No. Date
LCY-12T09303B
July. 21st 2009
TECHNICAL LITERATURE
For
TFT-LCD Module
Model No. LS013B4DN02
Notice The technical Literature is subject to change without any prior notice for the purpose of product improvement. Please contact Sharp or its representative before designing your product based on this literature.
Mobile Liquid Crystal Display Group SHARP CORPORATION
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LCY-12T09303B NOTICE
LS013B4DN02
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○ These specification sheets are the proprietary product of SHARP CORPORATION ("SHARP") and include materials protected under copyright of SHARP. Do not reproduce or cause any third party to reproduce them in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. ○ The application examples in these specification sheets are provided to explain the representative applications of the device and are not intended to guarantee any industrial property right or other rights or license you to use them. SHARP assumes no responsibility for any problems related to any industrial property right of a third party resulting from the use of the device. ○ SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structures and other contents described herein at any time without notice in order to improve design or reliability. Contact SHARP in order to obtain the latest specification sheets before using any SHARP's device. Manufacturing locations are also subject to change without notice. Observe the following points when in using any device in this publication. SHARP takes no responsibility for damage caused by improper use of the devices. The devices in this publication are designed for use in general electronic equipment designs, such as: ・Personal computers ・Office automation ・Telecommunication equipment ・Industrial control ・Consumer electronics ・Test and measurement equipment ・Audio visual and multimedia equipment
The appropriate design measures should be taken to ensure reliability and safety when SHARP's devices are used for equipment such as: ・Transportation control and safety equipment(i.e.,aircraft,trains,automobiles,etc.) ・Traffic signals ・Alarm equipment ・Gas leakage sensor breakers ・Various safety devices etc.
○ SHARP's devices shall not be used for equipment that requires extremely high level of reliability, such as: ・Military and space applications ・Medical equipment for life support ・Nuclear power control equipment
○ SHARP assumes no responsibility for any damage resulting from the use of the device which does not comply with the instructions and the precautions specified in these specification sheets. ○ Contact and consult with a SHARP sales representative for any questions about this device.
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[For handling and system design]
(1) Handle with care as glass is used in this LCD panel. Dropping or contact against hard object may cause cracks or chips. (2) Do not scratch the surface of the UV protection film as it is easily damaged. (3) Water droplets on the UV protection film must be wiped off immediately as they may cause color changes, or other defects if remained for a long time. (4) To clean LCD panel surface, wipe clean with absorbent cotton or soft cloth. If further cleaning is needed, use IPA (isopropyl alcohol) and wipe clean lightly on surface only. Do not use organic solvents as it may damage the LCD panel terminal area which uses organic material. Also, do not directly touch with finger. (5) To avoid circuit failure, do not touch panel terminal area. (6) Do not expose gate driver, etc. on the panel (circuit area outside panel display area) to light as it may not operate properly. Design that shields gate driver, etc. from light is required when mounting the LCD module. (7) Support for the LCD panel should be carefully designed to avoid stress that exceeds specification on glass surface. (8) Panel is susceptible to mechanical stress and such stress may affect the display. Place the panel on flat surface to avoid stress caused by twist, bend, etc.. (9) When transporting LCD panels, secure them in LCD panel tray to avoid mechanical stress. The tray should be conductive to protect LCD panels from static charge. Material used in set or epoxy resin (amine type hardening agent) from packaging, and silicon adhesive (dealcoholized or oxime) all release gas which may affect quality of UV protection film. Do confirm compatibility with user materials. (10) Do not use chloroprene rubber as it generates chlorine gas and affects reliability in LCD panel connective area. (11) This LCD module is sensitive to electrostatic discharge of 200V or more. Handle with care using cautions for the followings: Operators Operators must wear anti-static wears to prevent electrostatic charge up to and discharge from human body. Equipment and containers Process equipment such as conveyer, soldering iron, working bench and containers may possibly generate electrostatic charge up and discharge. Equipment must be grounded through 100Mohms resistance. Use ion blower. Floor Floor plays an important role in leaking static electricity generated in human body or equipment. If the floor is made of insulated material (such as polymer or rubber material), such static electricity may charge. Proper measure should be taken to avoid static electricity charge (electrostatic earth: 100Mohms).There is a possibility that the static electricity is charged to them without leakage in case of insulating floor, so the electrostatic earth:1×108Ω should be made.
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Humidity
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Humidity in work area relates to surface resistance of the persons or objects that generate electrostatics, and it can be manipulated to prevent electrostatic charge. Humidity of 40% or lower increases electrostatic earth resistance and promotes electrostatic charging. Therefore, the humidity in the work area should be kept above 40%. Specifically for film peeling process or processes that require human hands, humidity should be kept above 50% and use electricity removal blower. Transportation/Storage Containers and styroform used in transporation and storage may charge electrostatic (from friction and peeling) or electrostatic charge from human body, etc. may cause containers and styroform to have induced charge. Proper electrostatic measure should be taken for containers and storage material. (12) Protective film is attached to the surface of UV protection film on LCD panel to prevent scratches or other damages. Remove this protective film before use.
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[For operating LCD module]
(1) Do not operate the LCD panel under outside of electrical specification. Otherwise LCD panel may be damaged. (2) Do not use the LCD panel under outside of specified driving timing chart. Otherwise LCD panel may not have proper picture quality. (3) A still image should be displayed less than two hours, if it is necessary to display still image longer than two hour, display image data must be refreshed in order to avoid sticking image on LCD panel.
[Precautions for Storage]
(1) After opening the package, do not leave the LCD panel in direct sun or under strong ultraviolet ray. Store in dark place. (2) In temperature lower than specified rating, liquid crystal material will coagulate. In temperature higher than specified rating, it isotropically liquifies. In either condition, the liquid crystal may not recover its original condition. Store the LCD panel in at or around room temperature as much as possible. Also, storing the LCD panel in high humidity will damage the polarizer. Store in normal room temperature as much as possible. (3) Keeping Method a. Don't keeping under the direct sunlight. b. Keeping in the tray under the dark place.
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LCY-12T09303B [Other Notice]
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(1) Operation outside specified environmental conditions cannot be guaranteed. (2) As power supply (VDD-GND、VDDA-GND) impedance is lowered during use, bus controller should be inserted near LCD module as much as possible. (3) UV protection film is applied over LCD panel surface. time even with the UV protection film. (4) Disassembling the LCD module will cause permanent damage to the module. Do not disassemble the module. (5) If LCD panel is broken, do not ingest the liquid crystal from the broken panel. If hand, leg, or clothes come in contact with liquid crystal, wash off immediately with soap. (6) ODS (specific chlorofuorocarbon, specific halon, 1-1-1 trichloroethane, carbon tetrachloride) are not used or contained in material or all production processes of this product. (7) Observe all other precautionary requirements in handling general electronic components. Liquid crystal inside LCD panel deteriorates with ultraviolet ray. The panel should not be left in direct sun or under strong ultraviolet ray for prolonged period of
Discarding liquid crystal modules LCD Panel : Dispose of as glass waste. This LCD module contains no harmful substances. The liquid crystal panel contains no dangerous or harmful substances. This liquid crystal panel contains only an extremely small amount of liquid crystal (approximately 100mg) and therefore it will not leak even if the panel should break. Its median lethal dose (LD50) is greater than 2,000 mg/kg and a mutagenetic (Aims test: negative) material is used.
FPC
:
(1) FPC bend R should be 0.45mm or greater and R should be even. In LCD panel an connective area, do not bend FPC into UV protection film side. (2)Do not hang LCD module by FPC or apply force to FPC.
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Contents
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1. Outline ....................................................................................................................................................................................7 2. Characteristics ......................................................................................................................................................................7 3. Mechanical Specification .....................................................................................................................................................7 4. Input terminal names and functions ...................................................................................................................................8 5. Absolute Maximum Rating ...................................................................................................................................................9 6. Electrical characteristics ....................................................................................................................................................10 7. Optical characteristics ........................................................................................................................................................21 8. Module outline .....................................................................................................................................................................23 9. External capacitors .............................................................................................................................................................24 10. External Power Supply Circuit .........................................................................................................................................25 11. Packaging ..........................................................................................................................................................................26 12. Reliability Test Conditions ...............................................................................................................................................28
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1. Outline This TFT-LCD module is a reflective active matrix memory liquid crystal display module with CG silicone thin film transistor. Module outline is indicated in fig 8-1.
2. Characteristics
・ Reflective panel of white and black with aspect ratio of 1:1 ・ 1.3” screen has 96x 96 resolusion. (9216 pixels stripe array) ・ Display control by serial data signal communication. ・ Arbitrary line data renewable. ・ 1bit internal memory for data storage within the panel. ・ Thin, light-weight and compact module with monolithic technology. ・ Super low power consumption TFT panel.
3. Mechanical Specification
Table 3-1 Item Screen size Viewing Area Dot configuration Dot pitch Pixel Array Outline Dimension 3.4 (1.3”) 24.192 (H) × 24.192 (V) 96 (H) × 96 (V) Specification cm mm Dot mm mm g Pencil hardness unit
0.252 (H) × 0.252 (V) Stripe Array 28.2 (W) × 32.34 (H) × 1.40 (D) 3.6 (TYP) 3H
Mass Surface Hardness
(Note) Detail dimension and tolerance are shown in fig. 8-1 The FPC shape isn’t included in the outline dimension.
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4. Input terminal names and functions Table4-1 Terminal symbol I/O 1 2 3 4 5 6 7 8 9 10 SCLK SI SCS EXTCOMIN DISP VDDA VDD EXTMODE VSS INPUT INPUT INPUT INPUT INPUT POWER POWER INPUT GND
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Function Serial clock signal Serial data input signal Chip select signal External COM inversion signal input (H: enable) Display ON/OFF signal Power supply (Analog) Power supply (Digital) COM inversion select terminal GND(Digital)
Remark
【Remark4-2】
【Remark4-1】
GND(Analog) VSSA GND 【Remark4-1】When it’s ”H”, EXTCOMIN signal is enable. And when it’s ”L” ,sirial input flag is enable. 【Remark4-1】When it’s ”H”, EXTCOMIN signal is enable. And when it’s ”L” ,sirial input flag is enable. “H”mode; connect the EXTMODE toVDD, ”L” mode; connect the EXTMODE to VSS. 【Remark4-2】The display ON/OFF signal is only for display. Data in the memory will be saved at the time of ON/OFF. When it’s ”H”, data in the memory will display, when it’s ”L”, white color will diaplay and data in the memory will be saved. 4-2)Recommended circuit;
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5. Absolute Maximum Rating Table5-1 ( GND=0V ) Item Power supply voltage Analog Logic Symbol VDDA VDD MIN. -0.3 -0.3
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MAX. +5.8 +5.8 VDD
Unit V V V V ℃ ℃
Remark [Remark5-1] [Remark5-2] [Remark5-3,4] [Remark5-5]
Input signal voltage(high) Input signal voltage(low) Strage Temperature Operation Temperature (at panel surface) Tstg Topr1 -0.3 -30 -20
+80 +70
[Remark5-1] Applies to EXTMODE. [Remark5-2] Applies to SCLK, SI, SCS, DISP, EXTCOMIN. [Remark5-3] Do not exceed this temperature in any parts of module. [Remark5-4] Maximum wet bulb temperature is 57℃ or lower. No condensation is allowed. Cndensation will cause electeical leak and may cause the module to not meet this specification. [Remark5-5] Operating temperature is the temperature that guarantees only for the operation. For contrast, response time, and other display quality determination, use Ta=+25℃.
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6. Electrical characteristics 6-1) TFT LCD panel drive Table6-1 Recommended operating Condition Item Power supply Analog Logic Input signal voltage Hi Lo Input leak current Hi Lo symbol VDDA VDD VIH VIL IOH IOL MIN. +4.8 +4.8 +2.70 VSS TYP. +5.0 +5.0 +3.00 VSS -
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VSS(GND)=0V、Ta=+25℃ MAX. +5.5 +5.5 ※VDD VSS+0.15 TBD TBD Unit V V V V uA uA [Remark6-2] VI=3V [Remark6-2] VI=0V [Remark6-1] [Remark6-2] Remark
※Can operate below VDD voltage, however, operation around 3V is recommended. [Remark6-1] Applies to EXTMODE=”H” [Remark6-2] Applies to SCLK, SI, SCS, DISP, EXTCOMIN.
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6-2) Power supply sequence
On Sequenc e Nor mal oper ation
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Of f s equenc e
①
T1
②
T2
③※1 ④※1
T3 T4
⑤
T5
⑥
T6
⑦
T7 GND
VDD/VDDA( 5V) DISP EXTCOMIN SCS Others
GND
GND
GND
GND
Norm al operation ※2 ※2 Norm al operation Norm al operation ※2 ※2
GND
GND
GND
GND
GND
※Refer to timing chart and AC timing characteristics for detail ※1 ③ and ④ may be opposite (however, TCOM polarity inversion will not occur even with EXTCOMIN between DISP= L . Also, when DISP and EXTCOMIN are simultaneously started up, allow 30us or more before SCS starts up (It may be less than 60us). ※2 Setting value for pixel memory initialization SCS=Driving accordingly to clear pixel internal memory method (use all clear flag or write all screen white) S1=M2 (all clear flag) = “H” or write white SCLK: Normal Driving [ON Sequence] (1) 5V rise time (depends on IC) (2) Pixel memory initialization T2: 1V or more Initialize with M2 (all clear flag) or write all screen white (3) Release time for initialization of TCOM latch (4) TCOM polarity initialization time [Normal Operation] Duration of normal driving [Off Sequence] (5) Pixel memory initialization time (6) VA, VB, VCOM initialization time (7) 5V falling time (Depends on IC) [Remark] Precaustions at ehte time of power on and power off. Remark 1)When power on , VDDand VDDA are same timem or VDD should be faster than the VDDA. Remark 2) When power off, VDD and VDDA are same time or VDDA shoud be faster than the VDD. T5: 1V or more T6: 1V or more T3: 30us or more Time required to release COM related latch circuit initialization which is initializing using DISP signals T4: 30us or more Time required initializing TCOM polarity accordingly to EXTCOMIN input
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6-3) Input signal characteristics Table6-3-1 Item Frame frequency Clock frequency Vertical Interval COM Frequency
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VDDA=+5.0V、VDD=+5.0V、GND=0V、Ta=25℃ Symbol fSCS fSCLK tV fCOM 16.66 0.5 MIN 1 TYP 1 MAX 60 2 1000 30 Unit Hz MHz ms Hz Remark
Table 6-3-2 Item SCS Rising time SCS Falling Time SCS High duration SCS Low duration SCS set up time SCS hold time SI frequency SI Rising time SI Folling time SI set up time SI hold time SCLK Rising time SCLK Folling time SCLK High duration SCLK Low duration EXTCOMIN signal freequency EXTCOMIN signal rising time EXTCOMIN signal folling time EXTCOMIN signalHigh duration DISP Rising time DISP Folling time
VDDA=+5.0V、VDD=+5.0V、GND=0V、Ta=25℃ Symbol trSCS tfSCS twSCSH twSCSL tsSCS thSCS fSI trSI tfSI tsSI thSI trSCLK tfSCLK twSCLKH twSCLKL fEXTCOMIN trEXTCOMIN twEXTCOMIN thlEXTCOMIN trDISP tfDISP 1 50 50 MIN 68 12 1 3 1 120 125 200 200 TYP 0.5 450 450 1 MAX 50 50 1 50 50 50 50 60 50 50 Unit ns ns us us us us us MHz ns ns ns ns ns ns ns ns Hz ns ns us ns ns [Remark6-3] Remark
【Remark 6-3】 EXTCOMIN frequency should be made lower than frame frequency.
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SCS, SI, SCLK signal
tw SCSH
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tw SCSL
90% 50% 10% 50%
SCS
50% 10%
90%
trSCS
tsSCS
thSCS
tfSCS
SI
10%
90% 10%
90% 10% 10%
trSI tsSI thSI
tfSI
tw SCLKH
90% 10%
twSCLKL
SCLK
10%
90%
50%
50%
50%
50%
trSCLK
tfSCLK
EXTCOM IN signal
fEXTCOMIN
90% 90% 10% 50% 50% 50%
EXTCOMIN
10%
trEXTCOMIN
tfEXTCOMIN
tw EXTCOMINH
DISP signal
DISP
10% 90% 90% 10%
trDISP
tfDISP
※SCS,SI,SCLK、DISP、EXTCOMIN: 3V input voltage
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6-4) Power consumption (Average) Table6-4 Item Condition1 Condition2 Symbol MIN TYP 15 30 MAX
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Ta=25℃ unit uW uW Remark [Remark6-4] [Remark6-4]
* Measurement Condition 1 Display mode (no display data update), Display pattern: Vertical stripe display * Measurement Condition 2 Data update mode (with display data update: 1Hz) Common inversion with VDD=5V、VDDA=5V、fSCLK=1MHz、fSCS=1Hz, Display pattern: Vertical stripe display 【Remark 6-4】 This is value in steady condition, not the falue of peak power at the time of COM operation. Some marging for power supply is recommended. We recommend capacitor for VDD and VDDA. (If VDD and VDDA are on separate systems, we recommend capacitor for each.)
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6-5) Input Signal Timing Chart 6-5-1 Data update mode (1 line) Updates data of only one specified line. (M0=”H”、M2=”L”)
twSCSH S CS SI ts SI SCLK Mo de sele ction p erio d (3 ck+5c kDMY) Gate line add res s pe riod (7ck+1 ckDMY) Data writing p eriod (96ck) ts SCS M0 M1 M2 DMYDMYDMYDMYDMY AG0 AG1 AG2 AG3 AG4 AG5 AG6 DMY D1 D2 D3 D4 thSI twSCLKL twSCLKH D93 D94 D95 D96
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twSCSL thSCS DUMMY DATA(don't c are)
Data transf er p erio d (16c k)
M0: Mode flag. Set for “H”. Data update mode (Memory internal data update) When “L”, display mode (maintain memory internal data). M1: Frame inversion flag. When “H”, outputs VCOM=”H”, and when “L”, outputs VCOM=”L”. When EXTMODE=”H”, it can be “H” or “L”. M2: All clear flag. Refer to 6-5-4) All Clear Mode to execute clear. DUMMY DATA: Dummy data. It can be “H” or “L” (“L” is recommended.) ※ Data write period Data is being stored in 1st latch block of binary driver on panel. ※ Data transfer period Data written in 1st latch is being transferred (written) to pixel internal memory circuit. ※For gate line address setting, refer to 6-6) Input Signal and Display. ※M1: Frame inversion fl is enaled when EXTMODE=”L”. ※When SCS becomes L , M0 and M2 are cleared.
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6-5-2 Data Update Mode (Multiple Lines) Updates arbitrary multiple lines data. (M0=”H”、M2=”L”)
twSCSH SC S tsSCS SI tsSI SCLK Mode s election period (3ck+5ckDMY) Gate line address period (7ck+1ckDMY) GL1 Data transfer period (96ck)
M0 M1 M2 DMY DMY DMY DMY DMY AG0 A G1 AG2 AG3 AG4 AG5 AG6 DMY D1 D2 D3 D4 D93 D94
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D95
D96
DUM M Y D ATA( don' t car e)
AG0
AG1
AG5
AG6
DMY
D1
D2
thSI
twSCLKL
twSCLKH
Data trans fer period (8ck(Dumm y)+7ck(address)+1ck(Dum m y)=16ck) GL2
twSCSH
twSCSL
thSCS
D95 D96
DU M M Y D ATA( don' t car e)
AG0
A G1
AG4
AG5
AG6
DMY
D1
D2
D94
D95
D96
DUMMY DA TA (don't c are)
GL(n-1)th Line
Data transfer period (8ck(Dym my)+7c k(addres s)+1ck(Dumm y)=16ck) GL(n)th line
Data writing period (96ck)
Data transfer period (16c k)
M0: Mode flag. Set for “H”. Data update mode (Memory internal data update) When “L”, display mode (maintain memory internal data). M1: Frame inversion flag. When “H”, outputs VCOM=”H”, and when “L”, outputs VCOM=”L”. When EXTMODE=”H”, it can be “H” or “L”. M2: All clear flag. Refer to 6-5-4) All Clear Mode to execute clear. DUMMY DATA: Dummy data. It can be “H” or “L” (“L” is recommended.) ※ Data write period Data is being stored in 1st latch block of binary driver on panel. ※ Data transfer period For example, during GL2nd line data transfer period, GL 2nd line address is latched and GL1st line data is transferred from 1st latch to pixel internal memory circuit at the same time. ※ For gate line address setting, refer to 6-6) Input Signal and Display. ※ Input data continuously. ※ M1: Frame inversion flag is enabled when EXTMODE= L . ※ When SCS becomes L , M0 and M2 are cleared.
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6-5-3 Display Mode
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Maintains memory internal data (maintains current display). (M0=”L”、M2=”L”)
tV twSCSH SCS ts SCS SI ts SI SCLK Mode s election period (3c k) Data transfer period (More than 13c k)
M0 M1 M2
DU MM Y DAT A( don' t car e)
twSCSL
thSCS
M0 M1 M2
DUM M Y DATA(don' t care)
thSI
M0: Mode flag. Set for “H”. Data update mode (Memory internal data update) When “L”, display mode (maintain memory internal data). M1: Frame inversion flag. When “H”, outputs VCOM=”H”, and when “L”, outputs VCOM=”L”. When EXTMODE=”H”, it can be “H” or “L”. M2: All clear flag. Refer to 6-5-4) All Clear Mode to execute clear. DUMMY DATA: Dummy data. It can be “H” or “L” (“L” is recommended.)
※M1: Frame inversion flag is enabled when EXTMODE= L ※When SCS becomes “L”, M0 and M2 are cleared.
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6-5-4 All Clear Mode Clears memory internal data and writes white. (M0=”L”、M2=”H”)
tV twSCSH SCS ts SCS SI ts SI SCLK Mode s elec tion period (3c k) Data trans fer period (More than 13c k)
M0 M1 M2
D UM M Y DATA( don' t car e)
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twSCSL
thSCS
M0 M1 M2
D UM M Y D ATA(don' t car e)
thSI
M0: Mode flag. Set it “L”. M1: Frame inversion flag. When “H”, outputs VCOM=”H”, and when “L”, outputs VCOM=”L”. When EXTMODE=”H”, it can be “H” or “L”. M2: All clear flag. Set it “H” DUMMY DATA: Dummy data. It can be “H” or “L” (“L” is recommended.) ※M1: Frame inversion flag is enabled when EXTMODE=”L”. ※When SCS becomes L , M0 and M2 are cleared.
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6-5-5 COM Inversion
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There are two types of inputs, COM signal serial input (EXTMODE=”L”) and external COM signal input (EXTMODE=”H”). EXTMODE=“L”
SCS SI COM fCOM ※2 ※2 M0 M1 M2 ※1 M0 M1 M2 ※1 M0 M1 M2 ※1
M1:LC polarity inversion flag: If M1is "H" then VCOM="H" is output. If M1 is "L" then VCOM="L" is output. ※1:LC inversion has been changed by M1 flag statement. ※2:The periods of plus polarity and minus polarity should be same length as much as possible. EXTMODE=“H”
SCS EXTCOMIN COMZ ※1 COM fCOM ※2 ※2 ※1 ※1
fEXTCOMIN
twEXTCOMIN
※1:LC inversion polarity has been set by the rising timing of EXTCOMIN in internal circuit block as COMZ signal, ※2:The period of EXTCOMIN should be constant.
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6-6) Input Signal and Display, Gate address(Line) Setting Data position in display〔H,V〕
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UP
P1,L1 P2,L1 P3,L1 P96,L1
P1,L2
P2,L2
P1,L3
Display side up
P1,L96
P96,L96
ライン Line L1 L2 L3 ・ ・ ・ L94 L95 L96
Gate line ンアドレス設 ゲートライaddress setting定
AG0 H L H ・ ・ ・ L H L
AG1 L H H ・ ・ ・ H H L
AG2 L L L ・ ・ ・ H H L
AG 3 L L L ・ ・ ・ H H L
AG4 L L L ・ ・ ・ H H L
AG5 L L L ・ ・ ・ L L H
AG6 L L L ・ ・ ・ H H H
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7. Optical characteristics Table 7-1 Item Viewing angle CR≧3 Contrast ratio Reflecivity ratio Response time Rise Fall H V Symbol θ21,θ22 θ11 θ12 CR. R τr τd MIN. 60 60 60 5 10 50 50 50 TYP. MAX.
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Ta=25℃ unit °(degree) °(degree) °(degree) [Remark7-2、3] % ms ms [Remark7-3] [Remark 7-3,4] Remark [Remark7-1]
Panel Chromaticity
White
x y
0.313 0.338
[Remark7-3]
[Remark7-3] Optical characteristics measurement equipment. Figure 7-2 is for contrast ratio, reflectivity ratio, and panel chromaticity measurement, and figure 7-3 is for response time measurement. Both are to be conducted in a dark or room equipment to a dark room
Measurement equipment (CM-2002) Normal line
Measurement equipment (LCD-5200) Normal line
Light receiver
Light source
Light receiver
Light source Integrating sphere
-30°
LCD panel LCD panel Display center Fig7-2 Contrast ratio, Reflection ratio, Panel chromaticity of white Display center Fig7-3 response time
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[Remark7-1] Defintion of Viewint Angle Normal Line 法線
Δθ22 Δθ11 Δθ12 Δθ21
6 6時方向 ction o’clock dire [Remark7-2] Defintion of Contrast Retio
Contrast ratio(CR) =
Reflection intensity in white display Reflection intensity in black display
[Remark7-4] Respons time (Change in reflection ratio) It’s difined by the time change of optical receiver output when signal is input to display white or black
White
Black
White
(Incremental)
Optical receiver output Time
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8. Module outline 8-1) Outline dimention of the 1.3” (96×96) panel with FPC type
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fig.8-1 <Recommended Connector> 8-2) FPC Bend Specification
SMK (Bottom Contact) FP12 Series: CFP-4610-0150F
fig. 8-2
When bending FPC, bend where specified in Condition (1) and the bend R should be more than R specified in Condition (2). FPC is not to contact glass edge, and there should be no stress to connective area between panel and FPC. Condition (1) FPC bend recommended area: 0.8mm – 6.0mm from glass edge. Condition (2) Minimum bend R: Inner diameter R0.45
Fig.8-3 【Remark 8-1】 Do not bend backward (toward UV protection film side) 【Remark 8-2】 Bend frequency: 3 times or less (Repeat bend condition: 180°∼ 0°) <Recommended Connector of 180 degree bent FPC> SMK (Contact side: upper side ) FP-12 series : CFP-4510-0150F
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9. External capacitors
Fig. 9-1 External capacitor recommendation capacity value <Recommended capacity value> C1:DISP- VSS: rank B C3:VDD- VSS: rank B 0.1uF Ceramic capacitor 1uF Ceramic capacitor ※Above circuit and parts are only recommendation. For actual use, please evaluate their conformity with your system and design. (Capacitor pressure resistance can be larger than resistance indicated above.) C2:VDDA- VSS: rank B 1uF Ceramic capacitor
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10. External Power Supply Circuit An external power supply circuit is necessary to drive the Pixel Memory LCD with the 3V battery. Table 1-1 shows power supply IC of the recommendation. Table 1-1 Maker SII National Semiconductor Model Number S-8821 LM2750 Note Charge pump type Charge pump type
Refer to specifications of each power supply IC for a detailed specification. Set the constant value after it evaluating it sufficiently by an actual application when you use it. Electrical specification Table 2-1 Model Number S-8821 LM2750 Vin [V] min max min Vout typ max Iout [A]
2.8 2.7
5.0 5.6
4.9 4.8
5.0 5.0
5.1 5.2
0.04 0.04
Refer to specifications of each power supply IC for a detailed specification. Set the constant value after it evaluating it sufficiently by an actual application when you use it. Reference circuit The reference circuit is shown below.
S-8821
LM2750
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11. Packaging
11-1) Serial number (Ink-jet print) Will be indicated on serial number label as indicated in Figure 11-1 outline dimension figure. Model number
Print structure
LS013B4DN02 9312AD00001FA Display side up Back side up
ABC Serial number specifications A:a single figure of the year B:month(1,2....9,X,Y,Z) C:day D:serial number
D
Fig. 11-1 Serial number print position
11-2) Forwarding form 1) Piling number of cartons : Max 12 Package quality in a carton : 800pcs 2) Storage condition ・ ・ Temperature: 0∼40℃ Humidity: 60%RH or lower (at 40℃) There should be no condensation at low temperature and high humidity. ・ Atmosphere: No harmful gas, such as acid or alkali, which causes severe corrosion on electronic parts and wiring, are to be detected. ・ ・ Period: About 3 months Opening the package: in order to prevent electrostatic damage to TFT modules, room humidity should be made over 50%RH and take effective measure such as use of earth when opening the package.
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11-3) Packaging
Fig. 12-2 Packaging Form
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12. Reliability Test Conditions
12-1) Reliability test items Table12-1 Test Item 1 2 3 4 5 6 7 High temperature storage test Low temperature storage test High temperature and high humidity operating test High temperature operating test Low temperature operating test Shock test (Non operating test) Electro static discharge test Tp=70degrees Celsius Tp=-20degrees Celsius
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Test condition Ta=80degrees Celsius Ta=35degrees Celsius 240h 240h
Remark
Tp=40degrees Celsius/95%RH
240h
240h 240h
Ta=-30degrees Celsius (1h)∼+80 degrees Celsius (1h) / 5 cycle ±200V、200pF(0Ω) each terminai: 1 time
[Remark] Ta = Ambient temperature, Tp = Panel temperature (Evaluation method) In the standard condition, there shall be no practical problems that may affect the display function.
12-2) Panel surface stress spesification Panel surface stress spesification has been defined as a parameter “Force of stress [N]” without no picture failer. Load testing: Minimum 120[N] Test condition ) Test stracture Press point Press Jig Press speed Support Press time :LCD panel with UV protection film :Center of LCD panel :φ10mm column :1mm/minute :fixed on stage :5 seconds after achivement of the press strength,then reless it.