PC928

PC928 Series PC928 Series Built-in Short Protection Circuit, Gate Drive SMD 14 pin ∗OPIC Photocoupler ■ Description ■ Agency approvals/Compliance PC928 Series contains an IRED optically coupled to an OPIC chip. It is packaged in a Mini-flat, Half pitch type (14 pin). Input-output isolation voltage(rms) is 4.0kV. 1. Recognized by UL1577, file No. E64380 (as model No. PC928) 2. Approved by VDE (VDE0884) (as an option) file No. 94626 (as model No. PC928) 3. Package resin : UL flammability grade (94V-0) ■ Features ■ Applications 1. 14 pin Half lead pin pitch (Lead pitch=1.27 mm) package type 2. Double transfer mold package (Ideal for Flow Soldering) 3. Built-in IGBT shortcircuit protector circuit 4. Built-in direct drive circuit for IGBT drive (Peak output current : IO1P, IO2P : MAX. 0.4 A) 5. High isolation voltage (Viso(rms) : 4.0 kV) 1. Inverter ∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A06202EN Date Mar. 26. 2004 © SHARP Corporation PC928 Series ■ Internal Connection Diagram 14 13 12 11 10 9 8 1 2 IGBT protection circuit 3 4 Interface 5 Amp. 6 7 1 2 3 4 5 6 Anode Anode Cathode NC∗ NC∗ NC∗ NC∗ 8 9 10 11 12 13 14 FS C GND O2 O1 VCC GND ∗ No. 4 to 7 pin shall be shorted in the device. 7 Voltage regulator ■ Truth table Input C input-output Low level High level Low level High level ON OFF O2 output High level Low level Low level Low level FS output High level Low level High level High level At operating protection function ■ Outline Dimensions (Unit : mm) 1. SMT Gullwing Lead-Form [ex. PC928P] 2. SMT Gullwing Lead-Form (VDE0884 option) [ex. PC928PY] 1.27±0.25 14 8 SHARP mark "S" 6.5±0.5 P C9 2 8 8 PC928 6.5±0.5 14 1.27±0.25 V 4 DE Date code Date code 1 7 1 7 Primary side mark Primary side mark VDE0884 Identification mark 9.22±0.5 9.22 7.62±0.3 3.5±0.5 0.35±0.25 0.26±0.1 3.5±0.5 7.62 0.35±0.25 ±0.3 0.26±0.1 ±0.5 Epoxy resin Epoxy resin 0.6±0.1 0.6±0.1 1.0+0.4 −0 1.0+0.4 −0 1.0+0.4 −0 1.0+0.4 −0 10.0+0 −0.5 10.0+0 −0.5 Product mass : approx. 0.47g Sheet No.: D2-A06202EN 2 PC928 Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · Mark P R S T U V W X A B C ·· · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D repeats in a 20 year cycle Country of origin Japan Sheet No.: D2-A06202EN 3 PC928 Series ■ Absolute Maximum Ratings Output Input (unless otherwise specified Ta=Topr) Parameter Symbol Rating Unit *1 IF 25 mA Forward current *2 VR 6 V Reverse voltage 35 VCC V Supply voltage I 0.1 A O1 output current O1 *3 0.4 IO1P A O1 peak output current IO2 0.1 A O2 output current *3 IO2P 0.4 A O2 peak output current VO1 35 V O1 output voltage *4 P 500 mW Power dissipation O VC VCC V Overcurrent detection voltage IC 30 mA Overcurrent detection current VFS VCC V Error signal output voltage IFS 20 mA Error signal output current *5 550 Total power dissipation Ptot mW *6 Isolation voltage Viso (rms) 4.0 kV −25 to +80 Operating temperature Topr ˚C −55 to +125 Storage temperature Tstg ˚C *7 Soldering temperature Tsol 260 ˚C *1 The derating factors of a absolute maximum ratings due to ambient temperature are shown in Fig.15 *2 Ta =25˚C *3 Pulse width≤0.15µs, Duty ratio : 0.01 *4.5 The derating factors of a absolute maximum ratings due to ambient temperature are shown in Fig.16 *6 AC for 1minute, 40 to 60%RH, Ta =25˚C, f=60Hz *7 For 10s ■ Electro-optical Characteristics Output Input Parameter Forward voltage Reverse current Terminal capacitance Symbol VF1 VF2 IR Ct Supply voltage VCC O1 Low level output voltage O2 High level output voltage O2 Low level output voltage O1 leak current VO1L VO2H VO2L IO1L High level supply current ICCH Low level supply current ICCL *8 Conditions Ta=25˚C, IF=20mA Ta=25˚C, IF=0.2mA Ta=25˚C, VR=4V Ta=25˚C, V=0, f=1kHz Ta=−10 to +60˚C − VCC1=12V, VCC2=−12V, IO1=0.1A, IF=10mA *9 VCC=VO1=24V, IO2=−0.1A, IF=10mA *9 *9 VCC=24V, IO2=0.1A, IF=0 Ta=25˚C, VCC=VO1=35V, IF=0 *9 Ta=25˚C, VCC=24V, IF=10mA *9 *9 VCC=VO1=24V, IF=10mA Ta=25˚C, VCC=VO1=24V, IF=0 *9 *9 VCC=VO1=24V, IF=0 (unless otherwise specified Ta=Topr) MIN. TYP. MAX. Unit 1.2 V 1.4 − 0.9 V 0.6 − µA 10 − − pF − 250 30 V 30 15 − V 24 15 − − 0.2 V 0.4 20 22 − V − 1.2 V 2.0 − − µA 500 − 10 mA 17 − − mA 19 − 11 mA 18 − − mA 20 *8 It shall connect a by-pass capacitor of 0.01 µF or more between VCC (pin 13 ) and GND (pin, 10 , 14 ) near the device, when it measures the transfer characteristics and the output side characteristics. *9 FS=OPEN, VC=0 Sheet No.: D2-A06202EN 4 PC928 Series Parameter Protection output Overcurrent detection Response time Transfer characteristics *11 *12 Conditions *10 Ta=25˚C, VCC=VO1=24V, FS=OPEN, VC=0 VCC=VO1=24V, FS=OPEN, VC=0 Ta=25˚C, DC=500V, 40 to 60%RH Ta=25˚C, VCC=VO1=24V, IF=10mA, RG=47Ω, CG=3 000pF FS=OPEN, VC=0 (unless otherwise specified Ta=Topr) MIN. TYP. MAX. Unit 7.0 4.0 mA 1.0 10 mA 0.6 − 10 11 Ω − 5×10 10 2.0 µs 1.0 − 2.0 µs 1.0 − µs 0.5 0.2 − µs 0.5 0.2 − "Low→High" input threshold current IFLH Isolation resistance "Low→High" propagation delay time "High→Low" propagation delay time Rise time Fall time RISO tPLH tPHL tr tf Instantaneous common mode rejection voltage (High level output) CMH Ta=25˚C, VCM=600V(p-p) IF=10mA, VCC=VO1=24V, ∆VO2H=2.0V, FS=OPEN, VC=0 −1.5 − − kV/µs Instantaneous common mode rejection voltage (Low level output) CML Ta=25˚C, VCM=600V(p-p) IF=0, VCC=VO1=24V, ∆VO2L=2.0V, FS=OPEN, VC=0 1.5 − − kV/µs Overcurrent detection voltage VCTH Overcurrent detection voltage hysteresis width VCHIS O2 "High→Low" propagation delay time at overcurrent protection tPCOHL O2 Fall time at overcurrent protection tPCOtf O2 "High→Low" output voltage at overcurrent protection VOE Low level error signal voltage Error signal output Symbol High level error signal current Error signal "High→Low" propagation delay time Error signal output pulse width Ta=25˚C VCC=VO1=24V IF=10mA, RG=47Ω CG=3 000pF, FS=OPEN VCC−6.5 VCC−6 VCC−5.5 V 1 2 3 V − 4 10 µs 2 5 − µs − − 2 V VFSL Ta=25˚C, IF=10mA VCC=VO1=24V IFS=10mA, RG=47Ω CG=3 000pF, C=OPEN − 0.2 0.4 V IFSH Ta=25˚C VCC=VO1=24V, IF=10mA VFS=24V, RG=47Ω CG=3 000pF, VC=0 − − 100 µA − 1 5 µs 20 35 − µs tPCFHL ∆tFS Ta=25˚C VCC=VO1=24V IF=10mA, RG=47Ω, CG=3 000pF, RC=1kΩ, CP=1 000pF FS=OPEN Ta=25˚C, VCC=VO1=24V IF=10mA, RFS=1.8kΩ RG=47Ω, RC=1kΩ CG=3 000pF, CP=1 000pF *10 It shall connect a by-pass capacitor of 0.01 µF or more between VCC (pin 13 ) and GND (pin 10 , 14 ) near the device, when it measures the device, when it measures the overcurrent characteristics, Protection output characteristics, and Error signal output characteristics. *11 IFLH represents forward current when output goes from "Low" to "High" *12 VCTH is the value of C (pin 9 ) voltage when output becomes from "High" to "Low" Sheet No.: D2-A06202EN 5 PC928 Series ■ Model Line-up Lead Form Package VDE0884 Model No. SMT Gullwing Sleeve Taping 50pcs/sleeve 1 000pcs/reel −−−−−− Approved −−−−−− Approved PC928P PC928PY PC928 PC928Y Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. Sheet No.: D2-A06202EN 6 PC928 Series Fig.1 Test Circuit for O1 Low Level Output Voltage Fig.2 Test Circuit for O2 High Level Output Voltage 13 1 2 VCC1 12 PC928 IF 13 11 V V O1L 1 2 VCC2 PC928 IF 11 14 10 3 9 V02H V 9 8 8 Fig.3 Test Circuit for O2 Low Level Output Voltage Fig.4 Test Circuit for O1 Leak Current 13 1 2 IO2 VCC 14 10 3 12 IO1 13 A IO1L 1 2 12 12 VCC PC928 IF V VO2L 14 10 3 VCC 11 PC928 IF IO2 14 10 3 9 9 8 8 Fig.5 Test Circuit for "Low→High" Input Threshold Current Fig.6 Test Circuit for High Level / Low Level Supply Current 13 13 1 2 11 1 2 12 12 VCC VCC PC928 IF variable 11 V VO2 PC928 IF 14 10 3 A ICC 14 10 3 9 8 11 9 8 Sheet No.: D2-A06202EN 7 PC928 Series Fig.7 Test Circuit for Instantaneous Common Mode Rejection Voltage Fig.8 Test Circuit for Response Time 13 1 2 SW A 13 1 2 12 12 VCC B PC928 11 VIN V VO2 14 10 3 RG tr=tf=0.01µs Pulse width 5µs Duty ratio 50% PC928 CG 9 8 + V VOUT 14 10 3 9 VCC 11 8 − VCM 50% VCM (peak) VCM waveform VIN waveform tPLH GND tPHL 90% CMH, VO2 waveform SW at A, IF=10mA VO2H VOUT waveform VO2L GND Fig.9 Test Circuit for Overcurrent Detection Voltage, Overcurrent Detection Voltage Hysteresis Fig.10 Test Circuit for O2 Output Voltage at Overcurrent Protection 13 1 2 13 1 2 12 RG PC928 IF RG 11 V VO2 12 VCC CG PC928 IF 14 10 8 V VO2 CG CP VC 14 10 3 9 VCC 11 V VCTH 3 tf tr ∆VO2H ∆VO2L CML, VO2 waveform SW at B, IF=0 50% 10% RC 9 8 Sheet No.: D2-A06202EN 8 PC928 Series Fig.11 Test Circuit for O1 Low Level Error Signal Voltage Fig.12 Test Circuit for High Level Error Signal Current 13 1 2 13 1 2 12 PC928 IF CG 11 PC928 IF V 9 CG 14 10 3 VFSL VCC RG 11 14 10 3 12 VCC RG 9 IFS 8 VFS 8 A IFSH Fig.13 Test Circuit for O2 "High→Low" Propagation Delay Time at Overcurrent Protection, O2 Fall Time at Overcurrent Protection Fig.14 Error Signal "High→Low" propagation Delay Time, Error Signal Output Pulse Width 13 13 1 2 RG tr=tf=0.01µs Pulse width 25µs Duty ratio 25% PC928 11 V VOUT 14 10 12 RC VCC VIN CG RC RG tr=tf=0.01µs Pulse width 25µs Duty ratio 25% PC928 VCC 11 CG 14 10 CP 3 3 9 8 IF (Input current) 8 90% 50% 10% tpCOHL 90% FS (Error signal output) RFS tpCOTF VO2 (O2 output voltage) C (Detecting terminal) VOUT V 9 VOE VIN 1 2 12 Error detection threshold voltage (VCTH) 10% tpCFHL ∆tFS 50% 50% Sheet No.: D2-A06202EN 9 PC928 Series Fig.15 Forward Current vs. Ambient Temperature Fig.16 Power Dissipation vs. Ambient Temperature 600 60 Total power dissipation 550 Power dissipation Ptot, Po (mW) Forward current IF (mA) 50 40 30 20 500 Output side power dissipation 400 300 200 100 10 0 −25 0 25 50 75 80 100 0 −25 125 0 25 50 75 80 100 125 Ambient temperature Ta (°C) Ambient temperature Ta (°C) Fig.18 "Low→High" Relative Input Threshold Current vs. Supply Voltage Fig.17 Forward Current vs. Forward Voltage 1.6 Ta=25°C Forward current IF (mA) 50°C Relative input threshold current IFLH Ta=75°C 25°C 0°C 100 −20°C 10 1.4 1.2 Value of VCC=24V assumes 1. 1 0.8 1 0 0.5 1.0 1.5 2.0 2.5 3.0 0.6 15 3.5 Forward voltage VF (V) 24 27 1 O1 low level output voltage VO1L (V) VCC=24V 1.2 1.1 IFLH = 1 at Ta=25°C 1 0.9 0 25 50 30 Fig.20 O1 Low Level Output Voltage vs. O1 Output Current 1.3 Relative input threshold current IFLH 21 Supply voltage VCC (V) Fig.19 "Low→High" Relative Input Threshold Current vs. Ambient Temperature 0.8 −25 18 75 0.1 0.01 0.001 0.01 100 Ambient temperature Ta (°C) Ta=25˚C VCC1=12V VCC2=12V IF=10mA 0.1 1 O1 output current IO1 (A) Sheet No.: D2-A06202EN 10 PC928 Series Fig.21 O1 Low Level Output Voltage vs. Ambient Temperature Fig.22 O1 Leak Current vs. Ambient Temperature 10−6 VCC=VO1=35V IF=0mA VCC1=12V VCC2=−12V IF=10mA 0.20 10−7 O1 leak current IO1L (A) O1 low level output voltage VO1L (V) 0.25 0.15 IO1=0.1A 0.10 10−8 10−9 0.05 0.00 −25 0 25 50 75 10−10 −25 100 0 Ambient temperature Ta (°C) Fig.23 O2 High Level Output Voltage vs. Supply Voltage 25 20 15 10 5 15 18 21 24 27 23 IO2=0A 22 −0.1A 21 20 19 −25 30 0 25 50 75 100 Ambient temperature Ta (°C) Fig.26 O2 Low Level Output Voltage vs. Ambient Temperature Fig.25 O2 Low Level Output Voltage vs. Output Current 10 1.3 VCC=24V Ta=25°C O2 low level output voltage VO2L (V) O2 low level output voltage VO2L (V) 100 VCC=24V IF=10mA Supply voltage VCC (V) 1 0.1 0.01 0.01 75 24 Ta=25°C IF=10mA IO2=−0.1A 30 50 Fig.24 O2 High Level Output Voltage vs. Ambient Temperature O2 high level output voltage VO2H (V) O2 high level output voltage VO2H (V) 35 25 Ambient temperature Ta (°C) 0.1 VCC=24V IF=10mA 1.2 1.1 IO2=0.1A 1 0.9 0.8 −25 1 Output current IO2 (A) 0 25 50 75 100 Ambient temperature Ta (°C) Sheet No.: D2-A06202EN 11 PC928 Series Fig.27 High Level Supply Current vs. Supply Voltage Fig.28 Low Level Supply Current vs. Supply Voltage 16 IF=10mA Low le ve l s upply c ur r e nt I C C L ( m A ) H igh le ve l s upply c ur r e nt I C C H ( m A ) 14 Ta=−25°C 12 10 2 5°C 8 8 0°C 6 4 15 18 21 24 27 IF=0mA 12 2 5 °C 10 8 0 °C 8 6 15 30 18 Supply voltage VCC (V) 24 2 .5 P r o p a g a tio n d e la y time t P H L , t P L H ( µ s ) Ta=25°C VCC=24V RG=47Ω CG=3 000pF 3 2.5 t PLH 2 1.5 1 0.5 t PHL 5 10 15 1 .5 t PLH 1 0 .5 20 t PHL 0 −25 25 0 Fig.31 Overcurrent Detecting Voltage vs. Ambient Temperature O 2 output fall time at protection from overcurrent t PCOtf / O 2 "H-L" delay time at protection from overcurrent t PCOHL (µs) VCC=24V RG=47Ω CG=3 000pF IF=10mA 20 15 10 5 0 25 50 75 50 75 100 Fig.32 O2 Output Fall Time at Protection from Overcurrent/O2 "High-Low" Propagation Delay Time at Protection from Overcurrent vs. Ambient Temperature 30 0 −25 25 Ambient temperature Ta (°C) F o rw a rd c u rre n t I F (m A ) 25 30 VCC=24V RG=47Ω CG=3 000pF IF=10mA 2 0 0 27 Fig.30 Propagation Delay Time vs. Ambient Temperature 3.5 P r o p a g a tio n d e la y time t P H L , t P L H ( µ s ) 21 Supply voltage VCC (V) Fig.29 Propagation Delay Time vs. Forward Current O v er cu r r en t d et e ct i ng vo l t a g e V C T H ( V) Ta=−25°C 14 100 10 8 VCC=24V IF=10mA RG=47Ω CG=3 000pF RC=1kΩ CP=1 000pF t PCOtf 6 t PCOHL 4 2 0 −25 0 25 50 75 100 Ambient temperature Ta (°C) Ambient temperature Ta (°C) Sheet No.: D2-A06202EN 12 PC928 Series Fig.34 O2 Output Voltage at Protection from Overcurrent vs. Ambient Temperature 2 .0 1.5 VCC=24V IF=10mA RFS=1.8kΩ RG=47Ω CG=3 000pF RC=1kΩ CP=1 000pF 1.2 0.9 0.6 0.3 0 −25 0 25 50 75 VCC=24V IF=10mA RG=47Ω CG=3 000pF RC=1kΩ CP=1 000pF 1 .8 O2 output voltage at protection from overcurrent VOE (V) Error signal "H-L" propagation delay time tPCFHL (µs) Fig.33 Error Signal "High-Low" Propagation Delay Time vs. Ambient Temperature 1 .6 1 .4 1 .2 1 .0 0 .8 0 .6 0 .4 0 .2 0 .0 −25 100 0 25 Ambient temperature Ta (°C) Fig.35 Low Level Error Signal Voltage vs. Ambient Temperature High level error signal current IFSH (A) Low level error signal voltage VFSL (V) 100 10-6 VCC=24V IF=10mA IFS=10mA RG=47Ω CG=3 000pF C=OPEN 0.3 0.2 0.1 0 −25 0 25 50 75 10-7 VCC=24V IF=10mA VFS=24V RG=47Ω CG=3 000pF VC=0 10-8 10-9 −25 100 0 25 Fig.37 Error Signal Output Pulse Width vs. Ambient Temperature Overcurrent detecting voltage VCTH (V) 20 10 0 100 25 VCC=24V IF=10mA RFS=1.8kΩ RG=47Ω CG=3 000pF RC=1kΩ CP=1 000pF 30 0 −25 75 Fig.38 Overcurrent Detecting Voltage vs. Supply Voltage 50 40 50 Ambient temperature Ta (°C) Ambient temperature Ta (°C) Error signal output pulse width ∆tFS (µs) 75 Fig.36 High Level Error Signal Current vs. Ambient Temperature 0.5 0.4 50 Ambient temperature Ta (°C) 25 50 75 Ta=25°C IF=10mA VCC=24V 20 RG=47Ω CG=3 000pF RC=1kΩ FS=OPEN 15 CP=1 000pF 10 Ambient temperature Ta (°C) 0.5kΩ 1kΩ 5 1.5kΩ 0 15 100 Added resistance=0Ω 18 21 24 27 30 Supply voltage VCC (V) Sheet No.: D2-A06202EN 13 PC928 Series Fig.39 Overcurrent Detecting Voltage - Supply Voltage Characteristics Test Circuit IF Cathode RG O2 PC928 Added resistance VCC O1 Anode V C RC VO2 CP VCC CG V FS VC GND Fig.40 Example of The Application Circuit (IGBT Drive for Inverter) VCC (+) R1 Cathode PC928 O1 Anode O2 + VCC1=12V + VCC2=12V RG CB Power supply Anode RC C TTL, microcomputer, etc. FS R2 D2 D1 R3 Cp GND (−) To microcomputer RFS PC817X etc. CFS • In order to stabilize the power supply line, we recommend to locate a bypass capacitor CB (0.01µF or more) between VCC and GND near photocoupler. • In order to stabilize the detecting voltage of pin-C, we recommend to locate a capacitor CP (approximately 1 000pF) between pin-C and GND, and a resistor RC (approximately 1.0kΩ) between VCC and pin-C. However, the rise time of the detection voltage at Pin-C varies along with the time constants of CP and RC. So, please make sure the device works properly in actual conditions. • For the diode D, which is located between pin-C and collector of IGBT, we recommend to use a diode that has the withstand voltage characteristic equivalent to IGBT and also has little leak current. • In order to prevent the failure mode or breakdown of pin-C from VCE variation of IGBT, we recommend to locate a resistor R2 (approximately 10kΩ) and a diode D1 at near pin-C, and a resistor R3 (approximately 50kΩ) and a diode D2 at between pin-C and GND. This application circuit shows the general example of a circuit, and is not a design guarantee for right operation. Sheet No.: D2-A06202EN 14 PC928 Series Fig.41 Operations of Shortcircuit Protector Circuit VCC PC928 13 Anode 1 2 Cathode 3 TTL, microcomputer, etc. 12 Constant voltage circuit Amp. O1 Tr. 1 Interface Anode VCC 11 O2 RG Tr. 2 IGBT RC VC Typ. 150kΩ 9 IGBT protector circuit 8 14 10 C FS CP GND VEE Feedback to primary side 1. Detection of increase in VCE(sat) of IGBT due to overcurrent by means of C terminal (pin 9 ) 2. Reduction of the IGBT gate voltage, and suppression of the collector current 3. Simultaneous output of signals to indicate the shortcircuit condition (FS signal) from FS terminal (pin 8 ) to the microcomputer 4. Judgement and processing by the microcomputer In the case of instantaneous shortcircuit, run continues. At fault, input to the photocoupler is cut off, and IGBT is turned OFF. Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A06202EN 15 PC928 Series ■ Design Considerations ● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ● Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01µF or more between VCC and GND near the device. We recommend to use approximately 1 000pF of capacitor between C-pin and GND in order to prevent miss operation by noise. In the case that capacitor is used approximately 1kΩ of resistance shall be recommended to use between V CC and C-pin However, the rise time of C-pin shall be changed by time constant of added CR, so that please use this device after confirmation. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through IRED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of IRED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent IRED. Sheet No.: D2-A06202EN 16 PC928 Series ● Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5years) into the design consideration. Please decide the input current which become 2times of MAX. IFLH. ● Recommended Foot Print (reference) 0.8 1.27 1.27 1.27 1.27 1.27 1.27 9.0 1.8 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A06202EN 17 PC928 Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 260˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A06202EN 18 PC928 Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. Sheet No.: D2-A06202EN 19 PC928シリーズ ■ Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 ±2 5.8 10.8 520 6.7 (Unit : mm) Sheet No.: D2-A06202EN 20 PC928 Series ● Tape and Reel package Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F J D E G MA X. H H A B C I Dimensions List A B ±0.3 16.0 7.5±0.1 H I 10.4±0.1 0.4±0.05 5˚ K C 1.75±0.1 J 4.2±0.1 D 12.0±0.1 K 9.7±0.1 E 2.0±0.1 F 4.0±0.1 (Unit : mm) G +0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b 330 17.5±1.5 e f ±1.0 23 2.0±0.5 f a b (Unit : mm) c d 100±1.0 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A06202EN 21 PC928 Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A06202EN 22