GP2S60B

GP2S60 GP2S60 SMT, Detecting Distance : 0.5mm Phototransistor Output, Compact Reflective Photointerrupter ■ Description ■Agency approvals/Compliance 1. Compliant with RoHS directive GP2S60 is a compact-package, phototransistor output, reflective photointerrupter, with emitter and detector facing the same direction in a molding that provides noncontact sensing. ■Applications The compact package series is a result of unique technology, 1. Detection of object presence or motion. combing transfer and injection molding, that also blocks visible 2. Any application, which production is migrating to light to minimize false detection. 100% surface mount components. Example : printer, optical storage This photointerrupter can be ordered in different CTR ranks, and has a thin, leadless (T&R) package, suitable for reflow soldering. ■Features 1. Reflective with Phototransistor Output 2. Highlights : • Compact Size • Surface Mount Type (SMT), reflow soldering • Tape and Reel (T&R) 2 000 pcs per reel 3. Key Parameters : • Optimal Sensing Distance : 0.5mm • Package : 3.2×1.7×1.1mm • Visible light cut resin to prevent 4. RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.:D3-A02101EN-A GP2S60 ■ Internal Connection Diagram Top view ① ④ ② ③ ① Collector ② Emitter ③ Cathode ④ Anode ■ Outline Dimensions (Unit : mm) Top view (0.7) (0.63) (0.7) Emitter center (0.65) (0.55) 1.7 Detector center 2.7 3.2 0.4 1.1 Opaque resin molding portion (0.57) (1.8) ③ ② Plating area ④ Pattern for directional Distinction (NC) (0.57) ① • Unspecified tolerance : ±0.15mm. • Dimensions in parenthesis are shown for reference. • Dimensions on the outline drawing is the maximum value excluding burr. • The dimensions shown do not include burr. • Burr's dimension : 0.15mm MAX. Product mass : approx. 0.01g Plating material : Au 2 Sheet No.: D3-A02101EN-A GP2S60 ■ Absolute Maximum Ratings Parameter Forward current Input Reverse voltage Power dissipation Collector-emitter voltage Emitter-collector voltage Output Collector current Collector power dissipation Total power dissipation Operating temperature Storage temperature ∗1 Soldering temperature Symbol Rating IF 50 VR 6 PD 75 VCEO 35 VECO 6 IC 20 PC 75 Ptot 100 Topr −25 to +85 Tstg −40 to +100 Tsol 260 (Ta=25˚C) Unit mA V mW V V mA mW mW ˚C ˚C ˚C ∗ 1 For 5s or less ■ Electro-optical Characteristics Parameter Forward voltage Input Reverse current Output Collector dark current ∗2 Collector Current Transfer ∗3 Leak current characRise time teristics Response time Fall time ∗ Condition IF=20mA VR=6V VCE=20V IF=4mA, VCE=2V IF=4mA, VCE=2V VCE=2V, IC=100μA, RL=1kΩ, d=1mm MIN. − − − 40 − − − TYP. 1.2 − 1 85 − 20 20 2 The condition and arrangement of the reflective object are shown below. The rank splitting of collector current (IC) shall be executed according to the table below. Rank ∗ Symbol VF IR ICEO IC ILEAK tr tf (Ta=25˚C) MAX. Unit 1.4 V 10 μA 100 nA 130 μA 500 nA 100 μs 100 Collector current, IC [μA] (IF=4mA, VCE=2V) A 40 to 80 B 65 to 130 3 Without reflective object. ● Test Condition and Arrangement for Collector Current Aluminum evaporation d=1mm glass plate Sheet No.:D3-A02101EN-A 3 GP2S60 ■ Model Line-up Model No. GP2S60 GP2S60A GP2S60B Rank A or B A B IC(μA) 40 to 130 40 to 80 65 to 130 Conditions IF=4mA VCE=2V Ta=25˚C Please contact a local SHARP sales representative to see the actial status of the produiction. Sheet No.:D3-A02101EN-A 4 GP2S60 Fig.1 Forward Current vs. Ambient Temperature Fig.2 Power Dissipation vs. Ambient Temperature 60 Power dissipation PD, PC, Ptot (mW) 120 Forward current IF (mA) 50 40 30 20 Ptot 100 80 75 PD, PC 60 40 20 15 10 0 25 0 25 50 75 85 0 −25 100 0 Fig.3 Forward Current vs. Forward Voltage 50 75 85 100 Fig.4 Collector Current vs. Forward Current 700 Ta=75˚C 50˚C VCE=2V Ta=25C 600 25˚C 100 Collector current IC (μA) Forward current IF (mA) 25 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) 0˚C −25˚C 10 500 400 300 200 100 0 1 0 0.5 1 1.5 2 2.5 0 3 5 Fig.5 Collector Current vs. Collector-Emitter Voltage 15 20 Fig.6 Relative Collector Current vs. Ambient Temperature 600 120 Ta=25˚C VCE=2V IF=4mA IF=15mA 500 100 Relative collector current (%) Collector current IC (μA) 10 Forward current IF (mA) Forward voltage VF (V) 400 10mA 300 200 7mA 4mA 100 80 60 40 20 2mA 0 0 2 4 6 8 0 −25 10 Collector-emitter voltage VCE (V) 0 25 50 75 Ambient temperature Ta (˚C) Sheet No.:D3-A02101EN-A 5 GP2S60 Fig.7 Collector Dark Current vs. Ambient Temperature Fig.8 Response Time vs. Load Resistance 10−6 1 000 VCE=2V IC=100μA Ta=25˚C tr 10−7 Response time (μs) Collector dark current ICEO (A) VCE=20V 10−8 100 tf td 10 −9 10 ts 10−10 0 25 50 75 1 0.1 100 1 Ambient temperature Ta (˚C) 10 100 Fig.9 Test Circuit for Response Time Fig.10 Relative Collector Current vs. Distance 100 Relative collector current (%) RL RD Input Output Output Input VCE=2V IF=4mA Ta=25˚C 90 VCC 10% ts tf td tr 90% 80 Al evaporation glass L Reflector Plate 1 000 Load resistance RL (kΩ) 70 60 50 40 30 20 10 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Distance between sensor and Aluminum evaporation glass L (mm) Fig.11 Spectral Sensitivity Fig.12 Detecting Position Characteristics (1) 100 100 OMS test card d 1mm Sensor − 0 + Ta=25˚C Relative collector current (%) Relative sensitivity (%) 80 60 40 20 0 600 700 800 900 1 000 1 100 80 60 40 20 −3 1 200 VCE=2V IF=4mA d=1mm −2 −1 0 1 2 3 4 5 6 OMS card moving distance (mm) Wavelength λ (nm) Sheet No.:D3-A02101EN-A 6 GP2S60 Fig.13 Detecting Position Characteristics (2) Relative collector current (%) 100 OMS test card d 1mm Sensor − 0 + 80 VCE=2V IF=4mA d=1mm 60 40 20 −3 −2 −1 0 1 2 3 4 5 6 OMS card moving distance (mm) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.:D3-A02101EN-A 7 GP2S60 ■ Design Considerations ● Design guide 1) Regarding to prevention of malfunction To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. 2) Distance characteristic The distance between the photointerrupter and the object to be detected shall be determined the distance by referencing Fig.10 "Relative collector current vs. distance". 3) For wiring on a mounting PCB To avoid possibility for short, please do not apply pattern wiring on the back side of the device. 4) Regarding to mounting this product There is a possibility that the opaque molded resin portion may have a crack by force at mounting etc. Please use this product after well confirmation of conditions in your production line. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. ● Parts This product is assembled using the below parts. • Light detector (qty. : 1) Category Material Maximum Sensitivity wavelength (nm) Sensitivity wavelength (nm) Response time (μs) Phototransister Silicon (Si) 930 700 to 1 200 20 • Light emitter (qty. : 1) Category Material Maximum light emitting wavelength (nm) I/O Frequency (MHz) Infrared emitting diode (non-coherent) Gallium arsenide (GaAs) 950 0.3 • Material Case PCB Lead frame plating Epoxy resin Black polyphenylene sulfide Glass epoxy resin Au plating Sheet No.:D3-A02101EN-A 8 GP2S60 ● Recommended pattern (Unit : mm) measure tolerance : ±0.1 area : Please do not apply the pattern wiring to avoid the possibility of short circuit. Regarding amount of solder, if there is solder leakage in terminal wiring pattern between PCB and housing main body, the reliability will be deteriorated. Please check the proper amount of solder in advance not to have solder leakage into terminal wiring pattern between PCB and housing main body. 9 Sheet No.: D3-A02101EN-A GP2S60 ■ Manufacturing Guidelines ● Storage and management after open Storage condition Storage temp.: 5 to 30˚C, Storage humidity : 70%RH or less at regular packaging. Treatment after opening the moisture-proof package After opening, you should mount the products while keeping them on the condition of 5 to 25˚C and 60%RH or less in humidity within 2 days. After opening the bag once even if the prolonged storage is necessary, you should mount the products within two weeks. And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products and silicagel are sealed up again, you should keep them under the condition of 5 to 30˚C and 70%RH or less in humidity. Baking before mounting When the above-mentioned storage method could not be executed, please process the baking treatment before mounting the products. However the baking treatment is permitted within one time. Recommended condition : 125˚C, 16 to 24 hours ∗Do not process the baking treatment with the product wrapped. When the baking treatment processing, you should move the products to a metallic tray or fix temporarily the products to substrate. Sheet No.:D3-A02101EN-A 10 GP2S60 ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please solder within one time. MAX 240˚C 1 to 4˚C/s 200˚C MAX 165˚C 1 to 4˚C/s 1 to 4˚C/s 25˚C MAX10s MAX120s MAX60s MAX90s Other notice Please take care not to let any external force exert on lead pins. Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the cooling and soldering conditions. ● Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : Do not execute ultrasonic cleaning. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. Sheet No.:D3-A02101EN-A 11 GP2S60 ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法). Toxic and hazardous substances Category Photointerrupter Lead Mercury Cadmium (Pb） (Hg) (Cd) ✔ ✔ ✔ Hexavalent Polybrominated Polybrominated chromium biphenyls diphenyl ethers (Cr ) (PBB) (PBDE) ✔ ✔ ✔ 6+ ✔ : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard. 12 Sheet No.: D3-A02101EN-A GP2S60 ■ Package specification ● Tape and Reel package Package materials Carrier tape : PS (with anti-static material) Reel : PS Package method 2 000 pcs of products shall be packaged in a reel. One reed is endased in aluminum laminated bag. After sealing up the bag, it encased in one case (5 bags/case). Carrier tape structure and Dimensions Dimensions List （Unit：mm） A B ±0.3 ±0.05 8 G 3.5 H ±0.05 Φ1.55 ±0.1 3.6 C ±0.1 1.75 D E F ±0.1 ±0.1 ±0.1 4 I 2 J ±0.05 K ±0.1 0.3 4 L ±0.1 1.25 Φ1.1±0.1 2.2 Reel structure and Dimensions Dimensions List a b c d 180±2.0 9±1.0 ＋0.5 60－0 Φ13±0.2 e f ±0.8 Φ21 13 （Unit：mm） g ±1.0 11.4 ＋0.3 2 －0 Sheet No.: D3-A02101EN-A GP2S60 Direction of product insertion Pull-out direction [Packing : 2 000pcs/reel] Storage method Storage conditions should follow the condition shown below. Storage temperature : 5 to 30˚C Storage hunidity : 70%RH or less Sheet No.:D3-A02101EN-A 14 GP2S60 ■ Important Notices · The circuit application examples in this publication are · Telecommunication equipment (Terminal) provided to explain representative applications of · Measuring equipment SHARP devices and are not intended to guarantee any · Tooling machines · Computers circuit design or license any intellectual property rights. If the use of the product in the above application areas is SHARP takes no responsibility for any problems related for equipment listed in paragraphs (2) or (3), please be to any intellectual property right of a third party resulting sure to observe the precautions given in those respective from the use of SHARP's devices. paragraphs. · Contact SHARP in order to obtain the latest device (2) Appropriate measures, such as fail-safe design and specification sheets before using any SHARP device. redundant design considering the safety design of the SHARP reserves the right to make changes in the overall system and equipment, should be taken to ensure specifications, characteristics, data, materials, structure, reliability and safety when this product is used for and other contents described herein at any time without equipment which demands high reliability and safety in notice in order to improve design or reliability. function and precision, such as ; Manufacturing locations are also subject to change · Transportation control and safety equipment (aircraft, without notice. train, automobile etc.) · Traffic signals · These specification sheets include materials protected · Gas leakage sensor breakers · Rescue and security equipment under copyright of Sharp Corporation ("Sharp"). · Other safety equipment Please do not reproduce or cause anyone to reproduce (3) Please do not use this product for equipment which them without Sharp's consent. require extremely high reliability and safety in function and · When using this product, please observe the absolute precision, such as ; maximum ratings and the instructions for use outlined in · Space equipment these specification sheets, as well as the precautions · Telecommunication equipment (for trunk lines) mentioned below. Sharp assumes no responsibility for · Nuclear power control equipment · Medical equipment any damage resulting from use of the product which does · Power generation and power transmission control not comply with the absolute maximum ratings and the system (Key system) instructions included in these specification sheets, and (4) Please contact and consult with a Sharp sales the precautions mentioned below. representative if there are any questions regarding interpretation of the above four paragraphs. · Please do verify the validity of this part after assembling it in customer’s products, when customer wants to make · Please contact and consult with a Sharp sales catalogue and instruction manual based on the representative for any questions about this product. specification sheet of this part. (Precautions) · If the SHARP devices listed in this publication fall within (1) This product is designed for use in the following the scope of strategic products described in the Foreign application areas ; · OA equipment Exchange and Foreign Trade Law of Japan, it is · Audio visual equipment necessary to obtain approval to export such SHARP · Home appliances devices. 15 Sheet No.: D3-A02101EN-A