GSM Receiver Circuit
PMB 2402
Preliminary Data
Bipolar IC
Features
q Heterodyne receiver with demodulator q Down mixing from 900 MHz receiver band to the base q q q q q q q q q q q q q
band Demodulation and generation of I/Q-baseband components Low mixer noise 10 dB (SSB) Input high intercept point + 2 dB Integrated 0˚ and 90˚ phase shifter 82 dB AGC-range On-chip second LO-oscillator with external tuning circuit Two differential operational amplifiers Low power consumption due to highly flexible powerdown capability Wide input frequency range up to 1 GHz Wide IF-range from 35 MHz to 100 MHz Wide output frequency range up to 13.5 MHz P-DSO-28-4 shrink package Temperature range – 25 ˚C to 85 ˚C
P-DSO-28-4
Applications
q Digital mobile cellular systems as GSM, DAMPS, JDC q Various demodulation schemes, such as PM, PSK, FSK, QAM, QPSK, GMSK q Space and power saving optimizations of existing discrete demodulator circuits
Type PMB 2402S PMB 2402S
Version V 2.1 V 2.1
Ordering Code Q67000-A6072 Q67006-A6072
Package P-DSO-28-4 (Shrink, SMD)) P-DSO-28-4 (Shrink, SMD, Tape + Reel)
Functional Description The PMB 2402 is a single-chip single-conversion heterodyn PM-receiver with phase shifting circuitry for the I/Q-phase baseband demodulation on chip. It also includes the second local oscillator, a gain controlled second IF-amplifier, two differential operational amplifiers for baseband filtering purposes and power down circuitry. The PMB 2402 is designed for digital mobile telephones according to the GSM-standard and other digital systems. Semiconductor Group 1 01.94
PMB 2402
Pin Configuration (top view)
Semiconductor Group
2
PMB 2402
Pin Definitions and Functions Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Symbol SOI SOQ INQ OUTQ OUTQ INQ SOQ LO2E LO2B GND IFI IFI GC LO2O MO MO Function Non-inverting in-phase signal output Non-inverting quadratur signal output Inverting op. amp. signal output (Q) Non-inverting op. amp. signal output (Q) Inverting op. amp. signal output (Q) Non-inverting op. amp. signal intput (Q) Inverting quadratur signal output External capacitors for oscillator VCO-tuning circuit Ground Inverting IF input Non-inverting IF input Gain control input VCO-signal output Inverted output of first mixer Non-inverted output of first mixer Supply voltage Non-inverted signal input of first mixer Inverted signal input of first mixer Power-down input 1 Non-inverting input for first local oscillator Inverting input for first local oscillator Power-down input 2 Inverting in-phase signal output Non-inverting op. amp. signal input (I) Inverting op. amp. signal output (I) Non-inverting op. amp. signal output (I) Inverting op. amp. signal input (I)
VS
SI SI PD1 LO1 LO1 PD2 SOI INI OUTI OUTI INI
Semiconductor Group
3
PMB 2402
Block Diagram Semiconductor Group 4
PMB 2402
Circuit Description The input signal SI/SI and the amplified first local oscillator signal LO1/LO1 are mixed down to an intermediate frequency (IF). The open collector output of the mixer generates a differential current at pins MO/MO which is filtered by an external resonant circuit. The resulting voltage drives an external SAW-filter. The second local oscillator signal LO2 is generated in an on chip VCO and is fed to two dividers, which generate orthogonal signals at a quarter of VCO-frequency. The internal LO-signal is fed to an additionally divider, whose output signal LO2O is fed to the RF-signal of PLL-synthesizer. The filtered IF-signal reenters the chip at the IFI/IFI input, where it is amplified and demodulated to the final baseband output frequency with each of the orthogonal signals. The resulting in-phase and quadrature signals pass through differential output drivers and appear at SOI/SOI and SOQ/SOQ outputs, respectively. The amplification of the IF-signal before the second mixer stage is performed by a gain-controlled amplifier, the gain being determined by the voltage at the gain control input GC. Two differential operational amplifiers with the input signals INI/INI (INQ/INQ) and the output signals OUTI/OUTI (OUTQ/OUTQ) can be used as active filters. Differential signals and symmetrical circuitry are used throughout, except at the signal output. Bias drivers generate internal temperature- and supply voltage-compensated reference voltages required by various circuit blocks. Switching the power down inputs PD1 and PD2 from high to low (see table) sets the circuit from its normal operating mode into a mode with reduced supply current.
PD1 L L H H
PD2 L H L H
RF-Part OFF OFF ON ON
IF-Part OFF ON OFF ON
VCO/Divders ON ON ON ON
Semiconductor Group
5
PMB 2402
Internal Input / Output Circuits Semiconductor Group 6
PMB 2402
Electrical Characteristics Absolute Maximum Ratings The maximum ratings may noy be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the IC will result.
TA = – 25 ˚C to 85 ˚C
Parameter Supply voltage Input/output voltage (any except open collector) Open collector output voltage (MO/MO) Differential input voltage (any differential input) Junction temperature Storage temperature Thermal resistence (junction to ambient) Symbol min. Limit Values max. 7 V V V V V V ˚C ˚C K/W K/W PDSO-28 P-DSO-28-S – 0.5 – 0.5 – 0.5 – 0.5 – 0.5 –3 Unit Remarks
VS VIO VOC VI Tj Tstg Rth JA
VS + 0.5
7.5
VS ≤ 7 V VS ≤ 7 V VS ≥ 5 V VS ≥ 5 V
VS + 2.5
7.5 3 125
– 55
125 55
Semiconductor Group
7
PMB 2402
Operational Range Within the operational range the IC operates as described in the circuit description. The AC/DCcharacteristics limits are not guaranteed.
VS = 4.5 V to 5.5 V; TA = – 25 ˚C to 85 ˚C; refer to test circuit 1.
Parameter SI/SI input level SI/SI input frequency LO1/LO1 input level LO1/LO1 input frequency Intermediate frequency IFI/IFI input level IFI/IFI input frequency LO2 input level LO2 input frequency VCO frequency range LO2O output level LO2O output frequency SOI/SOI, SOQ/SOQ output Bandwidth GC input voltage L-PD1/PD2 voltage H-PD1/PD2 voltage Symbol Limit Values min. max. – 11 1000 – 11 35 35 – 20 140 120 120 15 0 0 0 4 3 1100 100 – 24 100 0 400 250 180 50 13.5 2 1 dBm MHz dBm MHz MHz dBm MHz dBm MHz MHz mVpp MHz MHz V V V – 3 dB roll off with ext. capacitors VCO external Unit Remarks
PSI fSI PLO1 fLO1 fIF PIFI fIFI PLO2 fLO2 fVCO PLO2O fLO2O BSO VGC VPDL VPDH
VS
Note: Power levels are referred to resistance of 50 Ω
Semiconductor Group
8
PMB 2402
AC/DC Characteristics AC/DC-characteristics involve the spread of values guaranteed within the specified supply voltage and ambient temperature range. Typical characteristics are the median of the production.
VS = 4.75 to 5.25 V; TA = 25 ˚C;
Parameter Supply current Symbol Limit Values min. typ. 5.5 15.5 15 24.5 max. 6.8 19 18.5 30 mA mA mA mA PD1 = L PD1 = L PD1 = H PD1 = H PD2 = L PD2 = H PD2 = L PD2 = L 3.1 12 11.5 20 Unit Test Condition Test Circuit 1
IS
First Mixer Signal Input SI/SI Input resistance Input inductance Max. input level Input intercept Point Blocking level Input interference level at f = fint Input frequency Noise figure
RSI LSI PSI PIPI PB Pint fSI NSI NSI
17 3.5 – 13 0 – 16 – 38
25 5 – 11 2 – 14
33 6.5 3 – 12
Ω nH dBm dBm dBm dBm In series to RSI 1 dB compr. at MO/MO
2a 2a 1 1 1 3 1 DSB-noise, fC = 900 MHz SSB-noise, fC = 900 MHz including optimum noise matching 1
GMO = 14 dB
3 dB attenuation of wanted Signal at MO – 98 dBm interference at f = (fint +/– fLO1) X2 at MO
960 7.5 9.5 8 10 9.5 11.5
MHz dB dB
Output of First Mixer MO/MO (open collector) Output resistance
RMO RMO
11.2 7 0.7 3.5
16 10 1 5 13
20.8 13 1.3 6.5 14 100
kΩ kΩ pF mA dB MHz
fMO = 45 MHz fMO = 71 MHz
parallel to RMO
2c 2c 2c 1 1 1
Output capacitance CMO Total output current IMO + MO Power gain from Signal input Intermediate frequency
GMO fIF
35
Semiconductor Group
9
PMB 2402
AC/DC-Characteristics (cont’d) Parameter Symbol Limit Values min. typ. max. Unit Test Condition Test Circuit
Input of First Mixer Local Oscillator LO1/LO1 Input resistance Input capacitance Input level Input frequency
RLO1 CLO1 PLO1 VLO1 fLO1
490 0.7 – 11 178
700 1
910 1.3 3 890
Ω pF dBm mVpp
fLO1 = 900 MHz
parallel to RLO1 see diagram 1
2a 2a 1 1 1
1100 MHz
Isolation of First Mixer From SI SI to MO to LO1
ASI – MO ASI – LO1
30 60
dB dB dB dB dB dB
fSI = 945 MHz; fLO1 = 900 MHz fSI = 945 MHz; fLO1 = 900 MHz fSI = 945 MHz; fLO1 = 900 MHz fSI = 945 MHz; fLO1 = 900 MHz fSI = 945 MHz; fLO1 = 900 MHz fSI = 945 MHz; fLO1 = 900 MHz
1 1 1 1 1 1
LO1 to MO LO1 to SI MO to Si MO to LO1
ALO1 – MO 50 ALO1 – SI AMO – SI
60 50
AMO – LO1 65
IF Input IFI/IFI Input resistance Input capacitance Max. input level Input intercept point Input frequency Noise figure
RIFI CIFI PIFI VIFI PIPI fSI NSI
63 0.35
90 0.5 – 17 89
117 0.65
Ω pF dBm mVpp parallel to RIFI
2a 2a 1 1 1
VGC = 2 V, 1 dB compr. at
SO; see diagram 4
see diagram 5 35 10 11 100 14 MHz dB SSB-noise
1 1
Input for Second Local Oscillator LO2 (VCO external) Input resistance
RLO2
1.9 1.3
2.4 1.8
3.1 2.3
kΩ kΩ
fLO2 = 180 MHz fLO2 = 360 MHz
2b 2b
Semiconductor Group
10
PMB 2402
AC/DC-Characteristics (cont’d) Parameter Input capacitance Input level Input frequency Symbol Limit Values min. typ. 1 max. 1.3 0 630 400 pF dBm mVpp MHz into 50 Ω 0.7 – 20 63 140 Unit Test Condition Test Circuit 2b 1.1 1.1 1.1
CLO2 PLO2 VLO2 fLO2
Voltage Controlled Oscillator VCO (LO2) VCO-frequency VCO Output LO2O Output resistance Output level Output frequency
fVCO
120
250
MHz
with ext. capacitors
1.2
RLO2O VLO2O fLO2O
0.9 0.7 150 120 15
1.2 1 160 140
1.5 1.3
kΩ pF mVpp mVpp IF ≤ 75 MHz IF ≥ 75 MHz 1 1 1
Output capacitance CLO2O
50
MHz
Signal Outputs SOI/SOI, SOQ/SOQ Output resistance SO frequency roll off DC output level Diff. output offset voltage Voltage gain from IF to I/Q-output
RSO fSO VSO VSO/SO GSO
175 0.7
250 1 13.5
325 1.3
Ω pF MHz see diagram 6 1 between I/I or Q/Q 1 1
Output capacitance CSO
2.0
2.5 28
V mV dB dB
57 – 25
61 – 21
65 – 17
VGC = 0 V VGC = 2 V
see diagram 2 + 3
Gain Control Input GC GC-input voltage GC-input current Gain control factor
VGC
– IGC
0 40
2 1
V µA dB/V 0 V ≤ VGC ≤ 2 V
1 1 1
FGC
FGC = dGSO/dVGC
see diagram 3
Semiconductor Group
11
PMB 2402
AC/DC-Characteristics (cont’d) Parameter Symbol Limit Values min. Power-Down Inputs PD1, PD2 L-PD input voltage L-PD input current typ. max. Unit Test Condition Test Circuit
VPDL IPD1L IPD2L
0
1 0.1 0.2
V µA µA V µA 4 ≤ VPD1, 2L ≤ VS 0 ≤ VPD1, 2L ≤ 1 V
1 1 1 1
H-PD input voltage VPDH H-PD input current
4
VS
10
IPDH
Differential Operational Amplifier (open loop) Slew rate Gain Bandwith Prod. Voltage gain Phase margin Gain margin Common mode Rejection Ratio Offset voltage Output voltage
SR GBW AVo
ϕR AR
4.6 12 55 60 14 58 1 0.8
V/µs MHz dB degr. dB dB mV
1 1 1 1 1 1 1 1
CMRR VOFF VOUT
VS –1 V
Semiconductor Group
12
PMB 2402
Test Circuit 1 Semiconductor Group 13
PMB 2402
Test Circuit 1.1
Test Circuit 1.2 Semiconductor Group 14
PMB 2402
Test Circuit 2a
Test Circuit 2b
Test Circuit 2c
Semiconductor Group
15
PMB 2402
The S-parameters are tested at the indicated frequency and the equivalent parallel or series circuit is calculated on this base. Test Point LO1-input impedance SI-input impedance IFI-input impedance LO2-input impedance MO-output impedance Test Circuit Test Frequency / MHz 2a 2a 2a 2b 2c 900 900 45 … 90 180, 360 45, 71 Pin x 21 18 11 9 15 Pin y 22 19 12 – 16
Semiconductor Group
16
PMB 2402
Test Circuit 3
f W = wanted input signal from received channel fint = unwanted interfering signal within band : fint = fLO – fIF / 2 fLO = local oscillator signal fIFW = wanted IF signal from received channel = fLO – fW fIFi t = unwanted IF / 2 signal from interfering channel: fIFint = fLO – fint fIF2in = unwanted harmonic signal of fIF2in : fIF2in = 2 × fIFint
Semiconductor Group 17
PMB 2402
Application Circuit Semiconductor Group 18
PMB 2402
Diagram 1 First Mixer Gain versus LO-Level PLO1 PSI = – 40 dBm, fMO = 45 MHz
Diagram 2 Gain Control Characteristic Output Level PSO versus input Level PIFI
Diagram 3 Gain Control Characteristic Voltage Gain GSO versus GC-Voltage VGC
Diagram 4 Gain Control Characteristic Max. Input Level PIFI versus GC-Voltage VGC: (1 dB Compresion at SO)
Semiconductor Group
19
PMB 2402
Diagram 5 Gain–Control Characteristic Input Intercept Point PIPI versus GC-Voltage VGC
Diagram 6 Frequency Transfer Characteristic of Outputs SOI / SOQ
Semiconductor Group
20
PMB 2402
Package Outlines Plastic-Package, P-DSO-28-4 (Shrink) (SMD) (Dual-Small-Outlines)
Sorts of Packing Package outlines for tubes, trays ect. are contained in our Data Book “Package Information” SMD = Surface Mounted Device
Dimensions in mm
Semiconductor Group
21
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