Q62705-K271

Silicon Spreading Resistance Temperature Sensor in Robust Threaded Metal Housing Features • Temperature dependent Resistor with Positive Temperature Coefficient • Selected at 25 ˚C, R25 = 2000 Ω ± 1% • Corrosion resistant stainless steel housing with connector socket • Fast response • High long-term stability • excellent linearity • Robust threaded housing • Mating splash-proof connector set available Test voltage: Isolation voltage: Test duration: Insertion torque: Type KTY 19-6M KTY 19-6Z Marking 1000 V ~ 100 V ~ 1s max. 30 Nm Thread Ordering Code Q62705K271 Pin Configuration 1 2 KTY 19-6 M/Z Package KTY 19M ISO M10x1 electrical electrical BSS303 contact contact DIN 1.4305 electrical electrical stainless contact contact steel – – housing: potential free KTY 19Z NPTF Q627051/8" × 27 K272 – Q62901B80 Connector Set – (Splash-proof) Absolute Maximum Ratings Parameter Maximum operating voltage 1) TA ≤ 25 ˚C, t ≤ 10 ms Maximum operating current Peak operating current TA ≤ 25 ˚C, t ≤ 10 ms Operating temperature range Storage temperature range 1) Symbol Limit Values 25 5 7 − 50 … + 150 − 50 … + 150 Unit V mA mA ˚C ˚C Vopmax Iopmax Iopp Top Tstg ESD Class 1. When the temperature sensor is operated with long supply leads, it should be protected through the parallel connection of a > 10 nF capacitor to prevent damage to the sensor through induced voltage peaks. Semiconductor Group 1 1997-10-01 KTY 19-6 M/Z Electrical Characteristics at TA = 25 ˚C unless otherwise specified Parameter Temperature sensor resistance IB = 1 mA KTY 19-6M/Z Thermal time constant (63 % of ∆TA) in still air in still oil (Freon FC40/PP7) Package Outline Stainless Steel Housing, BSS303 (equiv. DIN 1.4305) 48.6 ±0.5 9 6 12 b SW17 12 Symbol min. Limit Values typ. max. Unit Ω R25 1980 τair τoil − − 40 4 2020 − − s 17 45˚ No undercut Plug-in socket connects with AMP Junior Timer a Spade terminals A2.8x0.8 DIN 46244 without hole SW17 13.5 Weight approx. 20 g 5 30 M10x1 or NPTF 1/8x27 Ø3.8 GMX05639 Dimensions in mm Exterior Packaging I.e. tubes, trays, boxes are shown in our Data Book “Package Information”. Semiconductor Group 2 1997-10-01 5