BSS 101
SIPMOS ® Small-Signal Transistor • N channel • Enhancement mode • Logic Level
• VGS(th) = 0.8...2.0V
Pin 1 S Type BSS 101 Type BSS 101 BSS 101
Pin 2 G Marking SS 101
Pin 3 D
VDS
240 V
ID
0.13 A
RDS(on)
16 Ω
Package TO-92
Ordering Code Q62702-S493 Q62702-S636
Tape and Reel Information E6288 E6325
Maximum Ratings Parameter Drain source voltage Drain-gate voltage Symbol Values 240 240 Unit V
VDS V
DGR
RGS = 20 kΩ
Gate source voltage Gate-source peak voltage,aperiodic Continuous drain current
VGS Vgs ID
± 14 ± 20 A 0.13
TA = 33 °C
DC drain current, pulsed
IDpuls
0.52
TA = 25 °C
Power dissipation
Ptot
0.63
W
TA = 25 °C
Semiconductor Group
1
12/05/1997
BSS 101
Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air 1) DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Symbol Values -55 ... + 150 -55 ... + 150 ≤ 200 E 55 / 150 / 56 K/W Unit °C
Tj Tstg RthJA
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit
V(BR)DSS
240 1.4 0.1 2 1 12 15 2 1 60 30 10
V
VGS = 0 V, ID = 0.25 mA, Tj = 25 °C
Gate threshold voltage
VGS(th)
0.8
VGS=VDS, ID = 1 mA
Zero gate voltage drain current
IDSS
µA nA nA Ω 16 26
VDS = 240 V, VGS = 0 V, Tj = 25 °C VDS = 240 V, VGS = 0 V, Tj = 125 °C VDS = 130 V, VGS = 0 V, Tj = 25 °C
Gate-source leakage current
IGSS RDS(on)
VGS = 20 V, VDS = 0 V
Drain-Source on-state resistance
VGS = 10 V, ID = 0.13 A VGS = 4.5 V, ID = 0.13 A
Semiconductor Group
2
12/05/1997
BSS 101
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit
gfs
0.06 0.16 60 8 3.5 -
S pF 80 12 5 ns 5 8
VDS≥ 2 * ID * RDS(on)max, ID = 0.13 A
Input capacitance
Ciss Coss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Output capacitance
VGS = 0 V, VDS = 25 V, f = 1 MHz
Reverse transfer capacitance
Crss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Turn-on delay time
td(on)
VDD = 30 V, VGS = 10 V, ID = 0.26 A RG = 50 Ω
Rise time
tr
8 12
VDD = 30 V, VGS = 10 V, ID = 0.26 A RG = 50 Ω
Turn-off delay time
td(off)
12 16
VDD = 30 V, VGS = 10 V, ID = 0.26 A RG = 50 Ω
Fall time
tf
15 20
VDD = 30 V, VGS = 10 V, ID = 0.26 A RG = 50 Ω
Semiconductor Group
3
12/05/1997
BSS 101
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS A 0.85 0.13 0.52 V 1.2 Values typ. max. Unit
TA = 25 °C
Inverse diode direct current,pulsed
ISM
-
TA = 25 °C
Inverse diode forward voltage
VSD
VGS = 0 V, IF = 0.26 A
Semiconductor Group
4
12/05/1997
BSS 101
Power dissipation Ptot = ƒ(TA)
Drain current ID = ƒ(TA) parameter: VGS ≥ 10 V
0.14 A 0.12
0.70 W 0.60
Ptot
0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0
ID
0.11 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 0
20
40
60
80
100
120
°C
160
20
40
60
80
100
120
°C
160
TA
TA
Safe operating area ID=f(VDS) parameter : D = 0.01, TC=25°C
Drain-source breakdown voltage V(BR)DSS = ƒ(Tj)
285 V 275
V(BR)DSS 70 2
265 260 255 250 245 240 235 230 225 220 215 -60
-20
20
60
100
°C
160
Tj
Semiconductor Group
5
12/05/1997
BSS 101
Typ. output characteristics ID = ƒ(VDS) parameter: tp = 80 µs
0.30 A 0.26
Typ. drain-source on-resistance RDS (on) = ƒ(ID) parameter: tp = 80 µs, Tj = 25 °C
50
Ptot = 1W
k li j hg e f d
VGS [V] a 2.0
b c 2.5 3.0 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10.0
Ω
RDS (on) 40
35 30 25 20 15
a
b
ID
0.24 0.22 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0
a c
d e f g h i j k
c ed f h
bl
j ki g
10 5
VGS [V] =
a 2.5 2.0 b 3.0 c 3.5 d 4.0 e f 4.5 5.0 g 6.0 h i 7.0 8.0 j 9.0 k 10.0
1
2
3
4
5
6
7
8
V
10
0 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14
A
0.18
VDS
ID
Typ. transfer characteristics ID = f(VGS) parameter: tp = 80 µs VDS≥ 2 x ID x RDS(on)max
0.32
Typ. forward transconductance gfs = f (ID) parameter: tp = 80 µs, VDS≥2 x ID x RDS(on)max
0.24 S
A 0.20
ID
0.24
gfs
0.18 0.16 0.20 0.14 0.16 0.12 0.10 0.12 0.08 0.08 0.06 0.04 0.04 0.02 0.00 0 1 2 3 4 5 6 7 8 V 10 0.00 0.00 0.04 0.08 0.12 0.16 0.20 0.24 A ID 0.30
VGS
Semiconductor Group
6
12/05/1997
BSS 101
Drain-source on-resistance RDS (on) = ƒ(Tj) parameter: ID = 0.13 A, VGS = 10 V
40
Gate threshold voltage VGS (th) = ƒ(Tj) parameter: VGS = VDS, ID = 1 mA
4.6 V 4.0
Ω
RDS (on)
32 28 24 20 16 12
VGS(th)
3.6 3.2 2.8
98%
2.4
98%
2.0
typ
1.6 1.2
typ
8 4 0 -60
2%
0.8 0.4 -20 20 60 100 °C 160 0.0 -60 -20 20 60 100 °C 160
Tj
Tj
Typ. capacitances C = f (VDS) parameter:VGS=0V, f = 1 MHz
10 3
Forward characteristics of reverse diode IF = ƒ(VSD) parameter: Tj, tp = 80 µs
10 0
pF C 10 2
A
IF
10 - 1
Ciss
10 1
10 - 2
Coss Crss
Tj = 25 °C typ Tj = 150 °C typ Tj = 25 °C (98%) Tj = 150 °C (98%)
10 0 0
5
10
15
20
25
30
V VDS
40
10 -3 0.0
0.4
0.8
1.2
1.6
2.0
2.4
V
3.0
VSD
Semiconductor Group
7
12/05/1997