BSS 87
SIPMOS ® Small-Signal Transistor • N channel • Enhancement mode • Logic Level
• VGS(th) = 0.8...2.0V
Pin 1 G
Pin 2 D
Pin 3 S
Pin 4 D
Type BSS 87 Type BSS 87
VDS
240 V
ID
0.29 A
RDS(on)
6Ω
Package SOT-89
Marking KA
Ordering Code Q67000-S506
Tape and Reel Information E6327
Maximum Ratings Parameter Drain source voltage Drain-gate voltage Symbol Values 240 240 Unit V
VDS VDGR VGS Vgs ID
RGS = 20 kΩ
Gate source voltage Gate-source peak voltage,aperiodic Continuous drain current
± 14 ± 20 A 0.29
TA = 23 °C
DC drain current, pulsed
IDpuls
1.16
TA = 25 °C
Power dissipation
Ptot
1
W
TA = 25 °C
Semiconductor Group
1
Sep-18-1996
BSS 87
Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Symbol Values -55 ... + 150 -55 ... + 150 ≤ 125 E 55 / 150 / 56 K/W Unit °C
Tj Tstg RthJA
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Values typ. max. Unit
Static Characteristics Drain- source breakdown voltage
V(BR)DSS
240 1.5 0.1 10 1 3 4 2
V
VGS = 0 V, ID = 0.25 mA, Tj = 25 °C
Gate threshold voltage
VGS(th)
0.8
VGS=VDS, ID = 1 mA
Zero gate voltage drain current
IDSS
1 100 0.2
µA
VDS = 240 V, VGS = 0 V, Tj = 25 °C VDS = 240 V, VGS = 0 V, Tj = 125 °C VDS = 60 V, VGS = 0 V, Tj = 25 °C
Gate-source leakage current
IGSS
10
nA Ω 6 10
VGS = 20 V, VDS = 0 V
Drain-Source on-state resistance
RDS(on)
VGS = 10 V, ID = 0.29 A VGS = 4.5 V, ID = 0.29 A
Semiconductor Group
2
Sep-18-1996
BSS 87
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit
gfs
0.14 0.33 115 15 8 -
S pF 155 25 12 ns 6 9
VDS≥ 2 * ID * RDS(on)max, ID = 0.29 A
Input capacitance
Ciss Coss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Output capacitance
VGS = 0 V, VDS = 25 V, f = 1 MHz
Reverse transfer capacitance
Crss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Turn-on delay time
td(on)
VDD = 30 V, VGS = 10 V, ID = 0.28 A RGS = 50 Ω
Rise time
tr
10 15
VDD = 30 V, VGS = 10 V, ID = 0.28 A RGS = 50 Ω
Turn-off delay time
td(off)
33 45
VDD = 30 V, VGS = 10 V, ID = 0.28 A RGS = 50 Ω
Fall time
tf
22 30
VDD = 30 V, VGS = 10 V, ID = 0.28 A RGS = 50 Ω
Semiconductor Group
3
Sep-18-1996
BSS 87
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS A 0.85 0.29 1.16 V 1.4 Values typ. max. Unit
TA = 25 °C
Inverse diode direct current,pulsed
ISM
-
TA = 25 °C
Inverse diode forward voltage
VSD
VGS = 0 V, IF = 0.58 A, Tj = 25 °C
Semiconductor Group
4
Sep-18-1996
BSS 87
Power dissipation Ptot = ƒ(TA)
Drain current ID = ƒ(TA) parameter: VGS ≥ 10 V
0.30 A 0.26
1.2 W 1.0
Ptot
0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 20 40 60 80 100 120 °C 160
ID
0.24 0.22 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 20 40 60 80 100 120 °C 160
TA
TA
Safe operating area ID=f(VDS) parameter : D = 0.01, TC=25°C
Drain-source breakdown voltage V(BR)DSS = ƒ(Tj)
285 V 275
V(BR)DSS 70 2
265 260 255 250 245 240 235 230 225 220 215 -60
-20
20
60
100
°C
160
Tj
Semiconductor Group
5
Sep-18-1996
BSS 87
Typ. output characteristics ID = ƒ(VDS) parameter: tp = 80 µs , Tj = 25 °C
0.65 A 0.55
Typ. drain-source on-resistance RDS (on) = ƒ(ID) parameter: tp = 80 µs, Tj = 25 °C
19
Ptot = 1W lk h ji g
f
VGS [V]
Ω
16
a b c d 2.0 2.5 3.0 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10.0
a
b
c
d
ID
0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0.0 1.0 2.0 3.0 4.0 5.0
e
RDS (on)
14 12 10 8 6
e
e f g
dh
i j
c
k l
4
b a
f gh i j k
2 0 V 7.0
VGS [V] =
a 2.0 2.5 b 3.0 c 3.5 d 4.0 e f 4.5 5.0 g 6.0 h i 7.0 8.0 j 9.0 k 10.0
0.00
0.10
0.20
0.30
0.40
A
0.60
VDS
ID
Typ. transfer characteristics ID = f(VGS) parameter: tp = 80 µs
Typ. forward transconductance gfs = f (ID) parameter: tp = 80 µs,
1.2
0.55 S
A
ID
0.8
gfs
0.45 0.40 0.35 0.30
0.6 0.25 0.20 0.15 0.2 0.10 0.05 0.0 0 1 2 3 4 5 6 7 8 V 10 0.00 0.00 0.10 0.20 0.30 0.40 A ID 0.55
0.4
VGS
Semiconductor Group
6
Sep-18-1996
BSS 87
Drain-source on-resistance RDS (on) = ƒ(Tj ) parameter: ID = 0.29 A, VGS = 10 V
24
Gate threshold voltage VGS (th) = ƒ(Tj) parameter: VGS = VDS, ID = 1 mA
4.6 V 4.0
Ω
20
RDS (on)
18 16 14 12 10
VGS(th)
3.6 3.2 2.8 2.4
98%
2.0
98%
8 6 1.6 1.2
typ
typ
4 2 0 -60 -20 20 60 100 °C 160 0.8 0.4 0.0 -60 -20 20
2%
60
100
°C
160
Tj
Tj
Typ. capacitances C = f (VDS) parameter:VGS=0V, f = 1 MHz
10 3
Forward characteristics of reverse diode IF = ƒ(VSD) parameter: Tj , tp = 80 µs
10 1
pF C 10 2
A
IF Ciss
10 0
10 1
Coss Crss
10 -1
Tj = 25 °C typ Tj = 150 °C typ Tj = 25 °C (98%) Tj = 150 °C (98%)
10 0 0
5
10
15
20
25
30
V VDS
40
10 -2 0.0
0.4
0.8
1.2
1.6
2.0
2.4
V
3.0
VSD
Semiconductor Group
7
Sep-18-1996
BSS 87
Package outlines SOT-89 Dimensions in mm
Semiconductor Group
8
Sep-18-1996