PC3Q67

. I-), Ti&Grr~A APPROVED c-’ ?. .r SPEC No. DATE PREPARED BY: SHARI= _ qp-; I 9 1993 BY: DATE /: it!.. ,., f ,I.. - -- ELECTRONIC s,I ! ,; FILE No. -- ~~ COMPONENTS CROUP ISSUE April PAGE 12 Pages REPRESENTATIVE SHARP CORPORATION I ED-93033 9, 1993 DIVISION q PHOTOVOLTAICS DIV. q OPTO-ELECTRONIC DEVICES n ELECTRONIC 1 SPECIFICATION DJV COMPONENTS DIV. 10 w ’ DEVICE SPECIFICATION FOR PHOTOCOUPLER hiODEL 1. No. This specification sheets include the contents under the copyright of Please keep them with reasonable care as sharp Corporation (“Sharp”). important information. Please don’t reproduce or cause anyone reproduce :hem \;i’thout 2. Dlease (1) This Main Sharp’s consent. obey the instructions mentioned below for device is designed for general electronic uses of this device are as follows; . actual use of this equipment. - Computer * OA equipment -Telecommunication equipment * AV equipment - Measuring equipment -Tooling machine etc. C- Home appliance, (Zj Please take proper steps in order to maintain reliability in case this device is used for the uses mentioned below high reliability. -Unit concerning control and safety of a vehicle automobile etc.) * Gas leak detection breaker *Other safety i -Fire box and burglar alarm box (2) Please don’t use for the uses mentioned extremely high reliability Telecommunication Medical element), 0 CLJSTG:6RR’S DATE BY etc. below equipment equipment device. (Terminal) and safety, which require (air plane, train, - Traffic signal equipment, etc.. which 1 I require (Trunk) (relating to any fatal 1 APPROVAL T. Matsumura, Department General Manager of Engineering Dept., TI Opto-Electronic Devices Div. ELECOMGroup SHARP CORPORATION MODEL No. PACE PC3Q67 i. Application This specification photocoupler Model 2. applies to the outline No. PC3Q67. and characteristics of Outline Refer 3. 1 to the attached Ratings 3.1 drawing No. CY5890K02. and characteristics Absolute maximum ratings Ta=25"C iInput *1 Parameter --------_ Forward current *2 Peak forward Symbol IF current / Im / ! Reverse voltage "R ; *1 Power dissipation P / I ioutput ! ! 1 *l *3 *4 50 1 1 / A 6 I f , 1 V "CEO Emitter-collector voltage VECO ) 6 Ic i 50 current Collector power dissipation Total power dissipation Operating temperature ___Storage temperature -__-_-_--______ Isolation voltage -_~.--Soldering temperature --___. --__ I Ptot i' Topr i Tstg *1 The derating temperature factors of absolute maximum are shown in Fig. 1 'L 4. *2 Pulse < lOOus, *3 AC for *4 For 10 s width lmin., Duty ratio 40 ,-I, 60%RH, f=60Hz : 0.001 mW 35 j ! ! 1 I 1 rating (Refer " i ( "1 1 I * 1 mW j I i LUW ' 150 170 -30 % +lOO -40 'L +125 due to ambient to Fig. , mA 70 voltage Collector Unit j Collector-emitter /2..-*l Rating 5) ! OC MODEL 2 PC3Q67 3.2 Electra-optical l PACE hb. characteristics Ta=25"C ----T----Symbol MIN. Parameter ----.---+--Forward voltage -1 Input I VF - , I TYP. MAX. i 1.2 1 ! 1.4 Reverse current Terminal output capacitance / Collector-emitter breakdown voltage 1 ICE0 / 10 I 250 f Dark current ' - / - 100 Unit Conditions v ?F=20mA I 1 pA ‘VR=4V i I I I 'V=O, f=lkHz i pF I I ti /vCE=20v, IF'0 1 ! I i I Emitter-collector brakdown voltage Collector current Collector-emitter saturation voltage ------Isolation resistance Transfer characterostocs Response time (Rise) / r L tr Response time (Fall) I j- 14 18 I 1 US jVCE=2V , tf / - 3 18 ps 'Ic=2mA RL=lOOQ j 4. Reliability Refer 5. to the attached Incoming Refer 6. sheet, Page 7. sheet, Page 8. inspection to the attached Supplements 6.1 shall be measured in the following Short between anode and cathode on the primary between collector and Emitter on the secondary (2) The dielectric be used. (3) The waveform of applied (It is recommended that in insulation oil) withstand tester with voltage shall the isolation zero-cross This product is not designed (2) This product is assembled with (3) This product incorporates non coherent Package as radiation uL : Under attached preparation sheet, side and side. circuit shall hardened. electrical specifications to the method. be a sine wave. voltage be measured (1) Refer 6.4 voltape ( 1) 6.2 6.3 Isolation Page 9 to 11. input light and output. emitting diode. PAGE 4 MODEL No. PC3Q67 7. Notes 7.1 For cleaning * Cleaning conditions: (1) Solvent cleaning: Solvent temperature 45°C or less Immersion 3 min. or less (2) Ultrason ic Affection to device by ultrasonic cleaning has different affection by cleaning bath size, ultrasonic power output, cleaning time, PWB size If user or device mounting condition etc. carries out ultrasonic cleaning, user should select fit condition that doesn't occur defect. * The cleaning Solvent: c 1 eaning: shall be Carrie Ethyl Freon out with solvent below. alcohol, Methyl alcohol, TE.TF, Daiflon-solvent Isopropyl S3-E alcohol Please refrain from using Chloro Fluoro Carbon type solvent to clean devices as much as possible since it is restricted to protert the ozonosphere. Before you use alternative solvent you are requested to confirm that it does not damage package resin. 7.2 On mounting In mounting this device, please perform soldering reflow satisfied with the conditions indicated in page 12. And please pay attention not to occur the temperature rising of the package sectionally. 8. Others Any doubt as to this specification shall be determined upon mutual consultation of the both parties. in good faith pC3Q67 Date code Page 5 *1 .2 Pin Nos. connection and internal diagram Pti3Q67 m d ti c 0.4 Epoxy'- resin W & \,f *I) i Date code is composed of 2-digit number marked according to DIN standard and t'lie following weekly-code . First week : 1 Second week : 2 Third week : 3 Fouth week : 4 UNIT :1/l mm Fifth, Sixth week : 5 Name P-Q67 Outline Dimensions Drawin CY589OKO2 No. .; Page 6 pc3Q67 Fig. 1 Forward ambient current vs. temperature Fig. 2 I I 40 / Y 30-20 - - - i- 10 -‘JO- 0 Ambient 3 25 - ~t-b 55 75 100 temperature Ta ("C) Collector power dissipation vs. ambient temperature r\ I I I 80. 70 60 - I \ Ambi!nt fzmper?tur! --t-I \ 40 20 -030 Fig. 4 Ty"(OC) Total power dissipation vs. ambient temperature 200 -. 170 150 100 ..-\ . 50--. -30 0 Ambient Pig. i 5 I 1 looI-i--l-l--t-1-1 SO Fig. Diode power dissipation temperature vs. ambient 25 50 temperature 75 100 Ta ("C) Peak forward current vs. duty ratio Pulse width 5 100~s Ta - 25C Duty ratio 01111111 -30 Ambi!ent ~?rnpe?!atu~~ ?!'("C) PAGE 4. Reliability The reliability Test I ! shall Test heat be satisfied with Confidence level 23O"C, 5 s *2 260°C 10 s below. : 90%, LTPD : 10X/20% 2 IR>uX ICE0 15000m/sZ~1500G~, 0.5ms 3 times/s, ?Y, +Z direction 100 'L 2000 Q 100 Hz/4 4 times/X,Y Z direction / 200m/sZ{20G] j Temperature 1 cycling listed VF > u X 1.2 Weight : lNiO.lkgf} 1 time/each termianl frequency items Conditions *l .:! Terminal strength : (Bending) *3 / ! Mechanical shock / . I Variable ! vibration products Items ; Solderability i Soldering of Ic > u X n=ll, C=O n=ll, C=O 2 < L x 0.7 min. > u x 1.2 ' 1 cycle -40°C --I, +125"C (30min.) (30min.) 20 cycle test , *l Solder shall lead and pin --adhere at the area of 95% or more of immersed hole or other holes shall not be concentrated *2 The lead pin root of lead depth pins. *3 Terminal bending dipped (Refer direction into solder shall to the below) is shown be away 0.2mm from below. 0.211~s or more :.-i...