PC817X2NSZ2B

MDS (MATERIAL DATA SHEETS) Product name Photocoupler Business Dealing name PC817X2NSZ2B PC817X3NSZ2B PC817X1NSZ2B Item Infrared Light Emitting Diode Phototransistor Leadframe Material GaAs Si Cu Zn Fe P Ag (plating) Cu (plating) Bonding Wire Au Transparent Compound Silicone Resin Semitransparent Fused Silica Compound Silica, Crystalline Epoxy Resin Phenolic Resin Opaque Compound Silica Epoxy Resin Phenolic Resin Carbon Black Terminal Plating Sn Silver Epoxy Resin Ag DIGLYCIDYLETHER OF B.P.A Epoxy Resin CAS No. Wt of Item (mg) Wt. of material (mg) 1303-00-0 0.030 0.030 7440-21-3 7440-50-8 7440-66-6 7439-89-6 7723-14-0 7440-22-4 7440-50-8 7440-57-5 60676-86-0 14808-60-7 9003-5-4 7631-86-9 1333-86-4 7440-31-5 7440-22-4 0.148 63.297 0.148 61.319 0.094 1.330 0.014 0.242 0.297 0.027 1.000 27.576 0.400 7.993 3.997 75.722 36.640 9.160 0.611 3.354 0.034 0.027 1.000 39.966 122.133 3.354 0.046 25068-38-6 0.002 25068-38-6 0.010 230.000 Total (mg) Responsible Person: Yoshihisa Takahashi General Manager,Head of CS PROMOTION DIV. SHARP CORPORATION Electronic Components And Devices BU CS PROMOTION DIV. Date: 09-Feb-17