PC3H2/PC3Q62
PC3H2/PC3Q62
s Features
1. Half pitch surface mount type for high density mounting (Lead pitch : 1.27 mm) 2. High resistance to noise due to high common mode rejection voltage (CMR : MIN.10kV/µs) 3. Soldering reflow type (230°C, for 30seconds) 4. High temperature tested model 5. Taping package PC3H2 (1ch) PC3Q62 (4ch) 6. Recognized by UL, file No. E64380
High Resistance to Noise, Half Pitch Photocoupler
s Outline Dimensions
PC3H2 2.6±0.3 Anode mark
1
(Unit : mm)
S 3H2
4.4±0.2 5.3±0.3 (1.7)
4
2
3
1.27±0.25
0.4±0.1
Epoxy resin 2.0±0.2 0.1±0.1
1 2 3 4 1 2 9 10 3 4 11 12 5 6 13 14 7 8 15 16
0.2
±0.05
s Applications
1. Programmable controllers
7.0+0.2 −0.7
+0.4 0.5−0.2
Parting line
g ( ) : Reference dimensions Internal connection diagram
4 3
s Package Specifications
Model No. PC3H2 PC3Q62 Package specification Taping reel diameter 330mm (3 000pcs) Taping reel diameter 330mm (1 000pcs) (Ta=25˚C) Unit mA A V mW V V mA mW mW ˚C ˚C kVrms ˚C
0.2mm or more PC3Q62
Anode Cathode Emitter Collector
s Absolute Maximum Ratings
Parameter Symbol Rating *1 Forward current IF 50 *2 Peak forward current 1 IFM Input VR 6 Reverse voltage *1 P 70 Power dissipation *1 Collector-emitter voltage VCEO 70 6 Emitter-collector voltage VECO IC 50 Output Collector current *1 Collector dissipation 150 PC *1 Total power dissipation 170 Ptot Operating temperature Topr −30 to +100 Tstg −40 to +125 Tstg Storage temperature *3 Viso Isolation voltage Viso 2.5 *4 Soldering temperature TSOL 260
1
2
10.3±0.3
16
1.27±0.25
9
Anode Cathode Emitter Collector
0.4±0.1
1
4.4±0.2
Primary Side mark
S PC3Q62
C0.4 0.2±0.05 Epoxy resin
8
5.3±0.3
0.1±0.1 2.6±0.2
+0.4 0.5−0.2
6° Internal connection diagram
16 15 14 13 12 11 10
+0.2 7.0−0.7
*1 The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig.2 to 5 *2 Pulse width
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