −10 −15 −20 102 103 104 Frequency f (Hz) 105 106 − L=0 + − L=0 + Fig.15 Spectral Sensitivity (Detecting Side) 100 Ta = 25˚C 80 Relative sensitivity (%) 60 40 20 0 600 700 800 900 1 000 Wavelength λ (nm) 1 100 1 200 Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D3-A01901EN 8 GP2S27J0000F Series ■ Design Considerations ● Design guide 1) Prevention of detection error To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. 2) Distance characteristic Please refer to Fig.10 (Relative collector current vs. Distance) to set the distance of the photointerrupter and the object. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of the IRED used in photointerrupter will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. ● Parts This product is assembled using the below parts. • Photodetector (qty. : 1) Category Phototransister Material Silicon (Si) Maximum Sensitivity wavelength (nm) 930 Sensitivity wavelength (nm) 700 to 1 200 Response time (μs) 20 • Photo emitter (qty. : 1) Category Infrared emitting diode (non-coherent) Material Gallium arsenide (GaAs) Maximum light emitting wavelength (nm) 950 I/O Frequency (MHz) 0.3 • Material Case Black polyphenylene sulfide resin Lead frame 42Alloy Lead frame plating SnCu plating Sheet No.: D3-A01901EN 9 GP2S27J0000F Series ■ Manufacturing Guidelines ● Storage and management after open Storage condition Storage temp.: 5 to 30˚C, Storage humidity : 70%RH or less at regular packaging. Treatment after opening the moisture-proof package After opening, you should mount the products while keeping them on the condition of 5 to 25˚C and 70%RH or less in humidity within 4 days. After opening the bag once even if the prolonged storage is necessary, you should mount the products within two weeks. And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products and silicagel are sealed up again, you should keep them under the condition of 5 to 30˚C and 70%RH or less in humidity. Baking before mounting When the above-mentioned storage method could not be executed, please process the baking treatment before mounting the products. However the baking treatment is permitted within one time. Recommended condition : 125˚C, 16 to 24 hours ∗Do not process the baking treatment with the product wrapped. When the baking treatment processing, you should move the products to a metallic tray or fix temporarily the products to substrate. ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please solder within one time. MAX 240˚C 1 to 4˚C/s 200˚C MAX 160˚C 1 to 4˚C/s 1 to 4˚C/s 25˚C MAX10s MAX120s MAX60s MAX90s Sheet No.: D3-A01901EN 10 GP2S27J0000F Series Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the cooling and soldering conditions. Lead pin Lead terminals of this product are tin copper alloy plated. Before usage, please evaluate solderability with actual conditions and confirm. And the uniformity in color for the lead terminals are not specified. ● Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : Do not execute ultrasonic cleaning. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D3-A01901EN 11 GP2S27J0000F Series ■ Package specification ● Sleeve package Package materials Sleeve : Polystyrene Stopper : Styrene-Butadiene Aluminum laminated bag : Nylone, Polyethylene, Aluminum Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. MAX. 40 sleeves in one case. Color of sleeve Rank classification is distinguished by the color of the sleeve as shown in the table below. But the ratio of each rank can not be guaranteed. Rank A B C Color of sleeve Yellow Transparent Green ● Tape and Reel package Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Package method 1 000 pcs of products shall be packaged in a reel. One reel with silicagel is encased in aluminum laminated bag. After sealing up the bag, it encased in one case (5 bags/case). Sheet No.: D3-A01901EN 12 GP2S27J0000F Series Carrier tape structure and Dimensions G F E H D J K M C B I A I Dimensions List A B 12±0.3 7.6+0.3 −0 H I φ1.5+0.1 4.4±0.1 −0 C 5.5±0.05 J 0.3±0.05 D 1.75±0.1 K 2±0.1 E 8±0.1 L 5.2±0.1 (Unit : mm) F G 2±0.05 4±0.1 M φ1.6+0.1 −0 Reel structure and Dimensions e d g c f a b Dimensions List a b 180 13±0.8 e f ±0.8 21 15.4±1 5˚ X. MA (Unit : mm) d c 13±0.2 60+0.5 −0 g 2+0.3 −0 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Storage method Storage conditions should follow the condition shown below. Storage temperature : 5 to 30˚C Storage hunidity : 70%RH or less Sheet No.: D3-A01901EN 13 GP2S27J0000F Series ■ Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [H144] Sheet No.: D3-A01901EN 14