S116S02

S116S02 Series S216S02 Series S116S02 Series S216S02 Series ∗ IT(rms)≤16A, Zero Cross type SIP 4pin Triac output SSR Non-zero cross type is also available. (S116S01 Series/ S216S01 Series) ■ Description S116S02 Series and S216S02 Series Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector and a main output Triac. These devices are ideally suited for controlling high voltage AC loads with solid state reliability while providing 4.0kV isolation (V iso (rms) ) from input to output. ■ Agency approvals/Compliance 1. Recognized by UL508 (only for S116S02 Series), file No. E94758 (as models No. S116S02) 2. Approved by CSA 22.2 No.14 ( only for S 116S02 Series), file No. LR63705 (as models No. S116S02) 3. Package resin : UL flammability grade (94V-0) ■ Applications 1. Isolated interface between high voltage AC devices and lower voltage DC control circuitry. 2. Switching motors, fans, heaters, solenoids, and valves. 3. Power control in applications such as lighting and temperature control equipment. ■ Features 1. Output current, IT(rms)≤16.0A 2. Zero crossing functionary (VOX : MAX. 35V) 3. 4 pin SIP package 4. High repetitive peak off-state voltage (VDRM : 600V, S216S02 Series) (VDRM : 400V, S116S02 Series) 5. High isolation voltage between input and output (Viso(rms) : 4.0kV) 6. Lead-free terminal components are also available (see Model Line-up section in this datasheet) 7. Screw hole for heat sink Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.:D4-A02701EN Date Apr. 28. 2004 © SHARP Corporation S116S02 Series S216S02 Series ■ Internal Connection Diagram 1 2 3 4 1 2 34 Output (Triac T2) Output (Triac T1) Input (+) Input (−) Zero Crossing Circuit ■ Outline Dimensions S116S02 5.0±0.3 18.5±0.2 16.4±0.3 Common to pin No.1 (Unit : mm) S216S02 5.0±0.3 18.5±0.2 16.4±0.3 5.5±0.2 Common to pin No.1 3.2±0.2 φ3.2±0.2 Common to pin No.1 φ3.2±0.2 Common to pin No.1 3.2±0.2 5.5±0.2 CSA mark Epoxy resin 19.6±0.2 (36.0) 19.6 11.2 UL mark Model No. ∗ 4-1.1±0.2 4-1.25±0.3 4-0.8 ±0.2 Epoxy resin (36.0) S116S02 16A125VAC S216S02 Model No. ∗ 4-1.1±0.2 4-1.25±0.3 4-0.8±0.2 0.6±0.1 1 2 16A250VAC 0.2MAX. 0.2MAX. +− Date code (2 digit) 11.2MIN. +− Date code (2 digit) MIN. 4.2MAX. 1 2 34 34 4.2MAX. ±0.2 (5.08) (7.62) (2.54) (1.4) (5.08) (7.62) (2.54) 0.6±0.1 (1.4) Product mass : approx. 6.3g : Do not allow external connection. ( ) : Typical dimensions ∗ Product mass : approx. 6.3g Sheet No.: D4-A02701EN 2 S116S02 Series S216S02 Series Date code (2 digit) 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M · · N · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 Mark P R S T U V W X A B C · · · repeats in a 20 year cycle Country of origin Japan Rank mark There is no rank mark indicator and currently there are no rank offered for this device. Sheet No.: D4-A02701EN 3 S116S02 Series S216S02 Series ■ Absolute Maximum Ratings (Ta=25˚C) Parameter Symbol Rating Unit *3 Forward current IF 50 mA Input Reverse voltage VR 6 V RMS ON-state current IT (rms) 16 *3 A *4 Peak one cycle surge current Isurge 160 A Repetitive S116S02 400 VDRM V peak OFF-state voltage S216S02 600 Output Non-Repetitive S116S02 400 VDSM V peak OFF-state voltage S216S02 600 Critical rate of rise of ON-state current dIT/dt A/µs 50 Operating frequency 45 to 65 f Hz *1 Isolation voltage 4.0 Viso(rms) kV Operating temperature Topr −25 to +100 ˚C Storage temperature Tstg −30 to +125 ˚C *2 Soldering temperature Tsol 260 ˚C *1 40 to 60%RH, AC for 1minute, f=60Hz *2 For 10s *3 Refer to Fig.1, Fig.2 *4 f=60Hz sine wave, Tj=25˚C start Soldering area ■ Electro-optical Characteristics Conditions MIN. Parameter Symbol VF IF=20mA − Forward voltage Input IR VR=3V − Reverse current IDRM VD=VDRM − Repetitive peak OFF-state current VT(rms) IT(rms)=16A, Resistance load, IF=20mA − ON-state voltage IH − − Output Holding current dV/dt 30 VD=2/3•VDRM Critical rate of rise of OFF-state voltage 5 Critical rate of rise of OFF-state voltage at commutaion (dV/dt)c Tj=125˚C, VD=2/3•VDRM, dIT/dt=−8A/ms IFT − VD=6V, RL=30Ω Minimum trigger current RISO 1010 DC500V, 40 to 60%RH Isolation resistance VOX IF=8mA − Zero cross voltage VD(rms)=100V, AC50Hz − S116S02 IT(rms)=2A, Resistance load, IF=20mA Transfer Turn-on time ton characVD(rms)=200V, AC50Hz − S216S02 teristics IT(rms)=2A, Resistance load, IF=20mA VD(rms)=100V, AC50Hz − S116S02 IT(rms)=2A, Resistance load, IF=20mA toff Turn-off time VD(rms)=200V, AC50Hz − S216S02 IT(rms)=2A, Resistance load, IF=20mA Rth(j-c) − Between junction and case Thermal resistance Rth(j-a) − Between junction and ambient TYP. 1.2 − − − − − − − − − − − − − 3.3 40 1.5mm (Ta=25˚C) MAX. 1.4 100 100 1.5 50 − − 8 − 35 10 ms 10 10 ms 10 − − ˚C/W Unit V µA µA V mA V/µs V/µs mA Ω V Sheet No.: D4-A02701EN 4 S116S02 Series S216S02 Series ■ Model Line-up (1) (Lead-free terminal components) Case Shipping Package 200pcs/case Model No. S116S02F S216S02F VDRM [V] 400 600 IFT[mA] (VD=6V, RL=30Ω) MAX.8 MAX.8 ■ Model Line-up (2) (Lead solder plating components) Case Shipping Package 200pcs/case Model No. S116S02 S216S02 VDRM [V] 400 600 IFT[mA] (VD=6V, RL=30Ω) MAX.8 MAX.8 Please contact a local SHARP sales representative to see the actual status of the production. Sheet No.: D4-A02701EN 5 S116S02 Series S216S02 Series Fig.1 Forward Current vs. Ambient Temperature 60 50 Forward current IF (mA) 40 30 20 10 0 −25 0 25 50 75 100 125 Ambient temperature Ta (˚C) Fig.2 RMS ON-state Current vs. Ambient Temperature 20 18 RMS ON-state current IT (rms)(A) 16 14 (4) 12 10 8 6 4 2 0 −25 0 25 50 75 100 125 (5) (3) (2) (1) (1) With infinite heat sink (2) With heat sink (280×280×2mm Al plate) (3) With heat sink (200×200×2mm Al plate) (4) With heat sink (100×100×2mm Al plate) (5) Without heat sink (Note) In natural cooling condition, please locate Al plate vertically, spread the thermal conductive silicone grease on the touch surface of the device and tighten up the device in the center of Al plate at the torque of 0.4N • m. Ambient temperature Ta (˚C) Fig.3 RMS ON-state Current vs. Case Temperature 16 14 RMS ON-state current IT (rms)(A) Fig.4 Forward Current vs. Forward Voltage 100 Ta=100˚C 75˚C Forward current IF (mA) 50˚C 25˚C 0˚C 10 −25˚C 12 10 8 6 4 2 0 −25 1 0 25 50 75 100 125 0 1.0 Forward voltage VF (V) Sheet No.: D4-A02701EN 2.0 Case temperature Tc (˚C) 6 S116S02 Series S216S02 Series Fig.5 Surge Current vs. Power-on Cycle 200 Maximum ON-state power dissipation (W) 180 160 Surge current Isurge (A) 140 120 100 80 60 40 20 0 1 10 Power-on cycle (Times) 100 f=60Hz Tj=25˚C Start Fig.6 Maximum ON-state Power Dissipation vs. RMS ON-state Current 20 18 16 14 12 10 8 6 4 2 0 0 2 4 6 8 10 12 14 16 RMS ON-state current IT (rms)(A) Ta=25˚C Fig.7 Minimum Trigger Current vs. Ambient Temperature 10 VD=6V RL=30Ω Minimum trigger current IFT (mA) 8 Fig.8-a Repetitive Peak OFF-state Current vs. Ambient Temperature (S116S02) 10−4 Repetitive peak OFF-state current IDRM (A) VD=400V 10−5 6 10−6 4 10−7 2 10−8 0 −25 0 25 50 75 100 10−9 −25 0 25 50 75 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Fig.8-b Repetitive Peak OFF-state Current vs. Ambient Temperature (S216S02) 10−4 Repetitive peak OFF-state current IDRM (A) VD=600V 10−5 10−6 10−7 10−8 10−9 −25 0 25 50 75 100 Remarks : Please be aware that all data in the graph are just for reference. Ambient temperature Ta (˚C) Sheet No.: D4-A02701EN 7 S116S02 Series S216S02 Series ■ Design Considerations ● Recommended Operating Conditions Input Symbol Parameter Input signal current at ON state IF(ON) Input signal current at OFF state IF(OFF) S116S02 Load supply voltage VOUT(rms) S216S02 Load supply current IOUT(rms) f Topr Conditions − − − Locate snubber circuit between output terminals (Cs=0.1µF, Rs=47Ω) − − MIN. 16 0 80 80 0.1 47 −20 MAX. 24 0.1 120 240 IT(rms) ×80%(∗) 63 80 Unit mA mA V mA Hz ˚C Output Frequency Operating temperature (∗) See Fig.2 about derating curve (IT(rms) vs. ambient temperature). ● Design guide In order for the SSR to turn off, the triggering current (lF) must be 0.1mA or less. When the input current (IF) is below 0.1mA, the output Triac will be in the open circuit mode. However, if the voltage across the Triac, VD, increases faster than rated dV/dt, the Triac may turn on. To avoid this situation, please incorporate a snubber circuit. Due to the many different types of load that can be driven, we can merely recommend some circuit vales to start with : Cs=0.1µF and Rs=47Ω. The operation of the SSR and snubber circuit should be tested and if unintentional switching occurs, please adjust the snubber circuit component values accordingly. When making the transition from On to Off state, a snubber circuit should be used ensure that sudden drops in current are not accompanied by large instantaneous changes in voltage across the Triac. This fast change in voltage is brought about by the phase difference between current and voltage. Primarily, this is experienced in driving loads which are inductive such as motors and solenoids. Following the procedure outlined above should provide sufficient results. For over voltage protection, a Varistor may be used. Any snubber or Varistor used for the above mentioned scenarios should be located as close to the main output triac as possible. Particular attention needs to be paid when utilizing SSRs that incorporate zero crossing circuitry. If the phase difference between the voltage and the current at the output pins is large enough, zero crossing type SSRs cannot be used. The result, if zero crossing SSRs are used under this condition, is that the SSR may not turn on and off irregardless of the input current. In this case, only a non zero cross type SSR should be used in combination with the above mentioned snubber circuit selection process. The load current should be within the bounds of derating curve. (Refer to Fig.2) Also, please use the optional heat sink when necessary. In case the optional heat sink is used and the isolation voltage between the device and the optional heat sink is needed, please locate the insulation sheet between the device and the heat sink. When the optional heat sink is equipped, please set up the M3 screw-fastening torque at 0.3 to 0.5N•m. In order to dissipate the heat generated from the inside of device effectively, please follow the below suggestions. Sheet No.: D4-A02701EN 8 S116S02 Series S216S02 Series (a) Make sure there are no warps or bumps on the heat sink, insulation sheet and device surface. (b) Make sure there are no metal dusts or burrs attached onto the heat sink, insulation sheet and device surface. (c) Make sure silicone grease is evenly spread out on the heat sink, insulation sheet and device surface. Silicone grease to be used is as follows; 1) There is no aged deterioration within the operating temperature ranges. 2) Base oil of grease is hardly separated and is hardly permeated in the device. 3) Even if base oil is separated and permeated in the device, it should not degrade the function of a device. Recommended grease : G-746 (Shin-Etsu Chemical Co., Ltd.) : G-747 (Shin-Etsu Chemical Co., Ltd.) : SC102 (Dow Corning Toray Silicone Co., Ltd.) In case the optional heat sink is screwed up, please solder after screwed. In case of the lead frame bending, please keep the following minimum distance and avoid any mechanical stress between the base of terminals and the molding resin. 4.4mm MIN. Some of AC electromagnetic counters or solenoids have built-in rectifier such as the diode. In this case, please use the device carefully since the load current waveform becomes similar with rectangular waveform and this results may not make a device turn off. ● Degradation In general, the emission of the IRED used in SSR will degrade over time. In the case where long term operation and / or constant extreme temperature fluctuations will be applied to the devices, please allow for a worst case scenario of 50% degradation over 5years. Therefore in order to maintain proper operation, a design implementing these SSRs should provide at least twice the minimum required triggering current from initial operation. ● Standard Circuit S116S02 S216S02 R1 +VCC D1 V1 Tr1 ZS : Surge absorption circuit (Snubber circuit) 4 3 1 Load ZS SSR 2 AC Line ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D4-A02701EN 9 S116S02 Series S216S02 Series ■ Manufacturing Guidelines ● Soldering Method Flow Soldering (No solder bathing) Flow soldering should be completed below 260˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please solder within one time. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D4-A02701EN 10 S116S02 Series S216S02 Series ● Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. Sheet No.: D4-A02701EN 11 S116S02 Series S216S02 Series ■ Package specification Package materials Packing case : Corrugated cardboard Partition : Corrugated cardboard Pad : Corrugated cardboard Cushioning material : Polyethylene Molt plane : Urethane Package method The product should be located after the packing case is partitioned and protected inside by 4 pads. Each partition should have 5 products with the lead upward. Cushioning material and molt plane should be located after all products are settled (1 packing contains 200 pcs). Package composition Molt plane Cushioning material Product Pad Partition Packing case Sheet No.: D4-A02701EN 12 S116S02 Series S216S02 Series ■ Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D4-A02701EN 13