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PC910L0NSZ

PC910L0NSZ

  • 厂商:

    SHARP(夏普)

  • 封装:

    8-DIP(0.300",7.62mm)

  • 描述:

    OPTOISO 5KV OPEN COLLECTOR 8DIP

  • 数据手册
  • 价格&库存
PC910L0NSZ 数据手册
PC910L0NSZ Series PC910L0NSZ Series High Speed 10Mb/s, High CMR DIP 8 pin ∗OPIC Photocoupler ■ Description ■ Agency approvals/Compliance PC910L0NSZ Series contains a LED optically coupled to an OPIC chip. It is packaged in a 8 pin DIP. Input-output isolation voltage(rms) is 5.0kV, High speed response (TYP. 10 Mb/s) and CMR is MIN. 10 kV/µs. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC910L) 2. Approved by VDE (VDE0884) (as an option), file No. 87446 (as model No. PC910L) 3. Package resin : UL flammability grade (94V-0) ■ Applications ■ Features 1. High speed interfaces for computer peripherals 2. Programmable controllers 3. Inverter 1. DIP 8 pin package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High speed response (tPHL : TYP. 48 ns, tPLH : TYP. 50 ns) 4. Low input current drive (IFHL : MAX. 5 mA) 5. Instantaneous common mode rejection voltage (CMH : MIN.10 kV/µs, CML : MIN. −10 kV/µs) 6. TTL and LSTTL compatible output 7. High isolation voltage between input and output (Viso(rms) : 5.0 kV) ∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A05601EN Date Nov. 28. 2003 © SHARP Corporation PC910L0NSZ Series ■ Internal Connection Diagram 1 2 7 3 6 4 5 NC Anode Cathode NC 1 8 2 3 4 5 6 7 8 GND VO (Open collector) VE (Enable) VCC ■ Truth table Input H L H L Enable H H L L Output L H H H L: Logic (0) H: Logic (1) ■ Outline Dimensions (Unit : mm) 1. Through-Hole [ex. PC910L0NSZ] 6 5 1 2 3 6.5±0.5 PC910L 4 2.54±0.25 7 6 5 PC910L 4 1 2 3 4 VDE0884 Identification mark 9.66±0.5 9.66±0.5 Date code 0.5±0.1 Primary side mark 7.62±0.3 Epoxy resin ±0.1 2.54±0.25 0.26 θ θ:0 to 13˚ Date code 3.4±0.5 3.5±0.5 0.5TYP. Primary side mark 8 θ 0.5±0.1 7.62±0.3 0.5 7 0.85±0.2 TYP. 8 SHARP mark "S" 3.4±0.5 3.5±0.5 SHARP mark "S" 1.2±0.3 0.85±0.2 6.5±0.5 1.2±0.3 2. Through-Hole (VDE0884 option) [ex. PC910L0YSZ] Epoxy resin 0.26±0.1 θ θ:0 to 13˚ θ Product mass : approx. 0.49g Sheet No.: D2-A05601EN 2 PC910L0NSZ Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · Mark P R S T U V W X A B C ·· · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D repeats in a 20 year cycle Country of origin Japan Sheet No.: D2-A05601EN 3 PC910L0NSZ Series Output Input ■ Absolute Maximum Ratings *2 *3 (Ta=25°C) Parameter Symbol Rating IF 20 Forward current VR 5 Reverse voltage P Power dissipation 40 VCC Supply voltage 7 *1 Enable voltage VE 5.5 High level output voltage VOH 7 IOL Low level output current 50 PC Collector power dissipation 85 Topr −40 to +85 Operating temperature Tstg Storage temperature −55 to +125 Viso (rms) Isolation voltage 5.0 Tsol 270 Soldering temperature Unit mA V mW V V V mA mW ˚C ˚C kV ˚C *1 Shall not exceed 500mV from supply voltage (VCC) *2 40 to 60%RH, AC for 1minute, f=60Hz *3 For 10s ■ Electro-optical Characteristics*4 Input Parameter Forward voltage Reverse current Terminal capacitance High level output voltage Low level output voltage Output (unles otherwise specified Ta=−40 to 85˚C) MIN. Symbol TYP. MAX. Unit Conditions 1.9 1.6 Ta=25˚C, IF=10mA VF V − − 10 µA IR Ta=25˚C, VR=5V − 60 150 Ta=25˚C, V=0, f=1MHz pF Ct − VCC=VO=5.5V, VE=2.0V, IF=250µA IOH − 0.02 100 µA VCC=5.5V, VE=2.0V, V VOL − 0.4 0.6 IF=5mA, IOL=13mA VCC=5.5V, VE=2.0V VCC=5.5V, VE=0.5V VCC=5.5V, VE=2.0V, IF=0 VCC=5.5V, VE=0.5V, IF=0 VCC=5.5V, VE=2.0V, IF=10mA VCC=5.5V, VE=0.5V, IF=10mA VCC=5V,VE=2.0V, VO=0.8V, RL=350Ω − − − − − − −0.5 −0.7 5 5 7 5.5 −1.6 −1.6 10 − 13 − mA mA mA mA mA mA − 2.5 5 mA RISO Cf tPHL tPLH tr tf ∆tw Ta=25˚C, DC500V, 40 to 60%RH Ta=25˚C, V=0, f=1MHz 5×1010 − 25 25 − − − 1011 0.6 48 50 10 20 − − 5 75 75 − − 35 Ω pF ns ns ns ns ns tEHL Ta=25˚C, IF=7.5mA, VCC=5V, RL=350Ω, CL=15pF, VEH=3V VEL=0.5V − 15 − ns − 10 − ns High level enable current Low level enable current IEH IEL High level supply current ICCH Low level supply current ICCL "High→Low" input threshold current IFHL Response time Isolation resistance Floating capacitance "High→Low" propagation delay time "Low→High" propagation delay time Rise time Fall time *5 Distortion of pulse width Transfer charac"High→Low" enable teristics propagation delay time "Low→High" enable propagation delay time tELH Ta=25˚C, IF=7.5mA, VCC=5V, RL=350Ω, CL=15pF, Instantaneous common mode rejection voltage (High level output) CMH Ta=25˚C, IF=0, VCC=5V, VCM=1kV(P-P), RL=350Ω, VO (Min)=2V 10 20 − kV/µs Instantaneous common mode rejection voltage (Low level output) CML Ta=25˚C, IF=5mA, VCC=5V, VCM=1kV(P-P), RL=350Ω, VO (Max)=0.8V −10 −20 − kV/µs *4 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin 8 ) and GND (pin 5 ) near the device, when it measures the transfer characteristics and the output side characteristics *5 Distortion of pulse width ∆tw= | tPHL−tPLH | Sheet No.: D2-A05601EN 4 PC910L0NSZ Series ■ Model Line-up Through-Hole Sleeve Package 50pcs/sleeve −−−−−− Approved VDE0884 Model No. PC910L0NSZ PC910L0YSZ Lead Form Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. Sheet No.: D2-A05601EN 5 PC910L0NSZ Series Fig.1 Test Circuit for Propagation Delay Time and Rise Time, Fall Time 7.5mA IF 8 2 7 3 6 3.75mA 5V 0.1µF 0mA IF Pulse input 1 tPHL 350Ω VO 4 5V 90% CL 47Ω tPLH VO 5 1.5V 10% *CL includes the probe and wiring capacitance. VOL tr tf Fig.2 Test Circuit for Enable Propagation Delay Time VE 3V Pulse input VE 1 8 2 7 3 6 1.5V 5V IF=7.5mA 0.1µF 0.5V tEHL 350Ω 5V VO CL 4 tELH VO 5 1.5V VOL *CL includes the probe and wiring capacitance. Fig.3 Test Circuit for Instantaneous Common Mode Rejection Voltage 1kV B IF A 1 8 2 7 3 6 4 5 5V VCM 0V 0.1µF GL SW 350Ω CL VCM VO (IF=0) 5V VO(MIN.) When the switch for LED sets to A VO(MAX.) When the switch for LED sets to B V VO (IF=5mA) OL *CL includes the probe and wiring capacitance. Sheet No.: D2-A05601EN 6 PC910L0NSZ Series Fig.4 Forward Current vs. Ambient Temperature Fig.5 Collector Power Dissipation vs. Ambient Temperature 100 Collector power dissipation PC (mW) Forward current IF (mA) 25 20 15 10 5 70 0 −40 −25 0 25 85 80 60 40 20 70 85 50 100 75 0 −40 −25 125 0 Fig.6 Forward Current vs. Forward Voltage 100.0 Ta=0˚C High level output current IOH (µA) Forward current IF (mA) Ta=25˚C Ta=50˚C 10 Ta=85˚C Ta=−20˚C Ta=−40˚C 1 1.20 1.40 1.60 1.80 10.0 125 1.0 0.1 0.01 0.001 −50 2.00 −25 0 25 50 75 100 Ambient temperature Ta (˚C) Fig.8 Low Level Output Voltage vs. Ambient Temperature Fig.9 Input Threshold Current vs. Ambient Temperature 6.0 0.8 IF=5.0mA VCC=5.5V VE=2.0V Input threshold current IFHL (mA) Low level output voltage VOL (V) 100 IF=250µA VCC=5.5V VO=5.5V VE=2.0V Forward voltage VF (V) 0.6 IO=16.0mA IO=12.8mA 0.4 IO=9.6mA IO=6.4mA 0.0 −50 75 Fig.7 High Level Output Current vs. Ambient Temperature 100 0.2 50 Ambient temperature Ta (°C) Ambient temperature Ta (°C) 0.1 1.00 25 85 −25 0 25 50 75 4.0 3.0 2.0 1.0 0.0 −50 100 VCC=5V VO=0.8V VE=2.0V RL=350Ω 5.0 −25 0 25 50 75 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Sheet No.: D2-A05601EN 7 PC910L0NSZ Series Fig.10 Output Voltage vs. Forward Current Fig.11 Propagation Delay Time vs. Forward Current 100 6 Output voltage VO (V) 5 Propagation delay time tPHL, tPLH (ns) VCC=5.0V VO=0.8V VE=2.0V Ta=25˚C 4 3 2 RL=350Ω 1 RL=1kΩ RL=4kΩ 0 Ta=25˚C VCC=5.0V RL=350Ω 80 60 tPLH 40 tPHL 20 0 0 1 2 3 4 5 6 5 Forward current IF (mA) 10 15 20 Forward current IF (mA) Fig.12 Propagation Delay Time vs. Ambient Temperature Propagation delay time tPHL, tPLH (ns) 100 IF=7.5mA VCC=5.0V RL=350Ω 80 60 tPLH 40 tPHL 20 0 −50 −25 0 25 50 75 100 Ambient temperature Ta (˚C) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A05601EN 8 PC910L0NSZ Series ■ Design Considerations ● Recommended operating conditions Parameter Low level input current High level input current High level enable input voltage Low level enable input voltage Supply voltage Fan out (TTL load) Operating temperature Symbol IFL IFH VEH VEL VCC N Topr MIN. 0 8 2.0 0 4.5 − −40 TYP. − − − − − − − MAX. 250 15 VCC 0.8 5.5 8 70 Unit µA mA V V V − ˚C ● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ● Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01µF or more between VCC and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED. ● Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5years) into the design consideration. Please decide the input current which become 2times of MAX. IFHL. ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A05601EN 9 PC910L0NSZ Series ■ Manufacturing Guidelines ● Soldering Method Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A05601EN 10 PC910L0NSZ Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. Sheet No.: D2-A05601EN 11 PC910L0NSZ Series ■ Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 ±2 5.8 10.8 520 6.7 (Unit : mm) Sheet No.: D2-A05601EN 12 PC910L0NSZ Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A05601EN 13
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