BUP 314
IGBT Preliminary data • Low forward voltage drop • High switching speed • Low tail current • Latch-up free • Avalanche rated Pin 1 G Type BUP 314 Maximum Ratings Parameter Collector-emitter voltage Collector-gate voltage Symbol Values 1200 1200 Unit V Pin 2 C Ordering Code Q67040-A4206-A2 Pin 3 E
VCE
IC
Package TO-218 AB
1200V 52A
VCE VCGR VGE IC
RGE = 20 kΩ
Gate-emitter voltage DC collector current
± 20 A 52 33
TC = 25 °C TC = 90 °C
Pulsed collector current, tp = 1 ms
ICpuls
104 66
TC = 25 °C TC = 90 °C
Avalanche energy, single pulse
EAS
65
mJ
IC = 25 A, VCC = 50 V, RGE = 25 Ω L = 200 µH, Tj = 25 °C
Power dissipation
Ptot
300
W -55 ... + 150 -55 ... + 150 °C
TC = 25 °C
Chip or operating temperature Storage temperature
Tj Tstg
Semiconductor Group
1
Jul-30-1996
BUP 314
Maximum Ratings Parameter DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Thermal Resistance Thermal resistance, chip case Symbol Values E 55 / 150 / 56 Unit -
RthJC
≤ 0.42
K/W
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol min. Static Characteristics Gate threshold voltage Values typ. max. Unit
VGE(th)
4.5 5.5 2.7 3.3 3.4 4.3 6.5 3.2 3.9 -
V
VGE = VCE, IC = 0.35 mA
Collector-emitter saturation voltage
VCE(sat)
-
VGE = 15 V, IC = 25 A, Tj = 25 °C VGE = 15 V, IC = 25 A, Tj = 125 °C VGE = 15 V, IC = 42 A, Tj = 25 °C VGE = 15 V, IC = 42 A, Tj = 125 °C
Zero gate voltage collector current
ICES
0.25
mA nA 100
VCE = 1200 V, VGE = 0 V, Tj = 25 °C
Gate-emitter leakage current
IGES
VGE = 25 V, VCE = 0 V
AC Characteristics Transconductance
gfs
8.5 20 1650 250 110 -
S pF 2200 380 160
VCE = 20 V, IC = 25 A
Input capacitance
Ciss Coss
-
VCE = 25 V, VGE = 0 V, f = 1 MHz
Output capacitance
VCE = 25 V, VGE = 0 V, f = 1 MHz
Reverse transfer capacitance
Crss
-
VCE = 25 V, VGE = 0 V, f = 1 MHz
Semiconductor Group
2
Jul-30-1996
BUP 314
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol min. Switching Characteristics, Inductive Load at Tj = 125 °C Turn-on delay time Values typ. max. Unit
td(on)
75 110
ns
VCC = 600 V, VGE = 15 V, IC = 25 A RGon = 47 Ω
Rise time
tr
65 100
VCC = 600 V, VGE = 15 V, IC = 25 A RGon = 47 Ω
Turn-off delay time
td(off)
420 560
VCC = 600 V, VGE = -15 V, IC = 25 A RGoff = 47 Ω
Fall time
tf
45 60
VCC = 600 V, VGE = -15 V, IC = 25 A RGoff = 47 Ω
Semiconductor Group
3
Jul-30-1996
BUP 314
Power dissipation Ptot = ƒ(TC) parameter: Tj ≤ 150 °C
320
Collector current IC = ƒ(TC) parameter: VGE ≥ 15 V , Tj ≤ 150 °C
55 A
W
Ptot
240
IC
45 40 35 30
200
160 25 120 20 15 10 40 5 0 0 20 40 60 80 100 120 °C 160 0 0 20 40 60 80 100 120 °C 160
80
TC
TC
Safe operating area IC = ƒ(VCE) parameter: D = 0, TC = 25°C , Tj ≤ 150 °C
10 3
Transient thermal impedance Zth JC = ƒ(tp) parameter: D = tp / T
10 0
IGBT
A K/W
IC
10 2
tp = 2.0µs
10 µs
ZthJC
10 - 1
100 µs
10 1 D = 0.50
1 ms
0.20 10 - 2 10 0
10 ms
0.10 0.05 0.02 0.01 single pulse
DC 10 -1 0 10 10
1
10
2
10
3
V
10 -3 -5 10
10
-4
10
-3
10
-2
10
-1
s 10
0
VCE
tp
Semiconductor Group
4
Jul-30-1996
BUP 314
Typ. output characteristics
Typ. output characteristics
IC = f (VCE)
parameter: tp = 80 µs, Tj = 25 °C
50 A
IC = f (VCE)
parameter: tp = 80 µs, Tj = 125 °C
50 A 17V 15V 13V 11V 9V 7V
IC
40 35 30 25 20 15 10 5 0 0
IC
40 35 30 25 20 15 10 5 0 0
17V 15V 13V 11V 9V 7V
1
2
3
V
5
1
2
3
V
5
VCE
VCE
Typ. transfer characteristics
IC = f (VGE) parameter: tp = 80 µs, VCE = 20 V
50 A
IC
40 35 30 25 20 15 10 5 0 0
2
4
6
8
10
V 14 VGE
Semiconductor Group
5
Jul-30-1996
BUP 314
Typ. switching time
Typ. switching time
I = f (IC) , inductive load , Tj = 125°C
par.: VCE = 600 V, VGE = ± 15 V, RG = 47 Ω
10 3
t = f (RG) , inductive load , Tj = 125°C
par.: VCE = 600 V, VGE = ± 15 V, IC = 25 A
10 3 tdoff
t
tdoff ns
t
ns
tdon 10 2 tdon tr 10 2 tr
tf
tf
10 1 0
10
20
30
40
A
60
10 1 0
20
40
60
80
100 120 140
IC
RG
Ω
180
Typ. switching losses
Typ. switching losses
E = f (IC) , inductive load , Tj = 125°C par.: VCE = 600 V, VGE = ± 15 V, RG = 47 Ω
10 mWs E 8 7 6 5 4 3 2 1 0 0 Eoff Eon
E = f (RG) , inductive load , Tj = 125°C
par.: VCE = 600V, VGE = ± 15 V, IC = 25 A
10 mWs E 8 7 6 5 4 3 2 1 Eoff
Eon
10
20
30
40
A
60
IC
0 0
20
40
60
80
100 120 140
RG
Ω
180
Semiconductor Group
6
Jul-30-1996
BUP 314
Typ. gate charge VGE = ƒ(QGate) parameter: IC puls = 25 A
20 V
Typ. capacitances
C = f (VCE)
parameter: VGE = 0 V, f = 1 MHz
10 1
nF
VGE
16 14 12 10
C Ciss
600 V
800 V
10 0
Coss 8 10 - 1 6 4 2 0 0 10 -2 0 Crss
20
40
60
80
100
120
140
170
5
10
15
20
25
30
QGate
V 40 VCE
Short circuit safe operating area
Reverse biased safe operating area
ICsc = f (VCE) , Tj = 150°C parameter: VGE = ± 15 V, tsc ≤ 10 µs, L < 25 nH
10
ICpuls = f (VCE) , Tj = 150°C parameter: VGE = 15 V
2.5
ICsc/IC(90°C)
ICpuls/IC
6
1.5
4
1.0
2
0.5
0 0 200 400 600 800 1000 1200 V 1600 VCE
0.0 0 200 400 600 800 1000 1200 V 1600 VCE
Semiconductor Group
7
Jul-30-1996
BUP 314
Package Outlines Dimensions in mm Weight:
Semiconductor Group
8
Jul-30-1996