PC942 Series
PC942 Series
High Power, Gate Drive DIP 8 pin
∗OPIC Photocoupler
■ Description
■ Agency approvals/Compliance
PC942 Series contains an IRED optically coupled to
an OPIC chip.
It is packaged in a 8 pin DIP, available in SMT gullwing lead form option.
Input-output isolation voltage(rms) is 5.0kV, High
speed response (t PHL ,t PLH : MAX. 5µs) and CMR is
MIN. 10kv/µs.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC942)
2. Package resin : UL flammability grade (94V-0)
■ Applications
1. Inverter controlled air conditioners
2. Small capacity general purpose inverters
■ Features
1. 8 pin DIP package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. Built-in base amplifier for inverter drive
4. High power (IO1 : MAX. 0.5A (DC))
(IO2P : MAX. 2.0A (pulse))
5. High noise immunity due to high instantaneous common mode rejection voltage
(CMH : MIN. −10 kV/µs, CML : MIN. 10 kV/µs)
6. High speed response (tPHL,tPLH : MAX. 5µs)
7. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A05901EN
Date Nov. 28. 2003
© SHARP Corporation
PC942 Series
■ Internal Connection Diagram
8
7
6
5
Tr.2
Tr.1
1
2
3
Interface
4
Anode
Cathode
NC
NC
5
6
7
8
O1
O2
GND
VCC
Amp.
1
2
3
4
■ Truth table
O2 Terminal output
High level
Low level
Tr. 1
ON
OFF
Tr. 2
OFF
ON
■ Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PC942]
1.2±0.3
2. SMT Gullwing Lead-Form [ex. PC942P]
1.2±0.3
0.85±0.2
8
6
6.5
2
3
4
1
3
4
Date code
0.5TYP.
7.62±0.3
0.26±0.1
3.5
±0.5
Epoxy resin
3.4
3.05±0.5
7.62±0.3
±0.5
0.5±0.1
2
9.66±0.5
Date code
2.54±0.25
5
Primary
side
mark
9.66±0.5
Primary side
mark
6
PC942
±0.5
PC942
1
7
5
6.5±0.5
7
0.26±0.1
θ
θ:0 to 13˚
2.54±0.25
θ
3.5±0.5
8
0.85±0.2
1.0+0.4
−0
Epoxy resin
0.35±0.25
Input
ON
OFF
1.0+0.4
−0
10.0+0
−0.5
Product mass : approx. 0.55g
Sheet No.: D2-A05901EN
2
PC942 Series
Date code (3 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
··
N
·
Mark
P
R
S
T
U
V
W
X
A
B
C
··
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
3rd digit
Week of production
Mark
Week
1st
1
2nd
2
3rd
3
4th
4
5.6th
5
repeats in a 20 year cycle
Country of origin
Japan
Sheet No.: D2-A05901EN
3
PC942 Series
■ Absolute Maximum Ratings
(Unless otherwise specified Ta=Topr)
Parameter
Symbol
Rating
Unit
*1
IF
Forward current
25
mA
Input *2
Reverse voltage
VR
V
6
Supply voltage
VCC
18
V
O1 output current
IO1
A
0.5
*3
1.0
O1 Peak output current
IO1P
A
0.6
IO2
A
Output O2 output current
*3
2.0
O2 Peak output current
IO2P
A
18
O1 output voltage
VO1
V
*4
500
mW
PO
Power dissipation
*5
550
mW
Ptot
Total power dissipation
*6
5.0
kV
Isolation voltage
Viso (rms)
−20 to +80
Operating temperature
˚C
Topr
−55 to +125
Storage temperature
˚C
Tstg
*7
260
Soldering temperature
Tsol
˚C
*1
The derating factors of a absolute maximum ratings due to ambient
temperature are shown in Fig.8
*2 Ta =25˚C *3 Pulse width≤5µs, Duty ratio : 0.01
*4.5 The derating factors of a absolute maximum ratings due to ambient temperature
are shown in Fig.8
*7 For 10s
*6 AC for 1minute, 40 to 60 %RH, Ta =25˚C, f=60Hz
■ Electro-optical Characteristics
Parameter
High level supply current
ICCH
Low level supply current
ICCL
"Low→High"
input threshold current
IFLH
Output
Input
Forward voltage
Isolation resistance
"Low→High" propagation delay time
"High→Low" propagation delay time
Rise time
Fall time
Instantaneous common mode
rejection voltage
(High level output)
Response time
*8
Transfer characteristics
Reverse current
Terminal capacitance
Supply voltage
O1 Low level output voltage
O2 High level output voltage
O2 Low level output voltage
O1 leak current
O2 leak current
Symbol
VF1
VF2
IR
Ct
VCC
VO1L
VO2H
VO2L
IO1L
IO2L
Instantaneous common mode
rejection voltage
(Low level output)
RISO
tPLH
tPHL
tr
tf
CMH
CML
Conditions
Ta=25˚C, IF=5mA
Ta=25˚C, IF=0.2mA
Ta=25˚C, VR=3V
Ta=25˚C, V=0, f=1kHz
−
VCC=6V, IO1=0.4A, RL2=10Ω, IF=5mA
VCC=6V, IO2=−0.4A, IF=5mA
VCC=6V, IO2=0.5A, IF=0
VCC=13V, IF=0
VCC=13V, IF=5mA
Ta=25˚C, V=6V, IF=5mA
VCC=6V, IF=5mA
Ta=25˚C, VCC=6V, IF=0
VCC=6V, IF=0
Ta=25˚C, VCC=6V, RL1=5Ω, RL2=10Ω
VCC=6V, RL1=5Ω, RL2=10Ω
Ta=25˚C, DC500V, 40 to 60%RH
Ta=25˚C, VCC=6V, IF=5mA
RL1=5Ω, RL2=10Ω
Ta=25˚C, VCM=600V(peak)
IF=5mA, RL1=470Ω
RL2=1kΩ, ∆VO2H=0.5V(MAX)
Ta=25˚C, VCM=600V(peak)
IF=0, RL1=470Ω
RL2=1kΩ, ∆VO2L=0.5V(MAX)
MIN.
−
0.6
−
−
5.4
−
4.5
−
−
−
−
−
−
−
0.3
0.2
5×1010
−
−
−
−
(Unless otherwise specified Ta=Topr)
MAX.
Unit
TYP.
1.4
V
1.1
−
V
0.9
10
µA
−
30
250
pF
−
13
V
0.2
0.4
V
5.0
−
V
0.2
0.4
V
−
200
µA
−
200
µA
9
13
mA
−
17
mA
11
15
mA
−
20
mA
1.5
3.0
mA
−
5.0
mA
1011
−
Ω
2
µs
5
2
µs
5
0.2
µs
1
0.1
µs
1
−10
−
−
kV/µs
10
−
−
kV/µs
*8 IFLH represents forward current when output goes from "Low" to "High"
Sheet No.: D2-A05901EN
4
PC942 Series
■ Model Line-up
Lead Form
Package
Model No.
Through-Hole
Sleeve
50pcs/sleeve
PC942
SMT Gullwing
Taping
1 000pcs/reel
PC942P
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
Sheet No.: D2-A05901EN
5
PC942 Series
Fig.1 Test Circuit for O1 Low Level Output
Voltage
1
Fig.2 Test Circuit for O2 High Level Output
Voltage
1
8
5
5
VCC
V VO1L
PC942
IF
PC942
6
IO1
RL2
V VO2H
2
7
Fig.3 Test Circuit for O1 Leak Current
1
VCC
IO2
IF
6
2
8
7
Fig.4 Test Circuit for O2 Leak Current
8
8
1
A IO1L
5
PC942
IF
1
6
2
7
Fig.5 Test Circuit for "Low→High" Input
Threshold Current
A
7
Fig.6 Test Circuit for Response Time
8
1
5
8
tr=tf=0.01µs
ZO=50Ω
RL1
VCC
RL1
5
VIN
VO2
6
6
RL2
RL2
2
VCC
PC942
PC942
IF
Variable
VCC
PC942
IF
6
2
A IO2L
5
VCC
2
V VO2
Vout
7
47Ω
7
VIN waveform
50%
tPLH
tPHL
90%
VOUT waveform
10%
50%
tr
tf
Sheet No.: D2-A05901EN
6
PC942 Series
Fig.7 Test Circuit for Instantaneous Common Mode Rejection Voltage
1
8
SW
A
VCM
(peak)
VCM waveform
RL1
VCC
5
B
PC942
GND
6
RL2
2
CMH VO2 waveform
VO2
+
VCM
VO2H
SW at A, IF=5mA
7
∆VO2H
CML VO2 waveform
−
∆VO2L
VO2L
GND
SW at B, IF=0
Fig.8 Forward Current vs. Ambient
Temperature
Fig.9 Power Dissipation vs. Ambient
Temperature
600
30
550
Power dissipation PO, Ptot (mW)
Forward current IF (mA)
25
20
15
10
5
0
−20
0
25
50
75 80
Ambient temperature Ta (˚C)
PO
300
200
100
0
25
50
75 80
100
Ambient temperature Ta (˚C)
Fig.11 "Low→High" Relative Input Threshold
Current vs. Supply Voltage
1 000
1.2
50˚C
100
IFLH=1 at VCC=6V
Ta=25˚C
25˚C
Ta=75˚C
Relative input threshold current
Forward current IF (mA)
Ptot
400
0
−20
100
Fig.10 Forward Current vs. Forward Voltage
0˚C
−20˚C
10
1
0.1
500
1.1
1.0
0.9
0.8
0.7
0
0.5
1.0
1.5
2.0
2.5
4
3.0
6
8
10
12
14
Supply voltage VCC (V)
Forward voltage VF (V)
Sheet No.: D2-A05901EN
7
PC942 Series
Fig.12 "Low→High" Relative Input Threshold
Current vs. Ambient Temperature
Fig.13 O1 Low Level Output Voltage vs.
O1 Output Current
1
VCC=6V
IFLH=1 at Ta=25˚C
O1 low level output voltage VO1L (V)
Relative input threshold current IFLH
1.6
1.4
1.2
1.0
0.8
0.6
−25
0
25
50
75
Ambient temperature Ta (˚C)
0.01
0.1
Fig.15 O2 High Level Output Voltage vs.
O2 Output Current
5.4
O2 high level output voltage VO2H (V)
VCC=6V
RL2=10Ω
0.4
IO1=0.5A
0.3
0.4A
0.2
0.1
0.1A
VCC=6V
IF=5mA
Ta=25˚C
5.3
5.2
5.1
5.0
4.9
4.8
0
25
50
75
100
0
−0.1
Ambient temperature Ta (˚C)
Fig.16 O2 High Level Output Voltage vs.
Ambient Temperature
1
O2 low level output voltage VO2L (V)
O2 high level output voltage VO2H (V)
IO2=−0.1A
VCC=6V
5.2
−0.4A
5.1
−0.5A
5.0
4.9
4.8
−25
0
25
50
75
Ambient temperature Ta (˚C)
−0.2
−0.3
−0.4
−0.5
O2 output current IO2 (A)
−0.6
Fig.17 O2 Low Level Output Voltage vs.
O2 Output Current
5.4
5.3
1
O1 output current IO1 (A)
0.5
O1 low level output voltage VO1L (V)
0.1
0.001
0.01
100
Fig.14 O1 Low Level Output Voltage vs.
Ambient Temperature
0
−25
VCC=6V
RL2=10Ω
IF=5mA
Ta=25˚C
0.1
0.01
0.001
0.01
100
VCC=6V
Ta=25˚C
0.1
O2 output current IO2 (A)
1.0
Sheet No.: D2-A05901EN
8
PC942 Series
Fig.18 O2 Low Level Output Voltage vs.
Ambient Temperature
Fig.19 High Level Supply Current vs.
Supply Voltage
14
VCC=6V
High level supply current ICCH (mA)
0.4
IO2=0.6A
0.3
0.5A
0.2
0.1
0.1A
0
−25
0
25
50
75
12
Ta=−20˚C
10
25˚C
8
80˚C
6
4
4
100
6
Ambient temperature Ta (˚C)
Fig.20 Low Level Supply Current vs.
Supply Voltage
6
Propagation delay time tPHL, tPLH (µs)
Low level supply current ICCL (mA)
10
12
14
Ta=−20˚C
12
25˚C
10
80˚C
8
VCC=6V
RL1=5Ω
RL2=10Ω
5
4
tPHL
Ta=80˚C
3
25˚C
−20˚C
2
tPLH
Ta=80˚C
1
25˚C
−20˚C
0
6
4
6
8
10
12
Supply voltage VCC (V)
0
14
10
15
20
Forward current IF (mA)
10
O2 peak output current IO2P (A)
VCC=6V
RL1=5Ω
RL2=10Ω
IF=5mA
4
5
25
Fig.23 O2 Peak Output Current vs.
O2 Low Level Output Voltage
Fig.22 Propagation Delay Time vs.
Ambient Temperature
5
14
Fig.21 Propagation Delay Time vs.
Forward Current
16
Propagation delay time tPHL, tPLH (µs)
8
Supply voltage VCC (V)
3
tPLH
2
tPHL
1
*Single
osc.pulse
Ta=25˚C
100ms*
10ms*
1ms*
I02 MAX. (Pulse)
1
I02MAX. (Continuous)
1s*
DC
VCC (MAX.)
O2 low level output voltage VO2L (V)
0.5
DC (Ta=80˚C)
0
−25
0
25
50
75
0.1
0.1
100
1
10
O2 low level output voltage VO2L (V)
Ambient temperature Ta (˚C)
Sheet No.: D2-A05901EN
9
PC942 Series
Fig.24 Application Circuit
VCC
Anode
Cathode
O1
PC942
+5V
+
Power transistor
module
6V
O2
Load
C
B
GND
TTL, microcomputer, etc.
+
E
This application circuit shows the general example of a circuit, and is not a disign guarantee for right operation.
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A05901EN
10
PC942 Series
■ Design Considerations
● Notes about static electricity
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Design guide
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through IRED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of IRED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent IRED.
Sheet No.: D2-A05901EN
11
PC942 Series
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
Please decide the input current which become 2times of MAX. IFLH.
● Recommended Foot Print (reference)
1.7
2.54
2.54
2.54
8.2
2.2
(Unit : mm)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A05901EN
12
PC942 Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
150 to 180˚C, 120s or less
100
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A05901EN
13
PC942 Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A05901EN
14
PC942 Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
±2
5.8
10.8
520
6.7
(Unit : mm)
Sheet No.: D2-A05901EN
15
PC942 Series
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
J
D
E
G
MA
X.
H
H
A
B
C
I
Dimensions List
A
B
16.0±0.3
7.5±0.1
H
I
±0.1
10.4
0.4±0.05
5˚
K
C
1.75±0.1
J
4.2±0.1
D
12.0±0.1
K
10.2±0.1
E
2.0±0.1
(Unit : mm)
F
G
+0.1
4.0±0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
330
17.5±1.5
e
f
23±1.0
2.0±0.5
f
a
b
c
(Unit : mm)
d
100±1.0
g
2.0±0.5
13±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A05901EN
16
PC942 Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
· If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
Sheet No.: D2-A05901EN
17
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