PC900V0YSZX

PC900V0NSZX Series PC900V0NSZX Series Digital Output, Normal OFF Operation DIP 6 pin ∗OPIC Photocoupler ■ Description ■ Agency approvals/Compliance PC900V0NSZX Series contains an IRED optically coupled to an OPIC chip. It is packaged in a 6 pin DIP, available in SMT gullwing lead-form and Wide SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC900V) 2. Approved by TÜV (VDE0884) (as an option) file No. R9151577 (as model No. PC900V) 3. Package resin : UL flammability grade (94V-0) ■ Applications ■ Features 1. Programmable controllers 2. PC peripherals 3. Electronic musical instruments 1. 6 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Normal OFF operation, open collector output 4. TTL and LSTTL compatible output 5. Operating supply voltage (VCC : 3 to 15 V) 6. Isolation voltage (Viso(rms) : 5.0 kV) ∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A05301EN Date Nov. 28. 2003 © SHARP Corporation PC900V0NSZX Series ■ Internal Connection Diagram 6 5 4 1 2 Voltage regulator 3 Amp 4 5 1 2 6 3 Anode Cathode NC VO GND VCC ■ Outline Dimensions (Unit : mm) 1. Through-Hole [ex. PC900V0NSZX] 2. Through-Hole (VDE0884 option) [ex. PC900V0YSZX] 1.2±0.3 1.2±0.3 0.6±0.2 SHARP mark "S" 4 PC900V Anode mark 1 2 6 7.12 1 Date code 2 3 ±0.5 7.12 3.5±0.5 7.62±0.3 2.9±0.5 0.5TYP. 7.62±0.3 3.5±0.5 VDE0884 Identification mark 4 ±0.5 2.9±0.5 4 PC900V Anode mark Date code 3 5 Epoxy resin θ : 0 to 13˚ 3. SMT Gullwing Lead-Form [ex. PC900V0NIPX] 6 4 PC900V Anode mark SHARP mark "S" PC900V 4 3 Date code 1 7.12±0.5 Epoxy resin 3 7.62±0.3 3.5±0.5 0.26±0.1 1.0+0.4 −0 2 7.12±0.5 7.62±0.3 3.5±0.5 2.54±0.25 VDE0884 Identification mark 0.35±0.25 2 4 Anode mark Date code 1 5 2.54±0.25 1.0+0.4 −0 10.0+0 −0.5 0.26±0.1 5 θ θ : 0 to 13˚ 1.2±0.3 0.6±0.2 6.5±0.5 6 SHARP mark "S" θ 4. SMT Gullwing Lead-Form (VDE0884 option) [ex. PC900V0YIPX] 1.2±0.3 0.6±0.2 0.5±0.1 2.54±0.25 θ 3.25±0.5 θ 6.5±0.5 0.5±0.1 2.54±0.25 3.25±0.5 Epoxy resin 0.35±0.25 5 0.5TYP. 6 6.5±0.5 SHARP mark "S" 6.5±0.5 0.6±0.2 1.0+0.4 −0 Epoxy resin 1.0+0.4 −0 10.0+0 −0.5 Sheet No.: D2-A05301EN 2 PC900V0NSZX Series (Unit : mm) 1.2±0.3 PC900V Anode mark 1.2±0.3 0.6±0.2 SHARP mark "S" 6.5±0.5 0.6±0.2 SHARP mark "S" 6. Wide SMT Gullwing Lead-Form (VDE0884 option) [ex. PC900V0YUPX] PC900V 4 Anode mark Date code 6.5±0.5 5. Wide SMT Gullwing Lead-Form [ex. PC900V0NUPX] Date code VDE0884 Identification mark 0.75±0.25 Epoxy resin 10.16±0.5 12.0MAX. 2.54±0.25 0.75±0.25 7.62±0.3 0.25±0.25 3.5±0.5 0.25±0.25 7.62 0.26±0.1 3.5±0.5 2.54±0.25 7.12±0.5 ±0.3 0.26±0.1 7.12±0.5 0.75±0.25 Epoxy resin 10.16±0.5 12.0MAX. 0.75±0.25 Product mass : approx. 0.36g Sheet No.: D2-A05301EN 3 PC900V0NSZX Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · Mark P R S T U V W X A B C ·· · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D repeats in a 20 year cycle Country of origin Japan Sheet No.: D2-A05301EN 4 PC900V0NSZX Series ■ Absolute Maximum Ratings Parameter Symbol IF Forward current *1 Peak forward current IFM Input Reverse voltage VR Power dissipation P Supply voltage VCC High level output voltage VOH Output Low level output current IOL PO Power dissipation Ptot Total power dissipation Topr Operating temperature Storage temperature Tstg *2 Isolation voltage Viso (rms) *3 Soldering temperature Tsol Rating 50 1 6 70 16 16 50 150 170 −25 to +85 −40 to +125 5.0 260 (Ta=25˚C) Unit mA A V mW V V mA mW mW ˚C ˚C kV ˚C *1 Pulse width≤100µs, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1minute, f=60Hz *3 For 10s ■ Electro-optical Characteristics Output Input Parameter Forward voltage Reverse current Terminal capacitance Operating Supply voltage Low level output voltage High level output current Low level supply current High level supply current *4 "High→Low" input threshold current *5 Transfer characteristics VF IR Ct VCC VOL IOH ICCL ICCH IFHL IFLH IFLH/IFHL Hysteresis RISO Isolation voltage tPHL "High→Low" propagation delay time "Low→High" propagation delay time tPLH Rise time tr Fall time tf Response time *6 "Low→High" input threshold current Symbol Conditions IF=4mA IF=0.3mA Ta=25˚C, VR=3V Ta=25˚C, V=0, f=1kHz − IOL=16mA, VCC=5V, IF=4mA VO=VCC=15V, IF=0 VCC=5V, IF=4mA VCC=5V, IF=0 Ta=25˚C, VCC=5V, RL=280Ω VCC=5V, RL=280Ω Ta=25˚C, VCC=5V, RL=280Ω VCC=5V, RL=280Ω VCC=5V, RL=280Ω Ta=25˚C, DC500V, 40 to 60%RH Ta=25˚C, VCC=5V, IF=4mA RL=280Ω (Unless otherwise specified Ta=0 to +70˚C) MIN. MAX. TYP. Unit − 1.1 1.4 V − 0.7 1.0 − − 10 µA 30 − 250 pF 3 − 15 V 0.2 − 0.4 V − − 100 µA − 2.5 5.0 mA 1.0 − 5.0 mA 1.1 − 2.0 mA − − 4.0 0.8 0.4 − mA 0.3 − − 0.7 − 0.5 0.9 1×1011 5×1010 − Ω 1 − 3 2 − 6 µs − 0.1 0.5 − 0.05 0.5 *4 IFHL represents forward current when output goes from high to low. *5 IFLH represents forward current when output goes from low to high. *6 Hysteresis stands for IFLH/IFHL. Sheet No.: D2-A05301EN 5 PC900V0NSZX Series ■ Model Line-up SMT Gullwing Wide SMT Gullwing Sleeve Taping Package 50pcs/sleeve 1 000pcs/reel −−−−−− Approved −−−−−− Approved −−−−−− Approved −−−−−− Approved VDE0884 Model No. PC900V0NSZX PC900V0YSZX PC900V0NIZX PC900V0YIZX PC900V0NIPX PC900V0YIPX PC900V0NUPX PC900V0YUPX Lead Form Through-Hole Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. Sheet No.: D2-A05301EN 6 PC900V0NSZX Series Fig.1 Test Circuit for Response Time Voltage regulator tPHL 280Ω tr=tf=0.01µs ZO=50Ω 50% VIN 5V Amp VIN tPLH VO 0.1µF 47Ω VOH 90% 1.5V 10% VOL tr VO tf Fig.3 Power Dissipation vs. Ambient Temperature 60 200 50 170 Power dissipation PO, Ptot (mW) Forward current IF (mA) Fig.2 Forward Current vs. Ambient Temperature 40 30 20 Ptot PO 150 100 50 10 0 −25 0 25 50 75 85 0 −25 100 Ambient temperature Ta (˚C) 1.4 Forward current IF (mA) Relative input threshold current IFHL, IFLH Ta=75˚C 50˚C 25˚C 0˚C −25˚C 50 50 75 85 100 Fig.5 Relative Input Threshold Current vs. Supply Voltage 500 100 25 Ambient temperature Ta (˚C) Fig.4 Forward Current vs. Forward Voltage 200 0 20 10 5 2 Ta=25˚C IFHL=1 at VCC=5V 1.2 IFHL 1.0 IFLH 0.8 0.6 0.4 0.2 1 0 0.5 1.0 1.5 2.0 2.5 0 3.0 5 10 15 20 Supply voltage VCC (V) Forward voltage VF (V) Sheet No.: D2-A05301EN 7 PC900V0NSZX Series Fig.7 Low Level Output Voltage vs. Low Level Output Current Fig.6 Relative Input Threshold Current vs. Ambient Temperature 1.0 VCC=5V VCC=5V 1.4 Low level output voltage VOL (V) Relative input threshold current IFHL, IFLH 1.6 1.2 IFHL 1.0 0.8 IFLH 0.6 0.4 Ta=25˚C 0.5 0.2 0.1 0.05 0.02 0.2 −25 IFHL=1 at Ta=25˚C 0 25 50 0.01 75 100 1 2 Ambient temperature Ta (˚C) 20 9 0.5 IOL=30mA VCC=5V 50 0.4 Ta= −25˚C 25˚C 7 0.3 16mA 0.2 5mA 0.1 0 −25 0 25 50 6 5 4 2 75 85˚C 5 7 9 11 13 15 17 Supply voltage VCC (V) Fig.11 Rise Time, Fall Time vs. Load Resistance Fig.10 Propagation Delay Time vs. Forward Current 0.5 Rise time, fall time tr, tf (µs) VCC=5V RL=280Ω Ta=25˚C 4 25˚C ICCL{ 1 I CCH{ 0 1 3 100 Ta= −25˚C 85˚C 3 Ambient temperature Ta (˚C) 5 100 8 Supply current ICC (mA) Low level output voltage VOL (V) 10 Fig.9 Supply Current vs. Supply Voltage Fig.8 Low Level Output Voltage vs. Ambient Temperature Propagation delay time tPHL, tPLH (µs) 5 Low level output current IOL (mA) tPLH 3 2 1 0.4 VCC=5V IF=4mA Ta=25˚C 0.3 0.2 tr 0.1 tf tPHL 0 0 10 20 30 40 50 0 0.1 60 Forward current IF (mA) 0.2 0.5 1 2 5 10 20 Load resistance RL (kΩ) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A05301EN 8 PC900V0NSZX Series ■ Design Considerations ● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ● Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01µF or more between VCC and GND near the device. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5years) into the design consideration. Please decide the input current which become 2times of MAX. IFHL. Sheet No.: D2-A05301EN 9 PC900V0NSZX Series ● Recommended Foot Print (reference) SMT Gullwing Lead-form Wide SMT Gullwing Lead-form 10.5 1.7 1.7 2.54 2.54 2.54 2.54 8.5 2.2 2.2 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A05301EN 10 PC900V0NSZX Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A05301EN 11 PC900V0NSZX Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. Sheet No.: D2-A05301EN 12 PC900V0NSZX Series ■ Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 ±2 5.8 10.8 520 6.7 (Unit : mm) Sheet No.: D2-A05301EN 13 PC900V0NSZX Series ● Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F D J G I 5˚ MA X. H H A B C E K Dimensions List A B ±0.3 16.0 7.5±0.1 H I ±0.1 10.4 0.4±0.05 C 1.75±0.1 J 4.2±0.1 D 12.0±0.1 K 7.8±0.1 E 2.0±0.1 F 4.0±0.1 (Unit:mm) G +0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b 330 17.5±1.5 e f ±1.0 23 2.0±0.5 f a b (Unit : mm) c d 100±1.0 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A05301EN 14 PC900V0NSZX Series 2. Wide SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F D G E I J MA X. H H A B C Dimensions List A B 24.0±0.3 11.5±0.1 H I ±0.1 12.2 0.4±0.05 5˚ K C 1.75±0.1 J 4.1±0.1 D 12.0±0.1 K 7.6±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b a 330 e 23±1.0 f b 25.5±1.5 f 2.0±0.5 (Unit : mm) c d ±1.0 100 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A05301EN 15 PC900V0NSZX Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A05301EN 16