PR33MA11NTZF

PR33MA11NTZF PR33MA11NTZF IT (rms)≤0.3A, Non-Zero Cross type DIP 6pin SSR ■Description ■Agency approvals/Compliance PR33MA11NTZF Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector. These devices are ideally suited for controlling high voltage AC loads with solid state reliability while providing 5.0kV isolation (Viso (rms)) from input to output. 1. Package resin : UL flammability grade (94V-0) ■Applications 1. Isolated interface between high voltage AC devices and lower voltage DC control circuitry. 2. Switching small capacity motors, fans, heaters, solenoids, and valves. 3. Phase or power control in applications such as lighting and temperature control equipment. ■Features 1. Output current, IT (rms)≤0.3A 2. Non-zero crossing functionary 3. 6 pin DIP package 4. High repetitive peak off-state voltage (VDRM : 600V, PR33MA11NTZF) 5. Superior noise immunity (dV/dt : MIN. 1000V/µs) 6. Response time, ton : MAX. 100µs 7. Double transfer mold construction (Ideal for Flow Soldering) 8. High isolation voltage between input and output (Viso (rms) : 5.0kV) Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: OP13017EN 1 PR33MA11NTZF ■ Internal Connection Diagram ⑥ ⑤ ④ ①Anode ②Cathode ③NC ④Anode/ Cathode ⑤No external connection ⑥Cathode/Anode ① ② ③ ■Outline *1) *2) 2-digit number shall be marked according to OLD DIN standard. Factory identification mark applies to the below. ：SUN-S Electronic Technology (KUNSHAN) Co. Ltd (China) *3) Pin 5 is cut at outside of package. Product mass : Approx.0.35g Unit : 1/1mm Name Pin material : Copper Alloy Pin finish : Sn plating R33MA1 Outline Dimensions (Business dealing name : PR33MA11NTZF) Sheet No.: OP13017EN 2 PR33MA11NTZF ■Absolute maximum ratings Ta=25°C Parameter Input Symbol Rating Unit IF 50 mA VR 6 V IT(rms) 0.3 A Isurge 3 A VDRM 600 V Viso(rms) 5 kV Operating temperature Topr -40 to +85 °C Storage temperature Tstg -40 to +125 °C Forward current *1 Reverse voltage RMS on-state current Output *1 Peak one cycle surge current *2 Repetitive peak off-state voltage Isolation voltage *3 Soldering temperature *4 Tsol 270 °C *1 The derating factors of absolute maximum rating due to ambient temperature are shown in Fig.1, 2. *2 50Hz sine wave *3 AC for 1min, 40 to 60%RH, f=60Hz *4 For 10s ■Electrical characteristics Ta=25°C Input Output Parameter Forward voltage Reverse current Symbol VF IR MIN. - TYP. 1.2 - MAX. 1.4 10 Unit V μA Conditions IF=20mA VR=3V Repetitive peak off-state current IDRM - - 100 μA VD=VDRM On-state voltage Holding current VT IH - - 3.0 3.0 V mA IT=300mA VD=6V dv/dt 1000 - - V/μs VD=(1/√2)・VDRM IFT RISO 5×1010 1011 15 - mA Ω VD=6V, RL=100Ω DC500V 40 to 60%RH tON - - 100 μs VD=6V, RL=100Ω, IF=20mA Critical rate of rise of off-state voltage Minimum trigger current Transfer Isolation resistance characteristics Turn on time ■Recommend operating condition Input Output Parameter Input signal current at on state Input signal current at off state Supply voltage Vout(rms) MIN. 30 0 - Load current Iout(rms) - f Topr 50 -30 Frequency Operating temperature Symbol IF(on) IF(off) MAX. 36 0.1 240 IT(rms)×80% *5 60 70 Unit mA mA V mA Hz °C *5 IT(rms) derating at ambient temperature is show in Fig. 2. Please locate the snubber circuit between output pins. (RS=47Ω,CS=0.022μF) Sheet No.: OP13017EN 3 PR33MA11NTZF Fig.1 Forward current vs. ambient temperature 70 Forward current IF (mA) 60 50 40 30 20 10 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Ambient temperature RMS on-state current IT (rms) (A) Fig.2 Ta (°C) RMS on-state current vs. ambient temperature(*1) 0.3 0.2 0.1 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Ambient temperature *1 Ta (°C) Mounting conditions No-heat sink Paper phenol board : 100mm×100mm×1.6mm All pins should be installed in the print board with soldering. Whole solder landing dimensions : 140mm2 Sheet No.: OP13017EN 4 PR33MA11NTZF ■Supplements ●The business dealing name used for this product when ordered or delivered shall be PR33MA11NTZF. ●Package specification Refer to the attached sheet, page 7, 8 ●Isolation voltage shall be measured in the following method. (1) Short between pins 1 to 3 on the primary side and between pins 4 to 6 on the secondary side. (2) The dielectric withstanding tester with zero-cross circuit shall be used. (3) The wave form of applied voltage shall be a sine wave. (It is recommended that the isolation voltage be measured in insulation oil.) ●This product is not designed against irradiation. This product is assembled with electrical input and output. This product incorporates non-coherent light emitting diode. ●ODS materials This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFCS, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methyl chloroform) ●Brominated flame retardants Specific brominated flame retardants (PBB and PBDE) are not used in this device at all. ●Compliance with each regulation 1) The RoHS directive(2002/95/EC) This product complies with the RoHS directive(2002/95/EC) . Object substances: mercury, lead (except for lead in high melting temperature type solders *1 and glass of electronic components), cadmium, hexavalent chromium, polybrominated biphenyls(PBB)and polybrominated diphenyl ethers(PBDE) *1：i.e. tin-lead solder alloys containing more than 85% lead 2) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法). Toxic and hazardous substances Hexavalent Polybrominate Polybrominated Category Lead Mercury Cadmium chromium d biphenyls diphenyl ethers (Pb) (Hg) (Cd) (Cr6+) (PBB) (PBDE) Solid State Relay ✓ ✓ ✓ ✓ ✓ ✓ ✓: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard . Sheet No.: OP13017EN 5 PR33MA11NTZF ■Notes ●Circuit design (1) The LED used in the solid state relay generally decreases the light emission power by operation. In case of long operation time, please decide IF value so that IF is more than 2 times or more of the maximum value of the Minimum triggering current at circuit design with considering the decreases of the light emission power of the LED. (50% / 5years) (2) This device doesn’t have built-in snubber circuit. To avoid the false operation and protect SSR, please locate the appropriate snubber circuit between output pins base on the load. (Recommendable values : Rs=47Ω, Cs=0.022μF) Particularly, in case the device is used for the load such as solenoid valves and motors, false operation may happen in off-state due to rapid change of voltage at output pins caused by the phase difference of load current. So please be sure to locate the snubber circuit (Rs=47Ω, Cs=0.022μF) and make sure the device works properly in actual conditions. In addition, the values of snubber circuit may have to be changed if necessary after Tested in actual conditions. load SSR Input Cs Output Rs Please locate the snubber circuit as close as possible to the output pins. (3) Input current (IF) at off state shall be set 0.1mA or less. (4) In case that pulse drive is carried out, the pulse width of input signal should be 1ms or more. (5) If the voltage exceeding the repetitive peak off-state voltage (VDRM) in the absolute maximum ratings is applied to the phototriac, it may cause not only faulty operation but breakdown. Make sure that the surge voltage exceeding VDRM shall not be applied by using the varistor, CR. ●Cleaning (1) Solvent cleaning : Solvent temperature 45°C or less, Immersion for 3 min or less (2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that any defect doesn’t occur before starting the ultrasonic cleaning. (3) Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol When the other solvent is used, there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition. ●Using method As to this product, all pin shall be used by soldering on the print wiring board. (Socket and others shall not be used.) ●Precautions for Soldering (1) In case of flow solder (Whole dipping is possible) It is recommended that flow soldering be carried out at 270°C or less and within 10s (Pre-heating : 100 to 150°C, 30 to 80 s) (2) It is recommended that hand soldering be carried out at 400°C or less and within 3s: Within 2 times (3) Other notes Depending on equipment and soldering conditions (temperature, Using solder etc.), the effect to junction between PCB and lead pins of solid state relay is different. Please confirm that there is no problem on the actual use conditions. Sheet No.: OP13017EN 6 PR33MA11NTZF ■Package specification ●Package materials No. Name Materials Purposes ① Sleeve HIPS or ABS with preventing static electricity Products packaged ② ③ ④ Stopper Packing case Kraft tape Styrene-Elastomer Corrugated cardboard Paper Products fixed Sleeve packaged Lid of packaged case fixed Paper Model No.(Business dealing name), lot No. , quantity , country of origin, Company name and inspection date specified ⑤ Label ●Package method (1) MAX. 50pcs. of products shall be packaged in a sleeve ① and both of sleeve edges shall be fixed by stoppers ②. (2) MAX. 20 sleeves (Product : 1000pcs.) above shall be packaged in a packing case ③. (3) The label ⑤ shall be put on the side of the packing case. (4) Case shall be closed with the lid and enclosed with kraft tape ④. ●Sleeve drawing 5.8 10.8 12 8-R0.5 (Unit : mm) 6.7 520±2 Length : L=520±2mm Note 1) Thickness : 0.5±0.2mm 2) Process with applying antistatic treatment. 3) Unless otherwise specified tolerances shall be ±0.5mm. (However except for deformation due to the rubber stopper in sleeve.) Sheet No.: OP13017EN 7 PR33MA11NTZF ●Packing case outline dimensions Product Sleeve① Anode mark or stepping side Stopper② (With pulled portion) Stopper② (Without pulled portion) Anode mark shall be arranged at stopper side without pulled portion. 20 sleeves (5 lines×4 stairs) * MAX It is disapproved to mix different model or different rank model in one case. Packing case③ Kraft tape④ Label⑤ (56mm) (544mm) (70mm) ( ) : Reference dimensions Regular packing mass : Approx. 760g Sheet No.: OP13017EN 8 PR33MA11NTZF ■Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: OP13017EN 9