BSP 171
SIPMOS ® Small-Signal Transistor • P channel • Enhancement mode • Logic Level • Avalanche rated
• VGS(th) = -0.8...-2.0 V
Pin 1 G Pin 2 D Pin 3 S Pin 4 D
Type BSP 171 Type BSP 171
VDS
-60 V
ID
-1.7 A
RDS(on)
0.35 Ω
Package SOT-223
Marking BSP 171
Ordering Code Q67000-S224
Tape and Reel Information E6327
Maximum Ratings Parameter Continuous drain current Symbol Values -1.7 Unit A
ID IDpuls
-6.8
TA = 24 °C
DC drain current, pulsed
TA = 25 °C
Avalanche energy, single pulse
EAS
8
mJ
ID = -1.7 A, VDD = -25 V, RGS = 25 Ω L = 3.23 mH, Tj = 25 °C
Gate source voltage Power dissipation
VGS Ptot
± 20 1.8
V W
TA = 25 °C
Semiconductor Group
1
18/02/1997
BSP 171
Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air 1) Thermal resistance, junction-soldering point 1) DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Symbol Values -55 ... + 150 -55 ... + 150 ≤ 70 ≤ 10 E 55 / 150 / 56 K/W Unit °C
Tj Tstg RthJA RthJS
1) Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit
V(BR)DSS
-60 -1.4 -0.1 -10 -10 0.22 -2
V
VGS = 0 V, ID = -0.25 mA, Tj = 25 °C
Gate threshold voltage
VGS(th)
-0.8
VGS=VDS, ID = -1 mA
Zero gate voltage drain current
IDSS
-1 -100
µA
VDS = -60 V, VGS = 0 V, Tj = 25 °C VDS = -60 V, VGS = 0 V, Tj = 125 °C
Gate-source leakage current
IGSS
-100
nA Ω 0.35
VGS = -20 V, VDS = 0 V
Drain-Source on-state resistance
RDS(on)
VGS = -10 V, ID = -1.7 A
Semiconductor Group
2
18/02/1997
BSP 171
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit
gfs
1 1.55 720 290 120 -
S pF 960 435 180 ns 16 25
VDS≥ 2 * ID * RDS(on)max, ID = -1.7 A
Input capacitance
Ciss Coss
-
VGS = 0 V, VDS = -25 V, f = 1 MHz
Output capacitance
VGS = 0 V, VDS = -25 V, f = 1 MHz
Reverse transfer capacitance
Crss
-
VGS = 0 V, VDS = -25 V, f = 1 MHz
Turn-on delay time
td(on)
VDD = -30 V, VGS = -10 V, ID = -0.3 A RGS = 50 Ω
Rise time
tr
70 105
VDD = -30 V, VGS = -10 V, ID = -0.3 A RGS = 50 Ω
Turn-off delay time
td(off)
230 310
VDD = -30 V, VGS = -10 V, ID = 0.3 A RGS = 50 Ω
Fall time
tf
280 375
VDD = -30 V, VGS = -10 V, ID = -0.3 A RGS = 50 Ω
Semiconductor Group
3
18/02/1997
BSP 171
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS TA = 25 °C Inverse diode direct current,pulsed A -0.9 300 0.82 -1.7 -6.8 V -1.2 ns µC Values typ. max. Unit
ISM VSD trr Qrr
TA = 25 °C
Inverse diode forward voltage
VGS = 0 V, IF = -3.4 A, Tj = 25 °C
Reverse recovery time
VR = 30 V, IF=lS = 0 , diF/dt = 100 A/µs
Reverse recovery charge
VR = 30 V, IF=lS = 0 , diF/dt = 100 A/µs
Semiconductor Group
4
18/02/1997
BSP 171
Power dissipation Ptot = ƒ(TA)
Drain current ID = ƒ(TA) parameter: VGS ≥ -10 V
-1.8 A
2.0 W
Ptot
1.6 1.4
ID
-1.4 -1.2
1.2 -1.0 1.0 -0.8 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 °C 160 -0.6 -0.4 -0.2 0.0 0 20 40 60 80 100 120 °C 160
TA
TA
Safe operating area ID=f(VDS) parameter : D = 0, TC=25°C
Transient thermal impedance Zth JA = ƒ(tp) parameter: D = tp / T
10 2 K/W 10 1
ZthJC
10 0
10 -1 D = 0.50 0.20 0.10 10 -3 single pulse 10 -4 0.05 0.02 0.01
10 -2
10 -5 -8 -7 -6 -5 -4 -3 -2 -1 0 10 10 10 10 10 10 10 10 s 10
tp
Semiconductor Group
5
18/02/1997
BSP 171
Typ. output characteristics ID = ƒ(VDS) parameter: tp = 80 µs
-3.8 A -3.2
Typ. drain-source on-resistance RDS (on) = ƒ(ID) parameter: tp = 80 µs, Tj = 25 °C
1.1
Ptot = k W 2
li jh g f
VGS [V] a -2.0
b c -2.5 -3.0 -3.5 -4.0 -4.5 -5.0 -6.0 -7.0 -8.0 -9.0 -10.0
Ω
RDS (on)
0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2
b a
a
b
c
d
ID
-2.8 -2.4 -2.0 -1.6 -1.2
c e
d e f g h
di
j k l
e f gh ij
-0.8 -0.4 0.0
VGS [V] =
0.1 0.0 V -5.0
a b c d e f -2.5 -2.0 -3.5 -4.0 -4.5 -5.0 -6.0 -3.0
g h i j -7.0 -8.0 -9.0 -10.0
0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0
0.0 -0.4 -0.8 -1.2 -1.6 -2.0 -2.4 -2.8 -3.2 A -3.8
VDS
ID
Typ. transfer characteristics ID = f(VGS) parameter: tp = 80 µs VDS≥ 2 x ID x RDS(on)max
-3.6 A
Typ. forward transconductance gfs = f (ID) parameter: tp = 80 µs, VDS≥2 x ID x RDS(on)max
2.2 S
ID
-2.8 -2.4 -2.0 -1.6 -1.2
gfs
1.8 1.6 1.4 1.2 1.0 0.8 0.6
-0.8 0.4 -0.4 0.0 0 -1 -2 -3 -4 -5 -6 -7 -8 V -10 0.2 0.0 0.0 -0.4 -0.8 -1.2 -1.6 -2.0 -2.4 -2.8 A -3.4 ID
VGS
Semiconductor Group
6
18/02/1997
BSP 171
Drain-source on-resistance RDS (on) = ƒ(Tj ) parameter: ID = -1.7 A, VGS = -10 V
0.9
Gate threshold voltage VGS (th) = ƒ(Tj) parameter: VGS = VDS, ID = -1 mA
-4.6 V -4.0
Ω
RDS (on) 0.7
0.6 0.5
VGS(th)
-3.6 -3.2 -2.8
98%
0.4 0.3 0.2
-2.4
98%
-2.0
typ
-1.6 -1.2
typ
2%
-0.8
0.1 0.0 -60 -20 20 60 100 °C 160
-0.4 0.0 -60 -20 20 60 100 °C 160
Tj
Tj
Typ. capacitances C = f (VDS) parameter:VGS=0V, f = 1 MHz
10 1
Forward characteristics of reverse diode IF = ƒ(VSD) parameter: Tj , tp = 80 µs
-10 1
nF C 10 0
A
IF
-10 0
Ciss
Coss
10 -1 -10 -1
Crss
Tj = 25 °C typ Tj = 150 °C typ Tj = 25 °C (98%) Tj = 150 °C (98%)
10 -2 0
-5
-10
-15
-20
-25
-30
V VDS
-40
-10 -2 0.0
-0.4
-0.8
-1.2
-1.6
-2.0
-2.4
V
-3.0
VSD
Semiconductor Group
7
18/02/1997
BSP 171
Avalanche energy EAS = ƒ(Tj ) parameter: ID = -1.7 A, VDD = -25 V RGS = 25 Ω, L = 3.23 mH
9 mJ
Drain-source breakdown voltage V(BR)DSS = ƒ(Tj)
-71 V -68 V(BR)DSS -66
EAS
7 6 5 4 3 2 1 0 20 40 60 80 100 120 °C 160
-64
-62 -60 -58
-56 -54 -60 -20 20 60 100 °C 160
Tj
Tj
Safe operating area ID=f(VDS) parameter : D = 0.01, TC=25°C
Semiconductor Group
8
18/02/1997