PC923L0YSZ

PC923L0NSZ Series PC923L0NSZ Series High Speed, Gate Drive DIP 8 pin ∗OPIC Photocoupler ■ Description PC923L0NSZ Series contains a LED optically coupled to an OPIC chip. It is packaged in a 8 pin DIP, available in SMT gullwing lead form option. Input-output isolation voltage(rms) is 5.0 kV, High speed response (tPHL, tPLH : MAX. 0.5 µs). ■ Agency approvals/Compliance 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC923L) 2. Approved by VDE (VDE0884) (as an option), file No. 87446 (as model No. PC923L) 3. Package resin : UL flammability grade (94V-0) ■ Features 1. 8 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Built-in direct drive circuit for MOSFET / IGBT drive (IO1P, IO2P : 0.6 A) 4. High speed response (tPHL, tPLH : MAX. 0.5 µs) 5. Wide operating supply voltage range (VCC=15 to 30 V) 6. High noise immunity due to high instantaneous common mode rejection voltage (CMH : MIN. −15kV/µs, CML : MIN. 15kV/µs) 7. High isolation voltage between input and output (Viso(rms) : 5.0 kV) ■ Applications 1. IGBT/MOSFET gate drive for inverter control ∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A06001EN Date Nov. 28. 2003 © SHARP Corporation PC923L0NSZ Series ■ Internal Connection Diagram 8 7 6 5 1 2 3 Interface 4 NC Anode Cathode NC 5 6 7 8 O1 O2 GND VCC Tr.1 Tr.2 Amp. 1 2 3 4 ■ Truth table Input ON OFF O2 Terminal output High level Low level Tr. 1 ON OFF Tr. 2 OFF ON ■ Outline Dimensions 1. Through-Hole [ex. PC923L0NSZ] 1.2±0.3 SHARP mark "S" 8 7 6 5 (Unit : mm) 2. Through-Hole (VDE0884 option) [ex. PC923L0YSZ] 1.2±0.3 SHARP mark "S" 8 7 6 5 0.85±0.2 0.85±0.2 6.5±0.5 4 1 2 3 4 1 2 3 4 9.66±0.5 Primary side mark Date code 7.62±0.3 0.5TYP. 3.4±0.5 3.5±0.5 9.66±0.5 Primary side mark 6.5±0.5 VDE0884 Identification mark Date code 7.62±0.3 3.4±0.5 3.5±0.5 TYP. PC923L PC923L 0.5 Epoxy resin 0.26 θ ±0.1 Epoxy resin 0.26±0.1 θ θ:0 to 13˚ θ 2.54±0.25 0.5±0.1 2.54±0.25 θ 0.5±0.1 θ:0 to 13˚ Sheet No.: D2-A06001EN 2 PC923L0NSZ Series (Unit : mm) 3. SMT Gullwing Lead-Form [ex. PC923L0NIP] 4. SMT Gullwing Lead-Form (VDE0884 option) [ex. PC923L0YIP] 1.2±0.3 SHARP mark "S" 6.5±0.5 8 7 6 5 1.2±0.3 SHARP mark "S" 8 7 6 5 0.85±0.2 0.85±0.2 4 1 2 3 ±0.5 4 9.66 Date code 1 2 3 ±0.5 4 9.66 Primary side mark 0.26±0.1 0.35±0.25 3.5±0.5 2.54±0.25 1.0+0.4 −0 Epoxy resin 10.0+0 −0.5 3.5±0.5 0.26±0.1 1.0+0.4 −0 2.54±0.25 1.0+0.4 −0 Epoxy resin 10.0+0 −0.5 Product mass : approx. 0.55g Sheet No.: D2-A06001EN 3 0.35±0.25 1.0+0.4 −0 7.62±0.3 Primary side mark 6.5±0.5 VDE0884 Identification mark Date code PC923L PC923L 7.62±0.3 PC923L0NSZ Series Date code (3 digit) 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M · · N · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D 3rd digit Week of production Mark Week 1st 1 2nd 2 3rd 3 4th 4 5.6th 5 A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 Mark P R S T U V W X A B C · · · repeats in a 20 year cycle Country of origin Japan Sheet No.: D2-A06001EN 4 PC923L0NSZ Series ■ Absolute Maximum Ratings Parameter Symbol *1 IF Forward current Input Reverse voltage VR Supply voltage VCC O1 output current IO1 *2 O1 Peak output current IO1P IO2 Output O2 output current *2 O2 Peak output current IO2P O1 output voltage VO1 *3 PO Power dissipation *4 Ptot Total power dissipation *5 Isolation voltage Viso (rms) Operating temperature Topr Storage temperature Tstg *6 Soldering temperature Tsol Rating 20 5 35 0.1 0.6 0.1 0.6 35 500 550 5.0 −40 to +85 −55 to +125 270 (Ta=25˚C) Unit mA V V A A A A V mW mW kV ˚C ˚C ˚C *1 The derating factors of a absolute maximum ratings due to ambient temperature are shown in Fig.10 *2 Pulse width≤0.15µs, Duty ratio : 0.01 *3, 4 The derating factors of a absolute maximum ratings due to ambient temperature are shown in Fig.11 *5 AC for 1minute, 40 to 60 %RH, f=60Hz *6 For 10s ■ Electro-optical Characteristics*7 Parameter Input Forward voltage Reverse current Terminal capacitance Supply voltage O1 Low level output voltage O2 High level output voltage O2 Low level output voltage O1 leak current O2 leak current High level supply current Low level supply current "Low→High" input threshold current Isolation resistance "Low→High" propagation delay time "High→Low" propagation delay time Rise time Fall time Instantaneous common mode rejection voltage (High level output) Instantaneous common mode rejection voltage (Low level output) Symbol VF1 VF2 IR Ct VCC VO1L VO2H VO2L IO1L IO2L ICCH ICCL IFLH RISO tPLH tPHL tr tf CMH Conditions Ta=25˚C, IF=10mA Ta=25˚C, IF=0.2mA Ta=25˚C, VR=5V Ta=25˚C, V=0, f=1MHz − VCC1=12V, VCC2=−12V, IO1=0.1A, IF=5mA VCC=VO1=24V, IO2=−0.1A, IF=5mA VCC=24V, IO2=0.1A, IF=0 VCC=VO1=35V, IF=0 VCC=VO2=35V, IF=5mA VCC=24V, IF=5mA VCC=24V, IF=0 Ta=25˚C, VCC=24V VCC=24V Ta=25˚C, DC500V, 40 to 60%RH *9 *9 *8 Transfer characteristics Ta=25˚C, VCC=24V, IF=5mA RG=47Ω, CG=3 000pF Ta=25˚C, VCM=1.5kV(p-p) IF=5mA, VCC=24V, ∆VO2H=2.0V Ta=25˚C, VCM=1.5kV(p-p) IF=0, VCC=24V, ∆VO2L=2.0V (Unless otherwise specified Ta=Topr) MIN. MAX. Unit TYP. V − 1.75 1.6 − 1.2 V 1.5 µA − 10 − 60 pF − 150 − V 15 30 0.2 − 0.4 V 20 22 − V − 0.5 0.8 V − − 500 µA − − 500 µA − 1.3 3.0 mA − 1.3 3.0 mA 1.5 mA 3.0 0.3 mA − 5.0 0.2 10 11 Ω 5×10 − 10 0.3 µs − 0.5 0.3 µs − 0.5 µs 0.2 − 0.5 µs 0.2 − 0.5 -15 − − kV/µs Output Response time CML 15 − − kV/µs *7 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin 8 ) and GND (pin 7 ) near the device, when it measures the transfer characteristics and the output side characteristics *9 O2 output terminal is set open *8 IFLH represents forward current when output goes from "Low" to "High" Sheet No.: D2-A06001EN 5 PC923L0NSZ Series ■ Model Line-up Lead Form SMT Gullwing Sleeve Taping Package 50pcs/sleeve 1 000pcs/reel −−−−−− Approved −−−−−− Approved −−−−−− Approved VDE0884 Model No. PC923L0NSZ PC923L0YSZ PC923L0NIZ PC923L0YIZ PC923L0NIP PC923L0YIP Through-Hole Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. Sheet No.: D2-A06001EN 6 PC923L0NSZ Series Fig.1 Test Circuit for O1 Low Level Output Voltage 8 2 5 IF 3 7 PC923L 6 V VO1L VCC1 IO1 VCC2 IF 3 7 2 5 PC923L 6 VO2H V IO2 VCC Fig.2 Test Circuit for O2 High Level Output Voltage 8 Fig.3 Test Circuit for O2 Low Level Output Voltage 8 2 5 IF 3 7 PC923L 6 V VO2L IO2 VCC Fig.4 Test Circuit for O1 Leak Current 8 2 5 IF 3 7 PC923L 6 VCC A IO1L Fig.5 Test Circuit for O2 Leak Current 8 2 5 IF 3 7 PC923L 6 A IO2L VCC Fig.6 Test Circuit for High Level / Low Level Supply Current 8 2 5 IF 3 7 PC923L 6 A ICC VCC Sheet No.: D2-A06001EN 7 PC923L0NSZ Series Fig.7 Test Circuit for "Low→High" Input Threshold Current 8 2 5 IF Variable 3 7 PC923L 6 V VCC Fig.8 Test Circuit for Response Time 50% 8 2 VIN tr=tf=0.01µs Pulse width 5µs Duty ratio 50% 3 7 VOUT wave form tr tf 5 PC923L 6 RG VOUT VCC CG tPLH tPHL 90% 50% 10% VIN wave form Fig.9 Test Circuit for Instantaneous Common Mode Rejection Voltage VCM (Peak) 8 A SW B 2 5 PC923L 6 3 7 + − V VO2 VCC CMH, VO2 wave form SW at A, IF=5mA CML, VO2 wave form SW at B, IF=0 ∆VO2L ∆VO2H VO2L GND VO2H VCM wave form GND VCM Sheet No.: D2-A06001EN 8 PC923L0NSZ Series Fig.10 Forward Current vs. Ambient Temperature 60 50 Forward current IF (mA) Fig.11 Power Dissipation vs. Ambient Temperature 600 Power dissipation PO, Ptot (mW) 500 400 300 200 PO Ptot 40 30 20 10 0 −40 −25 100 0 −40 −25 0 25 50 75 85 100 125 0 25 50 75 85 100 125 Ambient temperature Ta (°C) Ambient temperature Ta (°C) Fig.12 Forward Current vs. Forward Voltage 100 Fig.13 "Low→High" Relative Input Threshold Current vs. Supply Voltage 120 Ta=25°C Relative input threshold current (%) 110 Forward current IF (mA) 10 0˚C Ta=85˚C 50˚C 25˚C −20˚C −40˚C 100 90 1 IFLH=100% at VCC=24V 80 0.1 1.0 1.2 1.4 1.6 1.8 2.0 2.2 70 15 18 21 24 27 30 Forward voltage VF (V) Supply voltage VCC (V) Fig.14 "Low→High" Relative Input Threshold Current vs. Ambient Temperature 120 VCC=24V Relative input threshold current (%) 110 100 Fig.15 O1 Low Level Output Voltage vs. O1 Output Current 3 O1 low level output voltage VO1L (V) Ta=25°C VCC1=12V VCC2=−12V IF=5mA 2 90 IFLH=100% at Ta=25˚C 80 70 60 −40 1 −20 0 20 40 60 80 100 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 Ambient temperature Ta (˚C) O1 output current IO1 (A) Sheet No.: D2-A06001EN 9 PC923L0NSZ Series Fig.16 O1 Low Level Output Voltage vs. Ambient Temperature 0.3 0.25 0.2 High output voltage drop (VO2H-VCC) (V) O1 low level output voltage VO1L (V) VCC1=12V VCC2=−12V IF=5mA IO2=0.1A Fig.17 O2 Output Voltage Drop vs. O2 Output Current 0 Ta=25°C VCC=VO1=24V IF=5mA −1 −2 0.15 −3 0.1 0.05 0 −40 −4 −5 0.0 −20 0 20 40 60 80 100 0.1 0.2 0.3 0.4 0.5 0.6 Ambient temperature Ta (°C) O2 output current IO2 (A) Fig.18 O2 High Level Output Voltage vs. Supply Voltage 30 O2 high level output voltage VO2H (V) Ta=25°C IF=5mA Fig.19 O2 High Level Output Voltage vs. Ambient Temperature 24 O2 high level output voltage VO2H (V) VCC=24V IF=5mA 23 27 IO2=nearly 0A 24 21 22 IO2=−0.1A 18 21 15 12 15 18 21 24 27 30 20 −40 −20 0 20 40 60 80 100 Supply voltage VCC (V) Ambient temperature Ta (°C) Fig.20 O2 Low Level Output Voltage vs. O2 Output Current 3 O2 low level output voltage VO2L (V) Ta=25°C VCC=VO1=24V IF=0 Fig.21 O2 Low Level Output Voltage vs. Ambient Temperature 0.8 O2 low level output voltage VO2L (V) 0.7 VCC=24V IF=0 IO2=0.1A 2 0.6 0.5 1 0.4 0.3 0.2 −40 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 −20 0 20 40 60 80 100 O2 output current IO2 (A) Ambient temperature Ta (˚C) Sheet No.: D2-A06001EN 10 PC923L0NSZ Series Fig.22 High Level Supply Current vs. Supply Voltage 3 High level supply current ICCH (mA) Ta=25°C IF=5mA Low level supply current ICCL (mA) Fig.23 Low Level Supply Current vs. Supply Voltage 3 Ta=25°C IF=0 2.5 2 .5 2 2 1.5 1 .5 1 1 0.5 0 15 0 .5 0 15 18 21 24 27 30 18 21 24 27 30 Supply voltage VCC (V) Supply voltage VCC (V) Fig.24 High Level Supply Current vs. Ambient Temperature 3 VCC=24V IF=5mA Fig.25 Low Level Supply Current vs. Ambient Temperature 3 VCC=24V IF=0 High level supply current ICCH (mA) 2 Low level supply current ICCL (mA) −20 2.5 2 .5 2 1.5 1 .5 1 1 0.5 0 −40 0 .5 0 −40 0 20 40 60 80 100 −20 0 20 40 60 80 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Fig.26 Propagation Delay Time vs. Forward Current 1.0 Propagation delay time tPHL, tPLH (µs) tPHL tPLH 0.8 VCC=VO1=24V RG=47Ω CG=3 000pF Fig.27 Propagation Delay Time vs. Ambient Temperature 1 Propagation delay time tPHL, tPLH (µs) VCC=VO1=24V RG=47Ω CG=3 000pF IF=5mA 0 .8 0.6 Ta=85˚C 0 .6 t PLH t PHL 0 .2 Ta=25˚C Ta=−40˚C 0.4 0 .4 0.2 Ta=85˚C 0 0 5 10 15 Forward current IF (mA) Ta=25˚C Ta=−40˚C 20 25 0 −40 −20 0 20 40 60 80 100 Ambient temperature Ta (°C) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A06001EN 11 PC923L0NSZ Series ■ Design Considerations ● Recommended operating conditions Parameter Forward current Supply voltage Operating temperature Symbol IF VCC Topr MIN. 10 15 −40 TYP. − − − MAX. 20 30 70 Unit mA V ˚C ● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ● Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01µF or more between VCC and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED. This photocoupler is dedicated to the use for IGBT or MOSFET Gate Drive. Please do not use this for the other application. As mentioned below, when the input is on, if DC load (resistor etc.) is connected between O2 output pin 6 and GND pin 7 and if the electric potential VO2 goes approx. 2V below than electric potential VCC pin 8 continuously, supply current ICC may flow more than usually and go beyond power dissipation. 8 2 5 IF 3 7 PC923L 6 VCC A 2V or more Sheet No.: D2-A06001EN 12 PC923L0NSZ Series ● Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5years) into the design consideration. Please decide the input current which become 2times of MAX. IFLH. ● Recommended Foot Print (reference) 8.2 2.54 2.54 2.54 2.2 1.7 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A06001EN 13 PC923L0NSZ Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less 100 Preheat 150 to 180˚C, 120s or less 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A06001EN 14 PC923L0NSZ Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. Sheet No.: D2-A06001EN 15 PC923L0NSZ Series ■ Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 520 ±2 6.7 5.8 10.8 (Unit : mm) Sheet No.: D2-A06001EN 16 PC923L0NSZ Series ● Tape and Reel package Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E D G C I J B H A H Dimensions List A B 16.0±0.3 7.5±0.1 H I ±0.1 10.4 0.4±0.05 C 1.75±0.1 J 4.2±0.1 D 12.0±0.1 K 10.2±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e g c d Dimensions List a b f a b 5˚ K MA X. 330 e 23±1.0 17.5±1.5 f 2.0±0.5 (Unit : mm) c d ±1.0 100 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A06001EN 17 PC923L0NSZ Series ■ Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A06001EN 18