BSP 373
SIPMOS ® Small-Signal Transistor • N channel • Enhancement mode • Avalanche rated • VGS(th)= 2.1 ... 4.0 V Pin 1 G Pin 2 D Pin 3 S Pin 4 D
Type BSP 373 Type BSP 373
VDS
100 V
ID
1.7 A
RDS(on)
0.3 Ω
Package SOT-223
Marking BSP 373
Ordering Code Q67000-S301
Tape and Reel Information E6327
Maximum Ratings Parameter Continuous drain current Symbol Values 1.7 Unit A
ID IDpuls
6.8
TA = 28 °C
DC drain current, pulsed
TA = 25 °C
Avalanche energy, single pulse
EAS
45
mJ
ID = 1.7 A, VDD = 25 V, RGS = 25 Ω L = 23.3 mH, Tj = 25 °C
Gate source voltage Power dissipation
VGS Ptot
± 20 1.8
V W
TA = 25 °C
Semiconductor Group
1
Sep-12-1996
BSP 373
Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air Therminal resistance, junction-soldering point 1) DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Symbol Values -55 ... + 150 -55 ... + 150 ≤ 70 ≤ 10 E 55 / 150 / 56 K/W Unit °C
Tj Tstg RthJA RthJS
1) Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit
V(BR)DSS
100 3 0.1 10 10 0.16 4
V
VGS = 0 V, ID = 0.25 mA, Tj = 0 °C
Gate threshold voltage
VGS(th)
2.1
VGS=VDS, ID = 1 mA
Zero gate voltage drain current
IDSS
1 100
µA
VDS = 100 V, VGS = 0 V, Tj = 25 °C VDS = 100 V, VGS = 0 V, Tj = 125 °C
Gate-source leakage current
IGSS
100
nA Ω 0.3
VGS = 20 V, VDS = 0 V
Drain-Source on-state resistance
RDS(on)
VGS = 10 V, ID = 1.7 A
Semiconductor Group
2
Sep-12-1996
BSP 373
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit
gfs
1.5 2.8 400 125 70 -
S pF 550 190 105 ns 10 15
VDS≥ 2 * ID * RDS(on)max, ID = 1.7 A
Input capacitance
Ciss Coss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Output capacitance
VGS = 0 V, VDS = 25 V, f = 1 MHz
Reverse transfer capacitance
Crss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Turn-on delay time
td(on)
VDD = 30 V, VGS = 10 V, ID = 0.3 A RGS = 50 Ω
Rise time
tr
30 45
VDD = 30 V, VGS = 10 V, ID = 0.3 A RGS = 50 Ω
Turn-off delay time
td(off)
85 115
VDD = 30 V, VGS = 10 V, ID = 0.3 A RGS = 50 Ω
Fall time
tf
60 80
VDD = 30 V, VGS = 10 V, ID = 0.3 A RGS = 50 Ω
Semiconductor Group
3
Sep-12-1996
BSP 373
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS TA = 25 °C Inverse diode direct current,pulsed A 0.8 1.7 6.8 V 1.1 ns µC Values typ. max. Unit
ISM VSD trr Qrr
TA = 25 °C
Inverse diode forward voltage
VGS = 0 V, IF = 1.7 A, Tj = 25 °C
Reverse recovery time
VR = 30 V, IF=lS, diF/dt = 100 A/µs
Reverse recovery charge
VR = 30 V, IF=lS, diF/dt = 100 A/µs
Semiconductor Group
4
Sep-12-1996
BSP 373
Power dissipation Ptot = ƒ(TA)
Drain current ID = ƒ(TA) parameter: VGS ≥ 10 V
1.8 A
2.0 W
Ptot
1.6 1.4
ID
1.4 1.2
1.2 1.0 1.0 0.8 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 °C 160 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 °C 160
TA
TA
Safe operating area ID=f(VDS) parameter : D = 0, TC=25°C
Transient thermal impedance Zth JA = ƒ(tp) parameter: D = tp / T
10 2 K/W 10 1
ZthJC
10 0
10 -1 D = 0.50 0.20 0.10 10 -3 single pulse 10 -4 0.05 0.02 0.01
10 -2
10 -5 -8 -7 -6 -5 -4 -3 -2 -1 0 10 10 10 10 10 10 10 10 s 10
tp
Semiconductor Group
5
Sep-12-1996
BSP 373
Typ. output characteristics ID = ƒ(VDS) parameter: tp = 80 µs
3.8 A 3.2
Typ. drain-source on-resistance RDS (on) = ƒ(ID) parameter: tp = 80 µs, Tj = 25 °C
0.9
a b
Ptoth= 2W if g
ec d
VGS [V] a 4.0
b c 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 10.0 20.0
lj k
Ω
RDS (on) 0.7
0.6 0.5 0.4 0.3
c
ID
2.8
b
2.4 2.0 1.6 1.2
a
d e f g h i j k l
0.8 0.4 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 V 5.0
0.2
l
ed g ikjh f
j 9.0 k l 10.0 20.0
0.1 0.0
VGS [V] =
a 4.0 b 4.5 c 5.0 d 5.5 e f 6.0 6.5 g 7.0 h i 7.5 8.0
0.0
0.4
0.8
1.2
1.6
2.0
A
2.8
VDS
ID
Typ. transfer characteristics ID = f(VGS) parameter: tp = 80 µs
Typ. forward transconductance gfs = f (ID) parameter: tp = 80 µs,
6.5 A
4.5 S
5.5
ID
5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0
gfs
3.5 3.0 2.5 2.0 1.5 1.0 0.5
0.5 0.0 0 1 2 3 4 5 6 7 8 V 10 0.0 0.0 1.0 2.0 3.0 4.0 A ID 6.0
VGS
Semiconductor Group
6
Sep-12-1996
BSP 373
Drain-source on-resistance RDS (on) = ƒ(Tj ) parameter: ID = 1.7 A, VGS = 10 V
0.75
Gate threshold voltage VGS (th) = ƒ(Tj) parameter: VGS = VDS, ID = 1 mA
4.6 V 4.0
Ω
0.65
98%
RDS (on)0.60
0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 -60 -20 20 60 100 °C 160
VGS(th)
3.6 3.2 2.8
typ
98%
2.4 2.0 1.6
2%
typ
1.2 0.8 0.4 0.0 -60 -20 20 60 100 °C 160
Tj
Tj
Typ. capacitances C = f (VDS) parameter:VGS=0V, f = 1 MHz
10 1
Forward characteristics of reverse diode IF = ƒ(VSD) parameter: Tj , tp = 80 µs
10 1
nF C 10 0
A
IF
10 0
Ciss
10 -1
Coss Crss
10 -1
Tj = 25 °C typ Tj = 150 °C typ Tj = 25 °C (98%) Tj = 150 °C (98%)
10 -2 0
5
10
15
20
25
30
V VDS
40
10 -2 0.0
0.4
0.8
1.2
1.6
2.0
2.4
V
3.0
VSD
Semiconductor Group
7
Sep-12-1996
BSP 373
Avalanche energy EAS = ƒ(Tj ) parameter: ID = 1.7 A, VDD = 25 V RGS = 25 Ω, L = 23.3 mH
50 mJ
Drain-source breakdown voltage V(BR)DSS = ƒ(Tj)
120 V 116
EAS
40 35 30 25 20 15 10 5 0 20 40 60 80 100 120 °C 160
1 V(BR)DSS 14 112 110 108 106 104 102 100 98 96 94 92 90 -60 -20 20 60 100 °C 160
Tj
Tj
Safe operating area ID=f(VDS) parameter : D = 0.01, TC=25°C
Semiconductor Group
8
Sep-12-1996
BSP 373
Package outlines SOT-223 Dimensions in mm
Semiconductor Group
9
Sep-12-1996