PC457S0NIP0F Series
PC457S0NIP0F
Series
High Speed 1Mb/s, High CMR
Mini-flat Package ∗OPIC Photocoupler
■ Description
■ Agency approvals/Compliance
PC457S0NIP0F Series contains a LED optically coupled to an OPIC.
It is packaged in a 8 pin mini-flat.
Input-output isolation voltage(rms) is 3.75 kV.
High speed response (TYP. 1Mb/s) and CMR is MIN.
15kV/μs.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC457S)
2. Approved by VDE, DIN EN60747-5-2(∗) (as an option), file No. 40009162 (as model No. PC457S)
3. Package resin : UL flammability grade (94V-0))
(∗)
■ Features
DIN EN60747-5-2 : successor standard of DIN VDE0884.
■ Applications
1. 8 pin Mini-flat package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. High noise immunity due to high instantaneous common mode rejection voltage (CMH : MIN. 15kV/μs, CML
: MIN. −15kV/μs)
4. High speed response
(tPHL : TYP. 0.2μs, tPLH : TYP. 0.4μs)
5. Isolation voltage between input and output (Viso(rms) :
3.75kV)
6. Lead-free and RoHS driective compliant
1. Programmable controller
2. Inverter
* "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A09101EN
Date Sep. 1. 2006
© SHARP Corporation
PC457S0NIP0F Series
■ Internal Connection Diagram
8
7
6
5
1
2
3
4
1
2
4
3
N.C.∗
Anode
Cathode
N.C.∗
5
6
7
8
GND
VO (Open collector)
N.C.∗
VCC
∗
As for N.C. pins (➀, ➃, ➆), external
connection is not allowed.
■ Outline Dimensions
(Unit : mm)
5
1
2
3
4
Primary side
mark
1
2
3
4
1.27±0.05
0.406±0.076
Rank mark
5
PC457S
4
1.27±0.05
6
Rank mark
Date code
Date code
5.080±0.127
0.305MIN.
3.175±0.127
0.203±0.102
3.175±0.127
0.200±0.025
5.080±0.127
VDE Identification mark
0.406±0.076
0.200±0.025
Primary side
mark
7
0.305MIN.
Product mass : approx. 0.15g
0.203±0.102
PC457S
8
SHARP
mark
"S"
5.994±0.203
6
5.994±0.203
7
3.937±0.127
8
SHARP
mark
"S"
2. Mini-flat Package (VDE option) [ex. PC457S0YIP0F]
3.937±0.127
1. Mini-flat Package [ex. PC457S0NIP0F]
Product mass : approx. 0.15g
Plating material : Pd (Au flush)
Sheet No.: D2-A09101EN
2
PC457S0NIP0F Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
Mark
A.D.
A
2002
B
2003
C
2004
D
2005
E
2006
F
2007
H
2008
J
2009
K
2010
L
2011
M
2012
N
:
Mark
P
R
S
T
U
V
W
X
A
B
C
:
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
repeats in a 20 year cycle
Country of origin
Japan
Rank mark
With or without.
Sheet No.: D2-A09101EN
3
PC457S0NIP0F Series
■ Absolute Maximum Ratings
Parameter
*1
Forward current
Reverse input voltage
Input
*2
Input power dissipation
Supply voltage
Output voltage
Output
Output current
*3
Output power dissipation
*4
Isolation voltage
Operating temperature
Storage temperature
*5
Soldering temperature
Symbol
IF
VR
PI
VCC
VO
IO
PO
Viso(rms)
Topr
Tstg
Tsol
Rating
25
5
45
−0.5 to +30
−0.5 to +20
8
100
3.75
−55 to +100
−55 to +125
270
(Ta=25˚C)
Unit
mA
V
mW
V
V
mA
mW
kV
̊C
̊C
̊C
*1 When ambient temperature goes above 85˚C, the forward current goes down at 0.6mA/˚C. Refer to Fig.3
*2 When ambient temperature goes above 85˚C, the forward current goes down at 1.1mW/˚C. Refer to Fig.4
*3 When ambient temperature goes above 85˚C, the forward current goes down at 2.5mW/˚C. Refer to Fig.4
*4 AC for 1minute, 40 to 60%RH, f=60Hz
*5 For 10s
■ Electro-optical Characteristics
Input
Parameter
Input forward voltage
Reverse input voltage
Input capacitance
*6
Output
High level output current
High level supply current
Low level supply current
Low level output voltage
*6
Transfer characteristics
Current transfer ratio
*8
"High→Low" propagation delay time
*8
“Low→High” propagation delay time
(Ta=25˚C)
Symbol
VF
*7
VF
IR
Ct
IOH(1)
IOH(2)
*7
IOH(3)
ICCH(1)
*7
ICCH(2)
ICCL
VOL(1)
*7
VOL(2)
CTR(1)
*7
CTR(2)
tPHL(1)
*7
tPHL(2)
tPLH(1)
*7
tPLH(2)
*9
Instantaneous common mode rejection
voltage (High level output)
*9
Instantaneous common mode rejection
voltage (Low level output)
Isolation resistance
Floating capacitance
CMH
CML
RISO
Cf
Condition
IF=16mA
VR=5V
VF=0, f=1MHz
IF=0, VCC=5.5V, VO=5.5V
IF=0, VCC=15V, VO=15V
IF=0, VCC=15V, VO=OPEN
IF=16mA, VCC=15V, VO=OPEN
IF=16mA, VCC=4.5V, IO=3mA
IF=16mA, VCC=4.5V, IO=2.4mA
IF=16mA, VCC=4.5V, VO=0.4V
IF=16mA, VCC=4.5V, VO=0.5V
IF=16mA, VCC=5V, RL=1.9kΩ
IF=0,
RL=1.9kΩ,
VO(MIN)=2V
VCC=5V,
VCM=1kV(P-P),
IF=16mA,
CL=15pF
VO(MAX)=0.8V
DC500V, 40 to 60%RH
V=0, f=1MHz
MIN.
−
−
−
−
−
−
−
−
−
−
−
−
19
15
−
−
−
−
TYP.
1.5
−
−
60
3
0.01
−
0.02
−
50
−
−
−
−
0.2
−
0.3
−
MAX.
1.7
1.8
10
−
500
1
50
1
2
200
0.4
0.5
50
−
0.8
1
0.8
1
Unit
15
30
−
kV/μs
−15
−30
−
kV/μs
5×1010
−
1011
0.6
−
−
Ω
pF
V
μA
pF
nA
μA
μA
μA
V
%
μs
*6 It shall connect a by-pass capacitor of 0.01μF or more between VCC (pin ➇) and GND (pin ➄) near the device, when it measures the transfer characteristics and the output side
characteristics
*7 Ta=0 to 70˚C
*8 Propagation delay time : Refer to Fig.1
*9 Instantaneous common mode rejection voltage : Refer to Fig.2
Sheet No.: D2-A09101EN
4
PC457S0NIP0F Series
■ Model Line-up
Taping
1 500pcs/reel
DIN EN60747-5-2
Approved
−
Model No.
PC457S0NIP0F PC457S0YIP0F
Package
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A09101EN
5
PC457S0NIP0F Series
Fig.1 Test Circuit for Propagation Delay Time
IF
IF
0.01μF
VCC
Pulse input
Pulse width
10μs
Duty ratio
1/10
RL
0V
VO
tPHL
CL
IF
Monitor
tPLH
VO
5V
1.5V
*CL includes the probe
and wiring capacitance.
100Ω
VOL
Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage
IF
VCM
0.01μF
VCC
SW
B
A
1.0kV
RL
0V
VO
CMH
VO
2V
(IF=0)
CL
+
−
CML
0.8V
VO
GND
VOL
When SW is B
(IF=16mA)
VCM
5V
When SW is A
*CL includes the probe and wiring capacitance.
Fig.3 Forward Current vs.
Ambient Temperature
Fig.4 Power Dissipation vs.
Ambient Temperature
Power dissipation PI, PO (mW)
Forward current IF (mA)
PO
100
25
20
15
10
5
80
60
PI
45
40
20
85
85
0
−55
0
25
50
75
100
0
−55
125
Ambient temperature Ta (˚C)
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Sheet No.: D2-A09101EN
6
PC457S0NIP0F Series
Fig.5 Forward Current vs. Forward Voltage
Fig.6 Relative Current Transfer Ratio vs.
Forward Current
100
Normalized current transfer ratio
2
Forward current IF (mA)
Ta=25˚C
Ta=0˚C
Ta=50˚C
10
Ta=100˚C
Ta=−40˚C
1
0.1
1
1.2
1.4
1.6
1.8
Normalized
Ta=25˚C
VCC=5V
VO=0.4V
IF=16mA
1.5
1
0.5
0
0.1
2
1
Forward voltage VF (V)
Fig.8 Relative Current Transfer Ratio vs.
Ambient Temperature
15
1.5
Normalized current transfer ratio
Output current IO (mA)
Ta=25˚C
VCC=5V
IF=25mA
IF=20mA
IF=15mA
IF=10mA
5
IF=5mA
0
0
5
10
15
Normalized
Ta=25˚C
VCC=5V
VO=0.4V
IF=16mA
1
0.5
0
−60
20
−40
Output voltage VO (V)
0
20
40
60
80
100
Fig.10 Propagation Delay Time vs.
Ambient Temperature
1 000
800
Propagation delay time tPHL, tPLH (ns)
VCC=VO=5V
IF=0
High level output current IOH (nA)
−20
Ambient temperature Ta (˚C)
Fig.9 High Level Output Current vs.
Ambient Temperature
100
10
1
0.1
0.01
−60
100
Ambient temperature Ta (˚C)
Fig.7 Output Current vs. Output Voltage
10
10
−40
−20
0
20
40
60
80
VCC=5V
CL=15pF
RL=1.9kΩ
600
400
tPLH (IF=10mA)
tPHL (IF=10mA)
200
0
−55 −40
100
tPLH (IF=16mA)
tPHL (IF=16mA)
−20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D2-A09101EN
7
PC457S0NIP0F Series
Fig.11 Propagation Delay Time vs.
Load Resistance
Propagation delay time (ns)
10 000
VCC=5V
Ta=25˚C
tPLH (IF=16mA)
1 000
tPHL (IF=10mA)
tPHL (IF=10mA)
100
tPHL (IF=16mA)
10
1
10
Load resistance (kΩ)
Remarks : Please be aware that all data in the graph are just for reference and anot for guarantee.
Sheet No.: D2-A09101EN
8
PC457S0NIP0F Series
■ Design Considerations
● Recommended operating conditions
Parameter
Input current
Supply voltage
Operating temperature
Symbol
IF
VCC
Topr
MIN.
7
−
0
TYP.
−
5
−
MAX.
16
−
+85
Unit
mA
V
˚C
● Notes about static electricity
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Design guide
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01μF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
NC terminals (Pin ➀, ➃ and ➆) are not allowed external connection.
This product is not designed against irradiation and incorporates non-coherent LED.
● Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5 years)
into the design consideration.
● Recommended foot print (reference)
1.9
0.64
1.27 1.27 1.27
7.49
(Unit : mm)
Sheet No.: D2-A09101EN
9
PC457S0NIP0F Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
(package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
150 to 180˚C, 120s or less
100
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines.
Flow soldering should be completed below 270̊C and within 10s.
Preheating is within the bounds of 100 to 150̊C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400̊C.
Please don't solder more than twice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A09101EN
10
PC457S0NIP0F Series
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A09101EN
11
PC457S0NIP0F Series
● Tape and Reel package
SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
E
D
J
G
I
5˚
MA
X.
H
H
A
B
C
F
K
Dimensions List
A
B
±0.3
12.0
5.50±0.05
H
I
±0.1
5.4
0.30±0.05
C
1.75±0.10
J
3.7±0.1
D
8.0±0.1
K
6.3±0.1
E
2.00±0.05
F
4.0±0.1
(Unit : mm)
G
φ1.55±0.05
Reel structure and Dimensions
e
d
Dimensions List
a
b
φ330
13.5±1.5
e
f
±0.8
φ21.0
2.0TYP.
c
g
(Unit : mm)
c
d
φ100±1 φ13.0±0.2
g
2.0±0.5
f
a
b
Direction of product insertion
Pull-out direction
[Packing : 1 500pcs/reel]
Sheet No.: D2-A09101EN
12
PC457S0NIP0F Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high
level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and
other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
Sheet No.: D2-A09101EN
[E255]
13
