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GP2W0001

GP2W0001

  • 厂商:

    SHARP(夏普)

  • 封装:

  • 描述:

    GP2W0001 - Low Power Infrared Transceiver - Sharp Electrionic Components

  • 数据手册
  • 价格&库存
GP2W0001 数据手册
GP2W0001YP/GP2W0002YP IrDA Technical Information Low Power Infrared Transceiver The GP2W0002YP is the same module, and adds an integral Electro-Magnetic Interference (EMI) shield. While IR energy is inherently immune to EMI, the receiving devices themselves are not. This shield provides an additional level of protection in electromagnetically noisy environments such as PCs and other digital products. The SHARP GP2W0001YP/GP2W0002YP infrared transceiver modules contain a high speed, high efficiency, low power consumption AlGaAs LED, silicon PIN photodiode, and a low power bipolar integrated circuit. The IC contains an LED driver circuit and a receiver, providing the Rx output. IrDA data rates of 2.4 Kbps to 115.2 Kbps are supported at both 20 cm and one-meter distances. At the one-meter range, emitter current is approximately IF = 300 mA and in the IrDA Low Power Option communication mode IF = 27 mA. This dual mode communication capability provides wider product applications, such as a wireless data link with PCs, PDAs, or any other IrDA compliant application already on the market. The GP2W0001YP/GP2W0002YP transceiver modules may be operated over a power supply range of 2.7 V to 5.5 V without any performance degradation. This provides a single part with a wide variety of design applications. For power-conscious applications, the transceiver module has a built-in Shutdown mode. This reduces the receiver's current consumption to 1 µA (MAX.) during Shutdown. The transmitter and receiver circuits are separate, allowing the transmitter LED to be driven when in Shutdown mode. FEATURES • IrDA 1.2a Low Power Option Compatible: – IF = 27 mA (TYP.) for an operating distance of 20 cm • Small Package Design for IrDA 1.0 Compliant Infrared Transceiver 8.7 (W) × 4.2 (D) × 3.15 (H) mm • Receiver output provides a full output pulse for the received input signal • Fits within Mobile Phone Connector Dimensions • Low Power Consumption and Built-in Shut-Down Mode (1 µA MAX.) • Wide Range of Operating Voltages provides power supply design flexibility (VCC = 2.7 V to 5.5 V) • Solder Reflow Compatibility for automated production processes • SMD Package allows both Vertical and Horizontal mounting on PCBs Description DESCRIPTION The SHARP GP2W0001YP is one of the smallest transceiver modules. Even at low operating voltages, it provides a reliable interface between logic and IR signals for through-air, serial, half-duplex IR wireless data links and is designed to satisfy IrDA physical layer specifications. OUTLINE DIMENSIONS The dimensions shown in Figure 1 and Figure 2 are only for design reference, and are subject to change without notice. The metal shield case version GP2W0002YP, (for excellent noise immunity) is shown in Figure 2. Contact your local SHARP office for the latest device specifications. Technical Information 1 GP2W0001YP/GP2W0002YP Low Power Infrared Transceiver 8.7 2.0 2.95 2.325 4.2 3.15 1.7 φ2.8 1.1 TRANSMITTER CENTER φ3.6 RECEIVER CENTER NOTES: 1. Dimensions are in mm. 2. Unspecified tolerances are ±0.3 mm. 3. Resin burrs are not included in this outline dimension drawing. 4. Package material: Visible light cut-off resin (Color: black) 5. Weight: Approximately 0.12 g 6. Pin assignment: See Figure 5 and Table 1. 3.5 2.2 0.8 0.8 1.4 7.0 0.7 4.2 GP2W0001YP-20 Figure 1. GP2W0001YP Outline Dimensions 10.2 9.2 2.95 2.325 4.2 3.4 1.7 φ2.8 1.1 TRANSMITTER CENTER φ3.6 RECEIVER CENTER NOTES: 1. Dimensions are in mm. 2. Unspecified tolerances are ±0.3 mm. 3. Resin burrs are not included in this outline dimension drawing. 4. Package material: Visible light cut-off resin (Color: black) 5. Weight: Approximately 0.12 g 6. Pin assignment: See Figure 5 and Table 1. 3.5 2.2 1.55 0.8 0.8 1.4 7.0 0.7 4.2 GP2W0001YP-21 Figure 2. GP2W0002YP (with Shielding Case) Outline Dimensions 2 Technical Information 0.7 Low Power Infrared Transceiver GP2W0001YP/GP2W0002YP Solder Paste Footprints Figure 3 and Figure 4 are the Solder Paste footprint drawings for both parts. Note that the GP2W0002YP footprint in Figure 4 is compatible with both parts. PIN NO. 1 2 LENS (PD/LED) SIDE Table 1. Pinouts DESCRIPTION LED Anode Transmitter Data Input Shut Down Circuit Input Receiver Data Output Ground Supply Voltage SYMBOL LEDA TxD SD RxD GND VCC 3 4 5 6 1.7 5 4 3 2 1 6 0.9 0.7 P 1.4 × 5 = 7 NOTE: Viewed from the parts side of PCB. GP2W0001YP-22 Figure 3. GP2W0001YP Soldering Footprint PIN 1 PIN 6 LENS (PD/LED) SIDE 10 PIN 1 0.8 1.05 0.8 GP2W0001YP-28 PIN 6 Figure 5. Pin Locations 6 5 4 3 2 1 1.7 2.025 0.9 0.7 P 1.4 × 5 = 7 NOTE: Viewed from the parts side of PCB. GP2W0001YP-23 Figure 4. GP2W0002YP Soldering Footprint Technical Information 3 GP2W0001YP/GP2W0002YP Low Power Infrared Transceiver ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage Peak Forward LED Current Operating Temperature Soldering Temperature Storage Temperature SYMBOL VCC IFM TOPR TSOL TSTG -20 -10 MIN. 0 MAX. 6.0 500 +70 230 +85 UNIT V mA °C °C °C 2. See ‘IrDA Physical Layer Link Specification, Appendix A’ for ambient light conditions. 3. See Figure 6. CONDITIONS Pulse 78.1 ms, 3/16-duty cycle Solder reflow time: 5 seconds NOTE 1, 2, 3 3 NOTES: 1. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm < λp < 900 nm, and the pulse characteristics are compliant with the IrDA Physical Layer RECOMMENDED OPERATING CONDITIONS PARAMETER Supply Voltage Logic High Transmitter Input Voltage (TxIN) Logic Low Transmitter Input Voltage (TxIN) Shutdown Circuit High Level Input Voltage Shutdown Circuit Low Level Input Voltage Data Rate Operating Temperature SYMBOL VCC VIHTXD VILTXD VIHSD VILSD BR TOPR VCC – 0.6 0.0 2.4 -10 MIN. 2.7 2.4 MAX. 5.5 VCC 0.4 VCC 0.4 115.2 70 UNIT V V V V V Kbps °C 2 1 NOTE NOTES: 1. Measured at the input circuit, not the device pin. Tx input should not exceed 0.8 VCC. 2. 0.4 or Open 400 300 PEAK FORWARD CURRENT IFM (mA) 200 100 0 -10 0 25 50 60 70 75 100 AMBIENT TEMPERATURE TA (°C) GP2W0001YP-27 Figure 6. Peak Forward Current vs. Temperature 4 Technical Information Low Power Infrared Transceiver GP2W0001YP/GP2W0002YP ELECTRICAL AND OPTICAL SPECIFICATIONS PARAMETER Supply Voltage Maximum Reception Distance Data Rate Operating Temperature SYMBOL MIN. TYP. MAX. VCC L1 L2 BR TOPR VOH VOH VOL1 VOL2 2Θ tW1 Low Level Pulse Width tW2 ICC1 Current Consumption ICC2 Rise Time Fall Time tR tF IE1 IE2 λp ILEDA VIH VIL 2.4 0.0 3.6 40 850 870 500 VCC 0.4 0.7 1.0 1.0 1.2 0.2 28.8 350 900 mA µA µs µs mW/sr mW/sr nm mA V V IF = 27 mA, 2Θ1/2 ≤ 15° IF = 300 mA, 2Θ1/2 ≤ 15° IF = 20 mA All modes, PW = 78.1 µs or less, 3/16 duty cycle Measured at input circuit. Device pin will usually not exceed 0.8 V 30 0.8 0.8 1.0 16 8 1.4 2.7 ≥ 0.2 ≥ 1.0 2.4 -10 4.5 2.5 0.6 0.6 115.2 70 5.5 UNIT V m m Kbps °C V V V V degrees µs µs mA BR = 2.4 Kbps (pulse width 78.12 µs) BR = 115.2 Kb/s (pulse width 1.63 µs) No input signal, VCC = 5.0 V, output open, VIHSD = VCC - 0.6 V No input signal, VCC = 3.0 V, output open, VIHSD = VCC - 0.6 V Shut-down Mode 3 3 VCC = 5 V VCC = 3 V VCC = 5 V, IOL = 400 mA RxD = ON VCC = 3 V, IOL = 400 mA RxD = ON 3 3 2Θ1/2 ≤ 15°, IE = 3.6 mW/sr 2Θ1/2 ≤ 15°, IE = 40 mW/sr CONDITIONS NOTES RECEIVER High Level Output Voltage Low Level Output Voltage Viewing Angle TRANSMITTER Radiant Intensity Peak Emission Wavelength Peak LED Current High Level Input Voltage Low Level Input Voltage NOTES: 1. These specifications reflect the Recommended Operating Conditions, unless otherwise noted. 2. All typical values are at 25°C and 3.3 V, ambient light on the receiver surface under 10 Lux, unless otherwise noted. 3. See Figure 7, Figure 8, and Figure 9 t1 t2 RADIATION INTENSITY OF TRANSMITTER 3.6 mW/Sr MIN. NOTE: At BR = 2.4 Kbps: t1 = 416.7 µs, t2 = 78.1 µs At BR = 115.2 Kbps: t1 = 8.68 µs, t2 = 1.63 µs GP2W0001YP-24 Figure 7. Detector Input Signal Waveform Technical Information 5 GP2W0001YP/GP2W0002YP Low Power Infrared Transceiver tF tR VOH 1.63 µs Tx VCC = 3 V, RL = 2.2 Ω CX2 = 1,500 pF TxD 90% 50% 10% tW GP2W0001YP VOL VIN Tx = 2.7 V GP2W0001YP-7 R2 = 1 kΩ BR = 115.2 Kbps Figure 8. Output Waveform Specification GP2W0001YP-26 Figure 9. Recommended Emitter Circuit φ φ TRANSMITTER (NOTE 1) L Ee GP2W0001YP OSCILLOSCOPE NOTES: 1. Transmitter uses GP2W0001YP (λp = 870 nm TYP.) adjusted to a radiation intensity of 3.6 mW/Sr. 2. φ Indicates horizontal and vertical directions. 3. Ee: Detector face illuminance < 10 lx GP2W0001YP-25 Figure 10. Standard Optical Detector System 6 Technical Information Low Power Infrared Transceiver GP2W0001YP/GP2W0002YP ELECTRICAL DESIGN APPLICATION TIPS Figure 11 shows a circuit application and passive component values for a GP2W0001YP. The values shown are only for reference. Contact your local Sharp office concerning technical reference data for optical/ electrical characteristics. Circuit Application and External Passive Components The circuit application and the external passive components shown in Figure 11 enable the GP2W0001YP to operate at both one-meter and 20 cm low power option communication modes at VCC = 3.0 V. 6 5 CX1 4 3 2 1 RL R2 R1 CX2 SHUTDOWN MODE The ‘Shutdown’ pin is an active LOW terminal. Shutdown mode only affects the power consumption of the receiver circuits. The transmitter LED can still be operated when SD is asserted. The two circuits are independent and not internally connected. The transmitter circuit does not consume current unless a drive signal is applied. Table 2. SD Pin Functions INPUT HIGH LOW OPEN PERFORMANCE Normal Mode Shutdown Mode Shutdown Mode VCC COMPONENTS CX1 CX2 R1 R2 RL RxD SD TxD RECOMMENDED VALUES 47 µF, 6.3 V or as appropriate 1,500 pF, 25 V 47 Ω, ±5%, 1/10 W 1 kΩ, ±5%, 1/10 W 2.2 Ω ±5%, 1/2 W,1 meter 33 Ω ±1%, 1/8 W, 20 cm (low power) NOTE: All recommended values are for VCC = 3.0 V GP2W0001YP-29 Figure 11. External Components SD VIH VIL (or OPEN) HIGH RxD 40 ms OPERATABLE LOW GP2W0001YP-30 Figure 12. Receiver Activation Technical Information 7 GP2W0001YP/GP2W0002YP Low Power Infrared Transceiver Signal Waveform Example Figure 14 shows examples of each waveform when operating a GP2W0001YP to IrDA standards. Note that the IrDA bitstream is inverted in the encoder and decoder circuits, and the output pulse is sent during a ‘0’ bit. The examples are for reference only, to help understand the GP2W0001YP hardware, and device signal measurements. The receiver output is not gated, and will send output for the entire period of the received IR input signal. Refer to Figure 14 for waveform reference points. T T 1 0 3/16T 1 0 1 2 3 4 3 2 ENCODER CIRCUIT DECODER CIRCUIT 1 5 4 5 0 1 0 1 GP2W0001YP-31 Figure 13. GP2W0001YP Block Diagram NOTES: 1 Transmit data waveform 2 Encoder circuit output waveform 3 Transmitter output optical signal waveform 4 GP2W0001YP receiver output waveform 5 Receive data waveform T= 1 Data Rate Data rate: 2.4 Kbps, 9.6 Kbps, 19.2 Kbps, 38.4 Kbps, 57.6 Kbps, 115.2 Kbps GP2W0001YP-32 Figure 14. Signal Waveform Example 8 Technical Information Low Power Infrared Transceiver GP2W0001YP/GP2W0002YP MECHANICAL DESIGN APPLICATION TIPS Recommended Footprint Figure 15 shows the basic recommended footprint for PCB design using the SHARP GP2W0001YP infrared transceiver module. All values shown here are for reference, and are in mm. Electro-Mechanical Design Tip Figure 16 gives a recommended set of locations for resistors and capacitors for better performance, particularly for the power supply (VCC) line. R1 and CX1, as shown in Figure 16, should be mounted near the GP2W0001YP transceiver module for best performance. All values in Figure 16 are for reference and are in mm. 1.5 1.1 1.1 1.5 0.75 2 6 - 0.9 P1.4 7.0 NOTE: Dimensions are in mm. GP2W0001YP-33 Figure 15. Recommended Footprint Technical Information 6 - 2.6 9 GP2W0001YP/GP2W0002YP Low Power Infrared Transceiver 1.5 1.1 1.1 1.5 0.75 2 P1.4 6 - 0.9 7.0 Capacitor and resistor on the power trace should be located as close as possible to the GP2W0001YP transceiver module. VCC NOTE: Dimensions are in mm. GND GP2W0001YP-34 Figure 16. PCB Design Tip 10 Technical Information 6 - 2.6 Low Power Infrared Transceiver GP2W0001YP/GP2W0002YP Cabinet and IR Cosmetic Window Design Tips Figure 17 with its calculations illustrates the design tips for a cabinet and an IR cosmetic window with ±18° viewing angles in the vertical and horizontal axes. All transceiver dimension values are for reference, and are in mm. The optical window size should be the minimum size of W × H, either rectangular or elliptical, to maintain IrDA data transfer performance. The dimensions for W can be calculated by the formula: W = 2 × L × tan(18 + w) And the dimensions for H can be calculated by the formula: H = 2 × L × tan(18 +h) In the case where the viewing angle is +18°, which conforms to or exceeds the IrDA Serial Infrared Physical Layer Link Specifications. Values to be calculated with above the formula must be given in mm. L 18˚ w (8.475) 18˚ L h (3.15) 18˚ H 18˚ W NOTE: Dimensions are in mm. GP2W0001YP-35 Figure 17. Optical Window Tips Technical Information 11 GP2W0001YP/GP2W0002YP Low Power Infrared Transceiver When the 33 Ω value and a forward current of 27 mA is used, a total of 31.3 mW is dissipated during LED ontime. This dissipation is within the rating of the SR1206 package. When used at a data rate of 115 Kbps, the maximum on time is 18.75% of a bit time when the LED is ‘ON.’ Since only the logical ‘0’ values of a data string are sent, the overall duty cycle is below this value. The board carries three positions to allow the use of a combination of standard resistor values. To create the 2.2 Ω value, three 6.6 Ω resistors are connected in parallel. For the 43 Ω value, one 43 Ω resistor can be used or three parallel resistors of 130 Ω. The resistor positions on the board are in the SR1206 footprint, which supports one-quarter Watt resistors. This test and evaluation board is not intended for production applications, and should not be subjected to long periods at elevated temperature. Operation of the board should be limited to free-air test conditions. Evaluation Board Figure 18 shows the recommended evaluation circuit for the GP2W0001YP/GP2W0002YP devices. This circuit is provided on an evaluation board for test and evaluation purposes. Samples are available through your Sharp support office or Sales Representative. The resistor value for RL is based on the supply voltage. For the one-meter range, the parallel combination of the three values should be adjusted to approximately 2.2 Ω when VCC = 3.3 V, yielding a forward current of 300 mA with approximately 200 mW being dissipated in the resistors. For the 20 cm (reduced) range, the value is adjusted to 33 Ω, the nominal forward current is 27 mA, and the resistive power dissipation will be approximately 31 mW. RL 2.2 Ω - 33 Ω R5 R4 R3 VCC J1 GND 1 3 5 7 9 + + + + + + + + + + 2 VCC 4 TxD 6 RxD 8 10 R1 47 Ω R2 1K 1 2 3 4 5 6 LEDA TxD SD RxD GND VCC C2 1,500 pF 25 V 2×5 C1 47 µF TANT GP2W0001YP GP2W0001YP-36 Figure 18. GP2W0001YP Test Circuit 12 Technical Information Low Power Infrared Transceiver GP2W0001YP/GP2W0002YP MOISTURE-PROOF PACKING INFORMATION Scope This section describes the specifications of GP2W0001YP/GP2W0002YP moisture-proof packing, and is only for reference. The official specifications should be consulted for packing information. Packing Material Specifications The GP2W0001YP/GP2W0002YP reel is moistureproof packed for shipment. Table 3 describes the materials used for each item of the moisture-proof packing. TREATMENT AFTER UNSEALING 1. After unsealing, devices should be mounted at a temperature of 10°C to 30°C, humidity below 60% RH, within 3 days. 2. For long term storage, devices should either be stored in a dry box, or re-sealed in a moisture-proof bag with desiccant and stored in an environment where the temperature is 10°C to 30°C, humidity below 60% RH. Devices must be mounted within 2 weeks. BAKING BEFORE MOUNTING If the devices are not kept in the storage conditions described above, or the desiccant indicator has turned pink, baking must be performed before devices are mounted: baking may only be done once. • Recommended Baking Conditions: 100°C 12 to 24 hours NOTE: Do not bake the devices while they are still on the reel — the reel will melt. Parts should be either temporarily mounted to a PCB with adhesive, or placed in a metal tray. Any device that has been out of its dry pack for more than 72 hours should be dried in some manner prior to any automated surface mount reflow process. Otherwise these devices should be mounted and soldered by hand. Packing Method 1. Seal the aluminum laminate bag that contains the tape reel (2,000 devices/reel) and desiccant. 2. Fill in the necessary information on the label and paste it on the aluminum laminate bag. 3. Pack 4 aluminum laminated bags (1 reel each) into the designated outer case, placing paper pads on the bottom and top of the outer case, as well as between each layer of the aluminum laminated bags. See Table 4. 4. Seal the outer case with craft tape, indicating the model name, quantity, and out-going inspection date on the case. (8,000 pieces total per carton) Table 3. Packing Materials ITEM Aluminum Laminate Bag Label Desiccant Outer Case Pads Paper Paper MATERIAL Aluminum Polyethylene Paper Storage and Treatment STORAGE CONDITIONS The product should be stored under these conditions: • Storage temperature: 10°C to 30°C • Humidity: below 60% RH Table 4. Packing Quantities PACKING SHAPE Tape reel (∅ 330 mm) PRODUCT 1 model QUANTITY PER REEL 2,000 pieces QUANTITY PER BAG 1 reel NOTE: Minimum order/shipment quantity should be one laminated bag (1 reel of 2,000 pieces). Technical Information 13 GP2W0001YP/GP2W0002YP Low Power Infrared Transceiver LIFE SUPPORT POLICY SHARP components should not be used in medical devices with life support functions or in safety equipment (or similiar applications where component failure would result in loss of life or physical harm) without the written approval of an officer of the SHARP Corporation. LIMITED WARRANTY SHARP warrants to its Customer that the Products will be free from defects in material and workmanship under normal use and service for a period of one year from the date of invoice. Customer's exclusive remedy for breach of this warranty is that SHARP will either (i) repair or replace, at its option, any Product which fails during the warranty period because of such defect (if Customer promptly reported the failure to SHARP in writing) or, (ii) if SHARP is unable to repair or replace, refund the purchase price of the Product upon its return to SHARP. This warranty does not apply to any Product which has been subjected to misuse, abnormal service or handling, or which has been altered or modified in design or construction, or which has been serviced or repaired by anyone other than Sharp. The warranties set forth herein are in lieu of, and exclusive of, all other warranties, express or implied. ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY EXCLUDED. In no event will Sharp be liable, or in any way responsible, for any incidental or consequential economic or property damage. The above warranty is also extended to Customers of Sharp authorized distributors with the following exception: reports of failures of Products during the warranty period and return of Products that were purchased from an authorized distributor must be made through the distributor. In case Sharp is unable to repair or replace such Products, refunds will be issued to the distributor in the amount of distributor cost. SHARP reserves the right to make changes in specifications at any time and without notice. SHARP does not assume any responsibility for the use of any circuitry described; no circuit patent licenses are implied. NORTH AMERICA EUROPE ASIA SHARP Microelectronics of the Americas 5700 NW Pacific Rim Blvd. Camas, WA 98607, U.S.A. Phone: (360) 834-2500 Telex: 49608472 (SHARPCAM) Facsimile: (360) 834-8903 http://www.sharpsma.com ©2000 by SHARP Corporation SHARP Electronics (Europe) GmbH Microelectronics Division Sonninstraße 3 20097 Hamburg, Germany Phone: (49) 40 2376-2286 Facsimile: (49) 40 2376-2232 http://www.sharpmed.com SHARP Corporation Integrated Circuits Group 2613-1 Ichinomoto-Cho Tenri-City, Nara, 632, Japan Phone: +81-743-65-1321 Facsimile: +81-743-65-1532 http://www.sharp.co.jp Reference Code SMA00060
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