GP2W0104YP

GP2W0104YP IrDA Data Sheet FEATURES • Built-in Photodiode • Operating voltage 2.4 V to 5.5 V • Conforms to eye safety IEC60825-1, without external resistor • This product shall not contain the following materials, and these materials shall not be used in the production process for this product. – CFCs – Halon – Carbon Tetrachloride – 1.1.1. Trichloroethane (Methylchloroform) – Specific brominated flame retardants such as the PBBOS and PBBS are not used in this device. 115 kbps Transceiver that this device does not temporarily detect the inconsistent signal, since the transmitted light from the transmitter side reaches the detector side of the same transceiver. • When designing the system (program), consider that 0.3 ms or more (at TA = 25°C, no input signal) is necessary to return from shut-down mode to readyoperation mode. In addition, thoroughly confirm the operation in the actual application. • When there is considerable external stray light or a light source is located near the transceiver, or the detector face receives considerable external stray light, a pulse other than signal output may be generated as noise on output terminal of the transceiver. Consider the layout and structure in your design to minimize disturbing light on the detector face. • When the sensor is adopted in an IR communication system, it should be used according to the signal method which is specified by ‘Serial Infrared Physical Layer Link Specification’ published by the Infrared Data Association. Faulty operation may occur, if a signal method other than that specified is used. • RXD pinout remains at high-level output in shutdown mode. The RXD pinout is CMOS output, and other CMOS outputs must not be directly connected to this pinout, as it does not conform to tri-state output. • In circuit designs, make allowance for the degradation of the light emitting diode output that results from longterm continuous operation (50% degradation/5 years). INTRODUCTION This specification applies to the outline and characteristics of IrDA 1.2 type (data rate 2.4 kbps to 115.2 kbps, low power option compliant). NOTES • Caution should be taken to prevent the detector surface from being smeared with dust or dirt, or from being touched, as it may cause faulty operation. • Cleaning conditions: – Solvent cleaning: Solvent temperature 45°C or less. Immersion for 3 minutes or less. – Ultrasonic cleaning: The effect of ultrasonic cleaning on the device differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition, etc. Test the device under actual conditions and confirm that ultrasonic cleaning does not cause any immediate or potential defects. – Cleaning solvent: The cleaning shall be carried out with ethyl alcohol, methyl alcohol, isopropyl alcohol. • In order to prevent electrostatic damage to the integrated circuit, handle this device in a static-free environment and workstation. • External force applied to the device after mounting can cause mounting defects such as the terminal coming off. Be careful when handling the device and prevent objects from touching the device after mounting. • Refer to the ‘Precautions for Soldering’ section. • When the system (program) is designed, the turn around time from transmit to receive should be designed by considering 0.5 ms or more that is specified by IrDA. This turn around time means the time 1 NC 2 NC 3 4 VDD GND 5 6 7 8 SD RXD TXD LEDA + CX VDD GND SD RXD TXD COMPONENTS CX RECOMMENDED VALUES 10 µF/6.3 V (NOTE 1) NOTES: 1. Choose the most suitable CX according to the noise level and noise frequency of power supply. 2. Pin 1 and Pin 2 are not connected internally. GP2W0104YP-1 Figure 1. Recommended External Circuit IrDA Data Sheet 1 GP2W0104YP 115 kbps Transceiver + CX LEDA 1 ENCODER CIRCUIT 2 TXD VDD 3 UART GP2W0104YP 5 DECODER CIRCUIT 4 3 RXD SD GND SD INPUT LOW HIGH PERFORMANCE Normal Mode Shutdown Mode NOTES: 1 Transmitting data waveform 2 Encoder circuit output waveform 3 Transmitter output optical signal waveform 4 GP2W0104YP receiver output waveform 5 Receiving data waveform GP2W0104YP-2 Figure 2. System Example T T Recommended Size of Solder Cream Paste 0 1 1 0 3T/16 1 Open the solder mask as shown in Figure 4. The size of solder cream paste for this device before reflow soldering must be as large as one of the foot pattern land, indicated in Figure 5. 2 1.55 3 1.1 2.0 4 NOTES: 1 Transmitting data waveform 2 Encoder circuit output waveform 3 Transmitter output optical signal waveform 4 GP2W0104YP receiver output waveform 5 Receiving data waveform T= 1 Data Rate 0.6 0.475 1.425 2.375 3.325 NOTES: 1. Dimensions are in mm. 2. Dimensions are for reference. 3. GP2W0104YP-3 Data rate: 2.4 kbps, 9.6 kbps, 19.2 kbps, 38.4 kbps, 57.6 kbps, 115.2 kbps Soldering paste area GP2W0104YP-5 Figure 3. Signal Waveform Example Figure 4. Solder Cream Size 2 IrDA Data Sheet 1.55 5 0 1 0 1 0.1 115 kbps Transceiver GP2W0104YP 1.55 CENTER OF MOUNTING AREA 1.1 2.0 0.1 1.55 8 0.6 7 6 5 4 3 2 1 0.475 1.425 PIN 1 2 3 4 5 6 7 8 NC NC VDD Ground Shutdown Receiver Data Output Transmitter Data Input LED Anode PIN NAME SYMBOL NC NC VDD GND SD RXD TXD LEDA 2.375 3.325 NOTES: 1. Dimensions are in mm. 2. Dimensions are shown for reference. 3. Connect foot pattern of shield case to GND pattern. GP2W0104YP-4 Figure 5. Foot Pattern of PCB IrDA Data Sheet 1.0 3 GP2W0104YP 115 kbps Transceiver 1.15 3.9 1.15 0.9 0.48 2.75 ±0.3 1.88 2.5 7.9 ±0.3 5.2 2 ±0.3 1.05 ±0.3 0.3 0.8 +0.2 +0.4 -0.2 1.5 ±0.3 φ2.2 φ2.2 CENTER EMBOSSED OF DETECTOR 'S' CENTER OF EMITTER 0.35 1 2 3 4 5 6 7 8 8 - 0.4 +0.2 -0.3 PO .95 x 7 = 6.65 PIN 1 2 3 4 5 6 7 8 NC NC VDD PIN NAME SYMBOL NC NC VDD GND SD RXD TXD LEDA 8 - 0.6 BOTTOM VIEW 2.15 ±0.3 2.7 ±0.3 0.6 ±0.3 Ground Shutdown Receiver Data Output Transmitter Data Input LED Anode PO .95 x 7 = 6.65 NOTES: 1. Dimensions are in mm. 2. Unspecified tolerances are ±0.2 3. Adhesion of resin to the terminal area are allowed MAX. 0.2 mm. area: Au plating GP2W0104YP-6 Figure 6. GP2W0104YP Outline Dimensions 4 IrDA Data Sheet 115 kbps Transceiver GP2W0104YP RATINGS AND CHARACTERISTICS Absolute Maximum Ratings PARAMETER Supply voltage Peak forward current Operating temperature Storage temperature Soldering temperature SYMBOL VDD IFM TOPR TSTG TSOL RATINGS 0 to 6.0 60 -20 to +85 -30 to +85 230 UNIT V mA °C °C °C 2 1 NOTES NOTES: 1. Pulse width: 78.1 µs. Duty ratio: 3/16. 2. Soldering reflow time: 5 seconds. Recommended Operating Conditions PARAMETER Supply voltage Data rate SD terminal high level input voltage SD terminal low level input voltage TXD high level input voltage TXD low level input voltage NOTES: 1. Shut down mode 2. Normal mode SYMBOL VDD BR VIHSD VILSD VIHTXD VILTXD OPERATING CONDITION 2.4 to 5.5 2.4 to 115.2 VDD -0.5 to VDD 0.0 to 0.4 VDD -0.5 to VDD 0.0 to 0.4 3. LED ON. See Figure 12. 4. LED OFF. See Figure 12. UNIT V kbps V V V V NOTES 1 2 3 4 Electrical Characteristics TA = 25°C, VCC = 3.3 V unless otherwise specified PARAMETER Current consumption at no input signal Current consumption at shut-down mode High level output voltage Low level output voltage Low level pulse width Rise time Fall time Maximum reception distance Input irradiance Radiant intensity LED peak current Rise time Fall time Peak emission wavelength NOTES: 1. No input signal, VILSD = 0 V. Output terminal open. 2. No input signal, VIHSD = VDD. Output terminal open. 3. See Figures 7, 8, and 9. SYMBOL IDD IDD-S VOH VOL tW tR tF L Ee IE ILED tR tF λp 4. 5. 6. MIN. TYP. 70 0.01 MAX. 120 1.0 0.4 UNIT µA µA V V µs µs µs cm W/m2 NOTES 1 2 3 4 5 5 5 5 5 6 6 6 6 6 3.0 1.0 6.0 0.4 0.4 20 0.09 3.6 14 20 25 26 0.6 0.6 850 870 900 mW/sr mA µs µs nm IOL = 400 µA. See Figures 7, 8, and 9. BR = 115.2 kbps, φ ≤ 15°, See Figures 7, 8, and 9. BR = 115.2 kbps, φ ≤ 15°, VIHTXD = 2.8 V. See Figures 10, 11, and 12. IrDA Data Sheet 5 GP2W0104YP 115 kbps Transceiver T1 T2 T1 tF tR VOH 90% RADIATION INTENSITY OF TRANSMITTER 3.6 mW/sr NOTE: At BR = 2.4 Kbps: T1 = 416.7 µs, T2 = 78.1 µs At BR = 115.2 Kbps: T1 = 8.68 µs, T2 = 1.63 µs GP2W0104YP-7 50% 10% tW GP2W0104YP-8 VOL Figure 7. Input Signal Waveform (Detector Side) Figure 8. Output Waveform (Detector Side) φ φ TRANSMITTER (NOTE) L GP2W0104YP OSCILLOSCOPE NOTE: 1. Transmitter uses GP2W0104YP (λp = 870 nm TYP.) which is adjusted the radiation intensity at 3.6 mW/sr. 2. φ Indicates horizontal and vertical directions. 3. Ee: Detector face illuminance < 10 x GP2W0104YP-9 Figure 9. Standard Optical System (Detector Side) 6 IrDA Data Sheet 115 kbps Transceiver GP2W0104YP 90% IE 10% tR tF GP2W0104YP-10 Figure 10. Output Waveform Specification (Emitter Side) GP2W0104YP φ φ DETECTOR FOR RADIATION INTENSITY MEASURING NOTE: φ indicates horizontal and vertical directions GP2W0104YP-11 Figure 11. Standard Optical System (Emitter Side) VDD = 3.3 V 60 1.63 µs LEDA TXD GP2W0104YP PEAK 40 FORWARD CURRENT 25 IFM (mA) 20 VIN Tx = 2.8 V BR = 115.2 Kbps GP2W0104YP-12 0 -20 -25 85 0 25 50 75 100 Figure 12. Recommended Circuit (Emitter Side) AMBIENT TEMPERATURE TA (°C) NOTE: Pulse width ≤ 78.1 µs, Duty ratio 3/16 GP2W0104YP-13 Figure 13. Peak Forward Current Versus Ambient Temperature IrDA Data Sheet 7 GP2W0104YP 115 kbps Transceiver RELIABILITY TEST ITEMS Temperature cycling High temperature and high humidity storage High temperature storage Low temperature storage Operation life 1 Operation life 2 Mechanical shock Variable frequency vibration Reflow solder head TEST CONDITIONS 1 cycle -30°C to 85°C (30 minutes) 20 cycles test +40°C, 90% RH, 20 hours +85°C, 240 hours -30°C, 240 hours +25°C, VDD = 3.3 V, 240 hours +25°C, VDD = LEDA = 3.3 V, 240 hours, Pulse width 78.1 µs, Duty ratio 3/16 1000 m/s2, 6 ms, 3 times/±X, ±Y, ±Z direction 200 m/s2, 100 to 2,000 to 100 Hz for Approximately 4 minutes 48 minutes/X, Y, Z direction 230°C, 5 s IDD > Up × 1.2 L < Low × 0.8 IE < Low × 0.8 IE > Up × 1.2 Up: Upper Specification Limint Low: Lower Specification Limint FAILURE JUDGEMENT CRITERIA SAMPLES (n) n = 22 n = 22 n = 22 n = 22 n = 11 n = 11 n = 11 DEFECTIVE (c) c=0 c=0 c=0 c=0 c=0 c=0 c=0 NOTE 1, 3, 4 1, 3, 4 1, 3, 4 1, 3, 4 1, 3, 4 1, 3, 4 3, 4 n = 11 n = 11 c=0 c=0 3, 4 2, 3, 4 NOTES: 1. The sample to be tested shall be left at normal temperature and humidity for 2 hours after it is taken out of the chamber. No dew point. 2. Refer to the ‘Precautions for Soldering’ section for temperature profile. 3. Confidence level: 90% 4. LTPD: 10%/20%. 8 IrDA Data Sheet 115 kbps Transceiver GP2W0104YP PRECAUTIONS FOR SOLDERING Solder Reflow Solder only once at the temperature and the time within the temperature profile as shown in Figure 14. may break if the deformation of the PCB affects the lead pins. Use after fully confirming the conditions of actual solder reflow machine. Soldering • Soldering iron shall be less than 25 W, and temperature of soldering iron point shall be used at less than 260°C. • Soldering time shall be within 5 seconds. • Soldered product shall treat at normal temperature. • Solder: 6/4 solder or included Ag solder. Other Precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Figure 14. Also avoid immersing the resin part in the solder. Even if within the temperature profile shown in Figure 14, there is the possibility that the gold wire in the package 230°C MAX. 200°C 1 - 4°C/s 165°C MAX. 1 - 4°C/s 1 - 4°C/s 25°C 5 s MAX. 60 s MAX. 120 s MAX. 90 s MAX. GP2W0104YP-14 Figure 14. Temperature Profile IrDA Data Sheet 9 GP2W0104YP 115 kbps Transceiver TAPING SPECIFICATIONS Taping Method • Taping structure and dimensions: The tape should have a structure in which a cover tape is sealed heatpressed on the carrier tape of conductive PET. See Figure 15. • Reel structure and dimensions: The taping reel should be conductive plastic with its dimensions as shown in Figure 16. • Direction of product insertion: Product direction in carrier tape should be such that electrode side of product is placed on the cover tape side and lens side of product is placed on the hold side of the tape. See Figure 17. • Taped device repair: To repair taped failure devices, cut the bottom of carrier tape with a cutter, and after replacing with good devices, seal the cut portion with adhesive tape. • Adhesiveness of cover tape: The exfoliation force between carrier tape and cover tape should be 0.2 N to 1 N for the angle from 160° to 180°. • Rolling method and quantity: Wind the tape back on the reel so that the cover tape is on the outside. Attach more than 20 cm of blank tape to the trailer and the leader of the tape and fix both ends with adhesive tape. One reel shall contain 2,000 pieces. • Safety protection during shipping: There should be no deformation of component or degradation of electrical characteristics due to shipping. 2.0 ±0.1 4.0 ±0.1 8.0 ±0.1 φ1.5 -0.0 +0.1 2.65 ±0.1 0.3 ±0.05 1.75 ±0.1 7.5 ±0.1 16.0 ±0.3 3.25 ±0.1 NOTE: Dimensions are in mm. 8.2 ±0.1 GP2W0104YP-15 Figure 15. Tape Structure and Dimensions 10 IrDA Data Sheet 115 kbps Transceiver GP2W0104YP 21 ±0.8 13 ±0.2 2 ±0.5 22.4 MAX. 330 ±2 17.5 ±0.5 NOTE: Dimensions are in mm. GP2W0104YP-16 Figure 16. Reel Structure and Dimensions PULL-OUT DIRECTION 100 ±1 LENS SIDE GP2W0104YP-17 Figure 17. Direction of Product Insertion IrDA Data Sheet 11 GP2W0104YP 115 kbps Transceiver TAPING MOISTURE-PROOF PACKING Packaging Specifications Table 1. Packaging Material NAME Aluminum laminate bag Label Siccative Outer case Pads Paper Paper MATERIAL Aluminum polyethylene Paper Storage and Treatment After Unsealing • Storage conditions: The product should be stored with these conditions: – Storage temperature: 10°C to 30°C – Humidity: below 60% RH • Treatment after opening: – After unsealing, devices should be mounted under the temperature condition of 10°C to 30°C, at the humidity conditions of below 60% RH, within two days. – In case long term storage is needed, devices should either be stored in dry box or re-sealed in a moisture-proof bag with siccative and kept in an environment where the temperature is 10°C to 30°C, at the humidity condition of below 60% RH. Devices must be mounted within two weeks. • Baking before mounting: – In the event that the devices are not maintained in the recommended storage conditions or the enclosed siccative indicator has turned pink, baking must be done before devices are mounted. Please also note that baking should only be done once. – Recommended condition: 100°C, 12 to 24 hours. – Baking will not be properly done with the devices in their shipping package. To complete the baking properly, devices should either be temporarily mounted to PCB with adhesive, or placed in a metal tray. The temporary mounting should be done using adhesive, not by soldering. Packaging Method • Seal the aluminum laminated bag containing the tape reel (2,000 pieces per reel) and siccative. • Fill out necessary information on the label and paste it on the aluminum laminate bag. • Pack four aluminum laminated bags (containing one reel each) into the designated outer case, where paper pads are placed on the bottom and top of the outer case, as well as between each layer of the aluminum laminated bags. Minimum order/shipment quantity should be one laminated bag. • The outer case should then be sealed with packing tape, with indicating the model name, quantity, and outgoing inspection data on the case. Total of 8,000 pieces per carton. Table 2. Packaging Method Specifications PACKAGE SHAPE Tape reel (φ 330 mm) PRODUCT 1 model QUANTITY 2,000 pieces per reel SACK QUANTITY 1 reel per moisture-proof laminated bag 12 IrDA Data Sheet 115 kbps Transceiver GP2W0104YP PRODUCTS IN TAPE-REEL PADS (TOTAL 5 SHEETS) TAPE-REEL IN ALUMINUM LAMINATED BAG (TOTAL 4 SETS) DESICCANT ALUMINUM LAMINATED BAG EXAMPLE 1 PACKING CASE LABEL (MODEL NUMBER QUANTITY DATE) TAPE-REEL IN ALUMINUM LAMINATED BAG EXAMPLE 3 440 mm TYP. 370 mm TYP. PACKING TAPE 150 mm TYP. EXAMPLE 2 PACKAGE METHOD EXAMPLES: 1. Seal the aluminum laminated bag, including the tape reel with 2,000 pieces and desiccant. 2. Fill out the model name, quantity etc. in the blank area of label and paste on the bag. 3. Put the four moisture-proof laminated bags in the ruled case. Put the pad between the bags, and top and bottom. 4. Seal the case with packing tape, and indicate model name and quantity. (8,000 pieces/package) Total Packaged mass: Approximately 0.7 kg. NOTE: Dimensions are in mm. MODEL NUMBER QUANTITY DATE EXAMPLE 4 GP2W0104YP-18 Figure 18. Packing Specification IrDA Data Sheet 13 GP2W0104YP 115 kbps Transceiver LIFE SUPPORT POLICY SHARP components should not be used in medical devices with life support functions or in safety equipment (or similiar applications where component failure would result in loss of life or physical harm) without the written approval of an officer of the SHARP Corporation. LIMITED WARRANTY SHARP warrants to its Customer that the Products will be free from defects in material and workmanship under normal use and service for a period of one year from the date of invoice. Customer's exclusive remedy for breach of this warranty is that SHARP will either (i) repair or replace, at its option, any Product which fails during the warranty period because of such defect (if Customer promptly reported the failure to SHARP in writing) or, (ii) if SHARP is unable to repair or replace, refund the purchase price of the Product upon its return to SHARP. This warranty does not apply to any Product which has been subjected to misuse, abnormal service or handling, or which has been altered or modified in design or construction, or which has been serviced or repaired by anyone other than Sharp. The warranties set forth herein are in lieu of, and exclusive of, all other warranties, express or implied. ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY EXCLUDED. In no event will Sharp be liable, or in any way responsible, for any incidental or consequential economic or property damage. The above warranty is also extended to Customers of Sharp authorized distributors with the following exception: reports of failures of Products during the warranty period and return of Products that were purchased from an authorized distributor must be made through the distributor. In case Sharp is unable to repair or replace such Products, refunds will be issued to the distributor in the amount of distributor cost. SHARP reserves the right to make changes in specifications at any time and without notice. SHARP does not assume any responsibility for the use of any circuitry described; no circuit patent licenses are implied. NORTH AMERICA EUROPE ASIA SHARP Microelectronics of the Americas 5700 NW Pacific Rim Blvd. Camas, WA 98607, U.S.A. Phone: (360) 834-2500 Telex: 49608472 (SHARPCAM) Facsimile: (360) 834-8903 http://www.sharpsma.com ©2000 by SHARP Corporation SHARP Electronics (Europe) GmbH Microelectronics Division Sonninstraße 3 20097 Hamburg, Germany Phone: (49) 40 2376-2286 Facsimile: (49) 40 2376-2232 http://www.sharpmed.com SHARP Corporation Integrated Circuits Group 2613-1 Ichinomoto-Cho Tenri-City, Nara, 632, Japan Phone: +81-743-65-1321 Facsimile: +81-743-65-1532 http://www.sharp.co.jp Reference Code SMA00002