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PC817X4NSZ1B

PC817X4NSZ1B

  • 厂商:

    SHARP(夏普)

  • 封装:

    OC_4.6X6.5MM_TM

  • 描述:

    单向光耦 Viso=5kVrms VF(typ)=1.2V IF=50mA OC_4.6X6.5MM_TM

  • 数据手册
  • 价格&库存
PC817X4NSZ1B 数据手册
REFERENCE PC817X*NSZ1B REFERENCE 1. These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp"). Please handle with great cares and do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this Sharp product, please observe the absolute maximum ratings, other conditions and instructions for use described in the specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damages resulting from use of the product which does not comply with absolute maximum ratings, other conditions and instructions for use included in the specification sheets, and the precautions mentioned below. (Precautions) (1) In making catalogue or instruction manual based on the specification sheets, please verify the validity of the catalogue or instruction manuals after assembling Sharp products in customer's products at the responsibility of customer. (2) This Sharp product is designed for use in the following application areas ; • Computers • OA equipment • Telecommunication equipment (Terminal) • Measuring equipment • Tooling machines ・Audio visual equipment • Home appliances If the use of the Sharp product in the above application areas is for equipment listed in paragraphs (3) or (4), please be sure to observe the precautions given in those respective paragraphs. (3) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when Sharp product is used for equipment in responsibility of customer which demands high reliability and safety in function and precision, such as ; • Transportation control and safety equipment (aircraft, train, automobile etc.) • Traffic signals • Gas leakage sensor breakers • Rescue and security equipment • Other safety equipment (4)Sharp product is designed for consumer goods and controlled as consumer goods in production and quality. Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; • Space equipment • Telecommunication equipment (for trunk lines) • Nuclear power control equipment • Medical equipment (5) Please contact and consult with a Sharp sales representative if there are any question regarding interpretation of the above four paragraphs. 3. Disclaimer The warranty period for Sharp product is one (1) year after shipment. During the period, if there are any products problem, Sharp will repair (if applicable), replace or refund. Except the above, both parties will discuss to cope with the problems. The failed Sharp product after the above one (1) year period will be coped with by Sharp, provided that both parties shall discuss and determine on sharing responsibility based on the analysis results thereof subject to the above scope of warranty. The warranty described herein is only for Sharp product itself which are purchased by or delivered to customer. Damages arising from Sharp product malfunction or failure shall be excepted. Sharp will not be responsible for the Sharp product due to the malfunction or failures thereof which are caused by: (1) storage keep trouble during the inventory in the marketing channel. (2) intentional act, negligence or wrong/poor handling. (3) equipment which Sharp products are connected to or mounted in. (4) disassembling, reforming or changing Sharp products. (5) installation problem. (6) act of God or other disaster (natural disaster, fire, flood, etc.) (7) external factors (abnormal voltage, abnormal electromagnetic wave, fire, etc.) (8) special environment (factory, coastal areas, hotspring area, etc.) (9) phenomenon which cannot be foreseen based on the practical technologies at the time of shipment. (10) the factors not included in the product specification sheet. 4. Please contact and consult with a Sharp sales representative for any questions about Sharp product. 1/10 PC817X*NSZ1B REFERENCE 1. Application This specification applies to the outline and characteristics of photocoupler Model No. PC817series(Lead-Free Type). 2. Outline Refer to the attached sheet, page 4. 3. Ratings and characteristics Refer to the attached sheet, page 5, 6. 4. Reliability Refer to the attached sheet, page 7. 5. Outgoing inspection Refer to the attached sheet, page 8. 6. Supplement 6.1 Isolation voltage shall be measured in the following method. (1) Short between anode and cathode on the primary side and between collector and emitter on the secondary side. (2) The dielectric withstanding tester with zero-cross circuit shall be used. (3) The wave form of applied voltage shall be a sine wave. (It is recommended that the isolation voltage be measured in insulation oil.) 6.2 Package specifications 6.3 Business dealing name Refer to the attached sheet, page 9, 10. ("○" mark indicates business dealing name of ordered product) Rank mark Ic (mA) Test conditions PC817XNNSZ1B with or without 2.5 to 30 PC817X1NSZ1B A 4.0 to 8.0 IF=5mA VCE=5V Ta=25℃ PC817X2NSZ1B B 6.5 to 13 PC817X3NSZ1B C 10 to 20 PC817X4NSZ1B PC817X5NSZ1B PC817X6NSZ1B D A or B B or C 15 to 30 4.0 to 13 6.5 to 20 PC817X7NSZ1B PC817X8NSZ1B PC817X9NSZ1B PC817X0NSZ1B C or D A, B or C B, C or D A, B, C or D 10 to 30 4.0 to 20 6.5 to 30 4.0 to 30 Ordered product Business dealing name 6.4 This Model is approved by UL. (Under preparation). Approved Model No. : PC817 UL file No. : E64380 6.5 This Model is approved by CSA. (Under preparation). Approved Model No. : PC817 CSA approved mark " " shall be indicated on minimum unit package. 6.6 This product is not designed against irradiation. This product is assembled with electrical input and output. This product incorporates non-coherent light emitting diode. 2/10 PC817X*NSZ1B REFERENCE 6.7 ODS materials This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFCS, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methyl chloroform) 6.8 Specified brominated flame retardants Specified brominated flame retardants (PBB and PBDE) are not used in this device at all. 6.9 Compliance with each regulation (1) The RoHS directive(2011/65/EU) This product complies with the RoHS directive(2011/65/EU) . Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE) (2) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法). Category Photocoupler Marking Styles for the Names and Contents of the Hazardous Substances Hazardous Substances Hexavalent Polybrominated Lead Mercury Cadmium chromium biphenyls (Pb) (Hg) (Cd) 6+ (Cr ) (PBB) ○ ○ ○ ○ ○ This table is prepared in accordance with the provisions of SJ/T 11364. ○:Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572 7. Notes Precautions for photocouplers : Attachment-1. 3/10 Polybrominated diphenyl ethers (PBDE) ○ PC817X*NSZ1B REFERENCE 2. Outline Anode mark Rank mark 1.25 ± 0.15 Factory identification mark *2 Date code *1 ④ 4.60 ± 0.35 ① 2.54 ± 0.25 Pin-Number and internal connection diagram PC817 S ② ④ Collector Anode ① ③ Emitter Cathode ② ③ 6.5 ± 0.5 Traceability code 0.25 3.2 ± 0.4 Epoxy resin +0.1 -0.05 θ θ 4.15 ± 0.4 3.5 ± 0.5 7.62 ± 0.30 0.5 ± 0.1 θ: 0~13° *1) Date code : 3 digit indication according to production year and week *2) Factory identification mark apply to the below K : Kyushu Denshi Co.,Ltd. (Japan products) Pin material : Copper Alloy Pin finish : SnBi plating (Bi : 1~4%) Mark : laser marking Product mass : Approx. 0.23g UNIT : 1/1 mm Name 4/10 PC817 Outline Dimensions (Business dealing name : PC817X*NSZ1B) PC817X*NSZ1B REFERENCE 3. Ratings and characteristics 3.1 Absolute maximum ratings Parameter Input Symbol Rating Unit *1 Forward current IF 50 mA *2 Peak forward current IFM 1 A Reverse voltage VR 6 V P 70 mW Collector-emitter voltage VCEO 80 V Emitter-collector voltage VECO 6 V Collector current Ic 50 mA *1 Collector power dissipation Pc 150 mW *1 Total power dissipation Ptot 200 mW Operating temperature Topr -30 to +100 ℃ Storage temperature Tstg -55 to +125 ℃ *1 Power dissipation Output Ta=25℃ *3 Isolation voltage Viso(rms) *4 Soldering temperature Tsol 5 kV 270 ℃ 3.2 Electro-optical characteristics Parameter Ta=25℃ Symbol Condition MIN. TYP. MAX. Unit Forward voltage VF IF=20mA - 1.2 1.4 V Peak forward voltage VFM IFM=0.5A - - 3.0 V Reverse current IR VR=4V - - 10 μA Terminal capacitance Ct V=0, f=1kHz - 30 250 pF Dark current ICEO VCE=50V, IF=0 - - 100 nA Collector-emitter breakdown voltage BVCEO Ic=0.1mA IF=0 80 - - V Emitter-collector breakdown voltage BVECO IE=10μA, IF=0 6 - - V Collector current Ic IF=5mA, VCE=5V 2.5 - 30 mA Collector-emitter saturation voltage VCE(sat) IF=20mA Ic=1mA - 0.1 0.2 V Isolation resistance RISO DC500V 40 to 60%RH 5×1010 1011 - Ω Transfer Floating capacitance characteristics Cut-off frequency Cf V=0, f=1MHz - 0.6 1.0 pF fc VCE=5V, Ic=2mA RL=100Ω, -3dB - 80 - kHz Rise time tr - 4 18 μs Fall time tf - 3 18 μs Input Output *1 *2 *3 *4 VCE=2V Ic=2mA RL=100Ω The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1 to 4. Pulse width≦100μs, Duty ratio : 0.001 (Refer to Fig. 5) AC for 1 min, 40 to 60%RH For 10 s 5/10 PC817X*NSZ1B REFERENCE (Fig.2) Diode power dissipation vs. ambient temperature Diode power dissipation P (mW) (Fig.1) Forward current vs. ambient temperature Forward current IF (mA) 50 40 30 20 10 0 -30 -25 0 25 50 55 75 100 125 100 80 70 60 40 20 0 -30 -25 Ambient temperature Ta (℃) Total power dissipation Ptot (mW) Collector power dissipation Pc (mW) 200 150 100 50 25 50 75 100 125 Ambient temperature Ta (℃) Peak forward current IFM (mA) 2000 1000 500 200 100 50 20 10 -3 10 -2 75 100 125 10 -1 250 200 150 100 50 0 -30 -25 0 25 50 75 100 Ambient temperature Ta (℃) (Fig.5) Peak forward current vs. duty ratio Pulse width ≦ 100μs Ta = 25℃ 10 50 55 (Fig.4) Total power dissipation vs. ambient temperature 250 0 25 Ambient temperature Ta (℃) (Fig.3) Collector power dissipation vs. ambient temperature 0 -30 -25 0 10 0 Duty ratio 6/10 125 PC817X*NSZ1B REFERENCE 4. Reliability The reliability of products shall satisfy items listed below. Confidence level : 90% LTPD : 10 or 20 Test Items Solderability Failure Judgment Criteria Condition 245±3ºC, 5s Soldering heat *2 (Flow soldering) 270ºC, 10 s Samples (n) Defective (C) n=11, C=0 n=11, C=0 (Soldering by hand) 400ºC, 3 s VF >U×1.2 IR >U×2 ICEO >U×2 IC <L×0.7 VCE(sat) >U×1.2 Terminal strength (Tension) Weight: 5N 5 s/each terminal Terminal strength (Bending) *3 Weight: 2.5N 2 times/each terminal Mechanical shock 15km/s2, 0.5ms 3 times/±X, ±Y, ±Z direction Variable frequency vibration 100 to 2000 to 100Hz/4 min 200m/s2 4 times/X, Y, Z direction Temperature cycling 1 cycle –55 ºC to +125 ºC (30 min) (30 min) 20 cycles test High temp. and high Humidity storage +85ºC, 85%RH, 1000h n=22, C=0 High temp. storage +125 ºC, 1000h n=22, C=0 Low temp. storage -55 ºC, 1000h n=22, C=0 Operation life IF=50mA, Ptot=200mW Ta=25 ºC, 1000h n=22, C=0 n=11, C=0 n=11, C=0 U: Upper specification limit L: Lower specification limit n=11, C=0 n=22, C=0 *1 Test method, conforms to EIAJ ED 4701. *2 The product whose not-soldered area is more than 5% for all of the dipped area, and/or whose pinholes or voids are concentrated on one place shall be judged defect. *3 Terminal bending direction is shown below. θ n=11, C=0 θ 7/10 PC817X*NSZ1B REFERENCE 5. Outgoing inspection 5.1 Inspection items (1) Electrical characteristics VF, IR, ICEO, VCE(sat), Ic, RISO, Viso (2) Appearance 5.2 Sampling method and Inspection level LTPD sampling inspection confidence level:90% Defect Inspection item LTPD(%) Major defect Electrical characteristics(faiure) Marking (Unreadable) Lead form (Deformation) 3 Appearance defect except Minor defect 50 the above mentioned. 8/10 PC817X*NSZ1B REFERENCE 6.2 Package specification 6.2.1 Package materials No. Name Purposes ① Sleeve ② Stopper Enhanced polymer Products fixed ③ Inner bag Polyethylene Packaging bag for sleeve with product ④ Sealing tape Cellophane Lid of inner bag ⑤ Label Paper Model No.,(Business dealing name),Lot No., Quantity, Country of origin , Company name and Inspection date specified ⑥ Packing case Paper Inner bag packaged ⑦ Cushioning material Polyethylene Inner bag fixed ⑧ Sealing tape Cellophane Lid of packingcase Paper Model No.,(Business dealing name),Lot No., Quantity, Country of origin , Company name and Inspection date specified ⑨ Label 6.2.2 (1) (2) (3) (4) (5) (6) Materials HIPS or ABS with preventing Products packaged static electricity Package method MAX. 100pcs. of products shall be packaged in a sleeve ① and both of sleeve edges shall be fixed by stoppers ②. MAX. 25 sleeves (Product : 2500pcs.) above shall be packaged in inner case ③. and sealed by tape ④. The label ⑤ shall be put on the top of the inner bag. Max 2 bags(product : 5000pcs) above shall be packaged in packing case ⑥, and put a cushioning material ⑦ inside. The label ⑨ shall be put on the side of the packing case. Case shall be closed with the lid and enclosed with kraft tape ⑧. 6.2.3 Sleeve package ① outline dimensions 11.1 ± 0.2 5.5 ± 0.2 6.5 ± 0.2 8.8 ± 0.2 6.5 ± 0.2 14.2 ± 0.2 500 ± 2 (Unit :mm) Note 1) Thickness : 0.5±0.2mm 2) Process with applying antistatic treatment. 3) Unless otherwise specified tolerances shall be ±0.5mm. (However except for deformation due to the stopper in sleeve.) 9/10 PC817X*NSZ1B REFERENCE 6.2.4 Packing outer case outline dimensions Sleeve① Product Anode mark Stopper② Anode mark shall be arranged at stopper side without pulled portion. Stopper② Sealing tape④ Label⑤ Inner bag③ Cushioning material⑦ (535mm) Sealing tape⑧ Packing case⑥ (180mm) (85mm) Label⑨ Regular packing mass : Approx. 2kg ( ) : Reference dimensions 10/10 PC817X*NSZ1B REFERENCE Precautions for Photocouplers 1 Cleaning (1) Solvent cleaning : Solvent temperature 45℃ or less Immersion for 3 min or less (2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that any defect doesn't occur before starting the ultrasonic cleaning. (3) Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol When the other solvent is used, there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition. 2. Circuit design 2.1 The LED used in the Photocoupler generally decreases the light emission power by operation. In case of long operation time, please design the circuit in consideration of the degradation of the light emission power of the LED. (50%/5years) 2.2 There are cases that the deviation of the CTR and the degradation of the relative light emission power of the LED increase when the setting value of IF is less than 1.0mA. Please design the circuit in consideration of this point. 3. Precautions for Soldering (1) In the case of flow soldering (Whole dipping is possible) It is recommended that flow soldering should be at 270℃ or less for 10 s or less (Pre-heating : 100 to 150℃, 30 to 80s). (2 times or less) (2) In the case of hand soldering What is done on the following condition is recommended.( 2 times or less) Soldering iron temperature : 400℃ or less Time : 3s or less (3) Other precautions Depending on equipment and soldering conditions (temperature, Using solder etc.), the effect to the device and the PCB is different. Please confirm that there is no problem on the actual use conditions in advance. Attachment-1. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Sharp Microelectronics: PC817X3NSZ1B PC817X1NSZ1B PC817X4NSZ1B PC817X2NSZ1B
PC817X4NSZ1B 价格&库存

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