PC3SH21YFZ

PC3SH21YFZ Series PC3SH21YFZ Series ∗ VDRM : 600V, Reinforced insulation type Zero cross type DIP 4pin Phototriac Coupler for triggering Non-zero cross type is also available. (PC3SH11YFZ Series) ■ Description PC3SH21YFZ Series r einforced insulation type Phototriac Coupler include an infrared emitting diode (IRED) optically coupled to an output Phototriac. These devices feature full wave control and are ideal isolated drivers for medium to high current Triacs. DIP package provides 5.0kV isolation from input to output with superior commutative noise immunity. ■ Agency approvals/Compliance 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. 3SH21) 2. Approved by CSA, file No. CA95323 (as model No. 3SH21) 3. Approved by BSI : BS-EN60065, file No. 6690/BSEN60950, file No. 7421, (as model No. 3SH21) 4. Approved by SEMKO, EN60065/EN60950, file No. 0226022 (as model No. 3SH21) 5. Approved by DEMKO, EN60065/EN60950, file No. 311791 (as model No. 3SH21) 6. Approved by FIMKO, EN60065/EN60950, file No. 18397 (as model No. 3SH21) 7. Approved by VDE ( ∗ ) (DIN EN 60747-5-2), file No. 40008087 (as model No. 3SH21) 8. Package resin : UL flammability grade (94V-0) (∗) ■ Features 1. High repetitive peak off-state voltage (VDRM : 600V) 2. Zero crossing functionality (VOX : MAX. 20V) 3. IFT ranks available (see Model Line-up section in this datasheet) 4. 4 pin DIP package 5. Reinforced insulation type (MIN. 0.4mm internal separation) 6. Superior noise immunity (dV/dt : MIN. 1 000V/µs) 7. Lead-free components are also available (see Model Line-up section in this datasheet) 8. Double transfer mold construction (Ideal for Flow Soldering) 9. High isolation voltage between input and output (Viso(rms) : 5.0kV) DIN EN60747-5-2 : successor standard of DIN VDE0884. Up to Date code "RD" (December 2003), approval of DIN VDE0884. From Date code "S1" (January 2004), approval of DIN EN60747-5-2. ■ Applications 1. Triggering for Triacs used to switch on and off devices which require AC Loads. For example heaters, fans, motors, solenoids, and valves. 2. AC line control in power supply applications. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A07301EN Date Mar. 31. 2004 © SHARP Corporation PC3SH21YFZ Series ■ Internal Connection Diagram 1 4 1 2 3 4 2 3 Anode Cathode Anode/Cathode Cathode/Anode Zero Crossing Circuit ■ Outline Dimensions 1. Through-Hole [ex. PC3SH21YSZ] Anode mark 1.2±0.3 0.6±0.2 Rank mark Factory identification mark (Unit : mm) 2. Wide Through-Hole Lead-Form [ex. PC3SH21YFZ] Rank mark Factory identification mark Date code (2 digit) 1 4 Anode mark 1.2±0.3 0.6±0.2 Date code (2 digit) 4.58±0.5 1 4 2 3 Model No. 2.54±0.25 6.5±0.5 7.62±0.3 Model No. 6.5±0.5 7.62±0.3 2.54±0.25 VDE identification mark 4.58±0.5 0.5TYP. 3.5±0.5 1.0±0.1 3 S H21 4 2 3SH 21 4 3 4.58±0.5 VDE identification mark 4.58±0.5 3.5±0.5 0.26±0.1 Epoxy resin 0.26 θ ±0.1 2.7±0.5 3.0±0.5 2.7MIN. Epoxy resin 10.16±0.5 0.5±0.1 0.5±0.1 θ : 0 to 13˚ θ Product mass : approx. 0.23g 3. SMT Gullwing Lead-Form [ex. PC3SH21YIP] Anode mark 1.2±0.3 ±0.2 Product mass : approx. 0.23g 4. Wide SMT Gullwing Lead-Form [ex. PC3SH21YUP] Rank mark Rank mark Factory identification mark Anode mark 1.2±0.3 ±0.2 Factory identification mark Date code (2 digit) 0.6 1 4 0.6 Date code (2 digit) 1 4 4.58±0.5 Model No. ±0.25 1.0 ±0.1 2 3 SH21 4 6.5±0.5 3 2 3SH 21 4 6.5±0.5 3 7.62±0.3 ±0.1 4.58±0.5 3.5±0.5 7.62±0.3 0.25±0.25 2.54±0.25 VDE identification mark Model No. 2.54 4.58±0.5 VDE identification mark 4.58±0.5 3.5±0.5 0.5±0.1 ±0.25 0.26 0.35 1.0+0.4 −0 Epoxy resin 10.0+0 −0.5 1.0+0.4 −0 2.54±0.25 Epoxy resin 0.75 ±0.25 10.16 ±0.5 12.0MAX Product mass : approx. 0.21g Product mass : approx. 0.22g 0.26±0.1 0.75 ±0.25 Sheet No.: D2-A07301EN 2 PC3SH21YFZ Series Date code (2 digit) 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M · · N · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 Mark P R S T U V W X A B C · · · repeats in a 20 year cycle Factory identification mark Factory identification Mark no mark Japan Indonesia Philippines China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production. Country of origin Rank mark Refer to the Model Line-up table Sheet No.: D2-A07301EN 3 PC3SH21YFZ Series ■ Absolute Maximum Ratings Parameter Symbol Rating IF 50 Forward current Input VR 6 Reverse voltage IT(rms) 0.1 RMS ON-state current *3 Output Peak one cycle surge current 1.2 Isurge 600 VDRM Repetitive peak OFF-state voltage *1 5.0 Viso(rms) Isolation voltage −30 to +100 Topr Operating temperature −55 to +125 Tstg Storage temperature *2 270 *4 Tsol Soldering temperature *1 40 to 60%RH, AC for 1minute, f=60Hz *2 For 10s *3 f=50Hz sine wave *4 Lead solder plating models: 260˚C (Ta=25˚C) Unit mA V A A V kV ˚C ˚C ˚C Soldering area ■ Electro-optical Characteristics Parameter Forward voltage Input Reverse current Repentitive peak OFF-state current ON-state voltage Holding current Output Critical rate of rise of OFF-state voltage Rank B Zero cross voltage Rank C Rank B Transfer Minimum trigger current Rank C characIsolation resistance teristics Turn-on time Symbol VF IR IDRM VT IH dV/dt VOX IFT RISO ton Conditions IF=20mA VR=3V VD=VDRM IT=0.1A VD=4V − VD=1/√2 ·VDRM IF=15mA, Resistance load IF=8mA, Resistance load VD=4V, RL=100Ω DC500V,40 to 60%RH VD=4V, RL=100Ω, IF=20mA MIN. TYP. 1.2 − − − − − − − − 0.1 1 000 2 000 − − 5×1010 − − − 1011 − 1mm (Ta=25˚C) MAX. 1.4 10 1 3.0 3.5 − 20 7 5 − 50 Unit V µA µA V mA V/µs V mA Ω µs Sheet No.: D2-A07301EN 4 PC3SH21YFZ Series ■ Model Line-up (1) (Lead-free components) Lead Form Shipping Package DIN EN60747-5-2 Model No. Approved PC3SH21YSZBF PC3SH21YSZCF Through-Hole SMT Gullwing Sleeve 100pcs/sleeve Approved PC3SH21YIZBF PC3SH21YIZCF Wide Through-Hole Rank mark Approved PC3SH21YFZBF PC3SH21YFZCF B C MAX.7 MAX.5 IFT[mA] (VD=4V, RL=100Ω) Lead Form Shipping Package DIN EN60747-5-2 Model No. Wide SMT Gullwing Sleeve 100pcs/sleeve Approved PC3SH21YUZBF PC3SH21YUZCF SMT Gullwing Wide SMT Gullwing Taping 2 000pcs/reel Rank mark Approved PC3SH21YUPBF PC3SH21YUPCF B C MAX.7 MAX.5 IFT[mA] (VD=4V, RL=100Ω) - Approved PC3SH21YIPBF PC3SH21YIPCF - ■ Model Line-up (2) (Lead solder plating components) Lead Form Shipping Package DIN EN60747-5-2 Model No. Approved PC3SH21YSZB PC3SH21YSZC Through-Hole SMT Gullwing Sleeve 100pcs/sleeve Approved PC3SH21YIZB PC3SH21YIZC Wide Through-Hole Rank mark Approved PC3SH21YFZB PC3SH21YFZC B C MAX.7 MAX.5 IFT[mA] (VD=4V, RL=100Ω) Lead Form Shipping Package DIN EN60747-5-2 Model No. Wide SMT Gullwing Sleeve 100pcs/sleeve Approved PC3SH21YUZB PC3SH21YUZC SMT Gullwing Wide SMT Gullwing Taping 2 000pcs/reel Approved PC3SH21YUPB PC3SH21YUPC Rank mark IFT[mA] (VD=4V, RL=100Ω) MAX.7 MAX.5 - Approved PC3SH21YIPB PC3SH21YIPC B C Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A07301EN 5 PC3SH21YFZ Series Fig.1 Forward Current vs. Ambient Temperature 70 RMS ON-state current Ir (rms) (mA) 60 Forward current IF (mA) 50 40 30 20 10 0 −30 10 50 100 Ambient temperature Ta (˚C) Fig.2 RMS ON-state Current vs. Ambient Temperature 175 150 125 100 75 50 25 0 −30 10 50 100 Ambient temperature Ta (˚C) Fig.3 Forward Current vs. Forward Voltage Fig.4 Minimum Trigger Current vs. Ambient Temperature 7 6 5 4 3 2 1 VD=4V RL=100Ω 100 Forward current IF (mA) 50 Ta=75˚C 50˚C 25˚C 10 5 0˚C −25˚C Minimum trigger current IFT (mA) 1.5 1 0.9 1 1.1 1.2 1.3 1.4 0 −40 −20 0 20 40 60 80 100 Forward voltage VF (V) Ambient temperature Ta (˚C) Fig.5 Relative Repetitive Peak OFF-state Voltage vs. Ambient Temperature 1.3 Relative repetitive peak OFF-state voltage VDRM (Tj=Ta) / VDRM (Tj=25°C) 1.2 1.1 1 0.9 0.8 0.7 −40 Fig.6 ON-state Voltage vs. Ambient Temperature 2.5 IT=0.1A ON-state voltage VT (V) 2 1.5 −20 0 20 40 60 80 100 1 −40 −20 0 20 40 60 80 100 Ambient temperature Ta (°C) Ambient temperature Ta (˚C) Sheet No.: D2-A07301EN 6 PC3SH21YFZ Series Fig.7 Holding Current vs. Ambient Temperature 1 Repetitive peak OFF-state current IDRM (A) VD=4V Fig.8 Repetitive Peak OFF-state Current vs. Ambient Temperature 10−5 VD=600V Holding current IH (mA) 10−6 0.1 10−7 10−8 0.01 −40 10−9 −20 0 20 40 60 80 100 0 20 40 60 80 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Fig.9 Zero-cross Voltage vs. Ambient Temperature (rank B) 20 Resistance load, IF=15mA Zero-cross voltage VOX (V) Fig.10 Zero-cross Voltage vs. Ambient Temperature (rank C) 20 Resistance load, IF=8mA Zero-cross voltage VOX (V) 15 15 10 10 5 5 0 −40 −20 0 20 40 60 80 100 0 −40 −20 0 20 40 60 80 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Remarks : Please be aware that all data in the graph are just for reference. Sheet No.: D2-A07301EN 7 PC3SH21YFZ Series ■ Design Considerations ● Design guide In order for the Phototriac to turn off, the triggering current (IF) must be 0.1mA or less. Please refrain from using these devices in a direct drive configuration. These Phototriac Coupler are intended to be used as triggering device for main Triacs. Please ensure that the output rating of these devices will be sufficient for triggering the main output Triac of your choice. Failure to do may result in malfunctions. For applications with inductive loads such as motors,please use caution in utilizing a zero crossing type Phototraiac Coupler as this may cause undesired operations due to the phase difference between voltage and current of load. For designs that will experience excessive noise or sudden changes in load voltage, please include an appropriate snubber circuit as shown in the below circuit. Please keep in mind the Sharp Phototriac Coupler incorporate superrior dV/dt ratings which can eliminate the need for a snubber circuit. For over voltage protection, a Varistor may be used. ● Degradation In general, the emission of the IRED used in Phototriac Couplers will degrade over time. In the case where long term operation and / or constant extreme temperature fluctuations will be applied to the devices, please allow for a worst case scenario of 50% degradation over 5years. Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should provide at least twice the minimum required triggering current from initial operation. ● Recommended Foot Print (reference) SMT Gullwing Lead-form 8.2 Wide SMT Gullwing Lead-form 10.2 2.54 2.54 1.7 2.2 2.2 1.7 (Unit : mm) Sheet No.: D2-A07301EN 8 PC3SH21YFZ Series ● Standard Circuit (Medium/High Power Triac Drive Circuit) PC3SH21YFZ 1 4 Load Triac AC Line 2 3 Zero Crossing Circuit Note) Please add the snubber circuit according to a condition. Any snubber or varistor used for the above mentioned scenarios should be located as close to the main output triac as possible. ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A07301EN 9 PC3SH21YFZ Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less 100 Preheat 150 to 180˚C, 120s or less 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A07301EN 10 PC3SH21YFZ Series ● Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. Sheet No.: D2-A07301EN 11 PC3SH21YFZ Series ■ Package specification ● Sleeve package 1. Through-Hole or SMT Gullwing Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 520 ±2 6.7 5.8 10.8 (Unit : mm) 2. Wide Through-Hole or Wide SMT Gullwing Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 15.0 6.35 5.9 10.8 520 ±2 (Unit : mm) Sheet No.: D2-A07301EN 12 PC3SH21YFZ Series ● Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E D G C I J B H A H Dimensions List A B 16.0±0.3 7.5±0.1 H I ±0.1 10.4 0.4±0.05 C 1.75±0.1 J 4.2±0.1 D 8.0±0.1 K 5.1±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e g c d Dimensions List a b f a b 5˚ K X. MA 330 e 23±1.0 17.5±1.5 f 2.0±0.5 (Unit : mm) c d ±1.0 100 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 2 000pcs/reel] Sheet No.: D2-A07301EN 13 PC3SH21YFZ Series 2. Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E D G C I J B H A K Dimensions List A B 24.0±0.3 11.5±0.1 H I ±0.1 12.4 0.4±0.05 C 1.75±0.1 J 4.1±0.1 D 8.0±0.1 K 5.1±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e g c d Dimensions List a b 330 e 23±1.0 25.5±1.5 f 2.0±0.5 5˚ MA X. H a f b (Unit : mm) c d ±1.0 100 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 2 000pcs/reel] Sheet No.: D2-A07301EN 14 PC3SH21YFZ Series ■ Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A07301EN 15