BS 107
SIPMOS ® Small-Signal Transistor • N channel • Enhancement mode • Logic Level
• VGS(th) = 0.8...2.0V
Pin 1 S Type BS 107 Type BS 107
Pin 2 G Marking BS 107
Pin 3 D
VDS
200 V
ID
0.13 A
RDS(on)
26 Ω
Package TO-92
Ordering Code Q67000-S078
Tape and Reel Information E6288
Maximum Ratings Parameter Drain source voltage Drain-gate voltage Symbol Values 200 200 Unit V
VDS V
DGR
RGS = 20 kΩ
Gate source voltage Gate-source peak voltage,aperiodic Continuous drain current
VGS Vgs ID
± 14 ± 20 A 0.13
TA = 31 °C
DC drain current, pulsed
IDpuls
0.52
TA = 25 °C
Power dissipation
Ptot
1
W
TA = 25 °C
Semiconductor Group
1
12/05/1997
BS 107
Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air 1) DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Symbol Values -55 ... + 150 -55 ... + 150 ≤ 125 E 55 / 150 / 56 K/W Unit °C
Tj Tstg RthJA
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit
V(BR)DSS
200 1.5 0.1 2 1 14 14.5 2 1 60 30 1 10
V
VGS = 0 V, ID = 0.25 mA, Tj = 25 °C
Gate threshold voltage
VGS(th)
0.8
VGS=VDS, ID = 1 mA
Zero gate voltage drain current
IDSS
µA nA µA nA Ω 26 28
VDS = 200 V, VGS = 0 V, Tj = 25 °C VDS = 200 V, VGS = 0 V, Tj = 125 °C VDS = 130 V, VGS = 0 V, Tj = 25 °C VDS = 70 V, VGS = 0.2 V, Tj = 25 °C
Gate-source leakage current
IGSS RDS(on)
VGS = 20 V, VDS = 0 V
Drain-Source on-state resistance
VGS = 4.5 V, ID = 0.12 A VGS = 2.8 V, ID = 0.02 A
Semiconductor Group
2
12/05/1997
BS 107
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit
gfs
0.06 0.17 60 8 3.5 -
S pF 80 12 5 ns 5 8
VDS≥ 2 * ID * RDS(on)max, ID = 0.12 A
Input capacitance
Ciss Coss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Output capacitance
VGS = 0 V, VDS = 25 V, f = 1 MHz
Reverse transfer capacitance
Crss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Turn-on delay time
td(on)
VDD = 30 V, VGS = 10 V, ID = 0.24 A RG = 50 Ω
Rise time
tr
8 12
VDD = 30 V, VGS = 10 V, ID = 0.24 A RG = 50 Ω
Turn-off delay time
td(off)
12 16
VDD = 30 V, VGS = 10 V, ID = 0.24 A RG = 50 Ω
Fall time
tf
15 20
VDD = 30 V, VGS = 10 V, ID = 0.24 A RG = 50 Ω
Semiconductor Group
3
12/05/1997
BS 107
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS A 0.9 0.13 0.52 V 1.2 Values typ. max. Unit
TA = 25 °C
Inverse diode direct current,pulsed
ISM
-
TA = 25 °C
Inverse diode forward voltage
VSD
VGS = 0 V, IF = 0.5 A
Semiconductor Group
4
12/05/1997
BS 107
Power dissipation Ptot = ƒ(TA)
Drain current ID = ƒ(TA) parameter: VGS ≥ 4 V
0.14 A 0.12
1.2 W 1.0
Ptot
0.9 0.8 0.7 0.6 0.5 0.4 0.3
ID
0.11 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03
0.2 0.1 0.0 0 20 40 60 80 100 120 °C 160
0.02 0.01 0.00 0
20
40
60
80
100
120
°C
160
TA
TA
Safe operating area ID=f(VDS) parameter : D = 0.01, TC=25°C
Drain-source breakdown voltage V(BR)DSS = ƒ(Tj)
240 V 230 V(BR)DSS 225 220 215 210 205 200 195 190 185 180 -60 -20 20 60 100 °C 160
Tj
Semiconductor Group
5
12/05/1997
BS 107
Typ. output characteristics ID = ƒ(VDS) parameter: tp = 80 µs
0.30 A 0.26
Typ. drain-source on-resistance RDS (on) = ƒ(ID) parameter: tp = 80 µs, Tj = 25 °C
80
a d
VGS [V] a 2.0
b c 2.5 3.0 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10.0
Ptot = 1W
k li j hg e f
b
c
Ω
RDS (on)
60
ID
0.24 0.22 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0
a c
d e f g h i j k
50
40
30
bl
20 10 VGS [V] =
a 2.0 b 2.5 c 3.0 d 3.5 e f 4.0 4.5 g 5.0 h i 6.0 7.0 j 8.0
d e hf l j k ig
k l 9.0 10.0
2
4
6
8
V
11
0 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14
A
0.18
VDS
ID
Typ. transfer characteristics ID = f(VGS) parameter: tp = 80 µs VDS≥ 2 x ID x RDS(on)max
0.40
Typ. forward transconductance gfs = f (ID) parameter: tp = 80 µs, VDS≥2 x ID x RDS(on)max
0.30 S
A
0.26
ID
0.30
gfs
0.24 0.22 0.20
0.25
0.18 0.16 0.14
0.20
0.15
0.12 0.10
0.10
0.08 0.06
0.05 0.00 0
0.04 0.02 0.00 0.00
1
2
3
4
5
6
7
8
V VGS
10
0.05
0.10
0.15
0.20
A
0.30
ID
Semiconductor Group
6
12/05/1997
BS 107
Drain-source on-resistance RDS (on) = ƒ(Tj) parameter: ID = 0.12 A, VGS = 4.5 V
65
Gate threshold voltage VGS (th) = ƒ(Tj) parameter: VGS = VDS, ID = 1 mA
4.6 V 4.0
Ω
55
RDS (on)
50 45 40 35 30
VGS(th)
3.6 3.2 2.8
98%
2.4
98%
2.0
25 1.6 20 15 10 5 0 -60 -20 20 60 100 °C 160
typ
typ
1.2
2%
0.8 0.4 0.0 -60 -20 20 60 100 °C 160
Tj
Tj
Typ. capacitances C = f (VDS) parameter:VGS=0V, f = 1 MHz
10 3
Forward characteristics of reverse diode IF = ƒ(VSD) parameter: Tj, tp = 80 µs
10 0
pF C 10 2
A
IF
10 - 1
Ciss
10 1
10 - 2
Coss Crss
Tj = 25 °C typ Tj = 150 °C typ Tj = 25 °C (98%) Tj = 150 °C (98%)
10 0 0
5
10
15
20
25
30
V VDS
40
10 -3 0.0
0.4
0.8
1.2
1.6
2.0
2.4
V
3.0
VSD
Semiconductor Group
7
12/05/1997