GP2W0001YP

GP2W0001YP IrDA Data Sheet FEATURES • Built-in Photodiode • Operating voltage 2.7 V to 5.5 V • In circuit design, allow for the degradation of light emitting diode output that results from long continuous operation (50% degradation/5 years). • This product shall not contain the following materials, and these materials shall not be used in the production process for this product. – CFCs – Halon – Carbon Tetrachloride – 1.1.1. Trichloroethane (Methylchloroform) – Specific brominated flame retardants such as the PBBOs and PBBs are not used in this device. 115 kbps Transceiver designed by considering 0.5 ms or more that is specified by IrDA. This turn around time means the time that this device temporarily does not detect the incoming signal, since the transmitted light from the transmitter side reaches the detector side of the same transceiver. • Consider that 20 ms or more (at TA = 25°C, no input signal) is necessary to return from shut-down mode to ready operation mode. In addition, thoroughly confirm the operation in the actual application. • When there is considerable external stray light or a light source is located near the transceiver, or the detector face receives considerable external stray light, a pulse other than the desired signal output may be generated as noise on the output terminal of the transceiver. Consider the layout and structure in your design to minimize disturbing light on the detector face. • When the sensor is adopted in an IR communication system, it should be used according to the signal method specified by ‘Serial Infrared Physical Layer Link Specification’ published by the Infrared Data Association. Faulty operation may occur if a signal method other than that specified is used. INTRODUCTION This specification applies to the outline and characteristics of IrDA 1.2 type (data rate 2.4 kbps to 115.2 kbps, low power option compliant) optical data communication transceiver. NOTES • Caution should be taken to prevent the detector surface from being smeared with dust or dirt, or from being touched, as it may cause faulty operation. • Cleaning conditions: – Solvent cleaning: Solvent temperature 45°C or less. Immersion for 3 minutes or less. – Ultrasonic cleaning: The effect of ultrasonic cleaning on the device differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition, etc. Test the device under actual conditions and confirm that ultrasonic cleaning does not cause any immediate or potential defects. – Cleaning solvent: The cleaning shall be carried out with ethyl alcohol, methyl alcohol, or isopropyl alcohol. • In order to prevent electrostatic damage to the integrated circuit, handle this device in a static-free environment and workstation. • External force applied to the device after mounting can cause mounting defects such as the terminal coming off. Be careful when handling the device and prevent objects from touching the device after mounting. • Refer to the ‘Precautions for Soldering’ section. • When the system (program) is designed, the turn around time from transmit to receive should be 1 2 LEDA TXD R2 RL CX2 3 4 5 SD RXD GND 6 VCC CX1 + R1 TX COMPONENTS CX1 CX2 R1 R2 RL (STANDARD) RL (LOW POWER) SD RXD VCC RECOMMENDED VALUES 47 µF/6.3 V (NOTE) 1500 pF/25 V 47 Ω ±5%, 1/10 W (NOTE) 1 kΩ ±5%, 1/10 W 2.2 Ω ±5%, 1/2 W (VCC = 3.0 V, IE = 40 mW/sr) 33 Ω ±1%, 1/8 W (VCC = 3.0 V, IE = 3.6 mW/Sr) NOTE: Choose the most suitable CX1 and R1 according to the noise level and noise frequency of power supply. GP2W0001YP-1 Figure 1. Recommended External Circuit IrDA Data Sheet 1 GP2W0001YP 115 kbps Transceiver R1 + CX1 RL CX2 LEDA 1 ENCODER CIRCUIT 2 R2 TXD 3 VCC UART GP2W0001YP 3 RXD SD GND 5 DECODER CIRCUIT 4 SD INPUT HIGH LOW or OPEN PERFORMANCE Normal Mode Shutdown Mode NOTES: 1 Transmitting data waveform 2 Encoder circuit output waveform 3 Transmitter output optical signal waveform 4 GP2W0001YP receiver output waveform 5 Receiving data waveform GP2W0001YP-2 Figure 2. System Example 2 IrDA Data Sheet 115 kbps Transceiver GP2W0001YP T T LENS (PD/LED) SIDE 1 0 3T/16 1 0 1 1.7 6 2 0.9 3 5 4 3 0.7 2 1 P 1.4 x 5 = 7 View from parts side 4 1.7 5 0 1 0 1 0.9 NOTES: 1 Transmitting data waveform 2 Encoder circuit output waveform 3 Transmitter output optical signal waveform 4 GP2W0001YP receiver output waveform 5 Receiving data waveform T= 1 Data Rate PIN 1 2 3 GP2W0001YP-3 6 5 4 3 0.7 2 1 P 1.4 x 5 = 7 Solder Mask Opening PIN NAME LED Anode Transmitter Data Input Shutdown Receiver Data Output Ground Supply Voltage SYMBOL LEDA TXD SD RXD GND VCC Data rate: 2.4 kbps, 9.6 kbps, 19.2 kbps, 38.4 kbps, 57.6 kbps, 115.2 kbps 4 5 6 Figure 3. Signal Waveform Example Recommended Size of Solder Cream Paste Open the solder mask as shown in Figure 4. The size of solder cream paste for this device before reflow soldering must be as large as the foot pattern landings. NOTES: Dimensions are in mm. Soldering paste area GP2W0001YP-4 Figure 4. Foot Pattern and Solder Cream Paste Size IrDA Data Sheet 3 GP2W0001YP 115 kbps Transceiver 8.7 ±0.2 2.95 2.325 3.5 2.2 4.2 4.2 EMBOSSED 'S' 3.15 1.7 CENTER OF EMITTER φ2.8 ±0.1 φ3.6 ±0.1 CENTER OF DETECTOR 6 - 1.1 ±0.2 0.7 0.7 P 1.4 x 5 = 7 ±0.2 0.6 1 6 - 0.8 +0.2 -0.3 2 3 0.7 4 5 6 PIN 1 PIN NAME LED Anode Transmitter data Input Shutdown Receiver Data Output Ground Supply Voltage SYMBOL LEDA TXD SD RXD GND VCC 0.7 P 1.4 x 5 = 7 ±0.2 2 3 4 NOTES: 1. Dimensions are in mm. 2. Unspecified tolerances are ±0.3 mm. 3. Adhesion of resin to the terminal area are allowed MAX. 0.3 mm. 4. Resin burr are not included in this outline drawing. 5. Product mass: Approx. 0.12 g 6. Mold resin: Epoxy resin (black) area: Au plating 5 6 Figure 5. GP2W0001YP Outline Dimensions 4 IrDA Data Sheet 1.0 GP2W0001YP-5 115 kbps Transceiver GP2W0001YP RATINGS AND CHARACTERISTICS Absolute Maximum Ratings PARAMETER Supply voltage Forward current Peak forward current Operating temperature Storage temperature Soldering temperature SYMBOL VCC IF IFM TOPR TSTG TSOL RATINGS 0 to 6.0 50 500 -10 to +70 -20 to +85 230 UNIT V mA mA °C °C °C 2 1 NOTES NOTES: 1. Pulse width: 78.1 µs. Duty ratio: 3/16. 2. Soldering reflow time: 5 seconds. Recommended Operating Conditions PARAMETER Supply voltage Data rate Shutdown circuit high level input voltage Shutdown circuit low level input voltage Logic high transmitter input voltage* Logic low receiver input voltage* NOTES: * Recommended circuit of emitter side. SYMBOL VCC BR VIHSD VILSD VIHTXD VILTXD OPERATING CONDITION 2.7 to 5.5 2.4 to 115.2 VCC – 0.6 to VCC 0.0 to 0.4 or Open 2.4 to VCC 0.0 to 0.4 UNIT V kbps V V V V IrDA Data Sheet 5 GP2W0001YP 115 kbps Transceiver Electrical Characteristics TA = -25°C, VCC = 5 V unless otherwise specified PARAMETER Current consumption at no input signal SYMBOL ICC1 ICC2 Current consumption at shut-down mode High level output voltage Low level output voltage Low level pulse width Rise time Fall time Maximum reception distance Radiant intensity Peak emission wavelength ICC1-S ICC2-S VOH1 VOH2 VOL1 VOL2 tw tr tf L IE λp 1 40 850 870 350 900 0.8 4.5 2.5 0.6 0.6 8.0 1.2 0.2 MIN. TYP. 1.0 0.7 0.5 0.3 MAX. 1.4 1.0 1.0 1.0 UNIT mA mA µA µA V V V V µs µs µs m mW/Sr nm NOTES 1 2 3 4 5 6 7 8 9 9 9 10 11 11 NOTES: 1. VCC = 5 V, no input signal, output terminal open, VIHSD = VCC -0.6 V. 2. VCC = 3 V, no input signal, output terminal open, VIHSD = VCC -0.6 V. 3. VCC = 5 V, SD terminal open. 4. VCC = 3 V, SD terminal open. 5. VCC = 5 V. 6. VCC = 3 V. 7. VCC = 5 V, IOL = 400 µA. 8. VCC = 3 V, IOL = 400 µA. See Figures 6, 7, and 8. 9. BR = 115.2 kbps. See Figures 6, 7, and 8. 10. VOH, VOL, tw, tr, tf shall be satisfied at φ ≤ 15°. See Figures 6, 7, and 8. 11. BR = 115.2 kbps, φ ≤ 15°, VCC = 3 V, RL = 2.2 Ω, VINTX = 2.7 V, R2 = 1 kΩ ±5%, CX2 = 1,500 pF. See Figures 9, 10, and 11. T1 T2 T1 tF tR VOH 90% RADIATION INTENSITY OF TRANSMITTER 40 mW/Sr NOTE: At BR = 2.4 kbps: T1 = 416.7 µs, T2 = 78.1 µs At BR = 115.2 kbps: T1 = 8.68 µs, T2 = 1.63 µs GP2W0001YP-6 50% 10% tW GP2W0001YP-7 VOL Figure 6. Input Signal Waveform (Detector Side) Figure 7. Output Waveform (Detector Side) 6 IrDA Data Sheet 115 kbps Transceiver GP2W0001YP φ φ TRANSMITTER (NOTE 1) L GP2W0001YP OSCILLOSCOPE NOTES: 1. Transmitter uses GP2W0001YP (λp = 870 nm TYP.) adjusted to a radiation intensity of 40 mW/Sr. 2. φ Indicates horizontal and vertical directions. 3. Ee: Detector face illuminance < 10 x GP2W0001YP-8 Figure 8. Standard Optical System (Detector Side) 90% IE 10% tR tF GP2W0001YP-9 Figure 9. Output Waveform Specification (Emitter Side) IrDA Data Sheet 7 GP2W0001YP 115 kbps Transceiver GP2W0001YP φ φ DETECTOR FOR RADIATION INTENSITY MEASURMENT NOTE: φ indicates horizontal and vertical directions GP2W0001YP-10 Figure 10. Standard Optical System (Emitter Side) VCC = 3 V, RL = 2.2 Ω 1.63 µs TX CX2 = 1500 pF LEDA TXD GP2W0001YP 400 300 VIN Tx = 2.7 V BR = 115.2 kbps GP2W0001YP-11 R2 = 1 kΩ PEAK FORWARD CURRENT IFM (mA) 200 Figure 11. Recommended Circuit (Emitter Side) 100 0 -25 -10 0 25 50 60 70 75 100 AMBIENT TEMPERATURE TA (°C) GP2W0001YP-12 Figure 12. Peak Forward Current Versus Ambient Temperature 8 IrDA Data Sheet 115 kbps Transceiver GP2W0001YP RELIABILITY1 TEST ITEMS Temperature cycling High temperature and high humidity storage High temperature storage Low temperature storage Operation life 1 Operation life 2 Mechanical shock Variable frequency vibration Reflow solder heat TEST CONDITIONS 1 cycle -20°C to 85°C (30 minutes at each extreme) 20 cycles test +40°C, 90% RH, 240 hours +85°C, 240 hours -20°C, 240 hours +25°C, VCC = 5 V, 240 hours +25°C, IFM = 400 mA, 240 hours, Pulse width 78.1 µs, Duty ratio 3/16 1,000 m/s2, 6 ms, 3 times/±X, ±Y, ±Z direction 200 m/s2, 100 to 2,000 to 100 Hz for approximately 4 minutes 48 minutes/X, Y, Z direction 230°C, 5 s. FAILURE JUDGEMENT CRITERIA ICC1 > Up × 1.2 ICC2 > Up × 1.2 L < Low × 0.8 Judgement of Criteria: VOH1 < Low × 0.8 VOH2 < Low × 0.8 VOL1 > Up × 1.2 VOL2 > Up × 1.2 tw1 > Up × 1.2 tw1 < Low × 0.8 tw2 > Up × 1.2 tw2 < Low × 0.8 tr > Up × 1.2 tf > Up × 1.2 Up: Upper Specification Limit Low: Lower Specification Limit SAMPLES (n) n = 22 n = 22 n = 22 n = 22 n = 11 n = 11 n = 11 DEFECTIVE (c) c=0 c=0 c=0 c=0 c=0 c=0 c=0 NOTES 2 2 2 2 2 n = 11 n = 11 c=0 c=0 3 NOTES: 1. Confidence level 90%, LTPD 10%/20%. 2. The sample to be tested shall be left at normal temperature and humidity for 2 hours after it is taken out of the chamber. No dew point. 3. Refer to the ‘Precautions for Soldering’ section for temperature profile. IrDA Data Sheet 9 GP2W0001YP 115 kbps Transceiver INCOMING INSPECTION • Inspection lot: Inspection shall be carried out per each delivery lot. • Inspection method: A single sampling plan, normal inspection level two based on ISO 2859 shall be adopted. Table 1. Incoming Inspection PARAMETER INSPECTION ITEMS AND TEST METHOD Disconnection, short Inverse polarity on terminal Major defect Soldering defect (obstacle to use) Electrical characteristic defect Minor defect Appearance defect which affects the electrical characteristics such as, split, chip, scratch, stain, or blur AQL(%) 0.1 0.1 0.1 0.1 PRECAUTIONS FOR SOLDERING Solder Reflow Solder only once at the temperature and the time within the temperature profile as shown in Figure 13. Other Precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. Keep the package temperature within that specified in Figure 13. Also avoid immersing the resin part in the solder. Even if within the temperature profile shown in Figure 13, there is the possibility that the gold wire in the package may break if the deformation of the PCB affects the lead pins. Use after fully confirming the conditions of actual solder reflow machine. Soldering 0.25 • Soldering iron shall be less than 25 W, and temperature of soldering iron point shall be used at less than 260°C. • Soldering time shall be within 3 seconds. • Soldered product shall treat at normal temperature. • Solder: 6/4 solder or included Ag solder. 230°C MAX. 200°C 1 - 4°C/s 165°C MAX. 1 - 4°C/s 1 - 4°C/s 25°C 5 s MAX. 60 s MAX. 120 s MAX. 90 s MAX. GP2W0001YP-13 Figure 13. Temperature Profile 10 IrDA Data Sheet 115 kbps Transceiver GP2W0001YP TAPING SPECIFICATIONS Taping Method • Taping structure and dimensions: The tape should have a structure in which a cover tape is sealed by using heat-pressed on the carrier tape of conductive PET. See Figure 14. • Reel structure and dimensions: The taping reel should be conductive plastic with its dimensions as shown in Figure 15. • Direction of product insertion: Product direction in carrier tape should be such that electrode side of product is placed on the cover tape side and lens side of product is placed on the hold side of the tape. See Figure 16. • Taped device repair: To repair taped device failure, cut the bottom of carrier tape with a cutter, and after replacing with good devices, seal the cut portion with adhesive tape. • Adhesiveness of cover tape: The exfoliation force between carrier tape and cover tape should be 0.2 N to 1 N for the angle from 160° to 180°. • Rolling method and quantity: Wind the tape back on the reel so that the cover tape is on the outside. Attach more than 20 cm of blank tape to the trailer and the leader of the tape and fix both ends with adhesive tape. One reel shall contain 2,000 pieces. • Safety protection during shipping: There should be no deformation of component or degradation of electrical characteristics due to shipping. 2.0 ±0.1 4.0 ±0.1 8.0 ±0.1 φ1.5 -+0.1 0.0 0.3 ±0.05 3.5 ±0.1 7.5 ±0.1 1.75 ±0.1 16.0 ±0.3 7° MAX. 4.8 ±0.25 4.1 ±0.25 NOTE: Dimensions are in mm. 10.7 ±0.1 GP2W0001YP-14 Figure 14. Tape Structure and Dimensions IrDA Data Sheet 11 GP2W0001YP 115 kbps Transceiver 21 ±0.8 13 ±0.2 2 ±0.5 22.4 MAX. 330 ±2 17.5 ±0.5 NOTE: Dimensions are in mm. GP2W0001YP-15 Figure 15. Reel Structure and Dimensions PULL-OUT DIRECTION 100 ±0.1 LENS SIDE GP2W0001YP-16 Figure 16. Direction of Product Insertion 12 IrDA Data Sheet 115 kbps Transceiver GP2W0001YP TAPING MOISTURE-PROOF PACKING Packaging Specifications Table 2. Packaging Material NAME Aluminum laminate bag Label Desiccant Outer case Pads Paper Paper MATERIAL Aluminum polyethylene Paper Storage and Treatment After Unsealing • Storage conditions: The product should be stored with these conditions: – Storage temperature: 10°C to 30°C – Humidity: below 60% RH • Treatment after opening: – After unsealing, devices should be mounted under the temperature condition of 10°C to 30°C, at the humidity conditions of below 60% RH, within two days. – In case long term storage is needed, devices should either be stored in dry box or re-sealed in a moisture-proof bag with desiccant and kept in an environment where the temperature is 10°C to 30°C, at the humidity condition of below 60% RH. Devices must be mounted within two weeks. • Baking before mounting: – In the event that the devices are not maintained in the recommended storage conditions or the enclosed desiccant indicator has turned pink, baking must be done before devices are mounted. Please also note that baking should only be done once. – Recommended condition: 100°C, 12 to 24 hours. – Baking will not be properly done with the devices in their shipping package. To complete the baking properly, devices should either be temporarily mounted to PCB with adhesive, or placed in a metal tray. The temporary mounting should be done using adhesive, not by soldering. Packaging Method • Seal the aluminum laminated bag containing the tape reel (2,000 pieces per reel) and desiccant. • Fill out necessary information on the label and paste it on the aluminum laminate bag. • Pack four aluminum laminated bags (containing one reel each) into the designated outer case, where paper pads are placed on the bottom and top of the outer case, as well as between each layer of the aluminum laminated bags. Minimum order/shipment quantity should be one laminated bag. • The outer case should then be sealed with packing tape, indicating the model name, quantity, and outgoing inspection data on the case. Total of 8,000 pieces per carton. Table 3. Packaging Method Specifications PACKAGE SHAPE Tape reel (φ 330 mm) PRODUCT 1 model QUANTITY 2,000 pieces per reel SACK QUANTITY 1 reel per moisture-proof laminated bag IrDA Data Sheet 13 GP2W0001YP 115 kbps Transceiver PRODUCTS IN TAPE-REEL PADS (TOTAL 5 SHEETS) TAPE-REEL IN ALUMINUM LAMINATED BAG (TOTAL 4 SETS) DESICCANT ALUMINUM LAMINATED BAG EXAMPLE 1 PACKING CASE LABEL (MODEL NUMBER QUANTITY DATE) TAPE-REEL IN ALUMINUM LAMINATED BAG EXAMPLE 3 440 mm TYP. 370 mm TYP. PACKING TAPE 150 mm TYP. EXAMPLE 2 PACKAGE METHOD EXAMPLES: 1. Seal the aluminum laminated bag, including the tape reel with 2,000 pieces and desiccant. 2. Fill out the model name, quantity etc. in the blank area of label and paste on the bag. 3. Put the four moisture-proof laminated bags in the ruled case. Put the pad between the bags, and top and bottom. 4. Seal the case with packing tape, and indicate model name and quantity. (8,000 pieces/package) Total Packaged mass: Approximately 3.6 kg. NOTE: Dimensions are in mm. MODEL NUMBER QUANTITY DATE EXAMPLE 4 GP2W0001YP-17 Figure 17. Packing Specification 14 IrDA Data Sheet 115 kbps Transceiver GP2W0001YP LIFE SUPPORT POLICY SHARP components should not be used in medical devices with life support functions or in safety equipment (or similiar applications where component failure would result in loss of life or physical harm) without the written approval of an officer of the SHARP Corporation. LIMITED WARRANTY SHARP warrants to its Customer that the Products will be free from defects in material and workmanship under normal use and service for a period of one year from the date of invoice. Customer's exclusive remedy for breach of this warranty is that SHARP will either (i) repair or replace, at its option, any Product which fails during the warranty period because of such defect (if Customer promptly reported the failure to SHARP in writing) or, (ii) if SHARP is unable to repair or replace, refund the purchase price of the Product upon its return to SHARP. This warranty does not apply to any Product which has been subjected to misuse, abnormal service or handling, or which has been altered or modified in design or construction, or which has been serviced or repaired by anyone other than Sharp. The warranties set forth herein are in lieu of, and exclusive of, all other warranties, express or implied. ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY EXCLUDED. In no event will Sharp be liable, or in any way responsible, for any incidental or consequential economic or property damage. The above warranty is also extended to Customers of Sharp authorized distributors with the following exception: reports of failures of Products during the warranty period and return of Products that were purchased from an authorized distributor must be made through the distributor. In case Sharp is unable to repair or replace such Products, refunds will be issued to the distributor in the amount of distributor cost. SHARP reserves the right to make changes in specifications at any time and without notice. SHARP does not assume any responsibility for the use of any circuitry described; no circuit patent licenses are implied. NORTH AMERICA EUROPE ASIA SHARP Microelectronics of the Americas 5700 NW Pacific Rim Blvd. Camas, WA 98607, U.S.A. Phone: (360) 834-2500 Telex: 49608472 (SHARPCAM) Facsimile: (360) 834-8903 http://www.sharpsma.com ©2000 by SHARP Corporation SHARP Electronics (Europe) GmbH Microelectronics Division Sonninstraße 3 20097 Hamburg, Germany Phone: (49) 40 2376-2286 Facsimile: (49) 40 2376-2232 http://www.sharpmed.com SHARP Corporation Integrated Circuits Group 2613-1 Ichinomoto-Cho Tenri-City, Nara, 632, Japan Phone: +81-743-65-1321 Facsimile: +81-743-65-1532 http://www.sharp.co.jp Reference Code SMA00011