Q62705-K292

Silicon Piezoresistive Pressure Sensor KPY 62-RK KPY 66-RK Features • • • • Low pressure and temperature hysteresis Fast response High sensitivity and linearity Fatigue free monocrystaline silicon diaphragm giving high load cycle stability • High long term stability • Built in silicon temperature sensor • Metal housing Similar to TO-39-3 Type and Marking KPY 62 RK KPY 63 RK KPY 64 RK KPY 65 RK KPY 66 RK Pin Configuration 1 2 3 4 5 6 7 8 Symbol Pressure Range 0 … 600 0 … 1.6 0…4 0 … 10 0 … 25 Unit mbar bar Ordering Code Q62705-K319 Q62705-K320 Q62705-K321 Q62705-K322 Q62705-K292 P0 … PN Temp.- Sensor (typ. R25 = 2 kΩ) Not connected + VIN; Temperature sensor − VOUT No pin Shielding, to be connected to + VIN − VIN + VOUT Semiconductor Group 1 1998-05-11 KPY 62-RK KPY 66-RK Absolute Maximum Ratings Parameter Pressure overload KPY 65 RK KPY 66 RK Operating temperature range Storage temperature range Supply voltage Symbol Limit Values1) Frontside Rearside Unit bar 20 50 10 10 − 40 … + 125 − 40 … + 125 12 ˚C ˚C V PMAX TA Tstg VIN 1) Frontside coupling applies pressure onto chip face. Rearside coupling applies pressure through Kovar centre tube. Electrical Characteristics at TA = 25 ˚C and VIN = 5 V, unless otherwise specified. Parameter Bridge resistance Sensitivity KPY 65 RK KPY 66 RK Output voltage KPY 65 RK KPY 66 RK Offset voltage P = P0 Linearity error (Best fit straight line) P0 = P0 … PN KPY 65 … 66 RK Pressure hysteresis PH P1 = P0, P2 = PN, P3 = P0 KPY 65 … 66 RK Symbol Limit Values min. typ. − 5.2 2.1 260 260 − max. 8 8.0 3.0 400 370 mV − 25 + 25 % Vfin − − ± 0.3 ± 0.1 ± 0.5 − % Vfin kΩ mV/ Vbar mV 180 150 4 3.6 1.1 Unit RB s Vfin V0 FL Semiconductor Group 2 1998-05-11 KPY 62-RK KPY 66-RK Electrical Characteristics at T1 = 25 ˚C, T2 = 125 ˚C, T3 = 25 ˚C and VIN = 5 V, unless otherwise specified. Parameter Temperature coefficient of Vfin KPY 65 … 66 RK Temperature coefficient of V0 KPY 65 … 66 RK Temperature coefficient of RB KPY 65 … 66 RK Temperature hysteresis of V0; Vfin KPY 65 … 66 RK Package Outline Similar to TO-39-3 Basic Component 16 ±0.1 12 ±0.1 8 ±0.5 Symbol min. Limit Values typ. − 0.18 − + 0.23 ± 0.2 max. Unit %/K TCVfin − 0.22 − 0.15 TCV0 − 0.02 + 0.02 %/K %/K − − % v. Vfin − − TCRB TH View on Chip 9.3 -0.2 ø1.05 ±0.1 ø1.55 ±0.1 7.6 ±0.1 6 7 8 5 4 3 ø0.65 -0.1 1 2 2.6 max Bond Wire Loop Component Delivery Form 22.2±0.6 18.2±0.6 14.2±0.6 3.59 5.08 ø11.5-0.5 3.59 5 ±0.6 6.2 ±0.6 8±0.6 45˚ GMT05804 Weight approx. 2.0 g 5.08 Dimensions in mm Exterior Packaging I.e. tubes, trays, boxes are shown in our Data Book “Package Information”. Semiconductor Group 3 1998-05-11