PC81710NIP1B

REFERENCE PC8171*NIP1B REFERENCE 1. These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp"). Please handle with great cares and do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this Sharp product, please observe the absolute maximum ratings, other conditions and instructions for use described in the specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damages resulting from use of the product which does not comply with absolute maximum ratings, other conditions and instructions for use included in the specification sheets, and the precautions mentioned below. (Precautions) (1) In making catalogue or instruction manual based on the specification sheets, please verify the validity of the catalogue or instruction manuals after assembling Sharp products in customer's products at the responsibility of customer. (2) This Sharp product is designed for use in the following application areas ; • Computers • OA equipment • Telecommunication equipment (Terminal) • Measuring equipment • Tooling machines ・Audio visual equipment • Home appliances If the use of the Sharp product in the above application areas is for equipment listed in paragraphs (3) or (4), please be sure to observe the precautions given in those respective paragraphs. (3) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when Sharp product is used for equipment in responsibility of customer which demands high reliability and safety in function and precision, such as ; • Transportation control and safety equipment (aircraft, train, automobile etc.) • Traffic signals • Gas leakage sensor breakers • Rescue and security equipment • Other safety equipment (4)Sharp product is designed for consumer goods and controlled as consumer goods in production and quality. Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; • Space equipment • Telecommunication equipment (for trunk lines) • Nuclear power control equipment • Medical equipment (5) Please contact and consult with a Sharp sales representative if there are any question regarding interpretation of the above four paragraphs. 3. Disclaimer The warranty period for Sharp product is one (1) year after shipment. During the period, if there are any products problem, Sharp will repair (if applicable), replace or refund. Except the above, both parties will discuss to cope with the problems. The failed Sharp product after the above one (1) year period will be coped with by Sharp, provided that both parties shall discuss and determine on sharing responsibility based on the analysis results thereof subject to the above scope of warranty. The warranty described herein is only for Sharp product itself which are purchased by or delivered to customer. Damages arising from Sharp product malfunction or failure shall be excepted. Sharp will not be responsible for the Sharp product due to the malfunction or failures thereof which are caused by: (1) storage keep trouble during the inventory in the marketing channel. (2) intentional act, negligence or wrong/poor handling. (3) equipment which Sharp products are connected to or mounted in. (4) disassembling, reforming or changing Sharp products. (5) installation problem. (6) act of God or other disaster (natural disaster, fire, flood, etc.) (7) external factors (abnormal voltage, abnormal electromagnetic wave, fire, etc.) (8) special environment (factory, coastal areas, hotspring area, etc.) (9) phenomenon which cannot be foreseen based on the practical technologies at the time of shipment. (10) the factors not included in the product specification sheet. 4. Please contact and consult with a Sharp sales representative for any questions about Sharp product. 1/10 PC8171*NIP1B REFERENCE 1. Application This specification applies to the outline and characteristics of photocoupler Model No. PC8171 series (Lead-Free Type). 2. Outline Refer to the attached sheet, page 4. 3. Ratings and characteristics Refer to the attached sheet, page 5, 6. 4. Reliability Refer to the attached sheet, page 7. 5. Outgoing inspection Refer to the attached sheet, page 8. 6. Supplement 6.1 Isolation voltage shall be measured in the following method. (1) Short between anode and cathode on the primary side and between collector and emitter on the secondary side. (2) The dielectric withstanding tester with zero-cross circuit shall be used. (3) The wave form of applied voltage shall be a sine wave. (It is recommended that the isolation voltage be measured in insulation oil.) 6.2 Package specifications Refer to the attached sheet, page 9, 10. 6.3 Collector current (Ic) Delivery rank table ( "○" mark indicates business dealing name of ordered product) Rank at Business Test conditions Rank mark Ic (mA) delivery dealing name IF=0.5mA PC81710NIP1B With or without 0.5 to 3.0 VCE=5V PC81711NIP1B A 0.6 to 1.5 Ta=25℃ PC81712NIP1B PC81713NIP1B PC81716NIP1B B C B or C 0.8 to 2.0 1.0 to 2.5 0.8 to 2.5 6.4 This Model is approved by UL. (Under preparation). Approved Model No. : PC8171 UL file No. : E64380 6.5 This product is not designed against irradiation. This product is assembled with electrical input and output. This product incorporates non-coherent light emitting diode. 6.6 ODS materials This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFCS, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methyl chloroform) 6.7 Specified brominated flame retardants Specified brominated flame retardants (PBB and PBDE) are not used in this device at all 2/10 PC8171*NIP1B REFERENCE 6.8 Compliance with each regulation (1) The RoHS directive(2011/65/EU) This product complies with the RoHS directive(2011/65/EU) . Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls（PBB） and polybrominated diphenyl ethers（PBDE） (2) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法). Category Photocoupler Marking Styles for the Names and Contents of the Hazardous Substances Hazardous Substances Hexavalent Polybrominated Lead Mercury Cadmium chromium biphenyls (Pb) (Hg) (Cd) (Cr6+) (PBB) ○ ○ ○ ○ ○ Polybrominated diphenyl ethers (PBDE) ○ This table is prepared in accordance with the provisions of SJ/T 11364. ○：Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572 7. Notes Precautions for photocouplers ： Attachment-1 (Notice) The contents described herein are subject to change without notice for improvement since this product is under development. 3/10 PC8171*NIP1B REFERENCE 2. Outline Rank mark Factory identification mark *2 Date code *1 Pin-Number and internal connection diagram ④ ８１７１ Ｓ ② Anode ① 4.60 ± 0.35 ① 2.54 ± 0.25 1.25 ± 0.15 Anode mark ④ Collector ③ Emitter Cathode ② ③ 6.5 ± 0.5 Traceability code 0.10 +0.10 0.25 -0.05 +0.10 -0.05 3.5 ± 0.5 7.62 ± 0.30 0.9 ± 0.4 Epoxy resin 0.9 ± 0.4 9.6 ± 0.4 *1) Date code : 3 digit indication according to production year and week *2) Factory identification mark apply to the below K : Kyushu Denshi Co.,Ltd. (Japan products) A lead tip area and a part of a lead side area ( area) are no-plating. Pin material : Copper Alloy Pin finish : SnBi plating (Bi : 1～4%) Mark : laser marking Product mass : Approx. 0.22g UNIT : 1/1mm Name 4/10 PC8171 Outline Dimensions (Business dealing name : PC8171*NIP1B) PC8171*NIP1B REFERENCE 3. Ratings and characteristics 3.1 Absolute maximum ratings Parameter Forward current *1 Peak forward current *2 Input Reverse voltage Power dissipation *1 Collector-emitter voltage Emitter-collector voltage Output Collector current Collector power dissipation *1 Total power dissipation *1 Operating temperature Storage temperature Isolation voltage *3 Soldering temperature *4 3.2 Electro-optical characteristics Parameter Forward voltage Input Reverse current Terminal capacitance Dark current Collector-emitter Output breakdown voltage Emitter-Collector breakdown voltage Collector current Collector-emitter saturation voltage solation resistance Transfer Floating capacitance charac Response time (Rise) -teristics Response time (Fall) *1 *2 *3 *4 *5 Symbol VF IR Ct ICEO Symbol IF IFM VR P VCEO VECO Ic Pc Ptot Topr Tstg Viso (rrms) Tsol Ta=25℃ Unit mA mA V mW V V mA mW mW ℃ ℃ kV ℃ Rating 10 200 6 15 80 6 50 150 170 -30 to +100 -55 to +125 5 270 Condition Ta=25℃ Unit V μA pF nA IF=5mA VR=4V V=0, f=1kHz VCE=50V, IF=0 MIN. - TYP. 1.2 30 - MAX. 1.4 10 250 100 BVCEO Ic=0.1mA, IF=0 80 - - V BVECO Ic=10μA, IF=0 6 - - V Ic IF=0.5mA, VCE=5V 0.5 - 3.0 mA VCE (sat) IF=10mA, Ic=1mA - - 0.2 V DC500V 40 to 60%RH 5×1010 1011 V=0, f=1MHz 0.6 1.0 4 18 VCE=2V, Ic=2mA RL=100Ω 3 18 Ta=25℃, RL=470Ω Common mode VCM=1.5kV(peak), CMR 10 rejection ratio *5 IF=0, Vcc=9V, Vnp=100mV The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1 to 4. Pulse width≦100μs, Duty ratio : 0.001 (Refer to Fig. 5) AC for 1 min, 40 to 60%RH For 10s Measuring circuit RISO Cf tr tf Ω pF μs μs kV/μs (dv/dt) VCM RL Vnp VCC ※1 Vcp Vnp VO (Vcp≒dv/dt×Cf×RL ) VCM VCM:Higher value of pulse wave RL = 470Ω VCC = 9V *1 The voltage generated by a displacement current which flow through floating capacity between primary and secondary side 5/10 PC8171*NIP1B REFERENCE (Fig. 2) Diode power dissipation vs. Ambient temperature Diode power dissipation P (mW) Forward current IF (mA) (Fig. 1) Forward current vs. Ambient temperature 10 5 0 -30 -25 0 25 50 75 100 15 10 5 0 -30 -25 125 Ambient temperature Ta (℃) Total power dissipation Ptot (mW) Collector power dissipation Pc (mW) 150 100 50 25 50 75 100 125 Peak forward current IFM (mA) Ambient temperature Ta (℃) 200 100 50 10 -3 10 -2 Duty ratio 10 -1 75 100 125 200 170 150 100 50 0 -30 -25 0 25 50 75 Ambient temperature Ta (℃) (Fig. 5) Peak forward current vs. Duty ratio Pulse width ≦ 100μs Ta = 25℃ 2000 1000 500 20 10 50 (Fig. 4) Total power dissipation vs. Ambient temperature 200 0 25 Ambient temperature Ta (℃) (Fig. 3) Collector power dissipation vs. Ambient temperature 0 -30 -25 0 10 0 6/10 100 125 PC8171*NIP1B REFERENCE 4. Reliability The reliability of products shall satisfy items listed below. Test Items Solderability Soldering heat Terminal strength (Tension) Terminal strength (Bending) *3 Mechanical shock Variable frequency vibration Temperature cycling High temp. and high Humidity storage High temp. storage Low temp. storage Operation life Confidence level : 90% LTPD : 10 or 20 Failure Judgment Samples (n) Criteria Defective (C) *2 n=11, C=0 Condition 245±3ºC, 5s (Flow soldering) 270ºC, 10 s n=11, C=0 (Soldering by hand) 400ºC, 3 s Weight: 5N 5 s/each terminal Weight: 2.5N 2 times/each terminal 15km/s2, 0.5ms 3 times/±X, ±Y, ±Z direction 100 to 2000 to 100Hz/4 min 200m/s2 4 times/X, Y, Z direction 1 cycle –55 ºC to +125 ºC (30 min) (30 min) 20 cycles test ＞U×1.2 VF IR ＞U×2 ICEO ＞U×2 IC ＜L×0.7 VCE(sat)＞U×1.2 n=11, C=0 n=11, C=0 n=11, C=0 U: Upper specification limit L: Lower specification limit n=22, C=0 +85ºC, 85%RH, 1000h n=22, C=0 +125 ºC, 1000h n=22, C=0 -55 ºC, 1000h IF=10mA, Ptot=170mW Ta=25 ºC, 1000h n=22, C=0 n=22, C=0 *1 Test method, conforms to EIAJ ED 4701. *2 The product whose not-soldered area is more than 5% for all of the dipped area and/or whose pinholes or voids are concentrated on one place shall be judged defect. *3 Terminal bending direction is shown below. θ n=11, C=0 θ 7/10 PC8171*NIP1B REFERENCE 5. Outgoing inspection 5.1 Inspection items (1) Electrical characteristics VF, IR, ICEO, VCE(sat), Ic, RISO, Viso (2) Appearance 5.2 Sampling method and Inspection level LTPD sampling inspection confidence level：90％ Defect Inspection item Major defect Electrical characteristics(faiure) Marking (Unreadable) Lead form (Deformation) LTPD（％） 3 Appearance defect except Minor defect 50 the above mentioned. 8/10 PC8171*NIP1B REFERENCE 6.2 Package specifications 6.2.1 Taping conditions (1) Tape structure and Dimensions ( Refer to below in this page. ) The carrier tape has the heat pressed structure of PS material carries tape and PET material cover tape. (2) Reel structure and Dimensions (Refer to the attached sheet, Page 10) The taping reel shall be of plastic (PS material) (3) Direction of product insertion (Refer to the attached sheet, Page 10) (4) The cover tape and carrier tape in one weel shall be joint less. (5) To repair failure-taped devices, cutting a bottom of carrier tape or a cover tape with a cutter. After replacing the cut portion shall be sealed with adhesive tape. 6.2.2 Adhesiveness of cover tape The exfoliation force between carrier tape and cover tape shall be 0.2N to 0.7N 6.2.3 Rolling method and quantity Wind the tape back on the reel so that the cover tape will be outside the tape. Attach more than 18cm of blank tape to the trailer and the leader of the tape And fix the leader with adhesive tape. One reel basically contain 2000pcs 6.2.4 Outer packing appearance (Refer to the attached sheet, Page 10) 6.2.5 The label with following information shall be pasted at appointed place of the outer packing case. *Model No. *( Business dealing name ) *Lot No. *Quantity *Country of origin *Company name *Inspection date specified 6.2.6 Storage condition Taped products shall be stored at the temperature 5 to 30℃ and the humidity 70%RH or less away from direct sunlight. 6.2.7 Safety protection during shipping There shall be no deformation of component or degradation of electrical characteristics due to shipping. Carrier tape structure and Dimensions F D J G E I C B A H H K Dimensions list A B 16.0±0.3 7.5±0.1 (Unit : mm) C 1.75±0.1 D 8.0±0.1 5°max E 2.0±0.1 F G 4.0±0.1 φ1.5 9/10 +0.1 -0 H I 10.3±0.1 0.40±0.05 J K 4.0±0.1 5.3±0.1 PC8171*NIP1B REFERENCE Reel structure and Dimensions Dimensions list e (Unit : mm) a b (330) 17.5±1.5 e f g φ21.0±1.0 2.0±0.5 2.0±0.5 d g c c d φ100.0±1.0 φ13.0±0.5 f b a Direction of product insertion Pull-out direction Outer packing appearance Cushioning Pad(Each one sheet in top side and bottom side) (PE with antistatic treatment) Product（4reels including carrier tape） (350mm) (340mm) (100mm) Sealing tape （Cellophane） Sticker Packing case (corrugated cardboard) Regular packing mass : Approx. 3.4kg ( )：Reference dimensions 10/10 PC8171*NIP1B REFERENCE Precautions for Photocouplers 1 Cleaning (1) Solvent cleaning : Solvent temperature 45℃ or less Immersion for 3 min or less (2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that any defect doesn't occur before starting the ultrasonic cleaning. (3) Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol When the other solvent is used, there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition. 2. Circuit design (1) The LED used in the Photocoupler generally decreases the light emission power by operation. In case of long operation time, please design the circuit in consideration of the degradation of the light emission power of the LED. (50%/5years) (2) There are cases that the deviation of the CTR and the degradation of the relative light emission power of the LED increase when the setting value of IF is less than 0.5mA. Please design the circuit in consideration of this point (3) When steep voltage noise is applied between the primary side and the secondary side of the photocoupler, current flows or changes in the light emitting diode through a parasitic capacitance between the primary side and the secondary side of the photocoupler, then there is a case that miss operation occurs depending upon the applied noise level. We should certainly recommend to use a by-pass capacitor between both terminals of the light emitting diode where used in noisy environment. 3. Precautions for Soldering (1) In the case of flow soldering (Whole device dipping .) It is recommended that flow soldering should be at 270℃ or less for 10 s or less (Pre-heating : 100 to 150℃, 30 to 80s). (2 times or less) (2) If solder reflow : It is recommended to be done at the temperature and the time within the temperature profile as shown in the figure below. (2 times or less) 300℃ Terminal：260℃ peak (Package surface：250℃ peak) 200℃ Reflow 220℃ or more, 60s or less 100℃ Pre-heat 150℃ to 180℃, 120s or less 1min 2min 3min 4min (3) In the case of hand soldering What is done on the following condition is recommended.( 2 times or less) Soldering iron temperature : 400℃ or less Time : 3s or less (4) The form of a lead tip part There is production tolerance as shown in the following figure (5) Other precautions Depending on equipment and soldering conditions (temperature, Using solder etc.), the effect to the device and the PCB is different. Please confirm that there is no problem on the actual use conditions in advance. Attachment-1