Q67000-H5114

GHz PLL with I2C Bus and Four Chip Addresses MGP 3006X Bipolar IC Features q q q q q q 1-chip system for MPU-control (I2C Bus) 4 programmable chip addresses Short pull-in time for quick channel switch-over and optimized loop stability 2 high-current band switch outputs (20 mA) Software-compatible with SDA 3202 series Oxis III technology P-DSO-14-1 Type MGP 3006X MGP 3006X Ordering Code Q67000-H5114 Q67006-H5114 Package P-DSO-14-1 (SMD) P-DSO-14-1 Tape & Reel (SMD) Combined with a VCO (tuner), the MGP 3006X device, with four hard-switched chip addresses, forms a digitally programmable phase-locked loop for use in television sets with PLL-frequency synthesis tuning. The PLL permits precise crystal-controlled setting of the frequency of the tuner oscillator between 16 and 1300 MHz in increments of 62.5 kHz, and, with a 2.4-GHz prescaler 1/2, in the TV-SAT band in increments of 125 kHz. The tuning process is controlled by a microprocessor via an I2C Bus. The I2C Bus noise immunity has been improved by a factor of 10 compared to the SDA 3202-2, and the new crystal oscillator generates a sinusoidal signal, suppressing the higher-order harmonics, which reduces the moiré noise considerably. Semiconductor Group 1 04.93 MGP 3006X Circuit Description Tuning Section UHF/VHF REF The tuner signal is capacitively coupled at the UHF/VHF-input and subsequently amplified. The reference input REF should be decoupled to ground using a capacitor of low series inductance. The signal passes through an asynchronous divider with a fixed ratio of P = 8, an adjustable divider with ratio N = 256 through 32767, and is then compared in a digital frequency/phase detector to a reference frequency fREF = 7.8125 kHz. This frequency is derived from a balanced, low-impedance 4-MHz crystal oscillator (pin Q1, Q2) by dividing its output signal by Q = 512. The phase detector has two outputs UP and DOWN that drive the two current sources I+ and I– of a charge pump. If the negative edge of the divided VCO-signal appears prior to the negative edge of the reference signal, the I+ current source pulses for the duration of the phase difference. In the reverse case the I– current source pulses. PD, UD If the two signals are in phase, the charge pump output (PD) goes into the high-impedance state (PLL is locked). An active low-pass filter integrates the current pulses to generate the tuning voltage for the VCO (internal amplifier, external output transistor at UD and external RC-circuitry). The charge pump output is also switched into the high-impedance state when the control bit T0 = 1. Here it should be noted, however, that the tuning voltage can alter over a long period in the high-impedance state as a result of self-discharge in the peripheral circuitry. UD may be switched off by the control bit OS to allow external adjustments. By means of a control bit 5I the pump current can be switched between two values by software. This programmability permits alteration of the control response of the PLL in the locked-in state. In this way different VCO-gains in the different TV-bands can be compensated, for example. P1, P2 P7 CAU The software-switched outputs P1, P2 can be used for direct band selection (20 mA current output). P7 is a general-purpose open-collector output. The test bit T1 = 1 switches the test signal Cy (divided input signal) to P7. Four different chip addresses can be set by appropriate connection of pin CAU. Q1, Q2 Semiconductor Group 2 MGP 3006X I2C Bus Interface Data are exchanged between the processor and the PLL on the I2C Bus. SCL, SDA The clock is generated by the processor (input SCL), while pin SDA works as an input or output depending on the direction of the data (open collector; external pull-up resistor). Both inputs have hysteresis and a low-pass characteristic, which enhances the noise immunity of the I2C Bus. The data from the processor pass through an I2C Bus control. Depending on their function the data are subsequently stored in registers. If the bus is free, both lines will be in the marking state (SDA, SCL are high). Each telegram begins with the start condition and ends with the stop condition. Start condition: SDA goes low, while SCL remains high. Stop condition: SDA goes high while SCL remains high. All further information transfer takes place during SCL = low, and the data is forwarded to the control logic on the positive clock edge. The table “bit allocation” should be referred to in the following paragraph. All telegrams are transmitted byte-by-byte, followed by a ninth clock pulse, during which the control logic returns the SDA-line to low (acknowledge condition). The first byte is comprised of seven address bits. These are used by the processor to select the PLL from several peripheral components (chip select). The eighth bit is always low. In the data portion of the telegram the first bit of the first or third data byte determines whether a divider ratio or control information is to follow. In each case the second byte of the same data type or a stop condition has to follow the first byte. VS, GND When the supply voltage is applied a power-on reset circuit prevents the PLL from setting the SDA-line to low, which would block the bus. Semiconductor Group 3 MGP 3006X Circuit Description (cont’d) Bit Allocation MSB Address byte 1 1 0 0 0 MA1 A = Acknowledge MA0 0 A Prog. divider Byte 1 0 n14 n13 n12 n11 n10 n9 n8 A Prog. divider Byte 2 n7 n6 n5 n4 n3 n2 n1 n0 A Control info. Byte 1 1 5I T1 T0 1 1 1 OS A Control info. Byte 2 Divider Ratio P7 X X X X P2 P1 X A N = 16384 × n14 + 8192 × n13 + 4096 × n12 + 2048 × n11 + 1024 × n10 + 512 × n9 + 256 × n8 + 128 × n7 + 64 × n6 + 32 × n5 + 16 × n4 + 8 × n3 + 4 × n2 + 2 × n1 + n0 Band Selection P1, P2, P7 = 1 Open-collector output is active. Pump Current Programming 5I = 1 UD Disable OS = 1 Test Mode T1, T0 = 0, 0 T1 = 1 T0 = 1 Semiconductor Group High current UD is disabled. Normal operation P7 = carry Cy of programmable divider Tristate: charge pump output PD is in high-impedance state. 4 MGP 3006X Chip Address Switching MA1 0 0 1 1 MA0 0 1 0 1 Voltage at CAU (0 … 0.1) VS open-circuit (0.4 … 0.6) VS (0.9 … 1) VS Telegram Examples Start-Addr-DR1-DR2-CW1-CW2-Stop Start-Addr-CW1-CW2-DR1-DR2-Stop Start-Addr-DR1-DR2-CW1-Stop Start-Addr-CW1-CW2-DR1-Stop Start-Addr-DR1-DR2-Stop Start-Addr-CW1-CW2-Stop Start-Addr-DR1-Stop Start-Addr-CW1-Stop Start Addr DR1 DR2 CW1 CW2 Stop = = = = = = = start condition address divider ratio 1st byte divider ratio 2nd byte control word 1st Byte control word 2nd Byte stop condition Semiconductor Group 5 MGP 3006X Pin Configuration (top view) Semiconductor Group 6 MGP 3006X Pin Definitions and Functions Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Symbol PD Q1 Q2 SDA SCL P7 CAU P2 P1 Function Input active filter/charge pump output Quartz crystal Quartz crystal Data input/output for I2C Bus Clock input for I2C Bus Port output (open collector) Address switch input Port output (open collector) Port output (open collector) Supply voltage Signal input Amplifier reference input Ground Output active filter VS UHF/VHF REF GND UD Semiconductor Group 7 MGP 3006X Block Diagram Semiconductor Group 8 MGP 3006X Absolute Maximum Ratings TA = – 20 to 80 °C Parameter Symbol Limit Values min. Supply voltage Output PD Crystal oscillator pins Q1, Q2 Bus input/output SDA Bus input SCL Port outputs P1, P2, P7 Chip address switch CAU Signal input UHF/VHF Reference input REF Output active filter UD Bus output SDA Port outputs P7 Port outputs P1, P2 Total port output current Junction temperature Storage temperature Thermal resistance (junction to ambient) max. 6 V V V V V V V V V V mA mA mA mA °C °C K/W open collector open collector open collector for VS = 0 V for VS = 0 V Unit Remarks VS V1 V2 V4 V5 V6 V7 V11 V12 V14 I4L I6L I8L ΣIL – 0.3 – 0.3 – 0.3 – 0.3 – 0.3 – 0.3 – 0.3 – 0.3 – 0.3 – 0.3 –1 –1 –1 VS VS 6 6 16 VS 0.3 0.3 VS 5 7 20 25 125 Tj Tstg Rth JA – 40 125 125 Semiconductor Group 9 MGP 3006X Absolute Maximum Ratings (cont’d) TA = – 20 to 80 °C Parameter Symbol Limit Values min. Operating Range Supply voltage Ambient temperature Input frequency Crystal frequency Programmable divider factor max. Unit Remarks VS TA f11 f2 N 4.5 – 20 16 5.5 80 1300 4 V °C MHz (at 25 °C) MHz 256 32767 AC/DC Characteristics TA = – 20 to 80 °C; VS = 4.5 to 5.5 V Parameter Symbol min. Supply current Crystal oscillator frequency Oscillator amplitude (voltage across crystal) Margin from 1st (fundamental) to 2nd and 3rd harmonics Signal Input UHF/VHF Sensitivity Limit Values typ. 37 3.99975 4.000 2.61) max. 55 mA Unit Test Condition Test Circuit 1 1 IS f2 VS = 5 V series capacitance 18 pF, fQ = 4 MHz 4.00025 MHz Vpp 201) dB a11 a11 a11 — 27/10 — 27/10 — 20/22 3/315 3/315 3/315 2) dBm/ f11 = 70 … 500 MHz 2) dBm/ f11 = 1000 MHz 2) dBm/ f11 = 1100 MHz 2 2 2 Notes see page 11. Semiconductor Group 10 MGP 3006X AC/DC Characteristics (cont’d) TA = – 20 to 80 °C; VS = 4.5 to 5.5 V Parameter Symbol min. Limit Values typ. max. Unit Test Condition Test Circuit Port Output P7 (switch with open collector)3) H-input current L-output voltage I6H V6L 10 0.5 µA V V6H = 13.5 V I6L = 1.7 mA 4 4 Port Outputs P1, P2 (switch with open collector)3) H-input current L-output voltage I8H V8L 10 0.5 µA V V8H = 13.5 V I8L = 20 mA 3 3 Phase-Detector Output PD (VS = 5 V) Pump current Pump current Tristate current Output voltage I1H I1H I1Z V1L ± 90 ± 22 –5 1.0 ± 220 ± 50 0 ± 300 ± 75 5 2.5 µA µA nA V 5I = high; V1 = 2 V 5I = low; V1 = 2 V T1 = 1; V1 = 2 V locked 5 5 5 5 Active Filter Output UD (Test mode T0 = 1; PD = tristate) Output current – I14 500 µA 100 500 mV mV V14 = 0.8 V; I1H = 90 µA V1L = 0 V OS = 1; 5 Output voltage Output voltage V14 V14 5 5 Chip Address Switch CAU Input current Input current I7H – I7H 50 50 µA µA V7H = 5 V V7H = 5 V 7 7 1) Design note only: no 100 % final inspection. 2) mVrms into 50 Ω. 3) The sum of the currents in ports P1, P2, P7 may not exceed 25 mA. Semiconductor Group 11 MGP 3006X AC/DC Characteristics (cont‘d) TA = – 20 to 80 °C; VS = 4.5 to 5.5 V; refer to test circuit 6 Parameter Symbol min. Bus Inputs SCL, SDA H-input voltage L-input voltage H-input current L-input current Limit Values typ. max. Unit Test Condition V4IH V4IL I4IH – I4IL 3 5.5 1.5 10 20 V V µA µA V4IH = VS V4IL = 0 V Bus Output SDA (open collector) H-output current L-output voltage Edges SCL, SDA Rise time Fall time Shift Clock SCL Frequency H-pulse width L-pulse width Start Set-up time Hold time Stop Set-up time Bus free I4OH V4OL 10 0.4 µA V V4OH = 5.5 V I4OL = 3 mA tR tF 1 0.3 µs µs f5 t5H t5L 0 4 4.7 100 kHz µs µs tSUSTA tHDSTA 4.7 4 µs µs tSUSTO tBUF 4.7 4.7 µs µs Semiconductor Group 12 MGP 3006X AC/DC Characteristics (cont‘d) TA = – 20 to 80 °C; VS = 4.5 to 5.5 V; refer to test circuit 6 Parameter Symbol min. Data Transfer Set-up time Hold time Input hysteresis SCL, SDA1) Low-pass cutoff frequency SCL, SDA1) Limit Values typ. max. Unit Test Condition tSUDAT tHDDAT 0.25 0 300 500 µs µs mV kHz 1) Design note only: no 100 % final inspection. Semiconductor Group 13 MGP 3006X Crystal Oscillator Test Circuit 1 Semiconductor Group 14 MGP 3006X Calibration of Signal Generator Measurement of Input Sensitivity Test Circuit 2 Semiconductor Group 15 MGP 3006X Test Circuit 3 Test Circuit 4 Test Circuit 5 Semiconductor Group 16 MGP 3006X Test Circuit 6 I2C Bus Timing Diagram Set-up time (start) Hold time (start) H-pulse width (clock) L-pulse width (clock) Set-up time (data transfer) Hold time (data transfer) Set-up time (stop) Bus free time Fall time Rise time tSUSTA tHDSTA tHIGH tLOW tSUDAT tHDDAT tSUSTO tBUF tF tR All times related to 10 % and 90 % values. Semiconductor Group 17 MGP 3006X Test Circuit 7 Application Circuit Semiconductor Group 18 MGP 3006X Loop Filter Loop Filter Calculation Loop bandwidth: Attenuation: ωR = √[(IP × KVCO) / (C1 × P × N)] a = 0.5 × ωR × R × C1 P = N = IP = KVCO = R, C 1 = Example for channel 47: prescaler division ratio programmable division ratio charge pump current tuner slope loop filter P = 8, N = 11520, IP = 50 µA, KVCO = 18.7 MHz/V, R = 22 kΩ, C1 = 180 nF, ωR = 237 Hz, fR = 38 Hz, a = 0.47 Note: The high-impedance port outputs and CAU can be decoupled from external noise with a capacitor of 1 nF. It is important to keep to the I2C Bus specification concerning maximum capacitance and impedance. Semiconductor Group 19 MGP 3006X Diagrams Sensitivity at UHF/VHF-Input I2C Bus Noise Immunity Sinusoidal noise pulses are applied via a coupling capacitance of 33 pF to the SCL- and SDA-inputs. Semiconductor Group 20 MGP 3006X Plastic Package, P-DSO-14-1 (SMD) (Plastic Dual Small Outline) GPS05093 Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book “Package Information” SMD = Surface Mounted Device Semiconductor Group 21 Dimensions in mm